CN2671158Y - Electrical connectors with surface mount conductive terminals - Google Patents
Electrical connectors with surface mount conductive terminals Download PDFInfo
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- CN2671158Y CN2671158Y CN 200320110358 CN200320110358U CN2671158Y CN 2671158 Y CN2671158 Y CN 2671158Y CN 200320110358 CN200320110358 CN 200320110358 CN 200320110358 U CN200320110358 U CN 200320110358U CN 2671158 Y CN2671158 Y CN 2671158Y
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- 238000003466 welding Methods 0.000 claims abstract description 46
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- 229910000679 solder Inorganic materials 0.000 description 20
- 238000005476 soldering Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 11
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Abstract
Description
技术领域technical field
本实用新型涉及一种电连接器,具体涉及一种内部导电端子不需植入锡球即可利用表面粘着法(SMT)焊接在电路板上的电连接器。The utility model relates to an electric connector, in particular to an electric connector whose internal conductive terminals can be welded on a circuit board by a surface adhesion method (SMT) without implanting tin balls.
背景技术Background technique
对于中央处理器等高度密集化的晶片而言,其对外进行讯号输出输入的插脚数目相当多,因此所有的插脚大部分以针格状阵列(PGA)的方式密集排列,而所匹配的电连接器则如一般电脑主机板上常见的零插入力电连接器一样,中央处理器晶片与电路板之间由电连接器进行连接得以传递电讯号。For a highly dense chip such as a central processing unit, the number of pins for external signal output and input is quite large, so most of the pins are densely arranged in a pin grid array (PGA), and the matched electrical connections The connector is like the common zero-insertion force electrical connector on the motherboard of a general computer. The CPU chip and the circuit board are connected by an electrical connector to transmit electrical signals.
如图1及图2所示,一般的零插入力电连接器3主要包含有一基座32、一组装在基座32表面上的移动座31,以及一设在基座32与移动座31之间用来驱使移动座31在基座32表面上水平移动的驱动件33。其中,移动座31的表面上还设有配合一中央处理器晶片4的复数插脚41的数目而呈矩阵排列的插孔311。当然,基座12上也具有对应各插孔311的端子通道321,每一端子通道321内对应地插置有一导电端子34,各导电端子34接近移动座31的一端形成有一接合部341,而另一端则是形成一位于基座32的底面可用来与电路板(图中未画出)电性连接的一焊接部342。As shown in Figures 1 and 2, a general zero-insertion force electrical connector 3 mainly includes a
当电连接器3与中央处理器晶片4组装时,中央处理器晶片4是放置于移动座31的表面,使晶片4底面向下延伸的插脚41插入各对应的插孔311内,进而伸入端子通道321中,当使用者扳动驱动件33使移动座31在基座32的上方表面产生相对位移时,迫使晶片4的插脚41与位于端子通道321内导电端子34的接合部341相互接触,以达到中央处理器晶片4与电路板电性连接的作用。由于此零插入力电连接器3的构造是现在广泛应用的公知技术,在此不再详细说明。When the electrical connector 3 was assembled with the central processing unit chip 4, the central processing unit chip 4 was placed on the surface of the
以往零插入力电连接器3的导电端子34与电路板焊接的方式通常采用表面粘着法(SMT)。In the past, the
如图2所示,导电端子34的焊接部342处事先压制呈叉形或凹陷状窝形以供植入一锡球343,而对应的电路板表面则仅需预留相对应且具有焊锡层的接(pad)即可。焊接时,电连接器3上各导电端子34的焊接部342的锡球343对准并接触对应的接点位置,等电连接器3与电路板一起通过焊接后,即可使导电端子34的焊接部342以表面粘着的方式焊接固定在对应的接垫上。这种方式可有利于电路板上空间的利用,且接垫与接垫间的间距亦可更为缩小而密集,使得电连接器3可朝轻薄短小的市场趋势进行设计。但这种连接器也有缺陷,其中之一是由于采用了锡球343焊接,因此导电端子34的长度相对较短,而且锡球343与导电端子34的接合部341的距离也较近,当焊接作业使锡球343融化时,锡液因表面接触力会沿着导电端子34向上爬升,使得部分锡液可能因此聚积在导电端子34的接合部341上,当电连接器3的移动座31带动中央处理器晶片4移动时,聚积在导电端子34的接合部341上的焊锡将阻挠晶片4的插脚41进入接合部341,甚至会使插脚41弯折,使得中央处理器晶片4因接触不良而变为废品。另外,由于导电端子34与电路板间存在锡球343的导电性较差的问题,会使讯号传导电阻较以铜为主的导线增大,当用来传导高频讯号时会有杂讯产生,而使得讯号传导的可靠度降低。As shown in FIG. 2 , the
发明内容Contents of the invention
本实用新型目的是提供一种无须锡球即能进行表面粘着的导电端子的电连接器。The purpose of the utility model is to provide an electrical connector with conductive terminals that can be surface-adhesive without solder balls.
为达到上述目的,本实用新型采用的技术方案是:电连接器是电性连接在一电路板上,并供一具有复数插脚的电子元件插接。该电连接器包含一绝缘壳体及复数导电端子。In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: the electrical connector is electrically connected to a circuit board, and is used for plugging an electronic component with a plurality of pins. The electrical connector includes an insulating shell and a plurality of conductive terminals.
绝缘壳体具有一供电子元件接合的第一面及一接近电路板的第二面,绝缘壳体设有复数端子通道,各端子通道分别在第一面及第二面上形成一第一开口及一第二开口,在端子通道的内壁面上进一步设有一位于端子通道内的卡止部,卡止部位于端子通道内并构成一通道截面积小于第一开口及第二开口的颈缩部。The insulating housing has a first surface for bonding of electronic components and a second surface close to the circuit board. The insulating housing is provided with a plurality of terminal passages, and each terminal passage forms a first opening on the first surface and the second surface respectively. And a second opening, a locking part located in the terminal channel is further provided on the inner wall of the terminal channel, the locking part is located in the terminal channel and forms a necking part with a channel cross-sectional area smaller than that of the first opening and the second opening .
各导电端子具有一接合部、一焊接部及一位于接合部与焊接部中间的定位部,焊接部形成倒钩状,各导电端子可由第一开口及第二开口二择一地插入对应的端子通道内,使导电端子部分地通过颈缩部,并使定位部与卡止部相互干涉卡滞,迫使导电端子定位于端子通道内,而接合部位于接近第一开口处以供电子元件的插脚接触,焊接部则凸出于绝缘壳体的第二面外,且所有形成倒钩状的焊接部处于同一平面上,以此来取代锡球而直接利用表面粘着方式焊接于电路板上。Each conductive terminal has a joint part, a welding part and a positioning part located between the joint part and the welding part, the welding part is formed into a barb shape, and each conductive terminal can be inserted into the corresponding terminal alternatively through the first opening and the second opening In the channel, the conductive terminal is partially passed through the constricted part, and the positioning part and the locking part interfere with each other to force the conductive terminal to be positioned in the terminal channel, and the joint part is located close to the first opening for the contact of the pin of the electronic component , the soldering portion protrudes from the second surface of the insulating housing, and all the soldering portions forming the barb shape are on the same plane, so as to replace the solder balls and be directly soldered to the circuit board by surface adhesion.
由于上述技术方案运用,本实用新型与现有技术相比具有下列优点:Due to the application of the above-mentioned technical solutions, the utility model has the following advantages compared with the prior art:
1、导电性佳。由于不须使用锡球进行表面粘着而直接与电路板对应的接点焊接,因此电性传导上没有锡球锡料所造成的电阻问题,故不但保持了表面粘着工艺的导电端子密集化的优点,更可适合传递较为高频的电子讯号而不会有杂讯产生。另外,焊接作业时也不会有锡料沿导电端子爬升而聚积在导电端子的接合部上的问题,因此不会有影响晶片的插脚与导电端子的接合部电性接触的缺点。1. Good electrical conductivity. Since there is no need to use solder balls for surface adhesion, it is directly soldered to the corresponding contacts of the circuit board, so there is no resistance problem caused by solder balls and tin materials in electrical conduction, so it not only maintains the advantages of dense conductive terminals of the surface mount process, It is more suitable for transmitting relatively high frequency electronic signals without generating noise. In addition, there is no problem of tin material climbing along the conductive terminal and accumulating on the joint portion of the conductive terminal during the soldering operation, so there is no disadvantage of affecting the electrical contact between the pins of the chip and the joint portion of the conductive terminal.
2、可回收再制。因导电端子是直接以其焊接部与电路板的接垫焊接,故一旦焊接部与接点有对位不准的状况发生时,仅需再次加热使导电端子的焊接部与电路板对应的接垫脱离,即可进行回收再制,而不会有以往一旦焊接失败而破坏锡球后即无法使电连接器回收再制的缺点,可大幅降低废品的发生率以及材料的成本。2. It can be recycled and remanufactured. Because the conductive terminal is directly soldered to the pad of the circuit board by its soldering part, once the soldering part and the contact are out of alignment, it only needs to be reheated to make the soldering part of the conductive terminal and the corresponding pad of the circuit board It can be recycled and remanufactured after detachment, without the disadvantage that the electrical connector cannot be recycled and remanufactured once the solder ball is damaged due to soldering failure, which can greatly reduce the occurrence rate of waste products and the cost of materials.
3、制作成本低。与以往必须对电连接器进行植入锡球的制作过程相比,本实用新型仅需将导电端子的焊接部弯折成倒钩形状即可与电路板进行焊接,因此就导电端子植入锡球的工艺与导电端子焊接部加工弯折的工艺两者相比,本方案的制作成本显然较为低廉。3. The production cost is low. Compared with the previous manufacturing process in which solder balls had to be implanted into the electrical connector, the utility model only needs to bend the welding part of the conductive terminal into a barb shape to be welded with the circuit board, so the conductive terminal is implanted with tin Compared with the process of processing and bending the welding part of the conductive terminal, the production cost of this solution is obviously relatively low.
附图说明Description of drawings
附图1为一种零插入力电连接器构造立体图;Accompanying
附图2为图1电连接器构造剖视结构示意图,该图说明电连接器的底面具有复数锡球的构造;Accompanying
附图3为本实用新型电连接器一较佳实施例的部分构造立体剖视分解图,图中一导电端子由上方插入一基座的端子通道的结构方式以及该导电端子的焊接部形成半环形的形态;Accompanying drawing 3 is the three-dimensional cut-away exploded view of partial structure of a preferred embodiment of the electric connector of the present invention. In the figure, a conductive terminal is inserted into a terminal channel of a base from above and the welding part of the conductive terminal forms a semi-conductive structure. ring shape;
附图4为图3所示结构的侧面构造剖视示意图;Accompanying drawing 4 is the side structure sectional schematic diagram of structure shown in Fig. 3;
附图5为该较佳实施例的部分构造立体剖分解图,图中一导电端子由下方插入一基座端子通道的结构方式;Accompanying drawing 5 is the three-dimensional exploded view of the partial structure of the preferred embodiment, in which a conductive terminal is inserted into a base terminal channel from below;
附图6为图5所示结构的侧面构造剖视示意图;Accompanying drawing 6 is the schematic sectional view of the side structure of the structure shown in Figure 5;
附图7为本实用新型导电端子另一较佳实施例的结构示意图,图中导电端子的焊接部形成环形的形态;Accompanying drawing 7 is the structural schematic diagram of another preferred embodiment of the conductive terminal of the present invention, in which the welding part of the conductive terminal forms a ring shape;
附图8为本实用新型导电端子另一较佳实施例的结构示意图,图中导电端子的焊接部形成W形的形态;Accompanying drawing 8 is a structural schematic diagram of another preferred embodiment of the conductive terminal of the present invention, in which the welding part of the conductive terminal forms a W-shaped form;
附图9为本实用新型导电端子另一较佳实施例的结构示意图,图中导电端子的焊接部形成矩形的形态;Accompanying drawing 9 is a structural schematic diagram of another preferred embodiment of the conductive terminal of the present invention, in which the welding part of the conductive terminal forms a rectangular shape;
附图10为本实用新型导电端子另一较佳实施例的结构示意图,图中导电端子的焊接部形成三角形的形态;Accompanying drawing 10 is a structural schematic diagram of another preferred embodiment of the conductive terminal of the present invention, in which the welding part of the conductive terminal forms a triangular shape;
附图11为本实用新型导电端子另一较佳实施例的结构示意图,图中导电端子的焊接部形成水平线形的形态;Accompanying drawing 11 is the structure diagram of another preferred embodiment of the conductive terminal of the present invention, in which the welding part of the conductive terminal forms a horizontal linear form;
附图12为本实用新型导电端子另一较佳实施例的结构示意图,图中导电端子的焊接部形成梯形的形态。Figure 12 is a schematic structural diagram of another preferred embodiment of the conductive terminal of the present invention, in which the welding part of the conductive terminal forms a trapezoidal shape.
以上附图中:1、电连接器;12、基座;121、第一面;122、第二面;123、端子通道;1231、第一开口;1232、第二开口;1233、颈缩部;124、卡止部;125、挡止部;2、导电端子;21、接合部;22、焊接部;23、定位部;24、翼部;3、电连接器;31、移动座;311、插孔;32、基座;321、端子通道;33、驱动件;34、导电端子;341、接合部;342、焊接部;343、锡球;4、晶片;41、插脚。In the above drawings: 1. Electrical connector; 12. Base; 121. First surface; 122. Second surface; 123. Terminal channel; 1231. First opening; 1232. Second opening; 1233. Neck constriction ; 124, locking part; 125, blocking part; 2, conductive terminal; 21, joint part; 22, welding part; 23, positioning part; 24, wing part; 3, electrical connector; , socket; 32, base; 321, terminal channel; 33, driver; 34, conductive terminal; 341, junction; 342, soldering portion; 343, solder ball; 4, chip;
具体实施方式Detailed ways
下面结合附图及实施例对本实用新型作进一步描述:Below in conjunction with accompanying drawing and embodiment the utility model is further described:
参见图3及图4,本实施例作为电连接器的一较佳实施例,以零插入力电连接器1作说明,其具有一绝缘材料制成的绝缘壳体,绝缘壳体如公知的零插入力电连接器构造一样,包括一基座12,基座12具有一位于上方的第一面121以及一位于下方的第二面122,在基座12内设有复数个,由第一面121贯通至第二面122的端子通道123,该端子通道123分别在第一面121及第二面122上形成一第一开口1231及第二开口1232,在端子通道123的内壁面上进一步设有一位于端子通道123内的卡止部124,本实施例中,卡止部124是凸出于端子通道123内壁面的一凸筋,使得卡止部124于端子通道123内构成一通道截面积小于第一开口1231及第二开口1232的颈缩部1233。Referring to Fig. 3 and Fig. 4, this embodiment, as a preferred embodiment of the electrical connector, is described as a zero-insertion force
各导电端子2均具有一接合部21、一焊接部22以及一位于接合部21与焊接部22中间的定位部23,本例中,接合部21统一形成可相对弹性地扩张的夹钳结构,而焊接部22则事先用机械加工方式弯折形成倒钩的半圆形状。另外,定位部23则对应基座12的卡止部124的凸筋而在导电端子2侧边材料上形成一凹形。Each
组装时,导电端子2可具有两种组装方式,一是从第一开口1231插置于对应的端子通道123内,二是从第二开口1232插置于对应的端子通道123内。两种组装方式都必须使导电端子2的部分材料通过颈缩部1233,使其接合部23位于端子通道123内接近第一开口1231处,焊接部22则凸出于基座12下方的第二面122外部。During assembly, the
对图3及图4而言,当导电端子2是从第一开口1231插入端子通道123时,导电端子2的焊接部22是先由第一开口1231进入,接着穿过颈缩部1233,移动过程中,导电端子2两侧材料略产生弹性变形后,凹形定位部23将卡合在端子通道123内形成凸筋的卡止部124上,进而固定导电端子2与端子通道123两者的相对位置。为了进一步增加导电端子2在端子通道123内组装及定位的方便性,绝缘壳体的基座12在各端子通道123内相对的两内侧面、且接近第二面122处各设有一凸出的挡止部125。对应于挡止部125的设计,导电端子2在相反的两侧上各形成一向外凸出的翼部24,而在导电端子2插入端子通道123时,挡止部125将对翼部24的移动产生限制作用,在定位部23与卡止部124卡合后防止导电端子2继续向下运动,可进一步增加定位效果。3 and 4, when the
再如图5及图6所示,以相同的组装原理,当导电端子2从第二开口1232插入端子通道123时,导电端子2的接合部21先由第二开口1232进入,接着穿过颈缩部1233,再由导电端子2呈凹形的定位部23卡合在端子通道123内呈凸筋的卡止部124构成定位。同样,基座12也可设挡止部125,以及导电端子2上设翼部24,而与上述导电端子2由第一开口1231进入端子通道2的组装方式的不同点在于,挡止部125改在接近第一面121处,以配合导电端子2插入端子通道123的方向,其效果则与上述组装方式相同,在此不再描述。As shown in Figure 5 and Figure 6, with the same assembly principle, when the
如此,当导电端子2分别定位在对应的端子通道123内之后,由导电端子2形成倒钩状的焊接部22,可提供如锡球一样,用以与电路板焊接的底面,必要时,底面也可事先附着一焊锡层,而倒钩形状的形态实际上并非一定,设计者可视需要而利用不同的模具产生不同的焊接部22倒钩形状,如图7至图12所示,分别为一环形、W形、矩形、三角形、水平线形及梯形等形状的焊接部22,故由此焊接部22的倒钩形状将可用来取代锡球,使得导电端子3的焊接部22可直接利用表面粘着法的工艺焊接于电路板上对应的接垫上构成电性连接。In this way, after the
综上所述,本实用新型的电连接器应用复数具有形成倒钩状焊接部的导电端子,由焊接部的底面可直接取代锡球而进行表面粘着的焊接方式,确实能达到本实用新型的目的。To sum up, the electrical connector of the present invention uses a plurality of conductive terminals with barb-shaped welding parts, and the bottom surface of the welding parts can directly replace the solder balls for surface-adhesive welding, which can indeed achieve the purpose of the present invention. Purpose.
以上所述仅为本实用新型的较佳实施例,其中虽然以零插入力电连接器作为说明,但也可应用在其它使用表面粘着法方式焊接于电路板上的电连接器,因此不能以此限定本实用新型的实施范围,即凡按照本实用新型公开的内容所作的等效变化与替换,均应视为本实用新型的保护范围。The above description is only a preferred embodiment of the present invention. Although the zero-insertion force electrical connector is used as an illustration, it can also be applied to other electrical connectors that are soldered on the circuit board by surface-mounting. Therefore, it cannot be used This limits the implementation scope of the utility model, that is, all equivalent changes and replacements made according to the content disclosed in the utility model shall be regarded as the protection scope of the utility model.
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CN 200320110358 CN2671158Y (en) | 2003-10-20 | 2003-10-20 | Electrical connectors with surface mount conductive terminals |
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CN109462058A (en) * | 2017-09-01 | 2019-03-12 | 莫列斯有限公司 | The manufacturing method of connector, connector assembly and connector |
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Cited By (2)
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CN109462058A (en) * | 2017-09-01 | 2019-03-12 | 莫列斯有限公司 | The manufacturing method of connector, connector assembly and connector |
US10498065B2 (en) | 2017-09-01 | 2019-12-03 | Molex, Llc | Connector, connector assembly, and method for manufacturing connector |
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