CN2459692Y - Fan guide structure - Google Patents

Abstract

The utility model provides a fan water conservancy diversion structure, it includes one and the air inlet portion of fan outlet intercommunication montage and one in air inlet portion and computer rear end or the tuber pipe portion between central processing unit, the thickness of this tuber pipe portion is less than air inlet portion thickness, thereby the structure with compressed air flow accelerate and reach the inside each spare part of computer and dispel the heat really and reach the air current of absorbing the heat source simultaneously and fully discharge to the computer outside, and its thickness can span can make full use of computer inner space between memory top and computer, it is the air duct that the several is curved arc form partition portion in order to enclose the short air passage of partial segment distance to dispose in this tuber pipe portion.

Description

Fan guide structure

The utility model relates to a fan, in particular to a fluid guiding device.

The industrial computer server of general IU specification, because the hard disk, interface card, central processing unit (CPU) and other data processing components are compressed to operate in a small space, in order to cooperate with the complexity of logical operation data processing of each component, relatively The processing speed and performance of the IU are improved accordingly, and the high heat generated during its execution is also increased. In addition, the internal space and cost of the IU are limited, and it is impossible to add more fans to improve air convection. How to improve the existing installation in a limited space The cooling efficiency of the fan has become a new indicator for the technical competition of the industry.

In order to improve the fan structure of the traditional server (as shown in Figure 1), the designer once proposed an "improved computer cooling device", which can indeed absorb the heat from the front of the computer host and guide the airflow to dissipate heat from the rear components However, although the fan air volume and heat dissipation range used in this scheme are large, its speed is slightly insufficient, especially for servers with two central processing units arranged at the rear end of the mainframe housing, and the absorption is caused by the barrier of the heat sink. The air flow of the heat source is trapped inside the server and cannot be exhausted to the outside. Take the fan with a speed of 3600r.p.m as an example (as shown in Figure 2). After testing, the outlet wind speed of the fan is 8-10 m/s. Affected by factors such as memory barriers and distances, the wind speed of the airflow to the CPU is about 2-3 m/s. After being blocked by the heat sink, the wind speed measured at the heat dissipation hole at the rear end of the main computer case has It is close to 0 m/s. Therefore, although the program has been improved, its scope of application is limited, and its economic benefits have not been fully utilized.

The purpose of this utility model is to provide an improved fan diversion structure, which can accelerate the compressed air flow to make the components in the mainframe of the computer dissipate heat, fully discharge the absorbed hot airflow outside the mainframe of the computer, and have a secondary flow of airflow. The effect of compression acceleration, and part of the airflow can dissipate heat from chips such as the host computer and memory.

The utility model is realized in this way: the diversion structure is provided with an air inlet part connected with the fan air outlet and an air duct part bounded between the air inlet part and the rear end of the computer mainframe or the central processing unit, and the thickness of the air duct part is The thickness is smaller than the air inlet part, and its thickness can straddle between the top of the memory and the computer mainframe.

The diversion structure is equipped with a cover plate, and a bottom plate is set under the cover plate; the cover plate and the bottom plate are provided with matching buckle ears and buckle joints; one end of the bottom plate is bent to form a plurality of air outlets on it. The inclined part of the hole; several partitions are set in the air duct to define several air passages; the partitions are in the shape of a curved arc and enclose some air passages with narrower distances between adjacent partitions.

The utility model uses the thickness of the air duct part to be smaller than the thickness of the air inlet part, so that the compressed airflow can be accelerated, so that the components inside the computer mainframe can dissipate heat and the airflow that absorbs the heat source can be fully discharged outside the computer mainframe. The thickness of the utility model spans the memory Between the top of the body and the computer mainframe, the internal space of the computer mainframe can be fully utilized, and the several arc-shaped partitions arranged in the air duct can enclose some air passages with short distances, so that the secondary compression of the airflow can be achieved. Acceleration effect, one end of the bottom plate is bent to form an inclined part on which a plurality of air outlets are opened, so that part of the air flow can be blown out by the air outlets to dissipate heat from chips such as the motherboard and memory.

The concrete structure of utility model is provided by following embodiment and accompanying drawing thereof.

FIG. 1 is an axonometric schematic diagram of a fan configuration of a conventional server.

Fig. 2 is an axonometric schematic diagram of fan configuration in the existing "computer heat dissipation device improvement" scheme.

Fig. 3 is an axonometric schematic view of the fan guide structure of the present invention.

Fig. 4 is an exploded perspective view of the fan guide structure of the present invention.

Fig. 5 is a schematic diagram of the use state of the fan guide structure of the present invention.

Fig. 6 is a schematic diagram of another usage state of the utility model.

Fig. 7 is a schematic diagram of airflow compression acceleration of the present invention.

Referring to Fig. 3, 4, 5, the diversion structure 1 is connected to the air outlet of the fan 2 to accelerate the compressed air flow. The peripheral edge is provided with buckle ears 111, and the peripheral edge of the base plate 12 is provided with buckle joints 121 matched with the buckle ears 121. The buckle ears 111 of the cover plate 11 and the buckle ears 121 of the bottom plate 12 are assembled to form a flow guide structure 1 One end of the flow guide structure 1 is provided with an air inlet portion 13 connected to the air outlet of each fan 2, and an air duct portion 18 between the air inlet portion 13 and the rear end of the main computer 3 or the central processing unit 33 (CPU) is provided. , the thickness of the air duct part 18 is smaller than the thickness of the air inlet part 13. With this structure, the compressible airflow can be accelerated to achieve the heat dissipation of the internal components of the computer mainframe 3, and the airflow that absorbs the heat source can be fully discharged to the outside of the computer mainframe 3. , and its thickness can span between the top of the memory 32 (RAM) and the host computer 3, so as to fully utilize the internal space of the host computer 3, and the side of the air duct 18 is provided with several fixed parts 14, The positioning part 4 can be fixed inside the main computer 3 by borrowing the existing space of the main board 31, and several partitions 15, 15' are arranged in the air duct 18 to define several air passages 16. The parts 15, 15' are in the shape of a curved arc, so that the adjacent partition parts 15, 15' define several air passages 16, and the partition parts 15, 15' are in the shape of a curved arc, so that the adjacent partition parts 15, 15' 15' surrounds the air channel 16 with a short distance in some sections. When the air flow enters the air channel 16 from the fan 2 through the air inlet 13, the secondary compression acceleration effect can be achieved. Bending forms an inclined portion 17 on which a plurality of air outlet holes 171 are opened. With this structure, part of the air flow can be blown out by the air outlet holes 171 to dissipate heat from chips such as the motherboard 31 and memory 32 .

Referring to Figures 6 and 7, it is the use state of the utility model. As shown in the figure, the bottom plate 12 and the cover plate 11 are fastened together to form a diversion structure 1 with two ends open and a closed space inside. Be located on the main board 31, make the air inlet part 13 of one end of the air guide structure 1 be positioned at the air outlet of the fan 2 when it is connected, and because the thickness of the air duct part 18 is relatively thin, it can just straddle the memory 32 (RAM ) and between the host computer 3, as can be seen from Figures 5 and 6, no matter what the format of the memory 32, 32 ' is, it does not affect the installation of the present utility model, and the internal space of the host computer 3 can be fully utilized .

When the fan 2 operates to generate airflow, it first absorbs the airflow introduced from the front of the main computer 3 from the outside and enters the air duct portion 18 through the air inlet portion 13, part of the airflow will pass through the air outlet hole 171 of the inclined portion 17 to generate jet airflow against the air guide structure. 1 The components such as the motherboard 31 and memory 32 at the bottom dissipate heat, and because the jet airflow has a strong wind speed, the hot airflow generated by absorbing the above components can be blown to the position of the central processing unit 33 and dissipate heat to it, while most of the airflow Utilizing the thickness of the air duct portion 18 is smaller than the thickness of the air inlet portion 13, the airflow blown by the fan 2 can be compressed and accelerated for the first time, and the inside of the air duct portion 18 is surrounded by the adjacent partitions 15, 15' The air channel 16 is divided into several airflows to directly dissipate heat to the central processing unit 33. As shown in FIG. The distance of some sections of the channel 16 will be relatively narrow. When the airflow passes through the narrow section (such as the middle section of the figure), due to the shortened distance, the airflow will be compressed for the second time and the wind speed blown to the rear section area will rise sharply, with the same In the example of the same fan 2 with a rotating speed of 3600 rpm, the wind speed at the air outlet of the fan 2 is about 8-10 m/s, and it accelerates to the air passage 16 after passing through the air duct 18 and the partitions 15, 15' after secondary compression The wind speed at the air outlet of the rear section section increases to 15-18 m/s, and the wind speed blown to the central processing unit 33 is then 10-12 m/s, and the cooling holes 34 at the rear end of the computer host 3 are passed through the central processing unit 33 The wind speed at the location is 1.2-2.5 m/s. Therefore, in addition to blowing the airflow to the internal components of the computer mainframe 3 to improve its heat dissipation efficiency, the hot airflow that absorbs the heat source can be discharged to the outside of the computer mainframe 3. Therefore, the heat dissipation problem of the motherboard 31 with dual CPUs 33 at 1 GHz or higher frequency can be effectively solved.

Claims (7)

1, a kind of fan Flow guiding structure, it is characterized in that: Flow guiding structure (1) be provided with one and fan (2) air outlet be communicated with an inlet section (13) and the boundary airduct portion (18) between inlet section (13) and host computer (3) rear end or central processing unit (33) of winding, the thickness of airduct portion (18) is less than inlet section (13) thickness, and its thickness can be across between memory body (32) top and host computer (3).

2, fan Flow guiding structure according to claim 1 is characterized in that Flow guiding structure establishes a cover plate (11), establishes a base plate (12) in cover plate (11) below.

3,, it is characterized in that cover plate (11) and base plate (12) periphery are provided with the buckle ear (111) and the snapping portion (121) of the winding that is complementary according to claim 1 or 2 described fan Flow guiding structures.

4, fan Flow guiding structure according to claim 1 is characterized in that all sides of airduct portion (18) are provided with several Fixed Divisions (14) and are installed on the host computer (3) with keeper (4).

5, fan Flow guiding structure according to claim 1 and 2 is characterized in that base plate (12) one ends are to be bent to form a rake (17) of offering several air outlet openings (171) thereon.

6, fan Flow guiding structure according to claim 1 is characterized in that being provided with in the airduct portion (18) several isolating parts (15,15 ') and defines several air ducts (16).

7, according to claim 1 or 6 described fan Flow guiding structures, it is characterized in that isolating part (15,15 ') is bending arc shape, cross the narrower air duct (16) of part section distance at adjacent isolating part (15,15 ').

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