CN2682578Y - Chip bearing device - Google Patents

Abstract

A chip carrying device includes a carrying part, which has a plurality of partition ribs protruding from its upper surface, and is formed with a plurality of accommodating spaces for accommodating chips, and the bottom of each accommodating space is provided with at least one through hole; a stack of The joint part extends outward and downward from the side bottom of the bearing part respectively, and forms a superimposed space matched with the bearing part; a closeable air suction structure is arranged on the side wall of the superimposed part; and a sealing film, which is arranged under the air pumping structure and connected to the inner surface of the overlapping space.

Description

chip carrier

technical field

The utility model relates to a chip carrying device, in particular to a device for carrying unpackaged chips for storing and transporting the chips.

Background technique

The semiconductor integrated circuit (Integrated Circuit, IC) industry is regarded as a technology that "turns sand into gold". It uses reduction and purification methods to obtain high-purity silicon, and then undergoes processes such as melting, growth, cutting, and surface treatment to obtain pieces of silicon. Circular thin slices of "silicon wafers". Semiconductor integrated circuit technology in a broad sense includes circuit design, mask making, chip manufacturing, testing and packaging. The development of the semiconductor industry has gradually become an industrial model of vertical division of labor, and the division of labor of professional IC design companies without chip factories and professional chip foundry services has been developed. IC design companies focus on product structure design, product performance and quality improvement, while chip foundries provide excellent integrated circuit manufacturing services as a backing.

As far as the manufacturing process is concerned, after the IC design is completed, it is handed over to the chip foundry for manufacturing. After the chip is completed, chip cutting (Die Saw) is required, the purpose is to separate the dies on the chip that has been processed by the previous process. Cut and separate. In addition, the wafer needs to be sent to the chip packaging factory for cutting, packaging, and finally electrical testing. Therefore, the production process of IC components needs to pay more and more attention to the problem of storage and transportation between factories. During the storage and transportation process, it is necessary to have a carrying device with careful protection measures to avoid unnecessary damage during storage and transportation. Especially before packaging is the most fragile stage of the chip, as long as there is a little static electricity or vibration, the chip may be damaged.

Please refer to FIG. 1 to FIG. 3 , which are respectively a top view, a bottom view and a side sectional view of a chip carrier device in the prior art. The chip carrying device 9, or called a chip tray (Chip tray), is made of plastic material, and has a rectangular carrying portion 91 and a stacking portion 95 extending outwards and downwards from the periphery of the carrying portion 91. The carrying portion 91 has a plurality of partition ribs 92 protruding from the upper surface thereof, and forms a plurality of grid-like accommodating spaces 93 for accommodating chips 94 . The stacking portion 95 forms a stacking space 96 for another chip carrying device 9 to be accommodated below it in a stacked manner, and an antistatic film 97 is added between the two chip carrying devices 9 to protect the chip from damage caused by static electricity. damage. The chip carrier devices 9 in the known technology are usually stacked layer by layer with six as a unit, which is convenient for storage and transportation. It only limits the chip 94 in a predetermined range on the plane, but cannot fix the chip 94 in the X and Y directions, let alone fix the chip in the vertical Z direction. Moreover, the metal circuit of the chip 94 is placed upwards, so it is easy to scratch the chip 94 and cause damage if it is shaken or vibrated during transportation, so that the completed chip will fall short, affecting packaging and final testing.

It can be seen from the above that the above-mentioned known chip carrying device obviously has inconveniences and defects in actual use, and needs to be improved.

Contents of the invention

The main purpose of the utility model is to provide a chip carrying device, which can fix the chips in X, Y, and Z directions, facilitate the storage and transportation of the chips, and prevent the chips from being scratched during transportation.

In order to achieve the above purpose, the utility model provides a chip carrying device, which includes a carrying part with a plurality of partition ribs protruding from its upper surface and forming a plurality of accommodating spaces for accommodating chips, each accommodating space The bottom is provided with at least one through hole; a stacking part extends outward and downward from the side bottom of the bearing part respectively and forms a stacking space matched with the bearing part; a closeable air extraction structure is arranged on the stacking part a side wall of the combined part; and a sealing film, which is arranged under the air pumping structure and connected to the inner surface of the overlapping space.

Therefore, the utility model proposes a chip carrying device with a reasonable design and can effectively improve the above-mentioned defects, so as to improve the needless damage of the chip during transportation. The preferred embodiments of the present utility model are described in detail below in conjunction with the accompanying drawings, but this description is only used to illustrate the present utility model, not to limit the scope of rights of the present utility model.

Description of drawings

FIG. 1 is a top view of a chip carrying device in the prior art.

Fig. 2 is a bottom view of a chip carrying device in the prior art.

Fig. 3 is a side sectional view of a conventional chip carrier device.

FIG. 4 is a three-dimensional cross-sectional view of the chip carrying device of the present invention.

FIG. 4A is a side cross-sectional view of the first embodiment of the air pumping structure at part A in FIG. 4 .

FIG. 4B is a side view of the air pumping structure of part A in FIG. 4 .

Fig. 4C is a side sectional view of the second embodiment of the air pumping structure in the present invention.

Fig. 4D is a side view of the second embodiment of the air pumping structure in the present invention.

Fig. 4E is a side sectional view of the third embodiment of the air pumping structure in the present invention.

FIG. 4F is a side sectional view of another embodiment of part F in FIG. 4 .

FIG. 5 is a top view of the chip carrying device of the present invention.

Fig. 6 is a bottom view of the chip carrying device of the present invention.

Fig. 7 is a side cross-sectional view of the chip carrying device of the present invention after air extraction.

Fig. 8 is a side sectional view of the deflated chip carrier device of the present invention.

FIG. 9 is a side cross-sectional view of the chip carrier stack assembly of the present invention.

Wherein, the reference signs are explained as follows:

97 Antistatic film

9 Chip carrying device

91 Bearing part 92 Partition rib

93 Accommodating space 94 Chip

95 Overlapping Department 96 Overlapping Space

1 Chip carrying device 10 Carrying part

11 Chip 12 Separator Rib

14 Accommodating space 16 Through hole

18 Gasket 182 Perforation

20 Overlapping Department 22 Overlapping Space

24 Stop bump 26 Fixing ring

30, 30’ Suction structure 31 Suction part

32 Sealing hole 33 Engagement groove

34 Sealing column 35 Operation hole

36, 37 Air extraction hole 370 Air extraction port

40 sealing film

50 Suction structure

52 sealing hole

522 Expansion Department 524 Channel Department

54 Sealing column

542 Sealing part 544 Extraction part

546 Stopper 548 Sealing ring

56 Air extraction hole

562 Air extraction port 564 Air extraction tool

h1, h2 height

Detailed ways

Please refer to FIG. 4 to FIG. 6 , which are respectively a three-dimensional sectional view, a top view, and a bottom view with the sealing film removed of the chip carrier device of the present invention. The chip carrier device 1 includes a carrier part 10, a superimposed part 20 arranged around the bottom of the carrier part 10, a sealable air extraction structure 30 arranged on a side wall of the superposed part 20, and a sealing film 40 is disposed below the air extraction structure 30 and placed inside the overlapping portion 20 .

The carrying portion 10 has a plurality of partition ribs 12 protruding from its upper surface and forms a plurality of grid-shaped accommodation spaces 14 for accommodating chips. At least one through hole 16 is formed at the bottom of each accommodation space 14 . The accommodating space 14 varies depending on the size of the chips.

The stacking portion 20 extends outwards and downwards from the side lower edge of the carrying portion 10 respectively, thus forming a stacking space 22 matched with the carrying portion 10, whereby the carrying portion 10 of another chip carrier 1 can be It is accommodated in the stacking space 22 and stacked under the stacking portion 20 . The height h1 of the carrying portion 10 protruding from the top surface of the overlapping portion 20 is equal to or smaller than the height h2 of the sealing film 40 from the bottom surface of the overlapping portion 20 .

The overlapping portion 20 can further be provided with a stopper protrusion 24 protruding inwardly from its inner surface, wherein the height h2 of the bottom surface of the stopper protrusion 24 from the bottom surface of the overlapping portion 20 is equal to the protrusion of the bearing portion 10 The height h1 of the top surface of the overlapping portion 20 . The stop projection 24 can be multi-piece or can be arranged in a ring shape.

Please refer to FIG. 7 , which is a side cross-sectional view of the chip carrying device of the present invention after air extraction. The air pumping structure 30 is at least one disposed in the side wall of the superimposed part 20, and its function is that after the chip 11 is placed in the accommodating space 14 of the carrier part 10, the superimposed part 20 and the sealed The air between the membranes 40 is drawn out and sealed, so that the chips 11 are adsorbed and fixed on the bottom surface of the accommodating space 14 due to the vacuum state. Wherein the sealing film 40 is arranged under the air pumping structure 30 in a tensioned state and seals the stacking space 22 . The material of the sealing film 40 in the present invention can be anti-static material or common material.

In order to avoid air leakage caused by a gap between the chip 11 and the bottom surface of the accommodating space 14 , the accommodating space 14 of the carrying portion 10 can be set as a smooth bottom surface. Alternatively, please refer to FIG. 4F , which is an enlarged view of another embodiment of part F in FIG. 4 . The bottom of the accommodating space 14 of the carrying portion 10 can further be provided with an elastic gasket 18 , and the gasket 18 is provided with a through hole 182 matching the through hole 16 . Since the pad 18 is in direct contact with the chip 11, it is preferably made of antistatic material.

Please refer to FIG. 4A and FIG. 4B , which are an enlarged view and a side view of part A in FIG. 4 respectively, which are the first embodiment of the air extraction structure in the present invention. The closable air pumping structure 30 is arranged in the stop projection 24 of the overlapping portion 20, and mainly includes a sealing hole 32 arranged in the overlapping portion 20 and communicating with the overlapping space 22. A sealing column 34 made of plastic material is laterally slidably disposed in the overlapping portion 20 to seal the sealing hole 32 after air extraction, and at least one air extraction hole 36 communicates with the sealing hole 32 . The air extraction hole 36 is horizontally disposed in the overlapping portion 20 and surrounds the sealing hole 32 . The air extraction hole 36 communicates with the outer surface of the overlapping portion 20 for air extraction.

Please refer to FIG. 4C and FIG. 4D , which are respectively a side sectional view and a side view of the second embodiment of the air pumping structure in the present invention. In order to consider the convenience of mold design made of plastic, the air pumping structure 30' has a sealing hole 32 disposed in the overlapping portion 20 and communicating with the overlapping space 22, an engaging groove 33 communicating with the sealing hole 32 and communicating with the outside world. And a separate air suction part 31 that can extract air is engaged in the engaging groove 33, which is more convenient in mold design. The air extraction portion 31 has an operation hole 35 for the sealing post 34 to slide therein, and an air extraction hole 37 is horizontally disposed on the periphery of the operation hole 35 . The air extraction hole 37 can further be provided with an air extraction port 370 at the outer end for inserting an air extraction tool to extract air.

Please refer to FIG. 4E , which is a side sectional view of the third embodiment of the air pumping structure in the present invention. In order to consider the mold design cost of plastic manufacturing, the air pumping structure 50 can also be integrally formed in the overlapping portion, which mainly includes a sealing hole 52 arranged in the overlapping portion 20 and communicating the overlapping space 22 with the outside world, A sealing column 54 is slidably disposed in the sealing hole 52 , and a suction hole 56 communicates with the sealing hole 52 . The sealing hole 52 has an expansion part 522 connected to the outside and a channel part 524 extending from the expansion part 522 to the lamination space 22; the sealing post 54 is made of elastic plastic material, and has a The sealing portion 542 in the sealing portion 522 is formed at the end of the sealing portion 542 and a stopper portion 546 is located at the other end of the sealing portion 542 by the expansion portion 522 that snaps into the sealing hole 52 after pumping air. One end; the suction hole 56 communicates with the swelling portion 522 of the sealing hole 52 . Wherein the air suction hole 56 is disposed vertically upward in the stacking portion 20 , and an air suction port 562 can be further formed on the upper surface of the stacking portion 20 for inserting an air suction tool 564 . Wherein the sealing post 54 can further be provided with a sealing ring 548 between the extraction portion 544 and the sealing portion 542 to enhance the sealing effect.

The overlapping portion 20 may further have a fixing ring 26 engaged thereunder, and the fixing ring 26 clamps and fixes the sealing film 40 on the overlapping portion 20 . Alternatively, the fixing ring 26 can also be glued and fixed under the overlapping portion 20 , and the fixing ring 26 is adhesively fixed on the sealing film 40 on the overlapping portion 20 . Alternatively, the sealing film 40 can be connected to the inner surface of the overlapping portion 20 or the bottom surface of the stopper protrusion 24 by adhesive, as shown in FIG. 4A .

Please refer to FIG. 8 , when the chip 11 is to be taken out, as long as the sealing column 34 is pulled out, the air enters between the overlapping portion 20 and the sealing film 40 through the sealing hole 32, and the chip carrier 1 can be restored to its original state. . The chip 11 is no longer fixed by suction and can be taken out.

Please refer to FIG. 9 , which is a side cross-sectional view of the stacked assembly of the chip carrying device of the present invention. After the chip carrying device 1 of the present invention is pumped and sealed, it can be stacked and combined with each other to save space. Since the chip 11 in the present invention has been adsorbed and fixed in the accommodating space 14 due to vacuum, there will be no static electricity caused by friction. In principle, it is not necessary to install an antistatic film between the chip carrying devices 1, This saves the cost of the antistatic film.

Therefore, the chip carrying device of the present invention can fix the chips in X, Y, and Z directions, thereby preventing the chips from being scratched during transportation. Even when shaken or shaken during transportation, the chip is still securely fixed, effectively improving the good rate of packaging and final testing. It has superior features and functions compared to the prior art.

The above is only a preferred embodiment of the utility model, and cannot limit the scope of rights of the utility model. Therefore, equal changes or modifications made according to the application scope of the utility model are still covered by the utility model. scope.

Claims (10)

1. A chip carrying device, characterized in that it comprises: A carrying part has a plurality of partition ribs protruding from its upper surface, and forms a plurality of accommodating spaces for accommodating chips, and at least one through hole is provided at the bottom of each accommodating space; a superimposing part extending outward and downward from the side lower edge of the carrying part respectively, and forming a superimposing space matched with the carrying part; A sealable air suction structure is arranged on the side wall of the overlapping part; and A sealing film is arranged under the air pumping structure and connected to the inner surface of the overlapping space. 2. The chip carrier device according to claim 1, wherein the accommodating space of the carrying part has a smooth bottom surface, and wherein the bottom of the accommodating space of the carrying part is further provided with an elastic gasket , the gasket is provided with a through hole matching the through hole. 3. The chip carrier device as claimed in claim 2, wherein the gasket and the sealing film are made of antistatic material. 4. The chip carrier device as claimed in claim 1, wherein the overlapping portion further has a fixing ring engaged thereunder, and the fixing ring clamps and fixes the sealing film on the overlapping portion. 5. The chip carrier device according to claim 1, wherein the sealable air pumping structure is disposed in the stopper protrusion of the stacking portion, and comprises a sealing hole disposed in the stacking portion and communicating with the stacking portion. A sealing column made of elastic plastic material is horizontally slid in the overlapping portion to seal the sealing hole after pumping air, and at least one air extraction hole is horizontally arranged in the overlapping portion and surrounds the sealing hole around. 6. The chip carrier device according to claim 1, wherein the air pumping structure has a sealing hole disposed in the overlapping portion and communicating with the overlapping space, an engaging groove communicating with the sealing hole and communicating with the outside world, And a separate air suction part that can extract air is engaged in the engaging groove. 7. The chip carrier device as claimed in claim 6, wherein the air extraction part has an operation hole, a sealing column is slidably disposed in the operation hole, and an air extraction hole is horizontally arranged on the periphery of the operation hole; wherein The air extraction hole can further be provided with an air extraction port at the outer end for inserting an air extraction tool to extract air. 8. The chip carrier device according to claim 1, wherein the air extraction structure includes a sealing hole disposed in the overlapping portion and communicating the overlapping space with the outside world, and a sealing column is slidably disposed in the sealing hole And a suction hole communicates with the sealing hole; wherein the sealing hole has an expansion part connected to the outside world and a channel part extending from the expansion part to the overlapping space; the sealing column is made of elastic plastic material and has a corresponding The sealing part in the expansion part is the expansion part which snaps into the sealing hole after pumping air, a pull-out part is formed at the end of the filling part and a stopper part is arranged at the other end. 9. The chip carrier device according to claim 8, wherein the air pumping hole is arranged vertically upward in the overlapping portion and communicates with the swelling portion of the sealing hole, and can further form an air pumping port in the overlapping portion on the upper surface to insert a suction tool. 10 . The chip carrier device as claimed in claim 8 , wherein the sealing column is further provided with a sealing ring to enhance the sealing effect between the extraction part and the sealing part. 11 .

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