[go: up one dir, main page]

DD284561A5 - Chiptraeger - Google Patents

Chiptraeger

Info

Publication number
DD284561A5
DD284561A5 DD89328937A DD32893789A DD284561A5 DD 284561 A5 DD284561 A5 DD 284561A5 DD 89328937 A DD89328937 A DD 89328937A DD 32893789 A DD32893789 A DD 32893789A DD 284561 A5 DD284561 A5 DD 284561A5
Authority
DD
German Democratic Republic
Prior art keywords
chiptraeger
Prior art date
Application number
DD89328937A
Other languages
English (en)
Inventor
Rainer Rathmann
Uwe Reuter
Lothar Oppermann
Brigitte Rathmann
Original Assignee
Veb Mikroelektronik "Karl Liebknecht" Stahnsdorf,Dd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Veb Mikroelektronik "Karl Liebknecht" Stahnsdorf,Dd filed Critical Veb Mikroelektronik "Karl Liebknecht" Stahnsdorf,Dd
Priority to DD89328937A priority Critical patent/DD284561A5/de
Publication of DD284561A5 publication Critical patent/DD284561A5/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
DD89328937A 1989-05-26 1989-05-26 Chiptraeger DD284561A5 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DD89328937A DD284561A5 (de) 1989-05-26 1989-05-26 Chiptraeger

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD89328937A DD284561A5 (de) 1989-05-26 1989-05-26 Chiptraeger

Publications (1)

Publication Number Publication Date
DD284561A5 true DD284561A5 (de) 1990-11-14

Family

ID=5609430

Family Applications (1)

Application Number Title Priority Date Filing Date
DD89328937A DD284561A5 (de) 1989-05-26 1989-05-26 Chiptraeger

Country Status (1)

Country Link
DD (1) DD284561A5 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0650658A1 (de) * 1992-07-13 1995-05-03 Olin Corporation Elektronisches gehäuse mit einem kontrollierten durchfluss des epoxidharzes

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0650658A1 (de) * 1992-07-13 1995-05-03 Olin Corporation Elektronisches gehäuse mit einem kontrollierten durchfluss des epoxidharzes
EP0650658A4 (de) * 1992-07-13 1996-03-13 Olin Corp Elektronisches gehäuse mit einem kontrollierten durchfluss des epoxidharzes.

Similar Documents

Publication Publication Date Title
DE69033697D1 (de) Mykonematizide
BR9002634A (pt) Poli-alfa-olefina
DE69028192D1 (de) Ablenkjoch
BR9000014A (pt) Classificaodr
DE69027258D1 (de) Phenacylpyridiniothiocephalosporine
DD294367A5 (de) Farbbildroehre
FI904121A0 (fi) Osiensyöttölaite
BR9001818A (pt) Girotrom quase-otico
DE59010414D1 (de) Fluorphenylpyridine
DD284561A5 (de) Chiptraeger
BR9006503A (pt) Copolimero agrilamidios
BR8905416A (pt) Continuador
BR8902938A (pt) Letramatica
DE3991666T1 (de) Glaettbohrer
FI954153A (fi) 3-aroyyli-2-oksindoli-1-karboksamideja
BR9007459A (pt) Aparelho digitalizador
IT8965801A0 (it) Lattina-bicchiere
NO921833L (no) Frisoerkam
SE8902545D0 (sv) Laasspaerr
BR6900796U (pt) Eletro-lamina
SE8903885D0 (sv) Foervaringsskaap
BR8906438A (pt) Super-domino
BR6901354U (pt) Mosquetao
BR8906265A (pt) Aspersorio
BR8906628A (pt) Chin-car

Legal Events

Date Code Title Description
VZ Disclaimer of patent (art. 11 and 12 extension act)