CN2681336Y - heat sink - Google Patents

Abstract

A heat dissipation device has a base, and at least one temperature averaging plate is arranged on the upper surface or the lower surface of the base, and the temperature averaging plate is connected to the base by heat conduction. When the heat dissipation device is installed above a heat-generating electronic component, the temperature averaging plate faces the heat-generating electronic component, thereby absorbing part of the heat generated by the heat-generating electronic component through the temperature averaging plate, alleviating the workload of the base and improving the heat dissipation efficiency of the entire heat dissipation device.

Description

Heat abstractor

Technical field

The utility model relates to a kind of heat abstractor, relates in particular to a kind of being applied on the heating electronic building brick, can improve and reach the heat abstractor of best radiating efficiency.

Background technology

As shown in Figure 1, traditional heat abstractor 10a mainly comprises a radiating block 1a, and radiating block 1a is made by the aluminum of perfect heat-dissipating.Radiating block 1a is provided with radiating fin group 3a, and radiating fin group 3a is made up of the radiating fin 31a of a plurality of equidistant arrangements, offers a groove 11a in the bottom of radiating block 1a, at groove 11a internal fixation one heat-conducting block 2a is installed.Heat-conducting block 2a is made by the copper product of perfect heat-dissipating.Radiating fin group 3a is provided with fan housing 4a and radiator fan 5a.

Heat abstractor 10a is installed on central processing unit (CPU) 20a, makes heat-conducting block 2a paste top at central processing unit 20a.Utilize the fast characteristic of heat conduction of the copper product of heat-conducting block 2a, the heat that is produced when apace central processing unit 20a being moved conducts on the radiating block 1a, utilize the thermal conduction characteristic and the radiating fin group 3a of the aluminum of radiating block 1a to heat sink to the external world apace again, reach the effect of heat conduction and heat radiation.

Along with science and technology develops fast, especially when the arithmetic speed of central processing unit 20a is high more, the heat that is produced during its operation is also more and more higher, therefore need fast central processing unit 20a to be dispelled the heat, yet for above-mentioned known heat abstractor 10a, it can't carry out best and the fastest heat radiation to the central processing unit 20a of high-speed cruising, therefore how to improve the radiating efficiency of heat abstractor 10a again, is the problem that those skilled in the art will solve.

In view of the defective that exists in the above-mentioned prior art, the utility model designer is by means of being engaged in the sector experience for many years, and in line with excelsior spirit, the active research improvement has the generation of " heat abstractor " of the present utility model then.

Content of the present utility model

Main purpose of the present utility model is to provide a kind of heat abstractor, and it is by the temperature-uniforming plate absorption portion heating heat that electronic building brick produced, and alleviates the operating load of pedestal, improves the radiating efficiency of entire heat dissipation device.

Of the present utility model one is characterised in that this heat abstractor has a pedestal, and the upper surface of this pedestal or lower surface place are provided with a temperature-uniforming plate at least, and temperature-uniforming plate is that the heat conduction contact is connected with this pedestal.When this heat abstractor being installed in heating electronic building brick top, this temperature-uniforming plate faces the heating electronic building brick, thus, can be by the direct absorption portion of this temperature-uniforming plate heating thermal source that electronic building brick produced, or directly the heat on the pedestal is absorbed and dispel the heat.

Another feature of the present utility model is, because this temperature-uniforming plate faces the heating electronic building brick, so the area of this temperature-uniforming plate size only need equate to get final product with the heating electronic building brick, and need not make too big, except the radiating efficiency that can improve heat abstractor, also reduced manufacturing cost.

Heat abstractor of the present utility model not only can improve radiating efficiency, has also reduced manufacturing cost.

Brief description of drawings

Fig. 1 is the combination generalized section of known heat abstractor;

Fig. 2 is the pedestal of heat abstractor of the utility model first embodiment and the schematic appearance of temperature-uniforming plate;

Fig. 3 is the location drawing that concerns between the temperature-uniforming plate of heat abstractor of the utility model first embodiment and radiating fin group;

Fig. 4 is the generalized section after Fig. 3 assembling;

Fig. 5 is the heat abstractor of the utility model first embodiment and the perspective exploded view between fan housing and radiator fan;

Fig. 6 is the generalized section after Fig. 5 assembling;

Fig. 7 is the generalized section of the heat abstractor of the utility model second embodiment;

Fig. 8 is the generalized section of the heat abstractor of the utility model the 3rd embodiment;

Fig. 9 is the pedestal of heat abstractor of the utility model the 4th embodiment and the floor map of temperature-uniforming plate;

Figure 10 is the pedestal of heat abstractor of the utility model the 5th embodiment and the floor map of temperature-uniforming plate.

In the accompanying drawing, the list of parts of each label representative is as follows:

10a-heat abstractor 1a-radiating block

11a-groove 2a-heat-conducting block

3a-radiating fin group 31a-radiating fin

4a-fan housing 5a-radiator fan

The 20a-central processing unit

10-heat abstractor 1-pedestal

11-groove 2-temperature-uniforming plate

21-working fluid 3-radiating fin group

31-radiating fin 4-fan housing

41-opening 42,51-bolt assembly

5-radiator fan 20-central processing unit

Embodiment

Relevant detailed description of the present utility model and technology contents, conjunction with figs. is described as follows, and accompanying drawing only provides reference and explanation usefulness, is not to be used for limiting the utility model.

The utility model provides a kind of heat abstractor, and as shown in Figure 2, in first embodiment of the present utility model, heat abstractor 10 is used for the heat radiation of central processing unit (CPU) 20.Wherein, heat abstractor 10 has a pedestal 1, and pedestal 1 can be aluminum or copper product is made, and offers a groove 11 at the place, upper surface centre position of pedestal 1, and a temperature-uniforming plate 2 is installed in groove 11 at least, and temperature-uniforming plate 2 is the heat conduction contact with pedestal 1 and is connected.Be hollow form in the temperature-uniforming plate 2, and working fluid 21 can be set, the heat that utilizes working fluid 21 absorption central processing units 20 to be produced carries out phase change and dispels the heat.Certainly, also can in temperature-uniforming plate 2, be provided with the radiating effect that the capillary structure (not shown) improves temperature-uniforming plate 2.

As shown in Figure 3, on pedestal 1, can be provided with radiating fin group 3.Radiating fin group 3 is made up of the radiating fin 31 of a plurality of equidistant arrangements, and radiating fin 31 is the vertical type arrangement in the present embodiment.

As shown in Figure 4, temperature-uniforming plate 2 can be fixedly mounted on cemented mode in the groove 11 of pedestal 1, or is fixedly mounted in the groove 11 in the solid welding mode, or the mode that embeds with tight fit is fixedly mounted in the groove 11.After being installed in radiating fin group 3 on the pedestal 1, temperature-uniforming plate 2 can be adhered together mutually with radiating fin group 3.

In the utility model,, can above radiating fin group 3, be provided with fan housing 4 and radiator fan 5 as Fig. 5, shown in Figure 6.Fan housing 4 is one " ㄇ " shape lamellar body, and 4 end face places offer opening 41 at fan housing, utilize bolt assembly 42 that " ㄇ " shape fan housing 4 is fixedly mounted on the pedestal 1, and fan housing 4 are located at the outside of radiating fin group 3.Radiator fan 5 is fixed on fan housing 4 tops by bolt assembly 51, makes wind that radiator fan 5 blown out be blown into radiating fin group 3 places from the opening 41 of fan housing 4 and dispels the heat.

As shown in Figure 6, when being installed in heat abstractor 10 on the central processing unit 20, pedestal 1 pastes on central processing unit 20, and temperature-uniforming plate 2 faces central processing unit 20.Thus, the heat that central processing unit 20 operation backs are produced can conduct to radiating fin group 3 places by pedestal 1, and by radiator fan 5 is dispelled the heat in wind to radiating fin group 3 places.And temperature-uniforming plate 2 is except the heat that can be produced by its inner working fluid 21 direct absorption portion central processing units 20, also can directly absorb the heat on the pedestal 1, reduced the heat that is conducted to radiating fin group 3 places, made heat can be discharged to the external world fast.

Fig. 7 is the schematic diagram of the utility model second embodiment.As shown in Figure 7, temperature-uniforming plate 2 can be set directly at the lower surface place of pedestal 1, and when being installed in heat abstractor 10 on the central processing unit 20, temperature-uniforming plate 2 can directly paste with central processing unit 20 mutually, thereby directly absorbs the heat that central processing unit 20 is produced.

Fig. 8 is the schematic diagram of the utility model the 3rd embodiment.As shown in Figure 8, temperature-uniforming plate 2 is embedded in pedestal 1.

Fig. 9, Figure 10 are the pedestal of heat abstractor of the utility model the 4th, the 5th embodiment and the floor map of temperature-uniforming plate.As Fig. 9 and shown in Figure 10, temperature-uniforming plate 2 can be the different geometry of various profiles, as trapezoidal, hexagon etc., mainly be to decide according to the heat distribution situation of the heating electronic building brick of practical application heat abstractor 10, heat is evenly distributed, and avoiding heat to hoard at a place has the phenomenon that can't or be difficult to effective heat extraction.

In the utility model,, can alleviate the operating load of pedestal 1, improve the radiating efficiency of entire heat dissipation device 10 by the temperature-uniforming plate 2 absorption portion heating heat that electronic building brick produced owing on pedestal 1, be provided with temperature-uniforming plate 2.And because temperature-uniforming plate 2 faces the heating electronic building brick, so the area of temperature-uniforming plate 2 size only need equate to get final product with the heating electronic building brick, and need not make too big, except the radiating efficiency that can improve heat abstractor 10, also reduced manufacturing cost.

In sum, heat abstractor of the present utility model can reach described effect by above-mentioned structure really.And do not publish before the utility model application in that any publication is also unexposed and used, meet practicality, novelty, the creationary requirement of utility application.

Above-mentioned accompanying drawing and explanation are embodiment of the present utility model only, but are not to be to limit embodiment of the present utility model.Other equivalent transformation or modification that every those skilled in the art do according to technical characterictic of the present utility model include in claim of the present utility model.

Claims (10)

1. A cooling device for heat dissipation of heating electronic components, characterized in that it comprises: a base, located relatively above the heat-generating electronic component; and At least one temperature chamber is arranged in the base and connected with the base in thermal conduction contact. 2. The heat dissipation device according to claim 1, wherein the base is made of aluminum or copper. 3 . The heat dissipation device according to claim 1 , wherein a groove is formed at a middle position of the upper surface or the lower surface of the base, and the temperature chamber is installed in the groove. 4 . 4 . The heat dissipation device according to claim 1 , wherein a groove is defined at a middle position in the base, and the temperature chamber is installed in the groove. 5 . 5. The heat dissipation device according to claim 1, wherein the shape of the vapor chamber is trapezoidal or hexagonal. 6. The heat dissipation device according to any one of claims 1-5, characterized in that the inside of the vapor chamber is hollow and has a working fluid. 7. The heat dissipation device according to claim 6, characterized in that capillary structures are further provided in the vapor chamber. 8 . The heat dissipation device according to claim 1 , further comprising a heat dissipation fin set mounted on the base, the heat dissipation fin set being composed of a plurality of heat dissipation fins arranged at equal intervals. 9. The heat dissipation device according to claim 8, further comprising a heat dissipation fan installed on one side of the heat dissipation fin group. 10. The heat dissipation device according to claim 9, further comprising a windshield, the windshield is a ㄇ-shaped piece, an opening is provided on the top surface of the windshield, and the windshield is fixedly installed on the said windshield. The heat dissipation fan is fixedly installed on the top of the windshield.

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