CN222940362U - Heat dissipation device and optical device of erbium-doped optical fiber amplifier - Google Patents
Heat dissipation device and optical device of erbium-doped optical fiber amplifier Download PDFInfo
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- CN222940362U CN222940362U CN202421738911.XU CN202421738911U CN222940362U CN 222940362 U CN222940362 U CN 222940362U CN 202421738911 U CN202421738911 U CN 202421738911U CN 222940362 U CN222940362 U CN 222940362U
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- heat dissipation
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- fiber amplifier
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Abstract
本实用新型涉及光通信技术领域，具体涉及一种掺饵光纤放大器的散热装置及光学器件。掺饵光纤放大器的散热装置包括：导热架、热管和散热鳍片，所述导热架的一侧面用于设置掺饵光纤放大器，所述热管设置于所述导热架的另一侧面，且所述热管与所述掺饵光纤放大器在导热架的正投影上具有重合区域，所述散热鳍片设置在所述导热架上，且所述热管夹持在所述导热架和所述散热鳍片之间。采用上述形式，能够在不增加过多体积的情况下，实现高效的散热，保证所需的散热需求。
The utility model relates to the field of optical communication technology, and specifically to a heat dissipation device and optical device for an erbium-doped optical fiber amplifier. The heat dissipation device for the erbium-doped optical fiber amplifier includes: a heat-conducting frame, a heat pipe and a heat dissipation fin. One side of the heat-conducting frame is used to set the erbium-doped optical fiber amplifier. The heat pipe is set on the other side of the heat-conducting frame, and the heat pipe and the erbium-doped optical fiber amplifier have an overlapping area on the positive projection of the heat-conducting frame. The heat dissipation fin is set on the heat-conducting frame, and the heat pipe is clamped between the heat-conducting frame and the heat dissipation fin. The above form can achieve efficient heat dissipation without increasing too much volume, and ensure the required heat dissipation requirements.
Description
Technical Field
The utility model relates to the technical field of optical communication, in particular to a radiating device and an optical device of a erbium-doped optical fiber amplifier.
Background
An Erbium-doped fiber amplifier (EDFA) is a device that amplifies optical signals using Erbium-doped fibers, and is commonly used in optical communication systems and lasers. The erbium-doped optical fiber amplifier can also be used as an optical amplifier, can amplify optical signals to enhance the strength of the signals, can transmit longer distances or cover larger areas, and has wide application in the field of optical communication.
The erbium-doped fiber amplifier generates a large amount of heat during use, and heat dissipation is required for the erbium-doped fiber amplifier in order to ensure the stability of the erbium-doped fiber amplifier during use and to prolong the service life. The existing heat dissipation technology of the erbium-doped fiber amplifier generally adopts a heat dissipation mode of aluminum or copper profiles and fins. Some heat sinks are also fitted with fans on the fins to dissipate the heat by forced air cooling. However, these heat sinks are bulky and cannot meet the demand for miniaturization of the device.
Disclosure of utility model
The technical problem to be solved by the embodiment of the utility model is to provide a heat dissipation device and an optical device of a erbium-doped optical fiber amplifier, which can realize efficient heat dissipation without increasing excessive volume and ensure the required heat dissipation requirement.
The utility model discloses a heat dissipation device of a erbium-doped optical fiber amplifier, which comprises a heat conduction frame, a heat pipe and heat dissipation fins, wherein one side surface of the heat conduction frame is used for arranging the erbium-doped optical fiber amplifier, the heat pipe is arranged on the other side surface of the heat conduction frame, the heat pipe and the erbium-doped optical fiber amplifier are provided with overlapping areas on the orthographic projection of the heat conduction frame, the heat dissipation fins are arranged on the heat conduction frame, and the heat pipe is clamped between the heat conduction frame and the heat dissipation fins.
Optionally, a plurality of heat pipes are arranged, and the plurality of heat pipes are arranged at intervals.
Optionally, a groove is formed in the heat conducting frame, and the heat pipe is arranged in the groove.
Optionally, one side surface of the heat pipe is connected with the heat conducting frame through soldering, and the other side surface of the heat pipe is connected with the heat radiating fins through soldering.
Optionally, the fin includes spacing and a plurality of L type heating panel, a plurality of L type heating panel's one side sets up side by side and forms the cooling surface, a plurality of L type heating panel's another side respectively with spacing block.
Optionally, the spacing is provided with a plurality of side by side, be provided with a plurality of with spacing one-to-one's spacing groove on the L type heating panel, spacing block in the spacing inslot.
Optionally, the shape of the heat pipe is linear or curved.
Optionally, the material of the heat conduction frame is aluminum alloy or copper alloy.
Optionally, the material of the heat dissipation fin is aluminum alloy or copper alloy.
The utility model also discloses an optical device, which comprises the heat dissipation device of the erbium-doped fiber amplifier.
Compared with the prior art, the heat dissipation device of the erbium-doped fiber amplifier and the optical device have the advantages that the erbium-doped fiber amplifier and the heat pipe are arranged on the two opposite sides of the heat conduction frame, heat generated by the operation of the erbium-doped fiber amplifier can be timely conducted to the heat conduction frame, and then the heat is conducted to other areas through the heat pipe arranged on the heat conduction frame, so that heat dissipation of the heat pipe is fully utilized by using the heat dissipation fins matched with the heat pipe, the heat dissipation of the heat pipe is realized, the working fluid in the heat pipe continuously evaporates and is converted in a condensation state, the continuous high-efficiency heat conduction of the heat pipe is ensured, the heat generated by the erbium-doped fiber amplifier is prevented from being concentrated at a certain place under the cooperation of the heat pipe and the heat dissipation fins, and the heat is dissipated through the heat dissipation fins when the heat pipe is dispersed. Therefore, other auxiliary devices such as a fan and the like are not required to be adopted for forced air cooling and heat dissipation, and the efficient heat dissipation can be realized without increasing excessive volume, so that the required heat dissipation requirement is ensured.
Drawings
The technical scheme of the utility model will be further described in detail below with reference to the accompanying drawings and examples, wherein:
FIG. 1 is a schematic diagram of a heat dissipating device of a erbium-doped fiber amplifier according to an embodiment of the present utility model;
FIG. 2 is an exploded view of a heat sink for a erbium-doped fiber amplifier according to an embodiment of the present utility model;
FIG. 3 is a schematic view of an L-shaped heat dissipating plate according to an embodiment of the present utility model;
Fig. 4 is a partial enlarged view at a in fig. 3.
The reference numerals in the drawings are as follows:
100. 110, a heat conduction frame, 112, a groove, 120, a heat pipe, 130, heat dissipation fins, 132, a limit bar, 134 and an L-shaped heat dissipation plate.
Detailed Description
It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. Preferred embodiments of the present utility model will now be described in detail with reference to the accompanying drawings.
The embodiment of the utility model as shown in fig. 1 and 2 provides a heat dissipation device 100 of a erbium-doped fiber amplifier, which comprises a heat conduction frame 110, a heat pipe 120 and heat dissipation fins 130, wherein one side surface of the heat conduction frame 110 is used for arranging the erbium-doped fiber amplifier, the heat pipe 120 is arranged on the other side surface of the heat conduction frame 110, the heat pipe 120 and the erbium-doped fiber amplifier have overlapping areas on the orthographic projection of the heat conduction frame 110, the heat dissipation fins 130 are arranged on the heat conduction frame 110, and the heat pipe 120 is clamped between the heat conduction frame 110 and the heat dissipation fins 130.
Specifically, the heat conducting frame 110 is used as a base for installing the erbium-doped fiber amplifier, not only plays a role in supporting and fixing the erbium-doped fiber amplifier, but also plays a role in conducting heat, so that heat generated by the erbium-doped fiber amplifier can be timely conducted to the heat conducting frame 110 and transferred to the heat pipe 120 through the heat conducting frame 110, and finally, the heat is dissipated from the heat radiating fins 130 to the external environment, so that the purpose of inhibiting the temperature rise of the erbium-doped fiber amplifier is achieved.
The heat pipe 120 is a device for transferring heat by liquid circulation, and is generally composed of a sealed metal pipe and an internally filled working fluid (generally in a liquid state). The working fluid corresponding to the erbium-doped fiber amplifier in the heat pipe 120 is partially evaporated into a gaseous state after being heated, and then is condensed again into a liquid state at the cold end of the heat pipe 120, and then flows back to the initial position. In this process, the heat pipe 120 transfers heat from one place to another to achieve uniform distribution of heat or efficient heat dissipation. So that heat generated at the heat source is rapidly transferred to the entire area of the heat radiation fins 130 to enhance heat radiation efficiency.
It should be noted that, the heat pipe 120 and the erbium-doped fiber amplifier have overlapping areas on the front projection of the heat conducting frame 110, which is favorable for reducing the heat transfer path between the erbium-doped fiber amplifier and the heat pipe 120, so that the heat generated by the erbium-doped fiber amplifier is timely conducted to the heat pipe 120, avoiding the aggregation of the heat, and being favorable for improving the heat dissipation efficiency.
According to the heat dissipation device 100 of the erbium-doped fiber amplifier provided by the embodiment of the application, the erbium-doped fiber amplifier and the heat pipe 120 are arranged on the opposite side surfaces of the heat conduction frame 110, heat generated when the erbium-doped fiber amplifier works can be timely conducted to the heat conduction frame 110, and then the heat is conducted to other areas through the heat pipe 120 arranged on the heat conduction frame 110, so that the heat dissipation of the heat pipe 120 is realized by fully utilizing the heat dissipation fins 130 matched with the heat pipe 120, the continuous evaporation and condensation state conversion of working fluid in the heat pipe 120 is realized, the continuous high-efficiency heat conduction of the heat pipe 120 is ensured, the heat generated by the erbium-doped fiber amplifier is prevented from being concentrated at a certain place under the matching of the heat pipe 120 and the heat dissipation fins 130, and the heat is dissipated through the heat dissipation fins 130 while being dispersed by the heat pipe 120. Therefore, other auxiliary devices such as a fan and the like are not required to be adopted for forced air cooling and heat dissipation, and the efficient heat dissipation can be realized without increasing excessive volume, so that the required heat dissipation requirement is ensured.
As shown in fig. 2, the heat pipes 120 are provided in plurality, and the plurality of heat pipes 120 are provided at intervals.
Specifically, in practical applications, the erbium doped fiber amplifier may be provided in plurality, and in order to avoid the heat source being too concentrated at the position where the erbium doped fiber amplifier is provided, the plurality of heat pipes 120 are correspondingly provided so as to be matched with the erbium doped fiber amplifier at different positions. In addition, the plurality of heat pipes 120 are arranged at intervals, which is favorable for ensuring the uniformity of heat transfer, thereby improving the utilization rate of the heat dissipation fins 130 and further improving the heat dissipation efficiency.
As shown in fig. 2, the heat conducting frame 110 is provided with a groove 112, and the heat pipe 120 is disposed in the groove 112.
Specifically, through the groove 112 arranged on the heat conducting frame 110, when the heat pipe 120 is matched with the heat conducting frame 110, the heat pipe can be accurately arranged at the corresponding position of the heat conducting frame 110, which is beneficial to reducing the positioning difficulty and improving the convenience in operation.
In an alternative embodiment of the present application, one side of the heat pipe 120 is connected to the heat conductive frame 110 by soldering, and the other side of the heat pipe 120 is connected to the heat dissipation fins 130 by soldering.
Specifically, a side of the heat pipe 120 is connected with the heat conducting frame 110 through soldering, which is favorable for improving the compactness of contact between the side of the heat pipe 120 and the heat conducting frame 110, avoiding the existence of a gap between the heat pipe 120 and the heat conducting frame 110, and being favorable for ensuring the stability and the heat conduction efficiency of heat conduction. Similarly, the connection between the other side of the heat pipe 120 and the heat dissipation fins 130 through soldering is beneficial to improving the contact tightness between the other side of the heat pipe 120 and the heat dissipation fins 130, avoiding the gap between the heat pipe 120 and the heat dissipation fins 130, and ensuring the stability and the heat conduction efficiency of heat conduction. In addition, through tin welded connection, when guaranteeing heat transfer efficiency, can also play the effect of connection, need not to additionally adopt the fastener to connect, be favorable to saving the cost, reduce process flow, promote assembly efficiency.
As shown in fig. 2 and 3, the heat dissipation fins 130 include a limiting bar 132 and a plurality of L-shaped heat dissipation plates 134, wherein one side of each of the L-shaped heat dissipation plates 134 is arranged side by side to form a heat dissipation surface, and the other side of each of the L-shaped heat dissipation plates 134 is engaged with the limiting bar 132.
Specifically, the limiting strip 132 plays a role in connecting the plurality of L-shaped cooling plates 134, so that the plurality of L-shaped cooling plates 134 are assembled together through the limiting strip 132, compared with a conventional milling mode, the production cost is reduced, and different quantities of L-shaped cooling plates 134 are arranged for connection according to actual needs, so that the overall environment applicability is higher. The assembled heat dissipation fins 130 are contacted with the heat pipe 120 through the heat dissipation surface, and a certain gap is formed between one side edges of the L-shaped heat dissipation plate 134, so as to promote air flow and enhance convection heat dissipation effect.
As shown in fig. 2, 3 and 4, a plurality of limit bars 132 are arranged side by side, and a plurality of limit grooves corresponding to the limit bars 132 one by one are arranged on the L-shaped heat dissipation plate 134, wherein the limit bars 132 are clamped in the limit grooves.
Specifically, by arranging the limit bars 132 in plurality side by side, it is advantageous to ensure the stability of the connection between the L-shaped heat dissipation plate 134 and the limit bars 132. In connection, only a limit groove is formed on the side corresponding to the L-shaped heat dissipation plate 134, and the limit groove is engaged with the limit bar 132.
In alternative embodiments of the present application, the shape of the heat pipe 120 is linear or curvilinear.
Specifically, in practical application, according to the setting position of the erbium-doped fiber amplifier, the shape, the size or the internal space structure of the heat pipe 120 can be flexibly set, and the placement position of the heat pipe 120 is reasonably planned, so as to improve the heat conduction effect and further improve the overall heat dissipation capacity.
In an alternative embodiment of the present application, the material of the heat conductive frame 110 is an aluminum alloy or a copper alloy.
Specifically, the heat conducting frame 110 can be directly made of aluminum alloy or copper alloy which is widely used in the market, so that the structural strength and high heat conductivity of the heat conducting frame are utilized to meet the actual production and application requirements.
In an alternative embodiment of the present application, the material of the heat sink fins 130 is an aluminum alloy or a copper alloy. Similarly, the heat dissipation fins 130 can be directly made of aluminum alloy or copper alloy which is widely used in the market, so that the structural strength and high heat conductivity of the heat dissipation fins are utilized to meet the actual production and application requirements.
The utility model also discloses an optical device, comprising the heat dissipation device 100 of the erbium-doped fiber amplifier in the previous embodiment. The optical device includes the same structure and advantageous effects as the heat sink 100 of the erbium doped fiber amplifier in the foregoing embodiment. The structure and the beneficial effects of the heat dissipation device 100 of the erbium-doped fiber amplifier have been described in detail in the foregoing embodiments, and are not described in detail herein.
It should be understood that the foregoing embodiments are merely illustrative of the technical solutions of the present utility model and not limiting thereof, and that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, and all such modifications and substitutions are intended to fall within the scope of the appended claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421738911.XU CN222940362U (en) | 2024-07-22 | 2024-07-22 | Heat dissipation device and optical device of erbium-doped optical fiber amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421738911.XU CN222940362U (en) | 2024-07-22 | 2024-07-22 | Heat dissipation device and optical device of erbium-doped optical fiber amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222940362U true CN222940362U (en) | 2025-06-03 |
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ID=95834245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421738911.XU Active CN222940362U (en) | 2024-07-22 | 2024-07-22 | Heat dissipation device and optical device of erbium-doped optical fiber amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222940362U (en) |
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2024
- 2024-07-22 CN CN202421738911.XU patent/CN222940362U/en active Active
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