CN2904598Y - Amplifier motherboard cooling device - Google Patents

Abstract

The utility model relates to a heat abstractor of amplifirer mainboard is refered in particular to in amplifirer equipment technical field. The heat radiator is arranged on a main board and is provided with a plurality of fins which are arranged at intervals, the fan is fixed on the fins, the heat radiator also comprises a wind shielding folded plate, and the wind shielding folded plate covers the upper part and three side parts of the fins so that gaps among the fins are communicated with the outside only through the other side part. After adopting above-mentioned structure, in fact be equivalent to increasing a hot-blast guiding device, directly the water conservancy diversion is to quick-witted case outside with hot-blast, reaches good radiating effect in the true sense, protects the power amplifier mainboard.

Description

Amplifier motherboard cooling device

Technical field:

The utility model relates to the technical field of power amplifier equipment, in particular to a heat dissipation device for a main board of a power amplifier.

Background technique:

In the technical field of electronic products such as power amplifiers and computers, integrated circuits and large-scale integrated circuits are distributed on the main board, which will generate a lot of heat during operation. If the generated heat is not discharged smoothly in time, it is easy to burn the circuit and circuit board. In severe cases, it can cause a fire. Therefore, people all will install cooling device on parts such as the CPU of power amplifier mainboard, computer. Existing cooling devices generally consist of a heat sink and a fan. The heat sink is attached to the main board or the CPU, and the fan rotates to make air flow, thereby dissipating heat. However, in the existing installation method, the general fan draws air from the main board or the CPU and blows it from the inside to the outside. Because of the small internal space and thin air volume, the heat dissipation effect is not good; in addition, the hot air blown by the existing cooling device , because the wind speed is not enough, it is not directly exported to the outside of the chassis, but still stays inside the chassis, it is easy to form a hot air circulation, and it is getting hotter and hotter, and the temperature is getting higher and higher, which will cause local overheating of the heat sink and keep burning the fan itself The material is made of plastic, which in turn causes a vicious cycle of deformation of the fan and a decrease in speed. In more serious cases, the fan will stop, the motor circuit will be short-circuited, the motherboard or CPU will be burned, and even a fire will occur.

Utility model content:

The purpose of the utility model is to overcome the above-mentioned shortcomings of the existing heat dissipation device, and provide a heat dissipation method and a heat dissipation device with good heat dissipation effect.

The technical solution adopted by the utility model to achieve its purpose is: it includes a radiator and a fan, the radiator is installed on the main board, the radiator has a plurality of fins arranged at intervals, the fan is fixed on the fins, and the heat dissipation device also includes a windshield plate, and the windshield flap covers the top and three sides of the fins so that the gap between the fins communicates with the outside world only through the other side.

The windshield flaps are generally made of materials with poor thermal conductivity, so as to prevent the air around the windshield flaps from being heated and cause the fan to blow hot air.

The fan is installed at the inner end of the radiator, and the outer end of the radiator extends to the panel of the power amplifier and communicates with the outside of the power amplifier. The fan blows air to the radiator.

The purpose of adopting the above structure is: the fan blows air to the radiator, because the gap between the fins of the radiator and the internal space of the chassis is blocked by the windshield flap, so the hot air can only be blown out from the place communicating with the outside of the chassis, and directly discharged out of the chassis In addition, it avoids the hot air remaining in the chassis, forming a hot air circulation.

After the utility model adopts the above-mentioned structure, it is actually equivalent to adding a hot air guide device, which directly guides the hot air to the outside of the chassis, achieves a good heat dissipation effect in a real sense, and protects the main board of the power amplifier.

Description of drawings:

Fig. 1 is the three-dimensional effect diagram after the utility model is combined;

Fig. 2 is an exploded schematic diagram of the utility model.

Detailed ways:

Below in conjunction with accompanying drawing, the utility model is further described.

As shown in Figure 1, the utility model comprises a radiator 1, a fan 2 and a windshield flap 3. The radiator 1 is a commonly used finned radiator, and the whole is a cuboid, and its bottom surface is attached to the main board of the power amplifier. The top is vertically provided with a plurality of fins 11 arranged at intervals, and the fan 2 is installed on the fins 11 of the radiator 1, and its size is equivalent to the width of the radiator 1, and is installed along the inner edge of the radiator 1.

The position exposed above the fins 11 of the radiator 1 is covered with a windshield flap 3, and the windshield flap 3 also covers the inner end and the front and rear sides of the radiator 1, that is, the whole radiator 1 only has the The fan 2 and the outer end communicate with the outside world, and the outer end of the radiator 1 extends to the panel of the power amplifier and communicates with the outside of the chassis, and communicates with the inner space of the chassis through the fan 2. When blowing air in the device 1, due to the function of the windshield flap 3, the hot air will flow to the outside of the power amplifier along the gap between the fins 11, and the windshield flap 3 has poor thermal conductivity, which is conducive to maintaining the air temperature in the chassis , so as to form a cold and hot cycle, so that the heat can be exported smoothly, and the normal operation of the main board of the power amplifier can be protected.

To sum up, the utility model has a simple structure, and the heat dissipation effect is better than that of ordinary heat dissipation devices.

Claims (3)

1. A power amplifier motherboard cooling device, it comprises radiator (1) and fan (2), radiator (1) is installed on the motherboard, radiator (1) has the fins (11) that most intervals are arranged, fan (2) fixed on the fins (11), characterized in that: the cooling device also includes a windshield flap (3), and the windshield flap (3) covers the top of the fin (11) and the three The side makes the gap between the fins (11) communicate with the outside only through the other side. 2. The cooling device for the main board of the power amplifier according to claim 1, characterized in that: the fan (2) is installed at the inner end of the radiator (1), and the outer end of the radiator (1) extends to the panel of the power amplifier and is connected to the power amplifier panel. The power amplifier is connected externally. 3. The cooling device for the motherboard of the power amplifier according to claim 2, characterized in that: the fan (2) blows air to the radiator (1).

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