CN2383123Y - Electronic module group device - Google Patents

Abstract

The utility model relates to an electronic module group device which comprises an electron module group and two metal casings arranged correspondingly, wherein the electron module group is composed of a circuit board, a plurality of chips and a relative electronic element, an n-shaped earth strips are arranged on the upper lateral edge and the board edges of both ends of the circuit board, and a plurality of contacts connected with contact terminals of an edge clamping connector are arranged at the lower lateral edge; the metal casings are made by punching the aluminum alloy, the peripheral edge is a frame part with a flat surface, and the frame part can be correspondingly contacted with the earth strip of the circuit board to achieve the favorable shielding effect.

Description

The electronics module device

The utility model is relevant a kind of electronics module device, refers in particular to a kind of electronics module device with high screening effect.

Along with the quick growth of electronic technology, electronic installation is little towards volume, the direction of fast operation develops, and the product modularity has become current trend.At present the ability of electronic product deal with data is more and more stronger, and is also more and more higher to the requirement of the capacity of electronics module device and speed, as the existing memory body die set (Memory Module) that is plugged in the bayonet connector.This bayonet connector comprises a microscler insulating body, a pair of guide posts of extending vertically upward to two ends from the body major axis that insulate, be installed in the backing-out punch on the guide posts, and several contact terminals, wherein insulating body extends the intercalation groove that inserts for the memory body die set down from end face, in the both sides of intercalation groove and be respectively equipped with the terminal channel of establishing for contact terminal row, and the some of contact terminal is to probe in the intercalation groove, to contact with related circuit track on the memory body die set, the afterbody of contact terminal then welds to be located on the motherboard, reaches the effect of interlock circuit on conducting memory body die set and the motherboard.The guide posts of this bayonet connector is to insert in order to guiding memory body die set, and is installed in backing-out punch on the guide posts except in order to eject the memory body die set, and other has the clamping part structure of fixed memory phantom group device.Above-mentioned memory body die set comprises that a circuit board and some welderings be located at memory chip and the associated electronic components on the circuit board, on the two sides of circuit board lower edge, be provided with the contact point of several surface gold-plating, when inserting bayonet connector and the contact terminal conducting at the memory body die set, and at the plate edge place at circuit board two ends and be respectively equipped with fixing slot, in order to cooperate with the clamping part of backing-out punch.But along with the capacity of memory body die set and the lifting of speed, the electromagnetic interference problem of associated wafer and electronic component will influence data storing, processing and telecommunication transmission quality.Therefore, how to provide the structure of the high screening effect of a kind of tool,, become instant problem to satisfy the user demand of electronics module device now.

The purpose of this utility model is to provide a kind of electronics module device with high screening effect, to guarantee the quality of data storing, processing and signal transmission.

The utility model electronics module device comprises an electronics module and the two corresponding metal shells that are provided with, and electronics module is made up of a circuit board and several wafers and electronic component.This circuit board is the rectangle plate body, be formed with circuit on it, and lateral margin row is provided with several contact points that engages with corresponding bayonet connector contact terminal below it, it is characterized in that: circuit board lateral margin and two end plates edge place up is provided with counterpoise grounding, this counterpoise grounding slightly is the coat of metal of reverse U shape for having proper width, wafer is that weldering is located in the zone that contact point and counterpoise grounding surrounded on the circuit board; Metal shell is to be stamped to form by aluminium alloy, and edge is the frame portion with flat surfaces around it, can corresponding contact with the counterpoise grounding on the circuit board, and to reach good screening effect.

Because the utility model electronics module device has the shell structure that aluminium alloy is made, can be fixed on the electronics module, and have suitable grounding path between the two, thereby can provide good screening effect to avoid electromagnetic interference problem.Moreover because housing be the good conductor of heat, it can be discharged wafer and heat that associated electronic components produced by the butting section structure, and raising electronics module integral heat sink effect.

Describe preferred embodiment of the present utility model in detail below in conjunction with accompanying drawing.

Fig. 1 is the isometric exploded view of the utility model electronics module device.

Now seeing also Fig. 1, is the isometric exploded view of the utility model electronics module device 10, and it includes an electronics module 20 and two corresponding metal shells 40 that are provided with.This electronics module 20 is by a circuit board 22 and comprise that the electronic component of several wafers 24 is formed, circuit board 22 is the rectangle plate body, be formed with circuit on it, lateral margin row is provided with several contact points 32 that engages with corresponding bayonet connector (figure does not show) contact terminal below circuit board 22, contact point 32 communicates with circuit on the circuit board 22, forms with power circuit board and bayonet connector to electrically conduct.Lateral margin and two end plates edge place are provided with counterpoise grounding 26 above circuit board 22, and it slightly is the coat of metal of reverse U shape for having proper width, and this counterpoise grounding 26 connects to one and communicates with grounding path on the circuit board 22.In addition, in the zone that contact point 32 and counterpoise grounding 26 are surrounded, circuit board 22 welderings are provided with this wafer 24, wafer 24 be with circuit board 22 on circuit join, and the setting by contact point 32 electrically connects and form with bayonet connector.In addition, further respectively be provided with a fixing slot 34 at the two end plates edge place of circuit board 22, when electronics module device 10 inserts bayonet connectors, can with the clamping part respective outer side edges (figure does not show) of bayonet connector, and electronics module device 10 is fixed on the bayonet connector.Circuit board 22 partly also has been symmetrically formed two first through holes 27 and two second through holes 28 near angle, upper limb two ends and in the middle of the lower edge, in order to metal shell 40 assembly mutually, at the periphery of second through hole 28 and be provided with coat of metal grounding leg 29, can contact with metal shell 40, reach better ground connection screening effect.

Metal shell 40 is to be stamped to form by aluminium alloy, and cooperates in order to the dependency structure with electronics module 20, and envelopes wafer 24 and associated electronic components on the electronics module 20.Edge is the frame portion 42 with flat surfaces around the metal shell 40, to fit with circuit board 22 surfaces of electronics module 20, this frame portion 42 is in the position of corresponding electronics module 20 first through holes 27 and second through hole 28, be respectively equipped with first connecting hole 44 and second connecting hole 45, metal shell 40 can pass first through hole 27, second through hole 28, first connecting hole 44 and second connecting hole 45 and fastens as one with electronics module 20 by bolt or rivet etc. (figure do not show).The periphery of this second connecting hole 45 is to be grounding parts 43, in order to the grounding leg 29 on contact electronics module 20 circuit boards 22, and the grounding path of formation metal shell 40.In addition, this frame portion 42 is can be by its partly counterpoise grounding 26 corresponding contacts on zone and the circuit board 22 after the combination, and another grounding path of formation metal shell 40.Directly expose for the metal material surface except the grounding parts 43 and the part zone of frame portion 42 on the metal shell 40, to provide outside the suitable ground connection function, remaining surface is all carried out anodizing, with the resistance to corrosion that improves metal shell 40, the outward appearance of improving product and lifting integral heat sink effect.Metal shell 40 is formed with towards the depressed part 46 away from electronics module 20 directions depressions in the zone that frame portion 42 is surrounded, and the spatial accommodation of wafer 24 and associated electronic components on the electronics module 20 is provided.Depressed part 46 is further oppositely dashed forward towards electronics module 20 and is set out a butting section 48 in the position of corresponding wafer 24, and butting section 48 is near wafer 24, is provided with heat-conducting medium between butting section 48 and wafer 24, derives with the heat that wafer 24 is produced.

Claims (10)

1. an electronics module device comprises an electronics module and at least one metal shell, and this electronics module is made up of a circuit board and some electronic components; It is characterized in that: be provided with the counterpoise grounding of the coat of metal around electronic component in the appropriate position of circuit board, above-mentioned metal shell is to be fitted on the surface of circuit board, and its some is the metal material surface, contacting with counterpoise grounding on the circuit board, and forms grounding path.

2. electronics module device as claimed in claim 1 is characterized in that it comprises two metal shells, and correspondence is arranged at the tow sides of circuit board.

3. electronics module device as claimed in claim 1, it is characterized in that circuit board is arranged with two through hole in the middle of lower edge, the periphery of through hole is the coat of metal, and this metal shell is the metal material surface in the part of corresponding circuits sheetmetal coating, to form grounding path.

4. electronics module device as claimed in claim 1 is characterized in that metal shell is to be stamped to form by aluminium alloy, and edge is the frame portion with flat surfaces around it, and the part surface of this frame portion is a metal material, with the corresponding contact of counterpoise grounding on the circuit board.

5. electronics module device as claimed in claim 4 is characterized in that metal shell in the zone that frame portion is surrounded, and is formed with the depressed part that caves in towards away from the electronics module direction, and the spatial accommodation of associated electronic components on the electronics module is provided.

6. electronics module device as claimed in claim 5, it is characterized in that depressed part in the position of corresponding wafer further oppositely towards the prominent butting section that sets out of electronics module, in order to associated electronic components heat radiation on the power supply submodule group.

7. electronics module device as claimed in claim 6 is characterized in that further being provided with between butting section and the associated electronic components heat-conducting medium.

8. as claim 1,2,3 or 4 described electronics module devices, it is characterized in that metal shell except with the contacted zone of circuit board counterpoise grounding be directly expose on the metal material surface, remaining surface has all been carried out anodizing.

9. as claim 1,2,3 or 4 described electronics module devices, it is characterized in that metal shell is to fasten as one with electronics module by rivet.

10. electronics module device as claimed in claim 1, it is characterized in that electronic component comprises that some wafers are arranged, and this circuit board is the rectangle plate body, it below lateral margin several contact points are arranged, contact point communicates with circuit on the circuit board, and wafer then is welded on the circuit board and communicates with circuit on the circuit board.

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