DE1004454B - Device for brazing metals, in particular silver contacts - Google Patents
Device for brazing metals, in particular silver contactsInfo
- Publication number
- DE1004454B DE1004454B DES44758A DES0044758A DE1004454B DE 1004454 B DE1004454 B DE 1004454B DE S44758 A DES44758 A DE S44758A DE S0044758 A DES0044758 A DE S0044758A DE 1004454 B DE1004454 B DE 1004454B
- Authority
- DE
- Germany
- Prior art keywords
- soldered
- parts
- silver contacts
- brazing metals
- particular silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title claims description 8
- 229910052751 metal Inorganic materials 0.000 title claims description 6
- 239000002184 metal Substances 0.000 title claims description 6
- 150000002739 metals Chemical class 0.000 title claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims description 5
- 229910052709 silver Inorganic materials 0.000 title claims description 5
- 239000004332 silver Substances 0.000 title claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000443 aerosol Substances 0.000 claims description 2
- 230000001939 inductive effect Effects 0.000 claims description 2
- 238000011144 upstream manufacturing Methods 0.000 claims description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 3
- 239000004327 boric acid Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000009189 diving Effects 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- VUZPPFZMUPKLLV-UHFFFAOYSA-N methane;hydrate Chemical compound C.O VUZPPFZMUPKLLV-UHFFFAOYSA-N 0.000 description 1
- UYVXZUTYZGILQG-UHFFFAOYSA-N methoxyboronic acid Chemical compound COB(O)O UYVXZUTYZGILQG-UHFFFAOYSA-N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
Einrichtung zum Hartlöten von Metallen, insbesondere Silberkontakten Die Erfindung betrifft eine Einrichtung zum Hartlöten von Metallen, insbesondere Silberkontakten, bei dem die zu verlötenden Teile vor und während des Lötvorganges der Einwirkung von Bororganoverbindungen ausgesetzt werden.Device for brazing metals, in particular silver contacts The invention relates to a device for brazing metals, in particular Silver contacts, in which the parts to be soldered before and during the soldering process exposed to the action of organoboron compounds.
Man hat bereits vorgeschlagen, beim Hartlöten von Metallen dem Acethy lengas eine gasförmige Bororganoverbindung beizumischen. Es war nämlich erkannt worden, daß sich beim Verbrennungsprozeß des Acethylens gleichzeitig auch diese Verbindung in Borsäure, Kohlendioxyd und Wasser aufspaltet, wobei die Borsäure an dein Kontakt haftende Beläge, wie z. B. Sulfide, Oxyde od. dgl., so weit auflöst, daß das Lot gleichmäßig an der gesamten Oberfläche haften kann. Diese gleichmäßige Haftung ist notwendig, weil sich sonst das Lot an einzelnen Stellen tropfenförmig konzentrieren würde und dann weder eine gleichmäßige Haftfestigkeit noch eine einwandfreie elektrische Verbindung vorhanden wären. Auch ist bereits vorgeschlagen worden, die Kontaktstücke in Bororganoverbindungen vor dem Verlöten zu tauchen, insbesondere wenn man keine Gasflamme für den Lötvorgang verwendet. Das Tauchen bedingt jedoch einen besonderen Arbeitsgang und hierfür entsprechend ausgebildete Arbeitsvorrichtungen, die eine in der Regel nicht tragbare Verteuerung des Hartlötvorganges mit sich bringen.It has already been proposed to use Acethy for brazing metals lengas to mix in a gaseous organoboron compound. For it was recognized have been that in the combustion process of the acetylene at the same time this The compound splits into boric acid, carbon dioxide and water, with the boric acid being attached Your contact adhering coverings, such. B. sulfides, oxides or the like, dissolves so far, that the solder can adhere evenly to the entire surface. This even Adhesion is necessary because otherwise the solder will be drop-shaped at individual points would concentrate and then neither a uniform bond strength nor a perfect one electrical connection would be available. It has also already been suggested that To dip contact pieces in organoboron compounds before soldering, in particular if you do not use a gas flame for the soldering process. However, diving is conditional a special work process and appropriately trained work devices, which usually lead to an unsustainable increase in the cost of the brazing process.
Die Erfindung zeigt einen Weg, wie die gleichen Erfolge ohne Einschalten eines besonderen Arbeitsvorganges erzielt werden können.The invention shows a way how the same successes without switching on a special process can be achieved.
Auch bei der Einrichtung nach der Erfindung zum Hartlöten von Metallen, insbesondere von Silberkontakten, sind die zu verlötenden Teile während des Lötvorganges der Einwirkung von Bororganoverbindungen ausgesetzt. Gemäß der Erfindung ist der Erwärmungsvorrichtung eine Gasbehandlungsvorrichtung vorgeschaltet, in der die Teile während des Zubringens vor dem Erwärmen mit einem Gas- bzw. Aerosolstrom einer Bororganoverbindung behandelt werden. Es wurde nämlich erkannt, daß es ausreichend ist, wenn die Kontakte zweckmäßig kurz vor Erreichen der Behandlungslage in der Hartlötvorrichtung mit einem Gasstrom der Bororganoverbindung, beispielsweise einem Borsäuremethylester, in Berührung kommen, da sich dann Borsäure an der Oberfläche der Kontaktstücke niederschlägt. Es können dann die bisher nur schwierig in den Arbeitsprozeß einschaltbaren Behandlungseinrichtungen eingespart werden.Even with the device according to the invention for brazing metals, especially of silver contacts, the parts to be soldered are during the soldering process exposed to the action of organoboron compounds. According to the invention is the Heating device upstream of a gas treatment device in which the parts during the introduction before heating with a gas or aerosol stream of an organoboron compound be treated. It has been recognized that it is sufficient if the contacts expediently shortly before reaching the treatment position in the brazing device with a gas stream of the organoboron compound, for example a boric acid methyl ester, come into contact, as boric acid is then deposited on the surface of the contact pieces. The treatment devices, which have hitherto only been difficult to incorporate into the work process, can then be used can be saved.
Besonders vorteilhaft läßt sich die Einrichtung nach der Erfindung beim fortlaufenden Löten verwenden, insbesondere wenn unter induktiver Erwärmung der zu verlötenden Teile gelötet wird. Bei derartigen Einrichtungen wird beispielsweise eine magazinartige Zuführungsvorrichtung für die Teile kanalartig ausgebildet und dient dann zugleich als Gasbehandlungskanal.The device according to the invention can be particularly advantageous Use for continuous soldering, especially when under inductive heating the parts to be soldered is soldered. In such facilities, for example a magazine-like feed device for the parts formed like a channel and then also serves as a gas treatment channel.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES44758A DE1004454B (en) | 1955-07-15 | 1955-07-15 | Device for brazing metals, in particular silver contacts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES44758A DE1004454B (en) | 1955-07-15 | 1955-07-15 | Device for brazing metals, in particular silver contacts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1004454B true DE1004454B (en) | 1957-03-14 |
Family
ID=7485247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DES44758A Pending DE1004454B (en) | 1955-07-15 | 1955-07-15 | Device for brazing metals, in particular silver contacts |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE1004454B (en) |
-
1955
- 1955-07-15 DE DES44758A patent/DE1004454B/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE2511210C3 (en) | Method and device for dip soldering of semiconductor components | |
| DE1108754B (en) | Method and device for the production of circuit boards in telecommunication, in particular telephone systems | |
| DE1004454B (en) | Device for brazing metals, in particular silver contacts | |
| JPS5348933A (en) | Device for making metal wire by injecting liquid metal or alloy jet into coolant fluid | |
| CH378765A (en) | Method for joining ceramic material to metal by soldering | |
| DE878996C (en) | Welding device | |
| DE334661C (en) | Anode pin for generating fine galvanic deposits | |
| AT226496B (en) | Process for soft soldering of aluminum or of predominantly aluminum-containing alloys | |
| JPS53138954A (en) | Metallic solder | |
| DE868822C (en) | Device for preheating of workpieces to be tinned or soldered | |
| JPS5353523A (en) | Device for making metal wire by jet of liquid metal or alloy | |
| DE936032C (en) | Bell for exchange facilities | |
| JPS5418444A (en) | Welding equipment | |
| DE666706C (en) | Electric arc welding device for coated rod or wire electrodes | |
| DE937484C (en) | Manual welding tongs for semi-automatic arc spot welding with melt jacket electrodes | |
| DE915886C (en) | Device for removing the slag that forms when melting on welding electrodes | |
| DE909616C (en) | Electrode holder for welding with inserted electrodes | |
| DE635634C (en) | Method for welding an electrical branch line to a continuous main line | |
| DE907008C (en) | Process for the descaling of objects made of iron, steel, copper and copper alloys without damaging the metallic surface | |
| DE338695C (en) | Method for attaching a piece of solder strip to pieces of wire intended for chain formation | |
| DE532900C (en) | Heat treatment of metals and metal alloys in fused baths containing oxidizable substances | |
| DE857567C (en) | Arc cutting and welding equipment | |
| JPS5245559A (en) | Welding equipment using covered consumable nozzle | |
| AT207211B (en) | Method for welding with an electric arc using carbon dioxide with an inert gas addition as a protective gas | |
| DE347259C (en) | Method for soldering solid wire chains |