CN2485801Y - Low thermal resistance LED structure - Google Patents
Low thermal resistance LED structure Download PDFInfo
- Publication number
- CN2485801Y CN2485801Y CN01229222U CN01229222U CN2485801Y CN 2485801 Y CN2485801 Y CN 2485801Y CN 01229222 U CN01229222 U CN 01229222U CN 01229222 U CN01229222 U CN 01229222U CN 2485801 Y CN2485801 Y CN 2485801Y
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- thermal resistance
- light
- low thermal
- emitting diode
- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
本实用新型提出一种低热阻发光二极管结构,包括一低热阻发光二极管、一电路基板及一散热基座,其是将低热阻发光二极管黏着固定在散热基座及电路基板中,通过散热板低热阻、导热性佳的特性,以利该低热阻发光二极体的芯片内的温度能由散热板与散热基座导出,而提升发光二极管(LED)的效能。
The utility model proposes a light-emitting diode structure with low thermal resistance, which includes a light-emitting diode with low thermal resistance, a circuit substrate and a heat dissipation base. The characteristics of good thermal resistance and thermal conductivity enable the temperature in the chip of the low thermal resistance light-emitting diode to be derived from the heat dissipation plate and the heat dissipation base, thereby improving the efficiency of the light-emitting diode (LED).
Description
本实用新型涉及一种低热阻发光二极管结构，尤其涉及一种可降低发光芯片的接面温度至空气中热阻(Rθja)的结构，而提高发光二极管的效能。The utility model relates to a structure of a light-emitting diode with low thermal resistance, in particular to a structure capable of reducing the junction temperature of a light-emitting chip to the heat resistance (Rθja) in air, thereby improving the efficiency of the light-emitting diode.
传统的发光二极管(LED)封装技术是以固晶胶将芯片固定于支架上，再将芯片的衬垫(pad)与支架之间打上金属线相连通，最后再以环氧树脂封装成型。而在应用上则是将该发光二极管以插件方式焊接固定于印刷电路板上。Traditional light-emitting diode (LED) packaging technology uses die-bonding glue to fix the chip on the bracket, and then connects the chip pad and the bracket with metal wires, and finally encapsulates it with epoxy resin. In application, the light-emitting diode is soldered and fixed on the printed circuit board in a plug-in manner.
由于发光二极管的发光效能、寿命与芯片的接面温度成反比，意即，芯片的接面温度高，LED的亮度衰减寿命缩短。上述的发光二极管由支架散热，因此，散热效果较差。Since the luminous efficacy and lifetime of the LED are inversely proportional to the junction temperature of the chip, that is, the higher the junction temperature of the chip, the shorter the brightness decay lifetime of the LED. The above-mentioned light-emitting diodes are dissipated by the support, so the heat dissipation effect is relatively poor.
本实用新型的目的，在于提供一低热阻的发光二极管封装结构，其是将发光芯片黏着固定于散热板上，该发光芯片的衬垫与印刷电路板相连结，且形成一保护盖层，借此，以达到良好的散热效果。The purpose of this utility model is to provide a light-emitting diode packaging structure with low thermal resistance, which is to glue and fix the light-emitting chip on the heat sink, the pad of the light-emitting chip is connected with the printed circuit board, and forms a protective cover layer, by Therefore, in order to achieve a good cooling effect.
本实用新型的另一目的，在于提供一可将低热阻封装成型的发光二极管黏着固定在散热基座及电路基板的结构，以便通过散热板低热阻、导热性佳的特性，使低热阻发光二极管的发光芯片内的温度能由散热板与散热基座导出，由于其是利用大面积的散热板散热，故可得到低Rθja，而提升发光二极管的效能。Another purpose of the present utility model is to provide a structure in which the light-emitting diodes with low thermal resistance packaged and molded can be adhered and fixed on the heat dissipation base and the circuit board, so that the low thermal resistance light-emitting diodes can be made The temperature in the light-emitting chip can be derived from the heat dissipation plate and the heat dissipation base. Because it uses a large-area heat dissipation plate to dissipate heat, it can obtain low Rθja and improve the performance of the light-emitting diode.
为实现本实用新型的目的，我们提出一种低热阻发光二极管结构，其包括：In order to achieve the purpose of this utility model, we propose a low thermal resistance light-emitting diode structure, which includes:
一低热阻发光二极管，其设有一散热板，散热板上设有一发光芯片，发光芯片的衬垫与一印刷电路板相连结，且形成一保护盖层；A light-emitting diode with low thermal resistance, which is provided with a heat dissipation plate, and a light-emitting chip is arranged on the heat dissipation plate, and the pad of the light-emitting chip is connected with a printed circuit board to form a protective cover layer;
一散热基座，与低热阻发光二极管的散热板相连结；及a heat dissipation base connected to the heat dissipation plate of the low thermal resistance LED; and
一电路基板，与散热基座或低热阻发光二极管的印刷电路板相连结；A circuit substrate, connected to the heat dissipation base or the printed circuit board of the low thermal resistance light-emitting diode;
借此，以降低发光芯片接面温度至空气中热阻，而提高发光二极管效能。Thereby, the heat resistance from the junction temperature of the light-emitting chip to the air is reduced, and the performance of the light-emitting diode is improved.
所述的低热阻发光二极管结构，在低热阻发光二极管的印刷电路板上可通过铜箔线路、接脚或连接器与电路基板及散热基座连结成一体。The low thermal resistance light emitting diode structure can be integrated with the circuit substrate and heat dissipation base through copper foil lines, pins or connectors on the printed circuit board of the low thermal resistance light emitting diode.
所述的低热阻发光二极管结构，其印刷电路板、电路基板可为硬性印刷电路板、软性印刷电路板、金属支架铜片或在金属板上直接涂覆线路层。The printed circuit board and the circuit substrate of the light-emitting diode structure with low thermal resistance can be rigid printed circuit boards, flexible printed circuit boards, copper sheets of metal brackets or directly coated with circuit layers on metal plates.
所述的低热阻发光二极管结构，在电路基板及散热基座连结的部位上设有导通孔，供低热阻发光二极管借连接器或接脚相连结。In the low thermal resistance light emitting diode structure, a through hole is provided on the connecting part of the circuit substrate and the heat dissipation base, so that the low thermal resistance light emitting diode can be connected by a connector or pins.
为了进一步说明本实用新型的特征及技术内容，请参阅以下有关本实用新型的详细说明与附图，然而所附图标仅供参考与说明用，并非用来对本实用新型加以限制。In order to further illustrate the features and technical contents of the present utility model, please refer to the following detailed description and accompanying drawings of the present utility model. However, the attached figures are for reference and illustration only, and are not intended to limit the present utility model.
图1是本实用新型低热阻发光二极管的一外观图；Fig. 1 is an appearance diagram of the low thermal resistance light-emitting diode of the present invention;
图2是图1的侧视图；Fig. 2 is a side view of Fig. 1;
图3是本实用新型在组装上的第一实施例图；Fig. 3 is the first embodiment diagram of the utility model in assembly;
图4是本实用新型在组装上的第二实施例图；Fig. 4 is the second embodiment diagram of the utility model in assembly;
图5是本实用新型低热阻发光二极管的另一外观图；Fig. 5 is another appearance diagram of the low thermal resistance light-emitting diode of the present invention;
图6是图5的侧视图；Fig. 6 is a side view of Fig. 5;
图7是本实用新型在组装上的第三实施例图。Fig. 7 is a diagram of the third embodiment of the utility model in assembly.
请参阅图1至图3，本实用新型提出一种“低热阻发光二极管结构”，其包括一低热阻发光二极管1、一电路基板2及一散热基座3；其中：Please refer to Fig. 1 to Fig. 3, the utility model proposes a "low thermal resistance light emitting diode structure", which includes a low thermal resistance light emitting diode 1, a
在低热阻发光二极管1中设有一散热板10，该散热板10上设有一凹穴11，供一发光芯片12黏着固定在散热板10上，该发光芯片12的衬垫是与一印刷电路板13相连接，且形成一保护盖层14，借此形成一低热阻封装的发光二极管，以便其具有良好的散热效果。A
再参阅图1至图3，本实用新型在低热阻发光二极管1的印刷电路板13上可设有铜箔线路15，以与电路基板2及散热基座3相连结，借由散热板低热阻、导热性佳的特性，使芯片内的温度能由散热板10及散热基座3导出，由于其利用大面积的散热板散热，故可得到低Rθja，以提升发光二极管效能。Referring to Fig. 1 to Fig. 3 again, the utility model can be provided with
请参阅图4所示，是本实用新型在组装上的另一实施例图。其在低热阻发光二极管1的印刷电路板13上可借铜箔线路15与电路基板2相连结；散热板10的底面则直接与散热基座3相连结，借此，以降低发光芯片12的Rθja，而提高发光二极管的效能。Please refer to Fig. 4, which is another embodiment diagram of the utility model in assembly. On the printed
请参阅图5至图7，本实用新型在低热阻发光二极管1的印刷电路板13上亦可借接脚(或连接器)16与散热基座3及电路基板2相连结，借此，以降低发光芯片12的Rθja，而提升发光二极管效能。Please refer to Fig. 5 to Fig. 7, on the printed
复参阅图7，本实用新型在散热基座3及电路基板2相连结的部位上设有一导通孔4，供印刷电路板13的接脚16借点焊方式连结成一体，借此，以降低发光芯片12的Rθja，而提升发光二极管效能。Referring back to Fig. 7, the utility model is provided with a
综上所述，通过本实用新型的组装结构，可有效的降低Rθja，提升发光二极管效能，极具产业上的利用性，可应用在照明设备、交通标志、警示装置显示器等。To sum up, the assembly structure of the present invention can effectively reduce Rθja, improve the performance of light-emitting diodes, and has great industrial applicability, and can be applied to lighting equipment, traffic signs, warning device displays, and the like.
以上所述，仅为本实用新型最佳之一的具体实施例，但本实用新型的构造特征并不局限于此，任何熟悉该项技术的人在本实用新型的领域内，可轻易思及的变化或修饰，如印刷电路板、电路基板可为硬性印刷电路板、软性印刷电路板、金属支架铜片或在金属板上直接涂覆线路层，皆可涵盖在本实用新型的权利要求的保护范围内。The above is only one of the best specific embodiments of the utility model, but the structural features of the utility model are not limited thereto, anyone familiar with the technology can easily think of it in the field of the utility model Changes or modifications, such as printed circuit boards, circuit substrates can be rigid printed circuit boards, flexible printed circuit boards, copper sheets of metal brackets or directly coated with circuit layers on metal plates, all of which can be covered by the claims of the present utility model within the scope of protection.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN01229222U CN2485801Y (en) | 2001-06-27 | 2001-06-27 | Low thermal resistance LED structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN01229222U CN2485801Y (en) | 2001-06-27 | 2001-06-27 | Low thermal resistance LED structure |
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| Publication Number | Publication Date |
|---|---|
| CN2485801Y true CN2485801Y (en) | 2002-04-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN01229222U Expired - Lifetime CN2485801Y (en) | 2001-06-27 | 2001-06-27 | Low thermal resistance LED structure |
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| Country | Link |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008119230A1 (en) * | 2007-03-29 | 2008-10-09 | Hong Kong Applied Science And Technology Research Institute Co. Ltd. | A lighting device |
| CN100435336C (en) * | 2004-10-18 | 2008-11-19 | 夏普株式会社 | Semiconductor light emitting device, backlight device for liquid crystal display device |
| CN100449801C (en) * | 2004-09-30 | 2009-01-07 | 晶元光电股份有限公司 | Semiconductor light emitting element composition |
| US7701055B2 (en) | 2006-11-24 | 2010-04-20 | Hong Applied Science And Technology Research Institute Company Limited | Light emitter assembly |
| CN104009028A (en) * | 2014-05-26 | 2014-08-27 | 上海信耀电子有限公司 | Integrated package method and structure of high-power LED with ceramic substrate and heat dissipation substratum |
| CN104966774A (en) * | 2015-07-07 | 2015-10-07 | 宏齐光电子(深圳)有限公司 | Reverse-buckling type small-dimension large-power LED packaging structure |
| CN106151959A (en) * | 2015-01-15 | 2016-11-23 | 旭德科技股份有限公司 | Lighting device |
| CN107706286A (en) * | 2017-09-27 | 2018-02-16 | 开发晶照明（厦门）有限公司 | LED light emission device and LED support |
| CN108508625A (en) * | 2018-03-12 | 2018-09-07 | 广东欧珀移动通信有限公司 | Structured light projector, image acquisition device, and electronic apparatus |
-
2001
- 2001-06-27 CN CN01229222U patent/CN2485801Y/en not_active Expired - Lifetime
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100449801C (en) * | 2004-09-30 | 2009-01-07 | 晶元光电股份有限公司 | Semiconductor light emitting element composition |
| CN100435336C (en) * | 2004-10-18 | 2008-11-19 | 夏普株式会社 | Semiconductor light emitting device, backlight device for liquid crystal display device |
| US7663229B2 (en) | 2006-07-12 | 2010-02-16 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Lighting device |
| US7701055B2 (en) | 2006-11-24 | 2010-04-20 | Hong Applied Science And Technology Research Institute Company Limited | Light emitter assembly |
| WO2008119230A1 (en) * | 2007-03-29 | 2008-10-09 | Hong Kong Applied Science And Technology Research Institute Co. Ltd. | A lighting device |
| CN104009028A (en) * | 2014-05-26 | 2014-08-27 | 上海信耀电子有限公司 | Integrated package method and structure of high-power LED with ceramic substrate and heat dissipation substratum |
| CN104009028B (en) * | 2014-05-26 | 2017-06-06 | 上海信耀电子有限公司 | The high power LED integration packaging method and structure of ceramic substrate and heat radiation substrate |
| CN106151959B (en) * | 2015-01-15 | 2019-02-15 | 旭德科技股份有限公司 | lighting device |
| CN106151959A (en) * | 2015-01-15 | 2016-11-23 | 旭德科技股份有限公司 | Lighting device |
| CN104966774A (en) * | 2015-07-07 | 2015-10-07 | 宏齐光电子(深圳)有限公司 | Reverse-buckling type small-dimension large-power LED packaging structure |
| CN104966774B (en) * | 2015-07-07 | 2019-06-11 | 宏齐光电子(深圳)有限公司 | An inverted small-size high-power LED package structure |
| CN107706286A (en) * | 2017-09-27 | 2018-02-16 | 开发晶照明（厦门）有限公司 | LED light emission device and LED support |
| CN107706286B (en) * | 2017-09-27 | 2019-10-11 | 开发晶照明（厦门）有限公司 | LED lighting device and LED bracket |
| CN108508625A (en) * | 2018-03-12 | 2018-09-07 | 广东欧珀移动通信有限公司 | Structured light projector, image acquisition device, and electronic apparatus |
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Address after: Taipei city of Taiwan Province Patentee after: Lite-On Technology Corporation Address before: Taiwan, China Patentee before: Guangbao Electronic Co., Ltd., Taiwan |
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