DE10031329C1 - Electronic data card manufacturing method has transmission elements and/or conductor paths provided by application of conductive dispersion to carrier layer - Google Patents

Abstract

The data card manufacturing method has a conductive dispersion applied to the surface of a carrier layer (4), for formation of the transmission elements and/or the conductor paths connected to at least one electronic component of each data card. The dispersion is applied via a dispensing needle with a controlled relative movement between the dispensing needle and the carrier layer while a relative distance of 500 microns of less is maintained between them. An Independent claim for a data card manufacturing device is also included.

Description

Card-shaped data carriers now have numerous areas of application Moved in. They are known, for example, as a means of payment for the cashless payment transactions in the form of telephone, EC and credit cards as well as an electronic key to regulate access authorization Premises and electronic equipment. The need for card-shaped Data carriers for such and other applications are increasing rapidly, so that such media are becoming increasingly important.

Card-shaped data carriers usually have at least one electronic one Component on, for example a chip that is responsible for data processing and that is connected to other components via conductor tracks. The Use of certain parts and components and their specific Arrangement on a map is also called map architecture. For the Transport of data to the electronic component and its energy supply two options are known. At the first the card is on their surface freely accessible contact points, which are connected to the Pads of the chip are connected. The data exchange takes place here by inserting the card into a reader that picks up the contact points. The The disadvantage of these contact cards is that the mechanical Establishing the contact between card and reader the contact points are subject to constant mechanical wear and tear, which over time too leads to a deterioration of the contact and thus the reliability of this Cards affected. Another, the functionality of a card adverse factors are environmental. This is how dust and moisture lead as well as corrosion on the contact surfaces to contact problems that increase Maintenance of the reading devices.  

For this reason, contactless cards are often preferred, where the Data between the electronic component and a reading unit inductively or capacitively. Such cards point next to one for data exchange electronic component is a transmission element in the form of a coil or electrically conductive layers. The coil acts like a transmit and Receiving antenna. All that is needed for data exchange and energy supply it to come close to a reading or sending unit, the one electromagnetic field, with the help of which communication between Card and reading unit is made possible.

In addition, so-called dual interface cards are known, which both combine contact and non-contact transmission elements.

There are numerous in the production of card-shaped data carriers Manufacturing variants known, the one used to manufacture the functionality Process steps essentially required on the manufacture of card Contacts in the area of specified connection surfaces, on the manufacture of Conductor tracks for data lines and for the manufacture of coils or electrically conductive surfaces can be traced back for data transmission.

Both DE 44 31 605 A1 and DE 197 28 993 C1 use Production of coils winding process for copper wire coils as known ahead. The copper wire is laid in several turns and on the Surface of a carrier layer fixed. The above-mentioned documents also disclose additive processes for manufacturing coils, such as that Screen printing process, in which a conductive layer outside of the by a Masked areas is applied to a carrier layer or Etching processes in which a conductive flat coating in unprotected Partial areas is removed. DE 44 31 605 also mentions galvanically waxed coils.  

The methods described are also suitable for producing conductor tracks, which connect the coils to the electronic components and which advantageously be produced simultaneously with the coil.

The basic possibilities of a coil made with the above method to be connected to an electronic component are essentially in DE 195 00 925 A1 called. In the case of wound coils, it is known, for example, that Wire ends directly with the connection surfaces of an electronic component (DE 44 31 605 A1) or to be soldered to the contact surfaces of a chip carrier. Instead of Soldering is also known as conductive adhesive, which can be used to connect two Pads, for example, between an electronic component and one coil produced by screen printing are suitable. The conductive Adhesive in the form of a paste applied to the points to be joined.

Further possibilities for producing conductive connections are in DE 195 00 925 A1 and DE 44 31 605 called ultrasonic welding and the Making contacts mechanically. The latter is described for example in DE 197 28 993 A1, where a chip on a Carrier element is arranged with connection surfaces. To manufacture the conductive An electrically conductive pin is made through the connection surface up to the contact Coil driven, which creates the conductive connection. A widespread use for the production of mechanical contacts is also in the course of the flip chip Technology is done.

A major disadvantage of the methods of manufacture described above A card-shaped data carrier can first be seen in the fact that several Procedural steps are required until a card is functional. So is with a first step in the process of producing the coil, if necessary with the associated conductor tracks before proceeding in a further process step the connections to an electronic component can be made. That makes it Manufacturing process cumbersome and complex, which is not least in the Manufacturing costs.  

Another disadvantage of the known methods lies in the process-related ones rigid operation. Once the architecture of the disk is set, are designed for this architecture to produce the maps Aid tools produced. This means that wound coils become winding cores manufactured with the required dimensions, for screening and etching processes appropriate stencils and masks are made, with the help of which the Data carriers can be produced in large quantities. With the change The architecture of a data carrier is therefore at the same time the re-creation of the production auxiliary tools connected, whereby such Manufacturing methods poorly adapt to changing framework conditions adjust. In particular, they are for the production of small quantities unsuitable from an economic point of view.  

JP 11 161 763 A describes a method for producing a card-shaped data carrier known, the electronic component le has. An antenna is provided, which with the electronic component is connected via conductor tracks. This According to the document, conductor tracks are to be applied a conductive ink along predetermined tracks on a Carrier layer are applied. Such inks are excluded neatly thin, so that big problems with the manufacture safe conductive tracks are given.

From DE 196 42 378 A1 a method is known in which chem to form conductive tracks an electrically conductive Paste is applied over a stencil. Such a template NEN cannot be used if the conductor tracks are three-dimensional nal manufactured by overcoming jumps in height have to.

Against this background, the invention is based on the object, a method and a Develop device that simplify the manufacturing process on the one hand and on the other hand, guarantee the greatest possible flexibility.

This object is achieved by a method with the features of the patent claim 1 or with the device for performing the method solved according to claim 10.

Advantageous further developments result from the subclaims.

The basic idea of the invention is to conductors, coils, conductive Surfaces and connections through successive and continuous application of one conductive dispersion along predetermined tracks on a carrier layer to manufacture. The dispersion has a viscosity which is suitable for to be placed on the carrier layer in a controlled manner by means of an aid. For example, a dispensing head with a dispensing needle is suitable for this purpose the dispersion flows on the carrier layer in a controlled manner. This creates senior Webs, the width of which is, for example, 100 μm with a corresponding thickness can be reduced.  

In this way, conductor tracks and transmission elements can be managed in just one To produce a process step and to connect it to an electronic component, provided that this has already been arranged on the carrier layer. It there is no additional work step, at least according to the state of the art the establishment of contacts to the electronic component and the next Additional equipment required for additional time required.

Another advantage is the great geometric flexibility with regard to the Card architecture that offers a method according to the invention. So it enables inventive method the design of a map architecture on the computer (CAD / CAM), d. H. there the exact location of the conductor tracks, Transmission elements and electronic components as well as their connection surfaces fixed. This data flows directly into the manufacturing process, where it is used Control of the aids used to apply the conductive dispersion become. As a result, it can be used at any time and as often as you like without significant loss of time the card architecture can be changed without affecting the means of production Need to make changes. That already opens in the Development phase of card-shaped data carriers great advantages, because in experience at this stage the map architecture until its optimization changes particularly often. The method according to the invention therefore enables this Rapid prototyping.

But it can also be done while making a particular card type required changes can be implemented in a very short time by corresponding changes can only be made on the computer. The same applies to the production of different types of cards with different map architectures that thanks to the invention now without the Modification of the means of production required for production can take place. The also enables, for example, the economical production of small series card-shaped data carrier.  

The great flexibility and the wide range of applications of the invention The process enables a much greater vertical range of manufacture on the part of Card maker. Up to now, the card manufacturers have mainly been on third-party companies instructed them prefabricated and with antenna, conductor tracks and Electronic components, such as B. chip, provided carrier layers, so-called Inlets, delivered. Thanks to the invention, this intermediate step is now eliminated. The Card manufacturers manufacture transmission elements and conductor tracks themselves and thus enjoy the entire value chain. Furthermore they remain independent of the supplies of third parties, what the Production security increased.

Another advantage of the method according to the invention lies in the possibility of to implement highly complex map architectures. This is achieved on the one hand by the given possibility, the dispersion in terms of location, quantity and consistency microprocessor controlled to apply to the carrier layer. On the other hand, you can Differences in height resulting from the crossing points of conductor tracks or Connections to chips, batteries or other electronic components result, be bridged, making the design more three-dimensional Map architectures allowed.

According to an advantageous embodiment of the invention, the conductivity checked the previously applied dispersion. This can be done with the help, for example an ultrasound, done on the geometry of the Conductor and the properties of the dispersion on conductivity is inferred. This check is advantageously carried out during the liquid phase of the dispersion. So in the case of a poorly manufactured one Conductor can be repaired immediately or later, the defect, causing the number of defective cards can be significantly reduced.

During the curing phase of the dispersion, another one is used Embodiment of the method according to the invention, the carrier layer with a Vacuum and temperature applied. This leads to an acceleration of the  Curing phase and a compression of the dispersion, the contact between whose leading components are enlarged. In this way, the Optimize the conductivity of the applied dispersion.

After the curing phase has one according to the inventive method manufactured card already its full functionality with regard to the posed Conditions. Checking the functionality this early Production stage enables defective cards to be sorted out very early, see above that their further processing in subsequent process steps, such as Example of applying other security features, such as. B. holograms, Signature foil etc. and personalization no longer take place and therefore none Costs caused more.

The invention is not only related to a method of making card-shaped Disk limited, but goes beyond and encompasses in general the production of a conductive path or surface by successive and continuous application of a conductive dispersion to a base substrate.

The invention is illustrated below with reference to one in the drawing Exemplary embodiment explained. Show it

Fig. 1 is an overview of the inventive process in schematic representation,

Fig. 2 is a schematic representation of the process step of applying the dispersion,

Fig. 3 is a detailed view of one end of a dispensing needle when applying the dispersion and

Fig. 4 is a plan view of a distribution system for applying the dispersion.

As can be seen from FIG. 1, the method according to the invention is carried out in various stations, which are identified by A, B, C and D in the present example. The arrows 1 , 2 and 3 indicate the direction of production.

In station A, the carrier layers 4 are held in the form of sheets stacked one above the other and, if necessary, transferred to station B. The arches are made of PVC in the present example, but equally are other plastics, such as. B. ABS, or cardboard. An arch of a carrier layer 4 is suitable for producing a multiplicity of data-shaped card carriers by simultaneously accommodating 3 × 8 or 3 × 7 cards (see also FIG. 4).

The carrier layer sheets 4 stacked in station A are already equipped with the necessary electronic components, so that in the following only the transmission elements, conductor tracks and connections to the electronic components have to be made.

For this purpose, a carrier sheet 4 is transferred to station B. In the present example, the dispersion is applied via a dispensing system with three parallel production lines 5 , 5 ', 5 ". Each of the production lines 5 , 5 ', 5 " is connected via a supply line 6 , 6 ', 6 "to one with the conductive dispersion filled storage container 7 , 7 ', 7 "connected. The application of the dispersion takes place via the schematically represented dispensing heads 8 , 8 ', 8 "with integrated control unit, which combine both a dispensing needle and, for example, an ultrasonic measuring device for checking.

The arrows 9 , 9 ', 9 "and 10 , 10 ', 10 " symbolize a photoelectronic adjustment device which ensures an exact adjustment of the backing sheet 4 within the station B and thus relative to the dispensing heads 8 , 8 'and 8 " Applying the dispersion is explained in more detail in FIGS. 2, 3 and 4.

After transfer of the carrier layer sheet 4 provided with a conductive dispersion in the direction of arrow 2 to station C, the hardening phase of the dispersion which is still in the liquid state takes place there. If appropriate, the carrier layer sheet 4 is exposed to a negative pressure and an increase in temperature during this time, which leads to a shortening of the curing phase and a densification of the dispersion.

The subsequent station D stands for all subsequent ones Processing steps. Optionally, this includes checking the functionality of the later cards and otherwise putting together additional layers a cardbook and its lamination and then punching out the make cards from the laminated sheets.

FIG. 2 shows a device broken down into its functional components for applying a conductive dispersion to a carrier layer 4 . Such a device comprises a data processing unit 11 , on which the map architecture is first designed. The resulting data are forwarded via an interface 12 to a dispensing device 13 , where they trigger the exact microprocessor-controlled control of the individual components, which essentially consist of a vacuum table (not shown in FIG. 2) on which the carrier sheet 4 is adjusted and fixed and one Dispensing head 8 . The vacuum table and thus the support layer 4 is displaceably mounted in a horizontal plane in two mutually orthogonal axes (X, Y) and is moved with the aid of a controlled drive in accordance with the card architecture. A movement in the direction perpendicular thereto (Z axis) is only provided as an option and is carried out either by raising and lowering the vacuum table or else the dispensing head 8 .

The dispensing unit 13 initially comprises a container 14 in which the conductive dispersion is stored. During operation, the dispersion passes from there to a unit 15 , in which the viscosity and temperature of the dispersion are brought to the required target size. In the direction of flow of the dispersion, there is an intermediate storage 16 for the dispersion before it arrives at a pump element 17 , which is also equipped with a storage volume.

On the way from the pump element 17 to the discharge opening, the dispersion passes a further module 18 for checking the viscosity and a further module 19 for checking the temperature. This ensures that the dispersion is applied to the carrier layer 4 in an optimal state. Following the module 19 , a further module 34 is provided which checks and confirms the presence of the dispersion 21 . The lower end of the dispensing head 8 facing the carrier layer sheet 4 has a dispensing needle through which the dispersion leaves the dispensing device 13 .

The process of applying the dispersion to the carrier layer 4 is illustrated in FIG. 3. There you see the mouth 20 at the free end of a dispensing needle 32 , from which the conductive liquid dispersion 21 emerges and is continuously applied to a carrier layer 4 . It is generally possible to bridge jumps in height on the surface of the carrier layer 4 , for example in the region of crossing points or connection surfaces to electrical components and / or batteries, without adjusting the height of the dispensing needle 32 or the vacuum table. For this purpose, the distance between the mouth 20 and the carrier layer 4 is matched to the component that extends furthest over the carrier layer plane in accordance with the respective card architecture. When using batteries inside the card, approx. 500 µm would be a suitable distance. Large height offsets in the map architecture can also be taken into account by adjusting the height of the dispensing head 8 or the vacuum table accordingly.

It is clear from FIG. 3 that the dispersion 21 is ejected from the mouth 20 of the dispensing needle 32 in the form of a continuous flow.

A track produced in this way from the dispersion 21 can serve as a conductor track 33 for connecting various electronic components on a card. The connections to the connection surfaces of the components can be carried out in a simple manner in that the dispensing needle 32 moves with its mouth 20 directly over the connection point. The contacting thus takes place in the course of the production of the conductor tracks 33 .

In addition, such tracks 33 can also be used directly to form a coil as a transmission element by executing corresponding relative movements of the dispensing needle 32 to the carrier layer 4 . Electrically conductive surfaces, for example for capacitive data transmission, are produced by laying the tracks directly next to one another. Since the dispersion 21 is still in the liquid state, a closed conductive surface is produced in this way.

Fig. 4 shows a plan view of an embodiment of the invention for producing card-shaped data carriers 31, 31 ', 31' in large numbers.

One can see a vacuum table 22 which is movable in the plane of representation and on which a support layer sheet 4 is fixed flat. The adjustment takes place via photoelectric sensors, which are designated with 23 and 24. The system for applying the dispersion is shown only schematically. It comprises three parallel supply lines 25 , 25 ′ and 25 ″, which are connected to the storage containers 26 , 26 , 26 ″ for the dispersion and are guided over the carrier layer sheet 4 at a short distance. From each supply line 25 , 25 ', 25 ", eight dispensing heads 27 , 27 ', 27 ", which are assigned in each case to a control unit 28 , 28 ', 28 ", branch off above the support sheet 4 , each of which is assigned a control unit 28. 28 ', 28 " the vacuum table 22 in the display plane, while the dispensing heads 27 , 27 ', 27 "and control units 28 , 28 ', 28 " are fixed in place.

In the example shown in FIG. 4, the carrier layer sheet 4 is already equipped with a chip 29 , 29 ', 29 "in the area of each card to be produced, in accordance with the card architecture. The dispensing heads 27 , 27 ', 27 " currently each provide a coil 30 , 30 ', 30 ", which is then connected directly to the connection areas of the chip 29, 29'29". In this way, 24 data-shaped card carriers 31 , 31 ', 31 "are created simultaneously on a carrier sheet 4 .

Claims (14)

1. A method for producing a card-shaped Datenträ gers ( 31 ) with at least one electronic component ( 29 ) and thus via conductor tracks ( 33 ) connected transmission elements ( 30 ), characterized in that the conductor tracks and / or transmission elements by successively continuously applying a conductive dispersion along predetermined tracks are formed on a carrier layer with the aid of a dispensing needle, which is either moved relative to the carrier layer or is held stationary while the carrier layer is moved along the predetermined paths. 2. The method according to claim 1, characterized in that the carrier layer ( 4 ) before application of the dispersion ( 21 ) with at least one electronic component ( 29 ) be pieces. 3. The method according to claim 2, characterized in that in the course of the manufacture of the conductor tracks ( 33 ) the contacts are made to the connection pads of the electronic components ( 29 ). 4. The method according to claim 1, characterized in that a distance of at most 500 microns is maintained between the dispensing needle ( 32 ) and the carrier layer ( 4 ). 5. The method according to any one of claims 1 to 4, characterized in that a check of the conductivity of the applied conductor track ( 33 ) is carried out immediately after application of the dispersion ( 21 ). 6. The method according to claim 5, characterized in that the checking of the applied conductor track ( 33 ) is carried out with the aid of an ultrasound measurement. 7. The method according to any one of claims 1 to 6, characterized in that the carrier layer ( 4 ) with the applied dispersion ( 21 ) is exposed to a curing phase. 8. The method according to claim 7, characterized in that a vacuum acts on the carrier layer ( 4 ) with the dispersion ( 21 ) during the curing phase. 9. The method according to claim 7 or 8, characterized in that during the curing phase, the carrier layer ( 4 ) with the dispersion ( 21 ) is impacted with a temperature increase. 10. Device for producing a card-shaped data carrier ( 31 ) with at least one electronic component ( 29 ) and transmission elements ( 30 ) connected to it via conductor tracks ( 33 ), characterized by a dispensing device ( 23 ) with a dispensing head ( 8 ), via its dispensing needle a conductive dispersion ent along predetermined tracks on a carrier layer can be successively and continuously applied, either the dispensing head ( 8 ) being designed to be movable relative to the carrier layer ( 4 ) or the carrier layer ( 4 ) being held movably and by means of the dispensing head ( 8 ) a controller can be moved along the predetermined paths. 11. The device according to claim 10, characterized in that a checking device for checking the conductivity of the applied conductor track ( 33 ) is provided. 12. The device according to one of claims 10 or 11, characterized by an ultrasonic measuring device for measuring the applied conductor track ( 33 ). 13. The device according to one of claims 10 to 12, characterized by a device for generating egg nes negative pressure, which acts on the carrier layer ( 4 ) with the dispersion ( 21 ) during the curing phase. 14. Device according to one of claims 10 to 13, characterized by a heating device for heating the carrier layer ( 4 ) with the dispersion ( 21 ) during the curing phase.