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CN2804929Y - computer case - Google Patents

computer case Download PDF

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Publication number
CN2804929Y
CN2804929Y CN 200520057752 CN200520057752U CN2804929Y CN 2804929 Y CN2804929 Y CN 2804929Y CN 200520057752 CN200520057752 CN 200520057752 CN 200520057752 U CN200520057752 U CN 200520057752U CN 2804929 Y CN2804929 Y CN 2804929Y
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CN
China
Prior art keywords
cpu
heat
heat radiation
radiation window
casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 200520057752
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Chinese (zh)
Inventor
李佳达
石劲松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN 200520057752 priority Critical patent/CN2804929Y/en
Application granted granted Critical
Publication of CN2804929Y publication Critical patent/CN2804929Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

本实用新型公开了一种电脑机箱,包括箱体,所述箱体上设有CPU散热窗,能够使得CPU的散热装置直接向箱体外散热。本实用新型有益的效果在于:在机箱箱体上设置CPU散热窗使得CPU芯片的散热装置能够直接向机箱外散热,不仅有利于降低芯片的温度,同时也减轻了机箱内的散热负担,有利于其他元件的正常工作。

The utility model discloses a computer case, including a case body, wherein the case body is provided with a CPU heat dissipation window, which enables the heat dissipation device of the CPU to directly dissipate heat outside the case body. The utility model has the beneficial effect that the CPU heat dissipation window is provided on the case body, so that the heat dissipation device of the CPU chip can directly dissipate heat outside the case body, which is not only conducive to reducing the temperature of the chip, but also reduces the heat dissipation burden in the case body, which is conducive to the normal operation of other components.

Description

Computer housing
[technical field]
The utility model relates to the computing machine peripheral equipment, is specifically related to a kind of computer housing.
[background technology]
Existing computer housing mostly dispels the heat to cabinet inside by the fan that is arranged on the housing.Along with the continuous development of computer chip, its thermal value also increases gradually, general main chip, and CPU for example, video card kernel processor chips etc. all can adopt independently heat abstractor such as fan, heat radiator.Chip elder generation to the heat radiator of being close to it, quickens heat transferred to exhale with heat by fan fixing on the heat radiator again.Because these heat abstractors all are enclosed in cabinet inside, its heat that gives out can only be delivered to the outside by case fan, thereby can't accomplish to reduce timely and effectively chip temperature.And along with the chip prolongation of service time, temperature in the cabinet is more and more higher, cause the heat radiator and the fan of chip itself almost can not to bring into play what effect, chip is easy to break down because temperature is too high, causes the phenomenons such as deadlock that occur after computer is started shooting for a long time in the use.At present, quite high for dominant frequency, various advanced persons' water-cooled, liquid cooling apparatus have appearred in chip that thermal value is relatively large.But owing to these water-cooleds, the most bulky of liquid cooling apparatus; therefore regular meeting occupies the interior big quantity space of cabinet when mounted; for the installation and the trace arrangements of other hardware are brought very big difficulty; and; because chip heat radiator generally all directly is fixed on the mainboard, its heavy component also can bring the threat of very big generation distortion to the vertical mainboard that generally adopts.
[summary of the invention]
The technical problems to be solved in the utility model provides a kind of computer housing that better radiating effect can be provided for computer chip.
For achieving the above object, the technical scheme that the utility model adopted is, a kind of computer housing comprises casing, and described casing is provided with CPU heat radiation window, can make the heat abstractor of CPU directly dispel the heat outside casing.
Preferably, also comprise CPU radiating fin, described CPU radiating fin is fixed in the described CPU heat radiation window, and the side of CPU radiating fin in cabinet is used to be close to the CPU surface and carries out the heat conduction.Can increase the area of CPU heat radiation window as required, this means the wherein area of fixing heat radiator of increase certainly, for example can just adopt heat radiator to be used as a complete side of casing with the whole side of casing all as CPU heat radiation window.
In addition preferably, the casing around the described CPU heat radiation window is provided with stationary installation, is used for fixing the heat abstractor that connects CPU.
In addition preferably, also be coated with dust cover on the described CPU heat radiation window.
In addition preferably, described CPU heat radiation window is the opening of outstanding tank surface, the heat abstractor of CPU can be contained in wherein.
The utility model adopts technique scheme, useful effect is: 1) CPU heat radiation window is set on the cabinet casing makes the heat abstractor of cpu chip directly to dispel the heat outside cabinet, not only help reducing the temperature of chip, also alleviate simultaneously the heat radiation burden in the cabinet, helped the operate as normal of other elements.2) directly in CPU heat radiation window, CPU radiating fin is set, directly the CPU that is installed on the mainboard in the cabinet is carried out passive heat radiation by this heat radiator, the problems such as noise of using radiator fan and bringing have been solved, realize super-silent operation, also removed the burden that mainboard need be fixed heavy heat abstractor, and this structure also avoided dust from the heat radiation window enter in the cabinet may, for system's operation provides environment more reliably.3) adopt large-area heat radiator (heat radiator even can become a complete face of cabinet), not only can better dispel the heat to CPU, simultaneously, to other elements on the whole mainboard, and the bulk temperature environment in the cabinet has all brought good regulating action.4) on the casing of heat radiation around the window, stationary installation is set, is used for fixing or the heat abstractor of auxiliary fixation of C PU, make heat abstractor no longer become the mainboard white elephant, strengthened the reliability and stability of using.5) on the heat radiation window, add dust cover, avoid because increase laying dust increases in the casees that opening caused more on cabinet.6) window that will dispel the heat is arranged to the opening of outstanding tank surface, make heat abstractor to be placed in one and stretch out outside the cabinet fully, like this, design to the heat abstractor of CPU will no longer be subjected to the restriction of space and volume, weight etc. in the case, and owing to directly dispel the heat outside cabinet, the effect of heat radiation also can be greatly improved.When using the utility model cabinet, should be used cpu chip and heat abstractor thereof and be arranged in the mainboard at other element slot back sides, this mainboard has been applied for Chinese patent, application number is 031403557, this application is published on the 20th volume the 30th phase utility model patent communique on July 28th, 2004, and publication number is CN1515977A." mainboard " mentioned in the following embodiments is the described mainboard of this patented claim.
Below by embodiment also in conjunction with the accompanying drawings, the utility model is described in further detail:
[Figure of description]
Fig. 1 is computer housing one and the part hardware configuration synoptic diagram of installing wherein.
Fig. 2 is computer housing two and the part hardware configuration synoptic diagram of installing wherein.
Fig. 3 is computer housing three and the part hardware configuration synoptic diagram of installing wherein.
Fig. 4 is computer housing four and the part hardware configuration synoptic diagram of installing wherein.
Fig. 5 is computer housing five and the part hardware configuration synoptic diagram of installing wherein.
Fig. 6 is computer housing six and the part hardware configuration synoptic diagram of installing wherein.
[embodiment]
Embodiment one, computer housing one in conjunction with Fig. 1, comprise casing 1, and described casing 1 is provided with CPU heat radiation window 2.3 is mainboards, its cpu chip (being positioned at heat abstractor 4 belows does not draw in the drawings) and CPU heat abstractor 4 are arranged on (comprising fan and the heat radiator of being close to cpu chip) back side of other element slots, mainboard 3 is installed in the casing 1, heat abstractor 4 can directly dispel the heat outside casing over against chip cooling window 2.During use, the fan of heat abstractor 4 directly blows to the cabinet outside with the heat that chip produces.
Embodiment two, computer housing two, in conjunction with Fig. 2, its structure and embodiment one are basic identical, just also comprise CPU radiating fin 5, described CPU radiating fin 5 is fixed in the described CPU heat radiation window 2, and the side of CPU radiating fin 5 in cabinet is close to cpu chip 6 surfaces that are positioned on the mainboard 3 and carried out the heat conduction.Because this cabinet has comprised CPU radiating fin 5, therefore need not extra CPU heat abstractor.
Embodiment three, computer housing three, in conjunction with Fig. 3, its structure and embodiment two are basic identical, and just the enlarged areas of its CPU heat radiation window 2 is to the whole side of casing, and corresponding C PU heat radiator 5 becomes a complete side of casing.
Embodiment four, computer housing four, in conjunction with Fig. 4, its structure and embodiment one are basic identical, just also are coated with latticed dust cover on described CPU heat radiation window 2.
Embodiment five, computer housing five, in conjunction with Fig. 5, its structure and embodiment one are basic identical, and just also fixedly connected with the casing around the CPU heat radiation window 2 by fastener 7 in the top of CPU heat abstractor 4.
Embodiment six, another computer housing, in conjunction with Fig. 6, its structure and embodiment one are basic identical, and just CPU heat radiation window is the opening of outstanding tank surface, and CPU heat abstractor 4 is contained in the opening of this projection.
The utility model cabinet is particularly suitable for but is not limited to as machine box for server, the rack unit that also can be used as data center after its profile is carried out adaptations uses, therefore " casing " speech that uses in the utility model only represents to have the running space that holds CPU and related hardware, and not as any qualification to its concrete shape.As long as the radiator structure that the running space of CPU and related hardware has adopted the utility model to provide is provided, all should be considered as within protection domain of the present utility model.

Claims (7)

1, a kind of computer housing comprises casing, it is characterized in that: described casing is provided with CPU heat radiation window, can make the heat abstractor of CPU directly dispel the heat outside casing.
2, computer housing according to claim 1 is characterized in that: also comprise CPU radiating fin, described CPU radiating fin is fixed in the described CPU heat radiation window, and the side of CPU radiating fin in cabinet is used to be close to the CPU surface and carries out the heat conduction.
3, computer housing according to claim 2 is characterized in that: described CPU heat radiation window is the whole side of casing.
4, computer housing according to claim 1 is characterized in that: the casing around the described CPU heat radiation window is provided with stationary installation, is used for fixing the heat abstractor that connects CPU.
5, according to claim 1 or 4 described computer housings, it is characterized in that: also be coated with dust cover on the described CPU heat radiation window.
6, according to claim 1 or 4 described computer housings, it is characterized in that: described CPU heat radiation window is the opening of outstanding tank surface, the heat abstractor of CPU can be contained in wherein.
7, computer housing according to claim 5 is characterized in that: described CPU heat radiation window is the opening of outstanding tank surface, the heat abstractor of CPU can be contained in wherein.
CN 200520057752 2005-04-25 2005-04-25 computer case Expired - Fee Related CN2804929Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200520057752 CN2804929Y (en) 2005-04-25 2005-04-25 computer case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200520057752 CN2804929Y (en) 2005-04-25 2005-04-25 computer case

Publications (1)

Publication Number Publication Date
CN2804929Y true CN2804929Y (en) 2006-08-09

Family

ID=36910218

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200520057752 Expired - Fee Related CN2804929Y (en) 2005-04-25 2005-04-25 computer case

Country Status (1)

Country Link
CN (1) CN2804929Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107908259A (en) * 2017-12-27 2018-04-13 黄河科技学院 Spherical host body structure with circulating type heat dissipation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107908259A (en) * 2017-12-27 2018-04-13 黄河科技学院 Spherical host body structure with circulating type heat dissipation
CN107908259B (en) * 2017-12-27 2019-01-11 黄河科技学院 Spherical host body structure with circulating type heat dissipation

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C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee