CN2566213Y

CN2566213Y - Radiating fin. heat pipe or through pipe mother board metal integrated radiator

Info

Publication number: CN2566213Y
Application number: CN 02234808
Authority: CN
Inventors: 吴鸿平
Original assignee: Individual
Current assignee: YIKU SCIENCE AND TECHNOLOGY Co Ltd SHENZHEN CITY
Priority date: 2002-05-20
Filing date: 2002-05-20
Publication date: 2003-08-13
Anticipated expiration: 2012-05-20

Abstract

The utility model relates to a radiator capable of radiating heat of high heat flow density and high power of a semiconductor temperature difference electric device, which combines a heat radiating fin, a heat pipe, a through pipe and a motherboard into a whole in a metallic mode. The utility model is characterized in that the radiator is formed by the arrangement and the combination of the heat radiating fin, the heat pipe, the through pipe and the motherboard which are used as three elements and welded mutually. The vertical and horizontal meander configuration of the heat pipe or the parallel and horizontal meander configuration of the heat pipe is formed according to the trend of the heat pipe, which simplifies various type fin grid bars of the through pipe. The intermediate position and the bias end position can be formed according to the position of the motherboard. Thereby, the radiator which is combined with various types of heat radiating fins, heat pipes, through pipes and motherboards into a whole in a metallic mode, and the utility model can be applied to domestic semiconductor electronic cold source refrigerators and ice-making machines.

Description

Radiating fin, heat pipe or poling, mother board metal integral heat radiator

The utility model relates to a kind of heat abstractor that distributes semiconductor temperature difference electrical part heat, especially can distribute the high-power heat of high heat flux and make and self keep radiating fin, heat pipe or poling, the mother board metal integral heat radiator of all low temperature rises.

At present, the known radiator that distributes semiconductor temperature difference electrical part heat, it is the radiating fin radiator of extruding or shaping by stock removal, when distributing the high-power heat of semiconductor temperature difference electrical part high heat flux, because although the radiating fin radiator adopts aluminium or copper good thermal conductor material, when accomplishing enough big area of dissipation, because of being subject to processing in the forming process, it is loose to make solid material density take place, cause the restriction that thermal conductivity reduces or distance is long, and make radiator in position temperature rise near the semiconductor temperature difference electrical part, away from the position temperature rise low, cause radiator self to form the temperature difference, reality does not reach all low temperature rise, or dispel the heat by heat pipe, the main effect of heat pipe is to conduct heat, though utilize the rising heat transfer rate of working medium fast, but self does not have sufficient heat-sinking capability as yet, thereby after reaching thermal balance, still high near the temperature rise of thermal source position, more than both mutually combine only to have under the condition of two key elements and also can't deal with problems, therefore all can not actually satisfy the requirement of semiconductor temperature difference electrical part distribute heat.

The purpose of this utility model provides a kind of characteristic at the high-power heat of semiconductor temperature difference electrical part high heat flux, radiating fin with the good thermal conductor high-compactness, heat pipe or poling, motherboard is having under three key element conditions, be welded to each other the metal-integral radiator of formation, could avoid the harmful effect that caused because of the density of material step-down fully, and make full use of radiating fin and can permutation and combination form best area of dissipation and adopting heat pipes for heat transfer speed both advantages of combining soon, or utilize radiating fin and the combination of poling free arrangement can form the advantage of enough big area of dissipation, the motherboard position is in the structure of directly accepting thermal source in addition, cause heat transfer to greatest extent, heat radiation is carried out on radiator integral simultaneously expeditiously, do not produce the tangible temperature difference between the part, make radiator integral reach all low temperature rise, to adapt to the requirement of semiconductor temperature difference electrical part heat dissipation characteristics.

The purpose of this utility model is achieved in that a kind of by radiating fin, heat pipe or poling, motherboard is welded to each other the radiating fin of formation as the three elements permutation and combination, heat pipe or poling, the mother board metal integral heat radiator, its radiating fin is formed by high-compactness aluminium or copper light sheet material punching press, fin bottom is the folded bottom of strip of being rectangle, but radiating fin can plane also pressure rolling go out corrugated, to increase area of dissipation, arch door shape heat pipe passage is arranged on folded bottom, the assembling circular hole that on fin, has heating tube or poling to walk, heat pipe part volt is in the heat pipe passage of fin folded bottom, a part runs in the guide in the assembling circular hole of radiating fin, the tortuous connection between heat pipe, the heat pipe two ends are connected by the working medium return duct, constitute the sealing circulation line, the parallel at certain intervals distribution of some radiating fins, run in the guide in the assembling circular hole on the fin and arrange by heat pipe or poling and combine, heat pipe is walked circuit and is carried out according to the needs of radiator integral Distribution of temperature rise, it is that volt will be directly connected to the lower position of radiator temperature rise in the part of fin folded bottom that its pipeline moves towards general trend, be that the working medium transpiration of being heated will at first promptly be delivered to heat in the fin groups of radiator than far-end, the working medium condensing reflux utilizes gravity to accelerate circulation rate, constitute vertical-horizontal meander configuration and parallel, horizontal meander configuration thus, is heat pipe volt fin folded bottom and the tortuous rectangular-shaped radiating fin grid row who wears the formation working medium closed circuit of fin as above-mentioned permutation and combination to outward appearance, these grid are arranged heat pipe section under all radiating fin folded bottoms and the Fu Zaiqi in the lump on the aluminium by being welded on public high-compactness or the copper motherboard, the motherboard position is according to the assembling needs of semiconductor temperature difference electrical part, can place fin grid row's centre, also can be partial to an end, constitute radiating fin thus, heat pipe, the mother board metal integral heat radiator, in addition, also can be only some radiating fins be through in the assembling circular hole with two mutually discrete polings up and down, do not constitute the tortuous working medium circulation line of sealing, form the rectangular-shaped poling type radiating fin grid row of the combination that is arranged in parallel at certain intervals, these grid are arranged all radiating fin folded bottoms in the lump by being welded on public aluminium or the copper motherboard, constitute radiating fin thus, poling, the mother board metal integral heat radiator, more than both can constitute all kinds and be referred to as radiating fin, heat pipe or poling, the mother board metal integral heat radiator, latter's radiator can be considered the reduced form of the former radiator on heat pipe section, in the incorporate one side of mother board metal is solder side, its reverse side is a conducting surface of accepting semiconductor temperature difference electrical part heat, can be directly with welding or bonding mode composite semiconductor thermoelectric device.

Owing to adopt such scheme, make this radiator keep all low temperature rise on the whole, can make semiconductor temperature difference electrical part fullest ground form the temperature difference, both available blower fan auxiliary heat dissipation, also can be without blower fan, just can reach the degree of degree of depth refrigeration, can be widely used in the refrigerator and ice machine of family expenses semiconductor electronic low-temperature receiver.

Below in conjunction with accompanying drawing and embodiment the utility model is further specified.

Fig. 1 is the signal of the utility model three elements.

Fig. 2 is first embodiment heat pipe vertical-horizontal meander configuration signal of the utility model.

Fig. 3 is the signal of second embodiment heat pipe of the utility model parallel, horizontal meander configuration motherboard interposition.

Fig. 4 holds the position signal partially for the 3rd embodiment heat pipe parallel, horizontal of the utility model meander configuration motherboard.

Fig. 5 is reduced to the signal of poling type for the 4th embodiment heat pipe of the utility model.

Among the figure: 1, radiating fin 2, folded bottom 3, corrugation 4, heat pipe passage 5, heat pipe 6, poling 7, assembling circular hole 8, return duct 9, motherboard 10, solder side 11, conducting surface 12, fin grid row

The utility model three elements as shown in Figure 1: radiating fin (1) is formed by punching press by high-compactness aluminium or copper light sheet material, fin bottom is the folded bottom (2) of strip of being rectangle, radiating fin can be plane, also but pressure rolling goes out corrugation (3) shape, to increase area of dissipation, arch door shape heat pipe passage (4) is arranged on folded bottom, the assembling circular hole (7) that on fin, has heating tube (5) or poling (6) to walk, heat pipe part volt is in the heat pipe passage of fin folded bottom, a part runs in the guide in the assembling circular hole of radiating fin, complications couple together and are connected by working medium return duct (8) in its two ends, constitute the sealing circulation line, the mode that heat pipe is walked sees following first for details, description among two embodiment, the circulation line major part is removed, two run through the reduced form that pipe just constitutes heat pipe about only surplus, high-compactness rectangular aluminum or copper motherboard (9) are prepared into one side are metal-integral solder side (10), weld for numerous folded bottoms in the fin groups, its reverse side is a conducting surface (11) of accepting semiconductor temperature difference electrical part heat, can be directly with welding or bonding mode composite semiconductor thermoelectric device.

First embodiment of the utility model as shown in Figure 2: with the parallel at certain intervals distribution of some radiating fins (1), walk in the assembling circular hole (7) on the radiating fin and arrange by heat pipe (5) and combine, the tortuous connection between heat pipe, when the utility model is used in a horizontal manner, it walks heat pipe just perpendicular to horizontal plane, heat pipe is walked route and is carried out according to the needs of radiator integral Distribution of temperature rise, it is that volt will be directly connected to the lower position of radiator temperature rise in the part of fin folded bottom (2) that its pipeline moves towards general trend, be that the working medium transpiration of being heated will at first promptly be delivered to heat in the fin groups of radiator than far-end, the working medium condensing reflux utilizes gravity to accelerate circulation rate, connect by working medium return duct (8) in the heat pipe two ends, constitute the sealing circulation line, so permutation and combination is the rectangular-shaped radiating fin grid rows (12) that heat pipe volt fin folded bottom and vertical-horizontal complications are worn the formation working medium closed circuit of fin to outward appearance, these grid are arranged heat pipe section under all radiating fin folded bottoms and the Fu Zaiqi in the lump by being welded on public aluminium or the copper motherboard (9), just constitute the radiating fin of vertical-horizontal meander configuration, heat pipe, the mother board metal integral heat radiator.

Second embodiment of the utility model as shown in Figure 3: with the parallel at certain intervals distribution of some radiating fins (1), walk in the assembling circular hole (7) on the radiating fin and arrange by heat pipe (5) and combine, the tortuous connection between heat pipe, when the utility model is used with vertical mode, it is walked heat pipe and just is parallel to horizontal plane, heat pipe is walked route and is carried out according to the needs of radiator integral Distribution of temperature rise, it is that volt will be directly connected to the lower position of radiator temperature rise in the part of fin folded bottom (2) that its pipeline moves towards general trend, be that the working medium transpiration of being heated will at first promptly be delivered to heat in the fin groups of radiator than far-end, the working medium condensing reflux utilizes gravity to accelerate circulation rate, connect by working medium return duct (8) in the heat pipe two ends, constitute the sealing circulation line, so permutation and combination is the rectangular-shaped radiating fin grid rows (12) that heat pipe volt fin folded bottom and parallel, horizontal complications are worn the formation working medium closed circuit of fin to outward appearance, these grid are arranged heat pipe section under all radiating fin folded bottoms and the Fu Zaiqi in the lump by being welded on public aluminium or the copper motherboard (9), the motherboard position is positioned in the middle of the fin grid row, just constitutes the radiating fin of parallel, horizontal meander configuration motherboard interposition, heat pipe, the mother board metal integral heat radiator.

The 3rd embodiment of the utility model as shown in Figure 4: this embodiment duplicates in second embodiment, do not exist together just constitutes radiating fin, heat pipe, mother board metal integral heat radiator that parallel, horizontal meander configuration motherboard is held the position partially for motherboard (9) position is positioned at fin grid row (12) one ends.

The 4th embodiment of the utility model as shown in Figure 5: with the parallel at certain intervals distribution of some radiating fins (1), radiating fin is all become corrugation (3) shape by pressure rolling, do not constitute the tortuous working medium circulation line of sealing, only walk in the assembling circular hole (7) on numerous fins by two polings (6) up and down, so permutation and combination is rectangular-shaped poling type radiating fin grid rows (12) to outward appearance, these grid are arranged all radiating fin folded bottoms (2) in the lump by being welded on public aluminium or the copper motherboard (9), but motherboard interposition or inclined to one side end position, can be considered first, two, the reduced form of three embodiment on heat pipe constitutes radiating fin thus, poling, the mother board metal integral heat radiator.

More than each embodiment when when energising the semiconductor temperature difference electrical part start working, the semiconductor temperature difference electrical part just discharges the high-power heat of high heat flux, this heat promptly conducts to whole motherboard by welding on the motherboard conducting surface or bonding compound position, under the condition that constitutes heat pipe, the heat of motherboard conducts in the radiating fin by the weld layer of solder side and folded bottom on the one hand, conduct in the heat pipe with the heat pipe weld layer of volt under folded bottom by solder side on the other hand and absorbed by working medium, be heated transpiration and in the tortuous loop of sealing, conducting among the lower radiating fin group of temperature of working medium by the assembling circular hole on the radiating fin, and heat radiation condensation cycle, remedy the slow deficiency of solid thermal conduction of velocity, the temperature rise that makes whole radiating fins much at one, make the almost heat exchange of participation and environment side by side of surface area of whole radiating fins, under the condition that constitutes poling, the heat of motherboard is under the connection of poling, weld layer by solder side and folded bottom conducts in the radiating fin, under the assistance of fan, the surface area that makes whole radiating fins almost side by side participates in the heat exchange with environment, constitute thus can distribute the high-power heat of semiconductor temperature difference electrical part high heat flux and make and self keep all radiating fins of low temperature rise, heat pipe or poling, the mother board metal integral heat radiator.

Claims

1, a kind of radiating fin that can distribute the high-power heat of semiconductor temperature difference electrical part high heat flux, heat pipe or poling, the mother board metal integral heat radiator, it is characterized in that radiating fin (1), heat pipe (5) or poling (6), motherboard (9) is welded to each other the metal-integral radiator of formation as the three elements permutation and combination, its radiating fin is formed by high-compactness aluminium or copper light sheet material punching press, fin bottom is the folded bottom (2) of strip of being rectangle, but radiating fin can plane also pressure rolling go out corrugation (3) shape, to increase area of dissipation, arch door shape heat pipe passage (4) is arranged on folded bottom, the assembling circular hole (7) that on fin, has heating tube or poling to walk, heat pipe part volt is in the heat pipe passage of fin folded bottom, a part runs in the guide in the assembling circular hole of radiating fin, the tortuous connection between heat pipe, the heat pipe two ends are connected by working medium return duct (8), constitute the sealing circulation line, the parallel at certain intervals distribution of some radiating fins, run in the guide in the assembling circular hole on the fin and arrange by heat pipe or poling and combine, heat pipe is walked route and is carried out according to the needs of radiator integral Distribution of temperature rise, constitute vertical-horizontal meander configuration and parallel, horizontal meander configuration thus, is heat pipe volt fin folded bottom and the tortuous rectangular-shaped radiating fin grid rows (12) that wear the formation working medium closed circuit of fin as above-mentioned permutation and combination to outward appearance, these grid are arranged heat pipe section under all radiating fin folded bottoms and the Fu Zaiqi in the lump on the aluminium by being welded on public high-compactness or the copper motherboard, the motherboard position is according to the assembling needs of semiconductor temperature difference electrical part, can place fin grid row's centre, also can be partial to an end, constitute radiating fin thus, heat pipe, the mother board metal integral heat radiator, in addition, also can be only some radiating fins be through in the assembling circular hole with two mutually discrete polings up and down, do not constitute the tortuous working medium circulation line of sealing, form the rectangular-shaped poling type radiating fin grid row of the combination that is arranged in parallel at certain intervals, these grid are arranged all radiating fin folded bottoms in the lump by being welded on public aluminium or the copper motherboard, constitute radiating fin thus, poling, the mother board metal integral heat radiator, more than both can constitute all kinds and be referred to as radiating fin, heat pipe or poling, the mother board metal integral heat radiator, latter's radiator can be considered the reduced form of the former radiator on heat pipe section, in the incorporate one side of mother board metal is solder side (10), its reverse side can be directly with welding or bonding mode composite semiconductor thermoelectric device as the conducting surface (11) of accepting semiconductor temperature difference electrical part heat.

2, radiating fin according to claim 1, heat pipe or poling, mother board metal integral heat radiator, it is characterized in that radiating fin (1) but can plane also pressure rolling go out corrugation (3) shape, constitute radiating fin thus and be plane or be various types of metal-integral radiators that form that are welded to each other by the three elements permutation and combination of corrugated.

3, radiating fin according to claim 1, heat pipe or poling, mother board metal integral heat radiator, it is characterized in that heat pipe (5) part volt is in the heat pipe passage (4) of radiating fin (1) folded bottom (2), a part runs in the guide in the assembling circular hole (7) of radiating fin, the tortuous connection between heat pipe, the heat pipe two ends are connected by working medium return duct (8), constitute the sealing circulation line.

4, radiating fin according to claim 1, heat pipe or poling, mother board metal integral heat radiator, it is characterized in that the parallel at certain intervals distribution of some radiating fins (1), run in the guide in the assembling circular hole (7) on the fin and arrange to combine by heat pipe (5) and constitute the vertical-horizontal meander configuration and arrange (12) with parallel, horizontal meander configuration radiating fin grid.

5, radiating fin according to claim 1, heat pipe or poling, mother board metal integral heat radiator, it is characterized in that some radiating fins (1) being through in the assembling circular hole (7) the poling type radiating fin grid rows (12) that parallel at certain intervals distribution and arrangement combine and constitute with two mutually discrete polings (6) up and down.

6, radiating fin according to claim 1, heat pipe or poling, mother board metal integral heat radiator, it is characterized in that motherboard (9) can place radiating fin grid row's (12) interposition or hold the position partially, grid are arranged the heat pipe section under all radiating fin folded bottoms and the Fu Zaiqi or do not have on the solder side (10) that heat pipe section is welded on motherboard in the lump, constitute various types of radiating fins, heat pipe, mother board metal integral heat radiator and radiating fin, poling, mother board metal integral heat radiator thus.

7, radiating fin according to claim 1, heat pipe or poling, mother board metal integral heat radiator is characterized in that the conducting surface (11) of motherboard (9) can be directly with welding or bonding mode composite semiconductor thermoelectric device.