DE10016453A1 - In-circuit test adaptors, includes double sleeve with optimal test spring contacts through which the test terminals of a PCB is directly connected to a test system - Google Patents
In-circuit test adaptors, includes double sleeve with optimal test spring contacts through which the test terminals of a PCB is directly connected to a test systemInfo
- Publication number
- DE10016453A1 DE10016453A1 DE2000116453 DE10016453A DE10016453A1 DE 10016453 A1 DE10016453 A1 DE 10016453A1 DE 2000116453 DE2000116453 DE 2000116453 DE 10016453 A DE10016453 A DE 10016453A DE 10016453 A1 DE10016453 A1 DE 10016453A1
- Authority
- DE
- Germany
- Prior art keywords
- test
- double sleeve
- circuit board
- spring contacts
- optimal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims abstract description 4
- 239000000523 sample Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31707—Test strategies
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
- G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
- G01R31/31915—In-circuit Testers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Es ist bekannt, dass InCircuit-Prüfadaptoren bereits mit direkter Adaptierung aber allerdings ohne Doppelhülse und mit einem anderen Verfahren hergestellt wurden. Hierbei wurde die Leiterplatte über manuelle Layouterstellung hergestellt und dieses Verfahren verteuerte die Prüfadapterherstellung erheblich gegenüber manuellen Drahtverbindungen.It is known that InCircuit test adapters already come with direct adaptation but made without a double sleeve and with a different process were. The circuit board was manufactured using manual layout creation and this procedure made the test adapter manufacture considerably more expensive manual wire connections.
Bei beiden bekannten Verfahren, betrug die Herstellungszeit, z. B. bei 2000 Verbindungen mehr als zwei Wochen und beinhaltete die manuelle Fehlerquote. Auch wurde keine Prüfpunktberechnung (Berechnung des strategisch besten Punktes durchgeführt). Dadurch ergaben sich längere Leitungswege, die beim Testen zu Störungen führten.In both known methods, the manufacturing time, z. B. at 2000 Connections more than two weeks and included the manual error rate. Also no checkpoint calculation (calculation of the strategically best Point). This resulted in longer conduction routes, the caused problems during testing.
Der im Patentanspruch 1 angegebenen Erfindung liegt das Problem Störungen beim Testen (kürzeste Leitungswege) zugrunde, die manuelle Fehlerherstellungs quote zu beseitigen und die Herstellungszeit sowie Kostenfrage erheblich zu reduzieren.The invention specified in claim 1 is the problem of interference when testing (shortest cable routes) based on manual error production eliminate quote and the manufacturing time and cost issue significantly to reduce.
Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, dass durch die Berechnung der kürzesten Leitungswege Störungen beim Testen entfallen, die Kontaktierung keine Fehler mehr beinhaltet und dass die Verbindungen innerhalb kürzester Zeit durch das Fräsen hergestellt werden können. Spätere Änderungen können sehr leicht durchgeführt werden.The advantages achieved with the invention are in particular that by calculating the shortest cable routes interference during testing are eliminated, the contacting no longer contains errors and that the Connections can be made in a very short time by milling can. Subsequent changes can be made very easily.
Die Anwendung von Patentanspruch 2 ermöglicht es, die Kontaktierung entsprechend den Erfordernissen zum Prüfling und zur Verbindungsleiterplatte durchzuführen. Auch verhindern die beiden Pressringe ein schräges Einschlagen der Hülsen.The application of claim 2 enables contacting according to the requirements for the device under test and the connecting circuit board perform. The two press rings also prevent slanting of the pods.
Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und wird im folgenden näher beschrieben.An embodiment of the invention is shown in the drawing and is described in more detail below.
Es zeigen:Show it:
Fig. 1 Prüfadapteraufbau. Fig. 1 test adapter structure.
Fig. 2 Platine mit sämtlichen Verbindungen, Ansicht von unten. Fig. 2 board with all connections, bottom view.
Fig. 3 Platine mit sämtlichen Verbindungen, Ansicht von oben. Fig. 3 board with all connections, top view.
Fig. 4 Doppelhülse mit zwei Pressringen ohne eingesteckte Prüffederkontakte. Fig. 4 double sleeve with two press rings without inserted test spring contacts.
Fig. 5 Doppelhülse mit zwei Pressringen mit eingesteckten Prüffederkontakten. Fig. 5 double sleeve with two press rings with inserted test spring contacts.
Erklärung zu Fig. 1:
In Fig. 1 ist der Prüfadapteraufbau ersichtlich. Die Platine
(Verbindungsplatine) wurde auf der oberen Seite bereits ausgefräst
und stellt nun alle benötigten Verbindungen zwischen Prüfadapter
und Testsystem her.Explanation of Fig. 1:
The test adapter structure can be seen in FIG . The board (connection board) has already been milled out on the upper side and now creates all the necessary connections between the test adapter and test system.
Erklärung zu Fig. 2:
In Fig. 2 ist die Verbindungsplatine (Ansicht von unten,
Testsystemrichtung) ersichtlich. Auf dieser Unterseite sind
alle Testerpins und Powerpins angeordnet und auf die Oberseite
an die Strategiepunkte der Verbindungsplatine geführt.Explanation of Fig. 2:
In FIG. 2, the connecting board (view from below, test system direction) can be seen. All tester pins and power pins are arranged on this underside and led to the strategy points of the connection board on the top side.
Erklärung zu Fig. 3:
In Fig. 3 ist die Verbindungsplatine (Ansicht von oben,
Adapterrichtung) ersichtlich.
Hierbei handelt es sich um eine vorgefertigte Multilayerplatine bei
der alle Testerpins auf die Oberseite der Verbindungsplatine an die
Strategiepunkte geführt sind. In diesem Stadium ist die
Oberfläche der Oberseite noch eine Kupferschicht,
allerdings mit den vorgefertigten Strategiepunkten.
Mit Hilfe der Software ADA-Connect werden nun die
Koordinaten der benötigten Prüfpunkte verifiziert und
den Strategiepunkten zugeordnet (es wird der kürzeste
Weg gesucht). Diese nun festgelegten Pins werden für
die Prüfprogrammerstellung verwendet.
Mit Hilfe der Software ADA-CU-FREE werden nun alle
nicht benötigten Kupferflächen freigefräst, d. h. am Schluss
bleiben nur noch die benötigten Verbindungen stehen.
Diese freigefräste Verbindungsplatte wird nun auf die
Unterseite des Adapters geschraubt.Explanation of Fig. 3:
In Fig. 3 the connection board (view from above, adapter direction) can be seen.
This is a prefabricated multilayer board in which all tester pins are routed to the strategy points on the top of the connection board. At this stage the surface of the top is still a copper layer, but with the pre-made strategy points.
With the help of the ADA-Connect software, the coordinates of the required test points are now verified and assigned to the strategy points (the shortest route is sought). These now defined pins are used for the test program creation.
With the help of the ADA-CU-FREE software, all copper surfaces that are not required are now milled free, ie only the required connections remain at the end. This milled connection plate is now screwed onto the underside of the adapter.
Erklärung zu Fig. 4:
Doppelhülse mit zwei Pressringen ohne eingesteckte Prüffeder-
Kontakte: Durch die Doppelhülse kann die Kontaktierung
flexibel und direkt entsprechend den Bedürfnissen gestaltet
werden, d. h. die Prüffederkontakte können flexibel gesteckt
werde. Durch die zwei Pressringe wird ein gerades Einschlagen
der Hülse gewährleistet. Auch nach grosser Beanspruchung
bei längerer Prüfling bleibt die Hülse gerade und garantiert
auch nach längerer Beanspruchung eine excellente Kontaktierung.Explanation of Fig. 4:
Double sleeve with two press rings without inserted test spring contacts: The contact can be designed flexibly and directly according to requirements, ie the test spring contacts can be inserted flexibly. The two press rings ensure that the sleeve is driven straight in. Even after heavy use with a longer test specimen, the sleeve remains straight and guarantees excellent contact even after extended use.
Erklärung zu Fig. 5:
Doppelhülse mit zwei Pressringe mit eingesteckten Prüffeder
kontakten.Explanation of Fig. 5:
Double sleeve with two press rings with inserted test spring.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2000116453 DE10016453A1 (en) | 2000-04-01 | 2000-04-01 | In-circuit test adaptors, includes double sleeve with optimal test spring contacts through which the test terminals of a PCB is directly connected to a test system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2000116453 DE10016453A1 (en) | 2000-04-01 | 2000-04-01 | In-circuit test adaptors, includes double sleeve with optimal test spring contacts through which the test terminals of a PCB is directly connected to a test system |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10016453A1 true DE10016453A1 (en) | 2001-11-15 |
Family
ID=7637393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2000116453 Ceased DE10016453A1 (en) | 2000-04-01 | 2000-04-01 | In-circuit test adaptors, includes double sleeve with optimal test spring contacts through which the test terminals of a PCB is directly connected to a test system |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE10016453A1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3812654A1 (en) * | 1987-04-16 | 1988-11-03 | Teradyne Inc | DEVICE FOR TESTING CIRCUIT BOARDS |
DE29616272U1 (en) * | 1996-09-18 | 1998-01-29 | atg test systems GmbH, 97877 Wertheim | Adapter for testing electrical circuit boards |
-
2000
- 2000-04-01 DE DE2000116453 patent/DE10016453A1/en not_active Ceased
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3812654A1 (en) * | 1987-04-16 | 1988-11-03 | Teradyne Inc | DEVICE FOR TESTING CIRCUIT BOARDS |
DE29616272U1 (en) * | 1996-09-18 | 1998-01-29 | atg test systems GmbH, 97877 Wertheim | Adapter for testing electrical circuit boards |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE2319011C2 (en) | Method for testing a conductor network on an insulating substrate and arrangement for carrying out the method | |
DE3812654C2 (en) | ||
DE112007000389T5 (en) | Spacing transducer, spacer transducer manufacturing method, and probe card containing the space transformer | |
DE19835840B4 (en) | Manufacturing method for a semiconductor chip | |
DE10259790A1 (en) | Test board for testing semiconductor devices | |
EP1583975A1 (en) | Universal-messadapter-system | |
DE10326317B4 (en) | Test system for testing integrated components | |
DE19961791A1 (en) | Arrangement for testing chips using a printed circuit board | |
DE102020202663A1 (en) | MODULAR WLCSP-DIE-DAISY-CHAIN-DESIGN FOR MULTIPLE DIE-SIZES | |
DE10056882C2 (en) | Method for calibrating a test system for semiconductor components and test substrate | |
DE10016453A1 (en) | In-circuit test adaptors, includes double sleeve with optimal test spring contacts through which the test terminals of a PCB is directly connected to a test system | |
DE10060585A1 (en) | Device and method for examining a semiconductor integrated circuit | |
WO2005078460A1 (en) | Device and method for testing a semi-conductor component having contact surfaces on both sides | |
DE60121820T2 (en) | Process for the production of integrated circuits with improved conductor tracks in so-called "saw arm" shape | |
DE3143768A1 (en) | Adaptor for connecting contact points, arranged in one plane, of a test specimen to the terminals of a test device | |
EP0544148B1 (en) | Method for programming programmable integrated circuits | |
DE69028527T2 (en) | METHOD AND APPARATUS FOR TESTING THE ASSEMBLY OF A VARIETY OF ELECTRICAL COMPONENTS ON A SUBSTRATE | |
DE10146176A1 (en) | Process for rewiring pads in the wafer level package | |
DE10143455B4 (en) | Method and apparatus for testing circuit units to be tested with increased data compression for burn-in | |
DE10147510A1 (en) | In-circuit test adapter for printed circuit board testing uses direct contact sleeves for direct connections between tested printed circuit board an in-circuit testing system | |
DE102005030496B4 (en) | Contacting device and method | |
DE10254520A1 (en) | Line connections formation method for test adapter for non-multiplexed and multiplexed test system for electronic board, involves pressing pins of needle carrier plate into direct route contact plate | |
DE9411360U1 (en) | Measuring board for quality assurance of semiconductors with a special probe tip | |
EP0146782A2 (en) | Adaptation device for the establishment of a removable electrical connection between contact elements | |
DD252695A1 (en) | SOCKET CONTACT MODULE SYSTEM FOR CONSTRUCTION OF ELECTRONIC EXPERIMENTATION CIRCUITS |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8131 | Rejection |