CN2613053Y - Organic Light Emitting Diodes with Water Removal Films - Google Patents
Organic Light Emitting Diodes with Water Removal Films Download PDFInfo
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- CN2613053Y CN2613053Y CNU022927034U CN02292703U CN2613053Y CN 2613053 Y CN2613053 Y CN 2613053Y CN U022927034 U CNU022927034 U CN U022927034U CN 02292703 U CN02292703 U CN 02292703U CN 2613053 Y CN2613053 Y CN 2613053Y
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- organic light
- light emitting
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- emitting diode
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Abstract
An organic light emitting diode with a water removal film comprises a substrate, a first electrode, an organic light emitting layer, a second electrode, a water removal film and a protective layer (passivation film). The first electrode is formed on the substrate, the organic light-emitting layer is formed on the first electrode, the second electrode is formed on the organic light-emitting layer, the water removal film is formed above the substrate in a deposition mode, the protective layer is arranged above the substrate and forms a sealed space (air space) with the substrate, and the first electrode, the organic light-emitting layer, the second electrode and the water removal film are all located in the sealed space.
Description
Technical field
The utility model relates to a kind of Organic Light Emitting Diode, particularly a kind of Organic Light Emitting Diode with the film that dewaters (drying layer).
Background technology
Organic Light Emitting Diode (Organic Light-Emitting Diode) with its self-luminous, no visual angle, power saving, advantage such as processing procedure is easy, cost is low, high answer speed and full-colorization, make Organic Light Emitting Diode have great application potential, be expected to become the illumination of follow-on flat-panel screens and planar light source, comprise special light sources and general lighting.
Please refer to shown in Figure 1ly, Organic Light Emitting Diode 1 comprises a substrate 11, one first electrode 12, an organic luminous layer 13, one second electrode 14 and a cover plate 15.Wherein, the substrate 11 and first electrode 12 are light-transmitting materials, and first electrode 12 and second electrode 14 are respectively as anode and negative electrode; When imposing an electric current in Organic Light Emitting Diode 1, the electricity hole is injected by first electrode 12, electronics is injected by second electrode 14 simultaneously, at this moment, because the potential difference that extra electric field caused, make carrier in organic luminous layer 13, move, meet and produce combination again that can excite light emitting molecule in the organic luminous layer 13 and combine the exciton (exciton) that is produced with electric hole by electronics, the light emitting molecule of excitation state gives off energy with the form of light then.
From the above, the normal dedining mechanism that takes place is the not generation of light-emitting zone (dark spot) in Organic Light Emitting Diode, therefore will promote the durability (durability) of Organic Light Emitting Diode, just is how to reduce the not generation of light-emitting zone.And the organic functional material in the organic LED structure and easy and airborne moisture and oxygen reaction (especially moisture) as second electrode of negative electrode cause the not generation of light-emitting zone.Therefore, it is considerable moisture being removed completely.So, generally when making Organic Light Emitting Diode, can under vacuum state, carry out plated film usually, and the mode to encapsulate, Organic Light Emitting Diode is sealed.But such mode can't guarantee fully that still Organic Light Emitting Diode can not be subjected to the influence of moisture and cause the not generation of light-emitting zone.
As mentioned above, in order thoroughly to prevent the not generation of light-emitting zone, and then promoting the life-span and the stability of Organic Light Emitting Diode, primarily is the water of removing Organic Light Emitting Diode inside fully.A kind of common mode is to add a water absorbing agent (water-trapping agent) or drier (drying agent) in the inside of Organic Light Emitting Diode.In order to solve the not generation of light-emitting zone of Organic Light Emitting Diode inside, existing several relevant patent application cases: in European patent case EP0776147, propose as people such as Kawami, Organic Light Emitting Diode is sealed in one contains in sealing (airtight) container of the solid material of chemical water absorption character, the compound that this class has chemical water absorption character comprises metal oxides such as calcium oxide and barium monoxide.And in British patent case GB23681 92, people such as Hisamitsu use organo-metallic compound (organometallic compound) as the suction material, therefore organo-metallic compound can effectively be adsorbed with the water of OLED inside, simultaneously can adsorb other chemical water absorbing agent (chemical drying agents) and physics water absorbing agent (physical drying agents), and then reach and prevent the not generation of light-emitting zone.And in United States Patent (USP) case US6226890, people such as Boroson propose, the drier blending is had in the adhesive agent (binder) of aqueous vapor percent of pass (water vaportransmission rate) preferably in one, make it in Organic Light Emitting Diode, form a film again, make it can have better or keep the soaking effect of this solid drier.
In more detail, the mode that material is filled in the Organic Light Emitting Diode that generally will absorb water has two kinds; Please refer to shown in Fig. 2 A, the first material 26 that will absorb water earlier fills in one and has been precast with in the cover plate 25 of groove 251, add the permeable film 27 of last layer again in groove 251 tops, push-down stack (shown in Fig. 2 B) on the Organic Light Emitting Diode that the cover plate 25 of suction material 26 will be housed subsequently and prepare, and with sealing 252 with cover plate 25 and substrate 21 driving fits forming a seal cavity, and first electrode 22, organic luminous layer 23, second electrode 24, permeable film 27 and suction material 26 are arranged in this seal cavity.But use this technology,, need to add the permeable film 27 of last layer simultaneously, so will increase the complexity on the processing procedure, make the yield of producing reduce and heighten with manufacturing cost because need in groove 251, load suction material 26.
In addition, please refer to shown in Fig. 3 A, its two be will suction material 36 blending in the Polymer Solution of tool water penetration, mode by coating, formation one includes the film 37 of suction material 36 on cover plate 35, subsequently again with removal of solvents, then again with push-down stack (shown in Fig. 3 B) on cover plate 35 and the Organic Light Emitting Diode that has prepared, and with sealing 351 with cover plate 35 and substrate 31 driving fits forming a seal cavity, and first electrode 32, organic luminous layer 33, second electrode 34, film 37 and suction material 36 are arranged in this seal cavity.Though this mode is comparatively approaching with encapsulation procedure on processing procedure; and reduced the complexity on the process technique; but after coating process; must toast processing procedure with removal of solvents; regular meeting causes and still residual in the Organic Light Emitting Diode partly solvent is arranged as a result; thereby cause the deterioration of sealing 351, and then make the peeling off of substrate 31 and cover plate 35, and cause the damage of assembly.
Above-mentioned for example in, the suction material is to utilize coating method, and utilizes Polymer Solution to be fixed on Organic Light Emitting Diode inside to form one except that water layer as the adhesive agent material that will absorb water; Yet, the organic luminous layer in the Organic Light Emitting Diode and second electrode, be to utilize depositional mode to form, can't reach processing procedure and be incorporated under the identical operations pressure, and need vacuum breaker to cause that processing procedure is complicated, yield reduces, manufacturing cost increases with the water layer coating process that removes under the normal pressure; Moreover, form one with coating method and remove the problem that water layer also has hole (pin hole) and coating dead angle.
In addition, when utilizing adhesive agent to fix the suction material, the thickness that removes water layer can't lower effectively, thereby can limit the degree of dwindling of the thickness of Organic Light Emitting Diode; Particularly Organic Light Emitting Diode is because of simple in structure, its thickness of formed flat-panel screens can be thinner than LCD, it is not good but to be subject to the existing suction material usefulness that dewaters, and make and the time need add a large amount of suction materials in encapsulation, make Organic Light Emitting Diode thickness increase, sacrificed the advantage that organic light emitting display can be thinner; In addition, when utilizing adhesive agent to fix the suction material, the suction material that only is fixed in the laminar surface that dewaters can touch the hydrone of Organic Light Emitting Diode inside, so, the suction material that only is fixed in the laminar surface that dewaters can reach the effect of adsorbed water molecule, thereby can't effectively bring into play the adsorption capacity of suction material.
Therefore, how a kind of Organic Light Emitting Diode is provided, form except that water layer, reduce to remove the thickness of water layer and effectively bring into play the adsorption capacity of removing water layer, one of important topic of current opto-electronics just in the hope of the operating environment that can integrate deposition manufacture process and encapsulation procedure.
Summary of the invention
At the problems referred to above, the purpose of this utility model is for providing a kind of Organic Light Emitting Diode of the film thickness that can reduce to dewater.
Another purpose of the present utility model is for providing a kind of Organic Light Emitting Diode that can effectively bring into play the adsorption capacity of the film that dewaters.
Another purpose of the present utility model forms the Organic Light Emitting Diode of the film that dewaters for a kind of operating environment that can integrate deposition manufacture process and encapsulation procedure is provided.
For reaching above-mentioned purpose, utilize depositional mode to form the film that dewaters according to Organic Light Emitting Diode of the present utility model.
Organic Light Emitting Diode of the present utility model comprises a substrate, one first electrode, an organic luminous layer, one second electrode, dewater a film and a protective layer.In the utility model; first electrode is formed on the substrate; organic luminous layer is formed on first electrode; second electrode is formed on the organic luminous layer; the film that dewaters is formed at the substrate top with depositional mode; protective layer is located at the substrate top and is formed a seal cavity with substrate, so that first electrode, organic luminous layer, second electrode and the film that dewaters are placed in this seal cavity.
As mentioned above, owing to utilize depositional mode to form the film that dewaters according to Organic Light Emitting Diode of the present utility model, so when formation dewaters film, can integrate the operating environment of deposition manufacture process and encapsulation procedure, to reduce manufacturing cost, reduce organic luminescent assembly and before encapsulation procedure, be exposed to chance under the atmospheric environment promoting yield, and utilize deposition manufacture process can avoid problem of solvent residue and save cost; In addition, owing to need not use adhesive agent to fix the suction material, so the thickness of the film that can reduce to dewater, and the dewater adsorption capacity of film of performance effectively.
Relevant detailed content of the present utility model and technology, conjunction with figs. is described as follows.
Description of drawings
Fig. 1 is a schematic diagram, shows the schematic diagram of existing Organic Light Emitting Diode;
Fig. 2 A is a schematic diagram, shows the cover plate of existing Organic Light Emitting Diode and the schematic diagram of suction material;
Fig. 2 B is a schematic diagram, shows the schematic diagram of existing Organic Light Emitting Diode, and it has cover plate and suction material shown in Fig. 2 A;
Fig. 3 A is a schematic diagram, shows the cover plate of another existing Organic Light Emitting Diode and the schematic diagram of suction material;
Fig. 3 B is a schematic diagram, shows the schematic diagram of another existing Organic Light Emitting Diode, and it has the schematic diagram of the cover plate as shown in Figure 3A and the material that absorbs water;
Fig. 4 is a schematic diagram, shows the schematic diagram of the Organic Light Emitting Diode of the utility model preferred embodiment; And
Fig. 5 is a schematic diagram, shows the schematic diagram of the Organic Light Emitting Diode of another preferred embodiment of the utility model.
Symbol description among the figure
1 Organic Light Emitting Diode
11 substrates
12 first electrodes
13 organic luminous layers
14 second electrodes
15 cover plates
21 substrates
22 first electrodes
23 organic luminous layers
24 second electrodes
25 cover plates
251 grooves
252 sealings
26 suction materials
27 permeable films
31 substrates
32 first electrodes
33 organic luminous layers
34 second electrodes
35 cover plates
351 sealings
36 suction materials
37 films
4 Organic Light Emitting Diodes
41 substrates
42 first electrodes
43 organic luminous layers
44 second electrodes
45 films that dewater
46 protective layers
5 Organic Light Emitting Diodes
Embodiment
Hereinafter with reference to relevant drawings, the Organic Light Emitting Diode of the utility model preferred embodiment is described, wherein identical assembly will be illustrated with identical reference marks.
Please refer to shown in Figure 4ly, the Organic Light Emitting Diode 4 of the utility model preferred embodiment comprises a substrate 41, one first electrode 42, an organic luminous layer 43, one second electrode 44, dewater a film 45 and a protective layer 46.
As shown in Figure 4, first electrode 42 is formed on the substrate 41; Organic luminous layer 43 is formed on first electrode 42; Second electrode 44 is formed on the organic luminous layer 43; The film 45 that dewaters is formed on second electrode 44; And protective layer 46 coats first electrode 42, organic luminous layer 43, second electrode 44 and the film 45 that dewaters.
In the present embodiment, substrate 41 is generally a transparency carrier, for example is a glass substrate, plastics (plastic) substrate or a flexibility (flexible) substrate.Wherein, plastic base and flexible base, board can be a Merlon (polycarbonate, PC) substrate, a polyester (polyester, PET) substrate, a cyclenes copolymer (cyclic olefin copolymer, COC) substrate, a crome metal compound base material-cyclenes copolymer (metallocene-based cyclic olefincopolymer, mCOC) substrate or a slim glass (Thin Glass) substrate.
First electrode 42 can be to utilize sputter (sputtering) mode or ion plating (ionplating) mode is formed on the substrate 41, this first electrode 42 is generally a transparent conductive metal oxide as anode and its material usually, for example is tin indium oxide (ITO), aluminum zinc oxide (AZO) or indium zinc oxide (IZO).
Organic luminous layer 43 comprises an electric hole implanted layer, an electric hole transfer layer, a luminescent layer, an electron transfer layer and an electron injecting layer (not shown) usually.For example, the main material of electric hole implanted layer is copper phthalocyanine (CuPc); The material of electricity hole transport layer is mainly 4,4 '-bis[N-(1-naphthyl)-N-phenylamino] biphenyl (NPB); The material of electron injecting layer is mainly lithium fluoride (LiF); The material of electron transfer layer is mainly tris (8-quinolinato-N1,08)-aluminum (Alq).And organic luminous layer 43 can be to be formed on first electrode 42 with evaporation (evaporation), rotary coating (spin coating), ink jet printing (ink jetprinting) or printing (printing) mode.In addition, the light launched of organic luminous layer 43 can be blue light, green glow, ruddiness, white light, other monochromatic light or full-color light.
Second electrode 44 is usually as negative electrode, and it can be to utilize vapour deposition method, electron beam coating method (E-gun) or sputtering method (sputtering) to form, and its material can be conductive materials such as aluminium, aluminium/lithium, calcium, magnesium silver alloy or silver.
The film 45 that dewaters utilizes depositional mode to form, and for example is vapour deposition (vapordeposition), physical vapour deposition (PVD) (physical Vapor deposition), chemical vapour deposition (CVD) (chemical vapor deposition) or evaporation (evaporation).In the present embodiment, the material of the film 45 that dewaters be for can be used as the material of sedimentary origin (deposition source), that is is that it can be applied in the deposition manufacture process, and it has the material of adsorbed water molecule ability; The material of this film 45 that dewaters can be organo-metallic compound (organometaliccomplex compound), alkali metal compound (alkaline metal compound), alkali metal oxide (alkaline metal oxide compound), alkaline earth metal compound (alkalineearth metal compound), alkaline earth oxide (alkaline earth metal oxidecompound), sulfur-bearing metallic compound (sulfate compound), metal halide (metalhalide compound), cross chloric acid compound (perchlorate compound), or organic compound (organic compound).
Protective layer 46 is a non-ventilated membrane (non-permeable film), it can be to utilize depositional mode to form, its material can be silica (SiO2), silicon nitride (Si3N4) and silicon oxynitride (SiOxNy), it can also be to utilize the mode of injecting glue to be formed at around first electrode 42, organic luminous layer 43, second electrode 44 and the film 45 that dewaters in addition, and it can also be prefabricated film and utilize and paste mode and be formed at around first electrode 42, organic luminous layer 43, second electrode 44 and the film 45 that dewaters in addition; And the material of protective layer 46 can be epoxy resin (epoxy resin).As shown in the figure, protective layer 46 and substrate 41 constitute an enclosure space, so that first electrode 42, organic luminous layer 43, second electrode 44 and the film 45 that dewaters are hedged off from the outer world, so that avoid the erosion of aqueous vapor, oxygen.
In addition, the film 45 that dewaters can also be to be deposited on around first electrode 42, organic luminous layer 43 and second electrode 44; As shown in Figure 5, in the Organic Light Emitting Diode 5 according to another preferred embodiment of the utility model, the film 45 that dewaters coats first electrode 42, organic luminous layer 43 and second electrode 44, and protective layer 46 is formed at film 45 outsides that dewater.
In sum, because Organic Light Emitting Diode of the present utility model utilizes depositional mode to form the film that dewaters, so when formation dewaters film, can integrate the operating environment of encapsulation procedure and leading portion deposition manufacture process, it for example is the deposition manufacture process when forming second electrode, so manufacturer must not spend extra cost and remove to build the environment of execution coating process, reaches to buy and carry out the board of coating process, so can reduce manufacturing cost.In addition, the dissolvent residual problem of utilizing depositional mode to form to dewater film can avoid existing coating adhesive agent mode to be caused, and the thickness of the film that can reduce effectively to dewater, can avoid the interference of adhesive agent in addition and the dewater hydrone adsorption capacity of film of performance effectively.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present utility model and category, and, all should be contained among the scope of claim its equivalent modifications of carrying out or change.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU022927034U CN2613053Y (en) | 2002-12-12 | 2002-12-12 | Organic Light Emitting Diodes with Water Removal Films |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU022927034U CN2613053Y (en) | 2002-12-12 | 2002-12-12 | Organic Light Emitting Diodes with Water Removal Films |
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| Publication Number | Publication Date |
|---|---|
| CN2613053Y true CN2613053Y (en) | 2004-04-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU022927034U Expired - Fee Related CN2613053Y (en) | 2002-12-12 | 2002-12-12 | Organic Light Emitting Diodes with Water Removal Films |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325953A (en) * | 2012-03-19 | 2013-09-25 | 瀚宇彩晶股份有限公司 | Organic light emitting diode package and packaging method thereof |
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2002
- 2002-12-12 CN CNU022927034U patent/CN2613053Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325953A (en) * | 2012-03-19 | 2013-09-25 | 瀚宇彩晶股份有限公司 | Organic light emitting diode package and packaging method thereof |
| US9070895B2 (en) | 2012-03-19 | 2015-06-30 | Hannstar Display Corp. | OLED package and packaging method thereof |
| CN103325953B (en) * | 2012-03-19 | 2016-02-10 | 瀚宇彩晶股份有限公司 | Organic Light Emitting Diode Encapsulation and Encapsulation Method |
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