CN2747819Y

CN2747819Y - Printed circuit board preventing ESD

Info

Publication number: CN2747819Y
Application number: CN 200420081511
Authority: CN
Inventors: 蔡书孔
Original assignee: Huanda Computer Shanghai Co Ltd; Mitac International Corp
Current assignee: Huanda Computer Shanghai Co Ltd; Shanghai Huanda Computer Technology Co Ltd; Mitac International Corp
Priority date: 2004-08-06
Filing date: 2004-08-06
Publication date: 2005-12-21
Anticipated expiration: 2014-08-06

Abstract

The utility model relates to a printed circuit board preventing electrostatic discharge, comprising a conductor layer, an embedded conducting element, a ground layer, an insulation layer and through holes, wherein, electric current passes through the conductor layer. The embedded conducting element is connected with the conductor layer and is provided with a point which is enough to generate point discharge effect. The ground layer is made of conducting materials and is adjacent to the point. The ground layer is used to receive electric charges released from the point and lead the electric charges into the main ground. The insulation layer forms between the conductor layer and the ground layer and is used to isolate electric current between the conductor layer and the ground layer. The through holes form in the insulation layer and hold the embedded conducting element and the point of the embedded conducting element and is between the conductor layer and the ground layer. When the printed circuit board (PCB) encounters extrinsic influences and generates electrostatic discharge effect, one can make use of point discharge effect generated by the structure to lead rapid electric current into the main ground to prevent electrostatic sensing elements or microcircuits from breakage and failure.

Description

Prevent the printed circuit board (PCB) of Electrostatic Discharge

Technical field

The utility model is a kind of printed circuit board (PCB), particularly a kind of printed circuit board (PCB) that prevents Electrostatic Discharge.

Background technology

A lot of electrostatic problems all are because people do not have static discharge (ElectroStatic Discharge, ESD) consciousness causes, even also there are a lot of people to suspect whether static discharge can cause damage to electronic product now, this is because most of damage of electrostatic discharge occur in below people's the sensation, because human body is about 3KV to the sense voltage of static discharge, and many electronic components will damage when several hectovolts even tens volts, usually electronic component does not have obvious limit after being damaged by static discharge, element is installed in printed circuit board (PCB) (PCB) goes up later on detection again, a lot of problems can appear in the result, analyze also quite difficulty.Particularly potential damage, promptly use precision instrument also to be difficult to measure its performance obvious variation is arranged, so a lot of Electronics Engineers and designer leave a question open to the damage that static discharge caused, in recent years experimental data confirms, this potential damage is after certain hour, because the infringement that is subjected to static discharge is for having cumulative bad, then the reliability of electronic product can obviously descend.

And the main effective means of protection microelectronic circuit component is to set up the protection loop when element is made.The design protection loop need be taken all factors into consideration between three key elements: the position (static discharge control) of the major function of element, element manufacturing restriction (for example gentle material behavior of shield water) and element.Protective circuit must be rapider than protected element for the reaction of static discharge moment.Though typical element protection can be obtained by the design loop, do not destroy problem yet there is element manufacturer can eliminate static discharge fully, therefore; also need the additional protection measure; thus, certainly will be on the cost of material with lifting, and also take element and have spendable area.

Summary of the invention

The technical problem that the utility model institute desire solves is to be additional on the printed circuit board (PCB) with minimum Material Cost, and can prevent that the static discharge effect from causing Electrostatic Discharge Sensitive and microcircuit to destroy the situation of the inefficacy that causes, and under the prerequisite of add ons, create the purpose of the maximum usage space of printed circuit board (PCB) to occupy the configuration of printed circuit board (PCB) minimum space.

The utility model proposes a kind of static discharge (ElectroStatic Discharge that prevents, ESD) printed circuit board (PCB), comprise conductor layer, embedded conducting element, ground plane, insulating barrier and perforation, wherein conductor layer provides electric current to pass through, embedded conducting element is connected in conductor layer, has the tip that is enough to produce the point discharge effect, ground plane also is a conductive material, adjacent with the tip, be used for receiving the most advanced and sophisticated electric charge that is discharged and import main ground, insulating barrier is formed between conductor layer and the ground plane, be used for completely cutting off the electric current between conductor layer and the ground plane, perforation is formed in the insulating barrier, holds embedded conducting element and tip thereof, and between conductor layer and ground plane, by this when printed circuit board (PCB) (PCB) suffers alien influence generation static discharge effect, the point discharge effect of utilizing this structure to produce imports main ground with rapid electric current, prevents that Electrostatic Discharge Sensitive or microcircuit from being destroyed and lost efficacy.

Utilize the utility model, when printed circuit board (PCB) when external static discharge disturbing effect takes place, its electric current that sharply produces will be received by ground plane, and then import mainly, this measure will prevent effectively that the electronic component on the printed circuit board (PCB) is subjected to electrostatic breakdown, therefore and the Material Cost of printed circuit board (PCB) can be kept, and open ended electronic component also will increase on the printed circuit board (PCB), indirect expansion the additional function on the printed circuit board (PCB).

Description of drawings

Fig. 1 discloses the printed circuit board (PCB) schematic diagram that prevents Electrostatic Discharge for the utility model;

Fig. 2 is the first example structure schematic diagram;

Fig. 3 is the second example structure schematic diagram.

Embodiment

Generally under the highfield effect, the place that body surface curvature is big (as top sharp-pointed, fines), equipotential plane is close, and electric field strength increases severely, and near the air causing is ionized and produces gas discharge, and this phenomenon is called corona discharge.And point discharge is a kind of of corona discharge, near air ionization its special fingertip end and produce the phenomenon of gas discharge, so the phenomenon of point discharge will take place, except enough high voltage will be arranged, also suitable form fit must be arranged, just accomplish easily, and the utility model is the combination that utilizes between the conductive layer on the printed circuit board (PCB), most advanced and sophisticated hardware and the ground plane, flow into main ground with the guiding electrostatic charge, prevent that electrostatic charge from causing high voltage to destroy electronic component.

Please refer to Fig. 1, illustrate that the utility model exposure is in order to prevent static discharge (ElectroStaticDischarge, ESD) printed circuit board (PCB), include: conductor layer 200 provides electric current to pass through, and be connected in the easy input/output terminal that suffers the static discharge effect, it is the conducting metal material, possesses the condition of general conductor layer, include that conductivity height, tensile strength are big, deflection, proportion is little and durable characteristics such as not perishable, as copper, silver and tin conductor layer etc.

Embedded conducting element is connected in conductor layer 100 in the scolding tin mode, has the tip that is enough to produce point discharge, its tip refers to that the big place of body surface curvature (as top sharp-pointed, fines) is for having most advanced and sophisticated shape, can utilize the dense characteristic of its most advanced and sophisticated equipotential plane, when electric field strength increased severely, near the air causing was ionized and produces gas discharge; Its embedded conducting element 300 is in order to guide current, also will start living rapid a large amount current steering to most advanced and sophisticated by static discharge, to possess the essential condition of point discharge, the shape of wherein embedded conducting element 300 is not limited to the disclosed taper of the utility model, every possess most advanced and sophisticated metal coupling and all be covered by the utility model institute restricted portion, for example coniform, sheet triangle and needle-like etc.

Ground plane 400 is most advanced and sophisticated adjacent with embedded conducting element 300, prevents that on the one hand conductor layer 200 from producing the electric phenomenon that is short-circuited that contacts with ground plane 400, and nearer on the other hand distance will help in the point discharge, the transmission of electrostatic charge between material; The material of ground plane 400 also is an electric conducting material, for example copper, tin and silver etc., and it is parallel with conductor layer 200, to obtain best screen worn-out (Shielding) effect, reaches the purpose that prevents to produce in the electric signal transmission course noise (noise); Its ground plane 400 is in order to receive the electric charge that the tip discharged of embedded conducting element 200, directly imports main ground, prevents printed circuit board (PCB) because of suffering rapid rush of current, thereby destruction internal electronic element circuit.

Insulating barrier 100 is formed between conductor layer 200 and the ground plane 400, the material that its material is heat insulation for insulation, can't be crooked, in order to the electric current between isolated conductor layer 200 and the ground plane 400, prevent that conductor layer 200 from producing the electric phenomenon that is short-circuited that contacts, for example glass epoxy resin (GlassEpoxy) or similar material etc. with ground plane 400.

Perforation 150 is formed in the insulating barrier 100, and in order to holding embedded conducting element 300, and the tip of embedded conducting element 300 is arranged in the perforation 150 of insulating barrier 100, and between conductor layer 200 and ground plane 400; Its perforation 150 be shaped as hollow cylindrical, the through-hole construction of right printed circuit board (PCB) that the utility model discloses is to be not limited to hollow cylindrical, every structure space that can hold its embedded conducting element 300 tips all is covered by the idea that the utility model institute desire is expressed, and for example hollow cone shape and funnel-form perforation all belong to the scope that the utility model is contained.

Please refer to Fig. 2, first embodiment that spreads out and stretch out according to spirit of the present utility model is described.

Wherein, embedded conducting element is formed by taper solder bump 310, on the conductor layer 200 of its melting welding in perforation 150, because taper solder bump 310 materials also are conductive material, and the top need have the tip, so can reach the effect of guide current, so the height of its taper solder bump 310 can not touch ground plane 400, in order to avoid start the situation of living line short; And the shape of perforation 150 does not also limit, as long as can hold the design of taper solder bump 310 and cutting-edge structure thereof all in the form range that the utility model is contained, its shape such as hollow cone shape, hollow cylindrical and infundibulate.

Please refer to Fig. 3, the utility model second embodiment is described.

Wherein embedded conducting element is the metal derby 320 that is shaped in advance, its material is required to be electric good conductor, as copper, silver and tin etc., be the sheet triangle, in the time of need providing the most advanced and sophisticated rapid electric current that causes producing in order to external static discharge effect to flow through conductor layer 200, can import the tip to meet the condition of static discharge, reach the effect of avoiding electrostatic breakdown with Come; Its metal derby 320 utilizes the scolding tin mode to be connected in conductor layer 200, connect to produce conduction, and the shape of metal derby is the non-sheet triangle described in the utility model that is confined to.

Claims

One kind prevent static discharge (ElectroStatic Discharge, printed circuit board (PCB) ESD) is characterized in that including:

One conductor layer passes through in order to electric current to be provided;

One embedded conducting element is connected in this conductor layer, has a tip that is enough to produce point discharge;

One ground plane, adjacent with this tip, constituted by a conductive material, in order to receive electric charge and the main ground of importing that this tip discharges;

One insulating barrier is formed between this conductor layer and this ground plane, in order to the electric current between isolated this conductor layer and this ground plane; And

One perforation is formed in this insulating barrier, and in order to holding this embedded conducting element, and the tip of this embedded conducting element is arranged in this perforation of this insulating barrier, and between this conductor layer and this ground plane.
2. prevent the printed circuit board (PCB) of Electrostatic Discharge according to claim 1, it is characterized in that: this embedded conducting element is a taper solder bump.
3. prevent the printed circuit board (PCB) of Electrostatic Discharge according to claim 1, it is characterized in that: the metal derby of this embedded conducting element for being shaped in advance is shaped as in the leg-of-mutton combination of taper, needle-like and the sheet group.
4. as preventing the printed circuit board (PCB) of Electrostatic Discharge as described in the claim 3, it is characterized in that: this metal derby material is selected from copper, silver and the tin combination group.
5. as preventing the printed circuit board (PCB) of Electrostatic Discharge as described in the claim 3, it is characterized in that: this embedded conducting element utilizes a scolding tin to be connected in this conductor layer one side.
6. as preventing the printed circuit board (PCB) of Electrostatic Discharge as described in the claim l, it is characterized in that: this perforation shape is selected from hollow cylindrical, funnel-form and the hollow cone shape combination group.
7. as preventing the printed circuit board (PCB) of Electrostatic Discharge as described in the claim 7, it is characterized in that: this ground plane is parallel to this conductor layer.
8. prevent the printed circuit board (PCB) of Electrostatic Discharge according to claim 1, it is characterized in that: this conductive material is selected from copper, silver and the tin combination group.
9. prevent the printed circuit board (PCB) of Electrostatic Discharge according to claim 1, it is characterized in that: this conductor layer is connected in an input/output terminal.