CN2580601Y - Heat sink and its connection structure - Google Patents
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- CN2580601Y CN2580601Y CN 02285663 CN02285663U CN2580601Y CN 2580601 Y CN2580601 Y CN 2580601Y CN 02285663 CN02285663 CN 02285663 CN 02285663 U CN02285663 U CN 02285663U CN 2580601 Y CN2580601 Y CN 2580601Y
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- 239000012634 fragment Substances 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 abstract description 47
- 238000001816 cooling Methods 0.000 description 20
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- 239000003292 glue Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 210000003813 thumb Anatomy 0.000 description 2
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Abstract
Description
技术领域technical field
本实用新型涉及一种散热装置的连接结构,应用于中央处理器的散热装置,特别是一种在其散热本体与中央处理器贴合时,能够使其散热本体与中央处理器脱离贴合关系的散热装置的连接结构。The utility model relates to a connection structure of a heat dissipation device, which is applied to a heat dissipation device of a central processing unit, in particular to a heat dissipation device capable of separating the heat dissipation body from the central processing unit when the heat dissipation body is attached to the central processing unit. The connecting structure of the cooling device.
背景技术Background technique
在使用电子仪器的过程中,其元件往往会产生许多热能,所以需要采用散热装置将电子仪器的热能排出,以避免过多的热能累积于元件,导致元件损坏,特别是计算机的中央处理器,因为需要满足快速处理资料的需求,所以其运算能力日渐提高,与此同时,中央处理器所产生的热能相较于以往增加更多,所以使用散热装置解决散热问题,已经成为一必要的手段。In the process of using electronic equipment, its components often generate a lot of heat energy, so it is necessary to use a cooling device to discharge the heat energy of the electronic equipment, so as to avoid excessive heat energy accumulating in the components, resulting in damage to the components, especially the central processing unit of the computer, Because of the need to meet the demand for fast data processing, its computing power is increasing day by day. At the same time, the heat energy generated by the central processing unit has increased more than before. Therefore, using a heat sink to solve the heat dissipation problem has become a necessary means.
一般而言,解决中央处理器的散热问题的方式,多是将散热装置的散热本体直接设置于中央处理器,甚至是加装风扇等,以达到散热的效果。为了使散热装置的散热本体与中央处理器两者间的表面得以更加地贴合,而增进散热效果,多是采用散热胶等介质,使散热装置的散热本体的一面贴合于中央处理器的表面,但是在散热装置损坏时,也因为散热胶使散热装置的散热本体及中央处理器紧密贴合的缘故,所以在拆卸散热装置时,往往会将中央处理器与散热装置一并自电路板上拆卸下来,如此一来,在执行散热装置的拆卸动作时,也就容易伤到中央处理器,甚至无法在中央处理器仍被使用时执行散热装置的拆卸动作。Generally speaking, the way to solve the heat dissipation problem of the CPU is to directly install the heat dissipation body of the heat dissipation device on the CPU, or even add a fan to achieve the effect of heat dissipation. In order to make the surface between the heat dissipation body of the heat sink and the central processing unit fit better, and improve the heat dissipation effect, a medium such as heat dissipation glue is mostly used to make one side of the heat dissipation body of the heat sink fit on the surface of the central processing unit. However, when the cooling device is damaged, the cooling body of the cooling device and the CPU are tightly bonded by the heat-dissipating glue, so when disassembling the cooling device, the CPU and the cooling device are often removed from the circuit board. As a result, when the cooling device is removed, the central processing unit is easily damaged, and even the cooling device cannot be removed when the central processing unit is still in use.
基于上述原因,设计一种散热装置的连接结构,在散热装置的散热本体与中央处理器贴合时,仅仅将散热本体拆卸下来,同时,可以在中央处理器使用时执行拆卸该散热装置的动作,而使散热装置与中央处理器脱离贴合的状况。Based on the above reasons, a connection structure of a heat sink is designed. When the heat sink body of the heat sink is attached to the central processing unit, only the heat sink body is disassembled. At the same time, the action of disassembling the heat sink can be performed when the central processing unit is in use. , so that the cooling device and the central processing unit are out of the bonded state.
实用新型内容Utility model content
本实用新型的主要目的,在于提供一种散热装置的连接结构,使散热装置的散热本体脱离与中央处理器的贴合时,可以仅将散热本体自中央处理器拆卸下来,而不致使中央处理器连同散热本体被拆卸下来。The main purpose of this utility model is to provide a connection structure of a heat sink, so that when the heat sink body of the heat sink is separated from the central processing unit, only the heat sink body can be disassembled from the central processing unit without causing the central processing unit to disassemble. The radiator together with the cooling body is disassembled.
本实用新型上述目的是这样实现的,本实用新型提供的一种散热装置的连接结构,包括有,一固定件,一弹性元件,一拆卸片,其特征在于,所述固定件,活动设置于散热本体,并具有一头部及一颈部,该头部的直径大于该颈部的直径;所述弹性元件,活动设置于该固定件的颈部;及所述拆卸片,活动设置于该固定件的颈部,所述拆卸片包括有一本体、一顶出部及一施力部,该固定件的颈部穿过该本体,该顶出部设于该本体的一端,并与该本体间成一角度差,且对应中央处理器,该施力部则设于该本体的另一端。The above purpose of the utility model is achieved in this way. The connection structure of a heat sink provided by the utility model includes a fixing piece, an elastic element, and a dismounting piece. It is characterized in that the fixing piece is movably arranged on The heat dissipation body has a head and a neck, the diameter of the head is larger than the diameter of the neck; the elastic element is movably arranged on the neck of the fixing member; and the dismounting piece is movably arranged on the neck The neck of the fixing piece, the dismounting piece includes a main body, a protruding part and a force application part, the neck of the fixing part passes through the main body, the protruding part is arranged at one end of the main body, and is connected with the main body There is an angle difference between them, and corresponding to the central processing unit, the force application part is arranged at the other end of the body.
本实用新型所述的连接结构,其特征在于,所述的弹性元件为弹片,且该弹性元件包括一施力端及一顶出端,该固定件的颈部穿过该弹片的施力端及顶出端之间,且在该施力部受力后,该施力端与该施力部一同移动,且该顶出端与该本体一同旋转,并施力于该本体,以拆卸该散热本体。The connection structure described in the present invention is characterized in that the elastic element is a shrapnel, and the elastic element includes a force application end and a ejection end, and the neck of the fixing member passes through the force application end and the ejection end of the elastic sheet Between, and after the force application part is stressed, the force application end moves together with the force application part, and the ejection end rotates together with the body, and exerts force on the body to disassemble the heat dissipation body.
本实用新型所述的连接结构,其特征在于,所述的弹性元件开设有一孔洞,供该固定件的颈部穿过。The connection structure of the present invention is characterized in that the elastic element is provided with a hole for the neck of the fixing member to pass through.
本实用新型所述的连接结构,其特征在于,还包括一套件,活动设置于该固定件的颈部,并供该拆卸片套置,且该套件与该固定件的头部一同夹置该弹性元件。The connection structure described in the utility model is characterized in that it also includes a sleeve, which is movably arranged on the neck of the fixing piece, and is used for the sleeve of the disassembly piece, and the sleeve and the head of the fixing piece are clamped together. Elastic elements.
所述的连接结构,其特征在于,所述的固定件的颈部具有外螺纹,而该套件具有内螺纹,供该固定件与该套件结合。The connection structure is characterized in that the neck of the fixing part has an external thread, and the sleeve has an internal thread for the combination of the fixing part and the sleeve.
本实用新型所述的连接结构,其特征在于,所述的拆卸片开设有一孔洞,供该固定件的颈部穿过。The connection structure described in the utility model is characterized in that the dismounting piece is provided with a hole for the neck of the fixing part to pass through.
本实用新型所述的连接结构,其特征在于,所述的固定件为螺丝。The connecting structure described in the utility model is characterized in that the fixing member is a screw.
根据本实用新型所揭露的散热装置包括有散热本体、固定件、弹性元件及拆卸片,其中散热本体的一面贴合于中央处理器,固定件活动设置于散热本体,并具有头部及颈部,头部的直径大于颈部的直径,且头部与散热本体间有一距离,弹性元件可活动地设置于固定件的颈部,而拆卸片可活动地设置于固定件的颈部,拆卸片包括有本体、顶出部及施力部,固定件的颈部穿过本体,顶出部设于本体的一端,并与本体间成一角度差,且对应中央处理器,施力部则设于本体的另一端。According to the heat dissipation device disclosed by the utility model, it includes a heat dissipation body, a fixing piece, an elastic element and a disassembly sheet, wherein one side of the heat dissipation body is attached to the central processing unit, and the fixing piece is movably arranged on the heat dissipation body, and has a head and a neck , the diameter of the head is greater than the diameter of the neck, and there is a distance between the head and the heat dissipation body, the elastic element can be movably arranged on the neck of the fixing piece, and the dismounting piece can be movably arranged on the neck of the fixing piece, the dismounting piece It includes a main body, an ejection part and a force application part. The neck of the fixing part passes through the body. the other end of the body.
本实用新型所述的散热装置,其特征在于,当连接结构中包含有套件时,所述的套件固设于该散热装置。The heat dissipation device of the present invention is characterized in that when the connection structure includes a sleeve, the sleeve is fixed on the heat dissipation device.
本实用新型所述的散热装置,其特征在于,所述的散热本体还包括对应于该顶出部的一开孔,供该顶出部穿过并顶于该中央处理器表面。The heat dissipation device of the present invention is characterized in that the heat dissipation body further includes an opening corresponding to the ejection portion, through which the ejection portion passes and pushes against the surface of the central processing unit.
当拆卸散热本体时,施力于施力部,使弹性元件受压,同时拆卸片以固定件为轴旋转,使顶出部朝向中央处理器移动,并施力顶于中央处理器表面,以自中央处理器表面拆卸散热本体,并由弹性元件使拆卸片回复原位。When disassembling the heat dissipation body, apply force to the force application part to press the elastic element, and at the same time, the disassembly piece rotates around the fixing part to move the ejector part towards the central processing unit, and apply force to the surface of the central processing unit to The cooling body is disassembled from the surface of the central processing unit, and the disassembly piece is returned to its original position by the elastic element.
下面,结合具体实施例及其附图对本实用新型的技术特征及技术内容作进一步详细的说明,然而,所示附图仅供参考与说明用并非用来对本实用新型加以限制。Below, the technical features and technical contents of the present utility model will be further described in detail in conjunction with specific embodiments and accompanying drawings. However, the accompanying drawings are for reference and illustration only and are not intended to limit the present utility model.
附图说明Description of drawings
图1为本实用新型的分解图;Fig. 1 is an exploded view of the utility model;
图2为本实用新型的组合图;Fig. 2 is the combined figure of the utility model;
图3A、3B、3C为本实用新型提供的散热装置的使用动作图;及Fig. 3A, 3B, 3C are the operation diagrams of the cooling device provided by the utility model; and
图4为本实用新型的另一散热本体的示意图。FIG. 4 is a schematic diagram of another heat dissipation body of the present invention.
具体实施方式Detailed ways
本实用新型的图1至图4中涉及如下元件:散热本体10,螺孔11,开孔12,中央处理器20,固定件31,头部311,颈部312,弹性元件32,施力端321,顶出端322,孔洞323,拆卸片33,本体331,顶出部332,施力部333,孔洞334,套件34。Figures 1 to 4 of the present utility model involve the following elements:
如图1、图2及图3A、图3B、图3C所示,根据本实用新型所揭露的散热装置的连接结构可用以将散热装置的散热本体10自中央处理器20拆卸下来,一般而言,在使用散热装置时,都使散热本体10的一面贴合于中央处理器20,将中央处理器20在运算时所产生的热能吸收并排出。As shown in Fig. 1, Fig. 2 and Fig. 3A, Fig. 3B, Fig. 3C, according to the connection structure of the heat dissipation device disclosed in the present invention, the
本实用新型所揭露的散热装置的连接结构包括有固定件31、弹性元件32、拆卸片33及套件34,其中散热本体10的一面贴合于中央处理器20,还包括螺孔11及开孔12,固定件31可活动地设置于散热本体10,其为螺丝,并具有头部311及颈部312,头部311的直径大于颈部312的直径,且头部311与散热本体10间有一距离,颈部312具有外螺纹。The connection structure of the heat dissipation device disclosed in the utility model includes a
弹性元件32可活动地设置于固定件31的颈部312,其为弹片,其包括施力端321及顶出端322,且开设有位于施力端321及顶出端322之间的孔洞323,而固定件31的颈部312穿过弹性元件32的孔洞323。The
而拆卸片33可活动地设置于固定件31的颈部312,并套设于套件34,拆卸片33包括有本体331、顶出部332及施力部333,本体331还开设有孔洞334,固定件31的颈部312穿过孔洞334,顶出部332设于本体331的一端,并与本体331间成一角度差,且对应于开孔12,供顶出部332穿过,并顶于中央处理器20表面,对应中央处理器20,施力部333设于本体331的另一端。The
套件34具有内螺纹,而可活动地设置于固定件31的具有外螺纹的颈部312,并供拆卸片33套置,且套件34与固定件31的头部311一同夹置弹性元件32。The
当装设时,先将弹性元件32通过孔洞323设于固定件31的颈部312,并使固定件31穿过拆卸片31的本体331的孔洞334,且将套件34套设于固定件31的颈部312,以使头部311与套件34一同夹置弹性元件32,再使固定件31设于散热本体10的螺孔11,当然,顶出部332必须对应于开孔12。When installing, the
如图3A、图3B、图3C所示,当拆卸散热本体10时,可以食指施力于施力部333,并以拇指施力于顶出部332的上方,当食指施力于施力部333,使弹性元件32的施力端321受压,而与施力部333一同移动,同时拆卸片33的本体331及弹性元件32以固定件31为支点而旋转,且顶出端322施力于本体331(皆同拇指施力于本体331),使顶出部332相对开孔12朝向中央处理器20移动,顶出部332施力顶于中央处理器20表面,以自中央处理器20表面拆卸散热本体10,并由弹性元件32使拆卸片33回复原位。As shown in Figure 3A, Figure 3B, and Figure 3C, when disassembling the
另一方面,套件34的型式也可为E型扣环,这样便于提高安装时的便利性。On the other hand, the type of the
当然,如图4所示,套件34也可固设于散热本体10,并供固定件31在穿过弹性元件32的孔洞323及拆卸片33的孔洞334后,直接通过套件34,而设置于散热本体10。Of course, as shown in Figure 4, the
本实用新型提供的一种散热装置的连接结构,其可达到下列功效:The utility model provides a connection structure of a cooling device, which can achieve the following effects:
1.在散热装置的散热本体与中央处理器贴合,而要拆卸散热本体,以使两者脱离贴合关系时,本实用新型可通过顶出部,顶于中央处理器,而使散热本体与中央处理器两者的表面脱离,因而达到自中央处理器拆卸散热本体的目的。1. When the heat dissipation body of the heat dissipation device is attached to the central processing unit, and the heat dissipation body needs to be disassembled so that the two are separated from the bonding relationship, the utility model can push the heat dissipation body against the central processing unit through the ejection part, so that the heat dissipation body The two surfaces of the central processing unit are detached, thereby achieving the purpose of detaching the cooling body from the central processing unit.
2.本实用新型的散热装置的连接结构可在中央处理器被使用时,执行拆卸散热本体的动作,而使散热本体与中央处理器脱离贴合的状况。2. The connection structure of the cooling device of the present invention can perform the action of disassembling the cooling body when the central processing unit is in use, so that the cooling body and the central processing unit are separated from the bonded state.
以上所述,仅为本实用新型其中的较佳实施例而已,并非用来限定本实用新型的实施范围;凡是依本实用新型申请专利范围所作的均等变化与修饰,均涵盖在本实用新型的专利保护范围内。The above is only a preferred embodiment of the utility model, and is not used to limit the implementation scope of the utility model; all equal changes and modifications made according to the patent scope of the utility model are covered by the scope of the utility model within the scope of patent protection.
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US11659671B2 (en) | 2020-03-03 | 2023-05-23 | Pegatron Corporation | Buckle assembly and electronic device using the same |
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