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CN2705893Y - 相变化散热器 - Google Patents

相变化散热器 Download PDF

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Publication number
CN2705893Y
CN2705893Y CN200420046450.6U CN200420046450U CN2705893Y CN 2705893 Y CN2705893 Y CN 2705893Y CN 200420046450 U CN200420046450 U CN 200420046450U CN 2705893 Y CN2705893 Y CN 2705893Y
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CN
China
Prior art keywords
cylinder
heat dissipation
phase
cavity
radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200420046450.6U
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English (en)
Inventor
余方祥
林淑和
李孟慈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN200420046450.6U priority Critical patent/CN2705893Y/zh
Priority to US10/952,691 priority patent/US20050263267A1/en
Application granted granted Critical
Publication of CN2705893Y publication Critical patent/CN2705893Y/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种相变化散热器，包括一中空柱体，该柱体两端设有两盖体，从而形成一密封的腔体，该腔体内装有可随温度变化作气、液两相变化的工作液体，柱体外周面一体成型有沿柱体轴向延伸的若干散热鳍片。由于该散热鳍片在柱体外周面沿轴向延伸，具有较大的散热表面积，且该散热鳍片与柱体一体成型，其成本低、加工简单。

Description

相变化散热器
【技术领域】
本实用新型是关于一种用来散发电子元件热量的相变化散热器。
【背景技术】
现代工业中，计算机的应用几乎无所不在，随着对生产实时性要求的提高及数据处理量的增加，需要不断有高性能的计算机推出来满足工业上的应用。计算机的性能很大程度上取决于其核心元件—中央处理器，因此，高频高速处理器不断更新换代，其运行速度越来越快，但是，中央处理器运行速度越快，则其单位时间产生的热量越多。为有效散发中央处理器在运行过程中产生的热量，业界通常在中央处理器表面加装一散热器辅助其散热，从而使中央处理器自身温度维持在正常运行范围内。
早期应用较多的是铝挤型散热器，其在高温下将一半熔融态金属铝一体挤出成型，而使其具有一扁平基座以及由该基座向上凸伸出的若干散热鳍片，由基座吸收热量传到散热鳍片再进一步散发出去，但是由于制造上的难度，散热鳍片密度、高宽比受限，有效散热面积也受到限制，因此，散热效果无法获得突破性提高。
后来，业界又出现热管与散热器结合的散热方式。热管是利用液体在气、液两态间转变时温度保持不变而可吸收或放出大量热的原理工作，一改传统散热器单纯以金属热传导方式散热而效率不高的状况。业者将热管一端连接一导热基座，另一端结合若干散热鳍片，从而组成散热器，由基座吸收热量，通过热管传到散热鳍片再进一步散发出去，由于液体循环速度快，使散热器整体散热效率大幅度提高，目前热管散热装置得到广泛而大量的应用。
热管散热装置虽具有上述优点，但因热管与散热鳍片结合需焊接，不仅成本较高且焊接处热阻较大。中国台湾专利公告第329341号揭露一种具一体成型散热鳍片的散热装置，该装置具有一中空且密封的基座及与基座上表面一体成型的散热鳍片，基座内装有可随温度变化作气、液两相变化的工作流体，并在基座内壁上设有沟槽结构。该装置中散热鳍片与基座一体成型，加工简单、成本较低且焊接处少。但由于该散热装置与电子元件的结合方式决定只能在其基座上表面一体成型出若干散热鳍片，散热面积受到限制；另外，基座长度受空间限制较大，加工太长容易与电子元件周围的其他元件形成干涉，这也对散热性能造成一定影响。
【发明内容】
本实用新型的目的在于提供一种不仅能有效增加散热鳍片面积且成本低的相变化散热器。
本实用新型的目的是通过下列技术方案实现的：
本实用新型相变化散热器包括一中空柱体，该柱体两端设有两盖体，从而形成一密封的腔体，该腔体内装有可随温度变化作气、液两相变化的工作流体，柱体外周面一体成型有沿柱体轴向延伸的若干散热鳍片。
本实用新型中一方面由于该散热鳍片在柱体外周面沿轴向延伸，较已知技术中只在基座上表面一体成型出若干散热鳍片的散热表面积大；另一方面，该散热鳍片与柱体一体成型，其成本低、加工简单。
下面参照附图，结合实施例对本实用新型作进一步的描述。
【附图说明】
图1是本实用新型相变化散热器的立体分解示意图。
图2是图1的俯视图。
图3是沿图2中III-III线的剖面示意图。
【具体实施方式】
请同时参阅图1到图3，本实用新型相变化散热器包括一柱体10、位于柱体10外周面上且沿柱体10轴向延伸的若干散热鳍片20及位于柱体10两端的两盖体30，盖体30密封柱体10两端，从而在柱体10中央形成一密封的腔体40，腔体40被抽成近似真空状态，其内装可随温度变化作气、液两相变化的工作流体，并在腔体40内壁上设有毛细结构50。散热鳍片20在柱体10的外周面沿柱体10径向呈放射状分布，且与柱体10一体成型。
其中一盖体30直接与一发热元件60接触，通过盖体30吸收发热元件60产生的热量并传送至腔体40内，腔体40内的工作流体受热蒸发转化为气体，气体上升将热量传送至温度较低的散热鳍片40上，上升的气体在另一盖体30的一端冷却凝结为液体再通过腔体40内壁上的毛细结构50作用回流到与发热元件60接触的盖体30的一端。如此反复循环，利用柱体10内的工作流体在气、液两相间的转变完成对发热元件60的散热。
本实用新型中一方面由于该散热鳍片20在柱体10外周面沿轴向延伸，较已知技术中只在基座上表面一体成型出若干散热鳍片的散热表面积大；另一方面，该散热鳍片20与柱体10一体成型，其成本低、加工简单。
可以理解的，本实用新型柱体10沿径向的截面为圆形、方形或其他形状；另外，散热鳍片20的形状也可根据系统内实际空间大小进行变化。

Claims (5)

1.一种相变化散热器，包括一中空柱体，该柱体两端设有两盖体，从而形成一密封的腔体，该腔体内装有可随温度变化作气、液两相变化的工作流体，其特征在于：柱体外周面一体成型有沿柱体轴向延伸的若干散热鳍片。
2.如权利要求1所述的相变化散热器，其特征在于：其中一盖体直接与发热元件接触。
3.如权利要求1所述的相变化散热器，其特征在于：所述腔体内壁上设有毛细结构。
4.如权利要求1所述的相变化散热器，其特征在于：所述柱体沿径向的截面为圆形或方形。
5.如权利要求1所述的相变化散热器，其特征在于：所述散热鳍片沿柱体径向呈放射状分布。
CN200420046450.6U 2004-05-26 2004-05-26 相变化散热器 Expired - Fee Related CN2705893Y (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200420046450.6U CN2705893Y (zh) 2004-05-26 2004-05-26 相变化散热器
US10/952,691 US20050263267A1 (en) 2004-05-26 2004-09-29 Cooling apparatus and method for manufacturing the same

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Application Number Priority Date Filing Date Title
CN200420046450.6U CN2705893Y (zh) 2004-05-26 2004-05-26 相变化散热器

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* Cited by examiner, † Cited by third party
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CN100413059C (zh) * 2006-03-23 2008-08-20 胡凯 一次整体成型芯片散热器
CN103149994A (zh) * 2012-01-23 2013-06-12 微软公司 具有相变材料的热传递设备
CN104422318A (zh) * 2013-09-05 2015-03-18 中央大学 固液相变冷却装置
CN107041102A (zh) * 2016-12-09 2017-08-11 淳铭散热科技股份有限公司 一种电子设备与器件的散热装置

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US12196496B2 (en) * 2022-09-25 2025-01-14 Aic Inc. Liquid-cooled cooling structure

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100413059C (zh) * 2006-03-23 2008-08-20 胡凯 一次整体成型芯片散热器
CN103149994A (zh) * 2012-01-23 2013-06-12 微软公司 具有相变材料的热传递设备
CN104422318A (zh) * 2013-09-05 2015-03-18 中央大学 固液相变冷却装置
CN107041102A (zh) * 2016-12-09 2017-08-11 淳铭散热科技股份有限公司 一种电子设备与器件的散热装置

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