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DE10016453A1 - In-circuit test adaptors, includes double sleeve with optimal test spring contacts through which the test terminals of a PCB is directly connected to a test system - Google Patents

In-circuit test adaptors, includes double sleeve with optimal test spring contacts through which the test terminals of a PCB is directly connected to a test system

Info

Publication number
DE10016453A1
DE10016453A1 DE2000116453 DE10016453A DE10016453A1 DE 10016453 A1 DE10016453 A1 DE 10016453A1 DE 2000116453 DE2000116453 DE 2000116453 DE 10016453 A DE10016453 A DE 10016453A DE 10016453 A1 DE10016453 A1 DE 10016453A1
Authority
DE
Germany
Prior art keywords
test
double sleeve
circuit board
spring contacts
optimal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE2000116453
Other languages
German (de)
Inventor
Grant Boctor
Bruno Ratzky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE2000116453 priority Critical patent/DE10016453A1/en
Publication of DE10016453A1 publication Critical patent/DE10016453A1/en
Ceased legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416Connectors, terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/31707Test strategies
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/319Tester hardware, i.e. output processing circuits
    • G01R31/31903Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/319Tester hardware, i.e. output processing circuits
    • G01R31/31903Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31915In-circuit Testers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A printed circuit board has its test terminals directly connected to a test system via the optimal test spring contacts of a double sleeve. The PCB is prefabricated with a copper layer on which the test terminals are strategically formed.

Description

Es ist bekannt, dass InCircuit-Prüfadaptoren bereits mit direkter Adaptierung aber allerdings ohne Doppelhülse und mit einem anderen Verfahren hergestellt wurden. Hierbei wurde die Leiterplatte über manuelle Layouterstellung hergestellt und dieses Verfahren verteuerte die Prüfadapterherstellung erheblich gegenüber manuellen Drahtverbindungen.It is known that InCircuit test adapters already come with direct adaptation but made without a double sleeve and with a different process were. The circuit board was manufactured using manual layout creation and this procedure made the test adapter manufacture considerably more expensive manual wire connections.

Bei beiden bekannten Verfahren, betrug die Herstellungszeit, z. B. bei 2000 Verbindungen mehr als zwei Wochen und beinhaltete die manuelle Fehlerquote. Auch wurde keine Prüfpunktberechnung (Berechnung des strategisch besten Punktes durchgeführt). Dadurch ergaben sich längere Leitungswege, die beim Testen zu Störungen führten.In both known methods, the manufacturing time, z. B. at 2000 Connections more than two weeks and included the manual error rate. Also no checkpoint calculation (calculation of the strategically best Point). This resulted in longer conduction routes, the caused problems during testing.

Der im Patentanspruch 1 angegebenen Erfindung liegt das Problem Störungen beim Testen (kürzeste Leitungswege) zugrunde, die manuelle Fehlerherstellungs­ quote zu beseitigen und die Herstellungszeit sowie Kostenfrage erheblich zu reduzieren.The invention specified in claim 1 is the problem of interference when testing (shortest cable routes) based on manual error production eliminate quote and the manufacturing time and cost issue significantly to reduce.

Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, dass durch die Berechnung der kürzesten Leitungswege Störungen beim Testen entfallen, die Kontaktierung keine Fehler mehr beinhaltet und dass die Verbindungen innerhalb kürzester Zeit durch das Fräsen hergestellt werden können. Spätere Änderungen können sehr leicht durchgeführt werden.The advantages achieved with the invention are in particular that by calculating the shortest cable routes interference during testing are eliminated, the contacting no longer contains errors and that the Connections can be made in a very short time by milling can. Subsequent changes can be made very easily.

Die Anwendung von Patentanspruch 2 ermöglicht es, die Kontaktierung entsprechend den Erfordernissen zum Prüfling und zur Verbindungsleiterplatte durchzuführen. Auch verhindern die beiden Pressringe ein schräges Einschlagen der Hülsen.The application of claim 2 enables contacting according to the requirements for the device under test and the connecting circuit board perform. The two press rings also prevent slanting of the pods.

Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und wird im folgenden näher beschrieben.An embodiment of the invention is shown in the drawing and is described in more detail below.

Es zeigen:Show it:

Fig. 1 Prüfadapteraufbau. Fig. 1 test adapter structure.

Fig. 2 Platine mit sämtlichen Verbindungen, Ansicht von unten. Fig. 2 board with all connections, bottom view.

Fig. 3 Platine mit sämtlichen Verbindungen, Ansicht von oben. Fig. 3 board with all connections, top view.

Fig. 4 Doppelhülse mit zwei Pressringen ohne eingesteckte Prüffederkontakte. Fig. 4 double sleeve with two press rings without inserted test spring contacts.

Fig. 5 Doppelhülse mit zwei Pressringen mit eingesteckten Prüffederkontakten. Fig. 5 double sleeve with two press rings with inserted test spring contacts.

Erklärung zu Fig. 1:
In Fig. 1 ist der Prüfadapteraufbau ersichtlich. Die Platine (Verbindungsplatine) wurde auf der oberen Seite bereits ausgefräst und stellt nun alle benötigten Verbindungen zwischen Prüfadapter und Testsystem her.
Explanation of Fig. 1:
The test adapter structure can be seen in FIG . The board (connection board) has already been milled out on the upper side and now creates all the necessary connections between the test adapter and test system.

Erklärung zu Fig. 2:
In Fig. 2 ist die Verbindungsplatine (Ansicht von unten, Testsystemrichtung) ersichtlich. Auf dieser Unterseite sind alle Testerpins und Powerpins angeordnet und auf die Oberseite an die Strategiepunkte der Verbindungsplatine geführt.
Explanation of Fig. 2:
In FIG. 2, the connecting board (view from below, test system direction) can be seen. All tester pins and power pins are arranged on this underside and led to the strategy points of the connection board on the top side.

Erklärung zu Fig. 3:
In Fig. 3 ist die Verbindungsplatine (Ansicht von oben, Adapterrichtung) ersichtlich.
Hierbei handelt es sich um eine vorgefertigte Multilayerplatine bei der alle Testerpins auf die Oberseite der Verbindungsplatine an die Strategiepunkte geführt sind. In diesem Stadium ist die Oberfläche der Oberseite noch eine Kupferschicht, allerdings mit den vorgefertigten Strategiepunkten.
Mit Hilfe der Software ADA-Connect werden nun die Koordinaten der benötigten Prüfpunkte verifiziert und den Strategiepunkten zugeordnet (es wird der kürzeste Weg gesucht). Diese nun festgelegten Pins werden für die Prüfprogrammerstellung verwendet.
Mit Hilfe der Software ADA-CU-FREE werden nun alle nicht benötigten Kupferflächen freigefräst, d. h. am Schluss bleiben nur noch die benötigten Verbindungen stehen. Diese freigefräste Verbindungsplatte wird nun auf die Unterseite des Adapters geschraubt.
Explanation of Fig. 3:
In Fig. 3 the connection board (view from above, adapter direction) can be seen.
This is a prefabricated multilayer board in which all tester pins are routed to the strategy points on the top of the connection board. At this stage the surface of the top is still a copper layer, but with the pre-made strategy points.
With the help of the ADA-Connect software, the coordinates of the required test points are now verified and assigned to the strategy points (the shortest route is sought). These now defined pins are used for the test program creation.
With the help of the ADA-CU-FREE software, all copper surfaces that are not required are now milled free, ie only the required connections remain at the end. This milled connection plate is now screwed onto the underside of the adapter.

Erklärung zu Fig. 4:
Doppelhülse mit zwei Pressringen ohne eingesteckte Prüffeder- Kontakte: Durch die Doppelhülse kann die Kontaktierung flexibel und direkt entsprechend den Bedürfnissen gestaltet werden, d. h. die Prüffederkontakte können flexibel gesteckt werde. Durch die zwei Pressringe wird ein gerades Einschlagen der Hülse gewährleistet. Auch nach grosser Beanspruchung bei längerer Prüfling bleibt die Hülse gerade und garantiert auch nach längerer Beanspruchung eine excellente Kontaktierung.
Explanation of Fig. 4:
Double sleeve with two press rings without inserted test spring contacts: The contact can be designed flexibly and directly according to requirements, ie the test spring contacts can be inserted flexibly. The two press rings ensure that the sleeve is driven straight in. Even after heavy use with a longer test specimen, the sleeve remains straight and guarantees excellent contact even after extended use.

Erklärung zu Fig. 5:
Doppelhülse mit zwei Pressringe mit eingesteckten Prüffeder­ kontakten.
Explanation of Fig. 5:
Double sleeve with two press rings with inserted test spring.

Claims (2)

1. InCircuit-Prüfadapter mit direkter Prüffederkontaktierung der bestückten Leiterplatte (über Doppelhülse und Leiterplatte) zum InCircuit-Testsystem, dadurch gekennzeichnet, dass die benötigten Prüfpunkt-Verbindungen der bestückten Leiterplatte auf dem InCircuit-Prüfadapter zum Testsystem direkt über Doppelhülse, in der die optimalen Prüffederkontakte selektiert werden und Leiterplatte, die gefräst wird erfolgen. Die zu fräsende Leiterplatte ist bereits mit Strategiepunkten vorgefertigt und hat nur noch auf der Oberseite eine Kupferschicht, die nach Software-Berechnung der Prüfpunkte bearbeitet wird und die Verbindungen herstellt1. InCircuit test adapter with direct test spring contact of the assembled printed circuit board (via double sleeve and printed circuit board) to the InCircuit test system, characterized in that the required test point connections of the assembled printed circuit board on the InCircuit test adapter to the test system directly via double sleeve, in which the optimal test spring contacts be selected and printed circuit board that is milled. The circuit board to be milled is already prefabricated with strategy points and only has a copper layer on the top, which is processed according to the software calculation of the test points and which creates the connections 2. Doppelhülse mit zwei Pressringen nach Patentanspruch 1, dadurch gekennzeichnet, dass auf beiden Seiten ein Prüffederkontakt entsprechend den Erfordernissen eingesetzt werden kann und dass die beiden Pressringe für geraden Sitz in der Nadelträgerplatte (Probe Plate) sorgen.2. double sleeve with two press rings according to claim 1, characterized, that a test spring contact on both sides according to the requirements can be used and that the two press rings for a straight fit in the Provide the probe plate.
DE2000116453 2000-04-01 2000-04-01 In-circuit test adaptors, includes double sleeve with optimal test spring contacts through which the test terminals of a PCB is directly connected to a test system Ceased DE10016453A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE2000116453 DE10016453A1 (en) 2000-04-01 2000-04-01 In-circuit test adaptors, includes double sleeve with optimal test spring contacts through which the test terminals of a PCB is directly connected to a test system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2000116453 DE10016453A1 (en) 2000-04-01 2000-04-01 In-circuit test adaptors, includes double sleeve with optimal test spring contacts through which the test terminals of a PCB is directly connected to a test system

Publications (1)

Publication Number Publication Date
DE10016453A1 true DE10016453A1 (en) 2001-11-15

Family

ID=7637393

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2000116453 Ceased DE10016453A1 (en) 2000-04-01 2000-04-01 In-circuit test adaptors, includes double sleeve with optimal test spring contacts through which the test terminals of a PCB is directly connected to a test system

Country Status (1)

Country Link
DE (1) DE10016453A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3812654A1 (en) * 1987-04-16 1988-11-03 Teradyne Inc DEVICE FOR TESTING CIRCUIT BOARDS
DE29616272U1 (en) * 1996-09-18 1998-01-29 atg test systems GmbH, 97877 Wertheim Adapter for testing electrical circuit boards

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3812654A1 (en) * 1987-04-16 1988-11-03 Teradyne Inc DEVICE FOR TESTING CIRCUIT BOARDS
DE29616272U1 (en) * 1996-09-18 1998-01-29 atg test systems GmbH, 97877 Wertheim Adapter for testing electrical circuit boards

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8131 Rejection