CN2762442Y - 10 Gbps photoelectric conversion module - Google Patents

Abstract

The utility model discloses a 10 Gbps photoelectric conversion module, particularly a signal conversion module. A printed circuit board 9 which is provided with a power supply unit 1, a clock circuit 2, a CDR chip 3, a detector 4, a GPO connector 5, a signal control circuit 6, a 24PIN pin 7 and a pigtail 8 is horizontally arranged in a shell 10. The CDR chip 3 is respectively connected with the clock circuit 2 and the detector 4 through coplanar differentiating waveguide wires which have the same length, the power supply unit 1 is connected with other parts, the signal control circuit 6 is connected with the detector 4 and the 24PIN pin 7, and the detector 4 is connected with the pigtail 8. The utility model causes a received 10Gbps light signal to be converted to a weak electrical signal, and data and a clock signal are recovered to achieve corresponding output amplitude after treated through the CDR chip 3 and are outputted through the GPO connector 5. The utility model has the characteristics of compact structure, simple interface, convenient use, wide application scope, etc. which is not only particularly suitable for high-speed photoelectric metering equipment and instruments, but is also applicable to an 10Gbps optical transmission apparatus.

Description

The 10Gbps photoelectric conversion module

Technical field

The utility model relates to a kind of signal conversion module, relates in particular to a kind of 10Gbps photoelectric conversion module.

Background technology

Because the continuous development of optical communication technique, transmission rate is more and more higher.The report that has occurred single channel superelevation speed (the above speed of 10Gbps) optical communication system and opto-electronic device in recent years; It has represented the state-of-the-art of current optical communication technique development.Critical component is above optical transmission module of 10Gbps and Optical Receivers in the superelevation speed optical communication equipment.

Existing 10Gbps light sends and Optical Receivers adopts MSA (Multi SourceAgreement multi-source agreement) 300PIN interface or XFP (the hot-swappable optical module of the little encapsulation of 10Gbps) interface pattern often, the output signal of telecommunication or 16*622Mbps data and clock signal, or the 10Gbps data-signal is only arranged, and do not have the 10Gbps clock signal.In some specific occasion, in high-performance optical electrical testing instrument, often need to use simultaneously the 10Gbps light signal and the signal of telecommunication, and require to provide simultaneously clock and the data-signal of 10Gbps.

Summary of the invention

The purpose of this utility model just is to overcome the deficiency that existing product exists, a kind of 10Gbps photoelectric conversion module is provided, be a kind of the 10Gbps light signal to be converted to the optical module of the signal of telecommunication, adopt unique encapsulation and I/O mode, to adapt to user's demand.

The purpose of this utility model is to realize like this.

As seen from Figure 1, Figure 2, the utility model is made of power supply module 1, clock circuit 2, CDR chip 3, detector 4, GPO connector 5, signal control circuit 6,24PIN contact pin 7, tail optical fiber 8, printed circuit board (PCB) 9, shell 10;

Its position relation is: clock circuit 2 is positioned at the top of printed circuit board (PCB) 9, power supply module 1 is positioned at the following middle part of printed circuit board (PCB) 9, GPO connector 5 is positioned at printed circuit board (PCB) 9 left hand edges, and CDR chip 3 is positioned at printed circuit board (PCB) 9 middle parts, and detector 4 is arranged in printed circuit board (PCB) 9 right parts; Signal control circuit 6 is positioned at printed circuit board (PCB) 9 lower right corner; Printed circuit board (PCB) 9 levels are installed in the shell 10.

Its annexation is: in shell 10, be horizontally disposed with printed circuit board (PCB) 9, power supply module 1, clock circuit 2, CDR chip 3, detector 4, GPO connector 5, signal control circuit 6,24PIN contact pin 7, tail optical fiber 8 are installed on printed circuit board (PCB) 9; CDR chip 3 is connected with clock circuit 2, detector 4, GPO connector 5 respectively by isometric coplane difference waveguide wire; Each parts of power supply module 1 and other are connected; Signal control circuit 6 is connected with detector 4,24PIN contact pin 7; Detector 4 is connected with tail optical fiber 8.

The utility model adopts the self-defined encapsulation and the I/O mode of shell 10,24PIN contact pin 7, GPO connector 5.

Operation principle of the present utility model is:

Be provided with in the power supply module 1 power-switching circuit realization+5V to+3.3V ,+5V is to the voltage transformation work of+30V, for each parts provides working power; Clock circuit 2 provides optional reference clock (155M or 622M) for CDR chip 3; Detector 4 changes the 10Gbps light signal that receives into the faint signal of telecommunication, after handling through CDR chip 3, and restore data and clock signal, and reach corresponding output amplitude, by 5 outputs of GPO connector; Power supply module 1 and signal control circuit 6 adopt 24PIN contact pin 7 to draw.

The utlity model has following advantage and good effect:

Have characteristics such as compact conformation, interface is simple, application is convenient, widely applicable, be particularly suited for high speed optoelectronic tester and instrument, also can be applicable in the 10Gbps optical transmission device.

Description of drawings

Fig. 1-the utility model structural representation;

Fig. 2-the utility model encapsulation three-view diagram.

Wherein:

1-power supply module, a kind of circuit that direct current+5V is changed into high direct voltage.

2-clock circuit, a kind of circuit that 155M or 622M clock can be provided.

3-CDR chip, a kind of 10Gbps clock and data recovery chip is realized the data of high speed signal and the restore funcitons of clock, has the signal amplification simultaneously.

4-photo-detector, a kind of integrated PIN (photodiode) or APD (avalanche diode) device, inside is integrated trans-impedance amplifier, the preliminary conversion of realization photosignal.

5-GPO connector, a kind of high-speed signal connector, flank speed can reach 40Gbps.

6-signal control circuit, a kind of control circuit at input/output signal is realized the isolation and the amplification of input/output signal.

The 7-24PIN contact pin.

8-tail optical fiber.

9-printed circuit board (PCB).

10-shell.

Embodiment

1, parts are selected

Power supply module 1 is selected MAX1771 for use.

Clock circuit 2 is selected MAX8115 155M/622M CDR chip for use.

CDR chip 3 is selected LXT16713XC 10Gbps CDR chip for use.

Detector 4 is selected PTHS992 PIN-TIA detector for use.

GPO connector 5 is selected GPO-JWHD circuit board mount type GPO connector for use.

Signal control circuit 6 is selected the LM258 operational amplifier for use.

24PIN contact pin 7 is selected the single contact pin of military products for use.

2, multilayer circuit board design

Fully take into account of the specific (special) requirements of 10Gbps high speed signal, carry out the multilayer circuit board design the pcb board design.

Level number	Describe
		1	Top layer: element, signal
2	Intermediate layer 1: power supply/ground
		3	Intermediate layer 2: ground/power supply
4	Bottom: element, signal

The multi-layer sheet distribution of sizes:

Gross thickness: 60*0.0254=1.5mm

Top layer, bottom single ended line 7mil (1mil=0.0254mm), 50 ohm of resistance values;

Difference live width 5mil, 8mil spacing, 100 ohm of resistance values;

3, compound mode flexibly

Fully take into account the compatibility of APD detector, because the PIN detector is received in the module and will be widely adopted at 10G single-shot list, and want compatible APD detector, so adopt the design of plug-in type hardboard, in the time that APD must be used, special hardboard can be installed in corresponding via hole place.Hardboard plug-in unit pin is defined as:

PIN No	Description	PIN No	Description
				1	VCC	5	R Thermal
2	GND	6	Vout
				3	R+	7	Reserved
4	R-	8	Reserved

Note：

1) R+/R-: be the two ends of external potentiometer or resistance

2) R Thermal: be thermistor pin in the detector

3) Vout: output voltage pin

4, the selection of interface mode

The GPO connector is adopted in electricity mouthful I/O.Main cause is that the GPO size is little, wide frequency range (0 ~ 40GHz), and be standard universal type interface, be easy to install and use.No. 2 half gentle lines (or half firm line) that can provide module to arrive instrument face plate simultaneously connect, and changeing provides the user to use with SMA or K/V Connector pattern.

5, substantially the encapsulation and pin definitions

The definition of product A 24Pin and description

No	Name	No	Name
				1	+5V	13	FFU

2	+ 3.3V (optional)	14	FFU
				3	GND	15	FFU
4	-5.2V	16	FFU
				5	LOS	17	FFU
6	LOL	18	FFU
				7	Rx Power Alarm	19	FFU
8	TBD	20	FFU
				9	TBD	21	FFU
10	FFU	22	FFU
				11	FFU	23	FFU
12	FFU	24	FFU

Note：

1) LOS: loss of signal alarm

2) LOL: signal losing lock alarm

3) Rx Power Alarm: input No Light Alarm

4) TBD: be about to definition, in the planning

5) FFU: may use later on

6)+and 5/-5.2V dual power supply and+5/-5.2 ,+3.3V three power supply powering modes are optional.

Claims (7)

1, a kind of 10Gbps photoelectric conversion module is characterized in that:

In shell (10), be horizontally disposed with printed circuit board (PCB) (9); Power supply module (1), clock circuit (2), CDR chip (3), detector (4), GPO connector (5), signal control circuit (6), 24PIN contact pin (7), tail optical fiber (8) are installed on printed circuit board (PCB) (9); CDR chip (3) is connected with clock circuit (2), detector (4), GPO connector (5) respectively by isometric coplane difference waveguide wire; Power supply module (1) is connected with other each parts; Signal control circuit (6) is connected with detector (4), 24PIN contact pin (7); Detector (4) is connected with tail optical fiber (8).

2, by the described a kind of 10Gbps photoelectric conversion module of claim 1, it is characterized in that:

Power supply module (1) is selected MAX1771 for use.

3, by the described a kind of 10Gbps photoelectric conversion module of claim 1, it is characterized in that: clock circuit (2) is selected MAX8115 155M/622M CDR chip for use.

4, by the described a kind of 10Gbps photoelectric conversion module of claim 1, it is characterized in that:

CDR chip (3) is selected LXT16713XC 10Gbps CDR chip for use.

5, by the described a kind of 10Gbps photoelectric conversion module of claim 1, it is characterized in that:

Detector (4) is selected PTHS992 PIN-TIA detector for use.

6, by the described a kind of 10Gbps photoelectric conversion module of claim 1, it is characterized in that:

GPO connector (5) is selected GPO-JWHD circuit board mount type GPO connector for use.

7, by the described a kind of 10Gbps photoelectric conversion module of claim 1, it is characterized in that:

Signal control circuit (6) is selected the LM258 operational amplifier for use.

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