CN222720855U - Light emitting module and carrier system - Google Patents
Light emitting module and carrier system Download PDFInfo
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- CN222720855U CN222720855U CN202421619162.9U CN202421619162U CN222720855U CN 222720855 U CN222720855 U CN 222720855U CN 202421619162 U CN202421619162 U CN 202421619162U CN 222720855 U CN222720855 U CN 222720855U
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Abstract
本申请公开了一种发光模组及载具系统，涉及激光技术领域，所述发光模组包括：底板、绝缘外框、发光元件、第一引线、第二引线以及光窗；发光元件固定在底板上，绝缘外框围绕底板，与底板密封连接，包括相对设置的第一端面与以及第二端面；光窗与绝缘外框的第一端面连接，光窗、绝缘外框以及底板共同限定一密封的容纳空间，容纳空间容纳发光元件；第一引线以及第二引线均固定在绝缘外框位于容纳空间外的连接侧面，连接侧面非第二端面；绝缘外框的内部布设有第一线路与第二线路，第一引线的一端通过第一线路与发光元件的正极连接，第二引线的一端通过第二线路与发光元件的负极连接。本申请的均热板不需要额外布设电路，可降低成本。
The present application discloses a light-emitting module and a carrier system, which relates to the field of laser technology. The light-emitting module includes: a base plate, an insulating outer frame, a light-emitting element, a first lead, a second lead, and a light window; the light-emitting element is fixed on the base plate, the insulating outer frame surrounds the base plate, and is sealed and connected to the base plate, including a first end face and a second end face that are arranged oppositely; the light window is connected to the first end face of the insulating outer frame, and the light window, the insulating outer frame, and the base plate jointly define a sealed accommodation space, and the accommodation space accommodates the light-emitting element; the first lead and the second lead are both fixed to the connecting side of the insulating outer frame outside the accommodation space, and the connecting side is not the second end face; the first circuit and the second circuit are arranged inside the insulating outer frame, one end of the first lead is connected to the positive electrode of the light-emitting element through the first circuit, and one end of the second lead is connected to the negative electrode of the light-emitting element through the second circuit. The heat spreader of the present application does not require additional circuit layout, which can reduce costs.
Description
Technical Field
The present application relates to the field of laser technology, and more particularly, to a light emitting module and a carrier system.
Background
In the laser technology field, a semiconductor laser is a core device of a light source, and although some lasers have been designed, the manufacturing cost of the existing lasers is high.
Disclosure of utility model
The application provides a light emitting module and a carrier system for improving the defects.
The application provides a light-emitting module, which comprises a bottom plate, an insulating outer frame, a light-emitting element, a first lead, a second lead and a light window, wherein the light-emitting element is fixed on the bottom plate, the insulating outer frame surrounds the bottom plate and is connected with the bottom plate in a sealing mode, the insulating outer frame comprises a first end face and a second end face which are arranged opposite to each other and are used for being connected with a soaking plate, the light window is connected with the first end face of the insulating outer frame, the light window, the insulating outer frame and the bottom plate jointly define a sealed accommodating space, the accommodating space accommodates the light-emitting element, the light-emitting element is used for emitting light rays, the light rays are used for being emitted from a perspective area of the light window, the first lead and the second lead are fixed on a connecting side face of the insulating outer frame, the connecting side face is not the second end face, a first circuit and a second circuit are arranged inside the insulating outer frame, one end of the first lead is connected with the first circuit and the first circuit is connected with the first end face of the insulating outer frame, the light-emitting element is used for being connected with the second circuit and the other end of the light-emitting element, and the light-emitting element is used for being connected with the other end of the light-emitting element.
Optionally, for one possible implementation manner, the connection side is provided with a first hole and a third hole which are communicated with the interior, a second hole and a fourth hole which are communicated with the interior are formed in a side wall, located in the accommodating space, of the insulating outer frame, one end of the first circuit is connected with one end of the first lead through the first hole, the other end of the first circuit is connected with the positive electrode of the light-emitting element through the second hole, the other end of the first lead is used for being connected with the positive electrode on the substrate circuit, one end of the second circuit is connected with one end of the second lead through the third hole, the other end of the second circuit is connected with the negative electrode of the light-emitting element through the fourth hole, and the other end of the second lead is used for being connected with the negative electrode on the substrate circuit.
Optionally, for a possible embodiment, the first lead and the second lead extend out of the insulating outer frame.
Optionally, for a possible embodiment, the first lead and the second lead are both fixed at the first end face located outside the accommodating space.
Optionally, for one possible implementation manner, the connection side surface has a third end surface opposite to the second end surface, a distance between the third end surface and the second end surface is smaller than a distance between the first end surface and the second end surface, a maximum distance between the third end surface and an inner wall of the accommodating space is larger than a maximum distance between the first end surface and the inner wall of the accommodating space, and the first lead and the second lead are both fixed on the third end surface.
Alternatively, for one possible implementation, the bottom plate is a copper bottom plate and the insulating outer frame is a ceramic outer frame.
Optionally, for one possible embodiment, the reflecting element is fixed on the bottom plate and is positioned in the accommodating space for changing the direction of the light rays emitted by the light emitting element.
Alternatively, for a possible embodiment, the reflecting element is disposed opposite to the plurality of light emitting elements, for changing the direction of the light emitted from the plurality of light emitting elements.
Optionally, for one possible implementation, the light emitting module further includes a lens, which is fixed on the light window by a fixing piece, and is used for making the light reflected by the reflecting element pass through the lens.
In a second aspect, the application further provides a carrier system, which comprises a main body and the light-emitting modules, wherein the main body is provided with a mounting position for mounting at least one light-emitting module.
The scheme provided by the application is that the light-emitting module comprises a bottom plate, an insulating outer frame, a light-emitting element, a first lead, a second lead and a light window. The light-emitting element is fixed on the bottom plate, the insulating outer frame surrounds the bottom plate and is in sealing connection with the bottom plate, the insulating outer frame comprises a first end face and a second end face which are oppositely arranged, and the second end face is used for being connected with the soaking plate. The light window is connected with the first end face of the insulating outer frame, the light window, the insulating outer frame and the bottom plate jointly define a sealed accommodating space, the accommodating space accommodates the light-emitting element, the light-emitting element is used for emitting light, and the light is used for being emitted from a perspective area of the light window. The first lead and the second lead are both fixed on a connecting side face of the insulating outer frame, which is positioned outside the accommodating space, and the connecting side face is not the second end face. The inside of insulating frame has laid first circuit and second circuit, the one end of first lead wire is passed through first circuit with the anodal of light emitting component is connected, and the other end is used for being connected with the anodal on the base plate circuit, the one end of second lead wire is passed through the second circuit with the negative pole of light emitting component is connected, and the other end is used for being connected with the negative pole on the base plate circuit.
The first lead and the second lead are both fixed on the connecting side surface, the connecting side surface is not the second end surface and is positioned outside the accommodating space, the first lead is connected with the anode of the light-emitting element through a first circuit arranged inside the insulating outer frame, the second lead is connected with the cathode of the light-emitting element through a second circuit arranged inside the insulating outer frame, the first lead and the second lead can be respectively connected with the anode and the cathode of an external circuit, namely, the connection between the light-emitting element in the accommodating space and the circuit outside the accommodating space is realized, and the circuit of the light-emitting element can be communicated.
Compared with the prior art that the lead wire is connected with the soaking plate, the first lead wire and the second lead wire can be directly connected with the circuit on the substrate through the circuit on the soaking plate, so that the circuit can be prevented from being arranged on the soaking plate, and the cost for arranging the circuit in the insulating outer frame is lower than the cost for arranging the driving circuit on the soaking plate, so that the manufacturing cost of the light-emitting module can be reduced.
Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application. The objectives and other advantages of the application will be realized and attained by the structure particularly pointed out in the written description and claims thereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 shows an exploded schematic view of a light emitting module according to an embodiment of the present application;
FIG. 2 is a schematic view showing the structure of the insulating housing of FIG. 1;
fig. 3 is a schematic structural diagram of the front surface of an insulating outer frame according to an embodiment of the present application;
FIG. 4 is a schematic view showing the structure of the back surface of the insulating frame in FIG. 3;
fig. 5 is a schematic structural view of an insulating outer frame according to another embodiment of the present application;
FIG. 6 is a schematic view showing the structure of the back surface of the insulating housing in FIG. 5;
fig. 7 shows a schematic structural diagram of a single-module laser according to an embodiment of the present application;
fig. 8 shows a schematic structural diagram of a dual-mode group laser according to an embodiment of the present application.
Reference numerals illustrate:
1. The light-emitting device comprises a bottom plate, 2, an insulating outer frame, 21, a first end face, 22, a second end face, 23, a connecting side face, 231, a third end face, 3, a light-emitting element, 31, a wire, 4, a first lead, 5, a second lead, 6, a light window, 7, a reflecting element, 8, a lens, 9, a fixing piece, 101, a soaking plate, 102 and a substrate.
Detailed Description
In order to make the present application better understood by those skilled in the art, the following description will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present application.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only to distinguish the description, and are not to be construed as indicating or implying relative importance.
In the technical field of laser, a semiconductor laser is a core device of a light source, the performance of the laser is strongly related to the packaging mode of the laser, packaging difference has great influence on the brightness, the service life and the like of the laser, and the packaging of a laser chip is required to meet the requirements of heat dissipation, air tightness and the like. Although some lasers have been designed, the manufacturing costs of existing lasers are high.
Therefore, in an embodiment of the present application, a light emitting module and a carrier system are provided for solving or partially solving the above-mentioned problems.
Referring to fig. 1, an exploded view of a light emitting module 100 according to an embodiment of the application is shown, wherein the light emitting module includes a base plate 1, an insulating frame 2, a light emitting element 3, a first lead 4, a second lead 5, and a light window 6.
The light-emitting element 3 is fixed on the bottom plate 1, the insulating outer frame 2 surrounds the bottom plate 1 and is in sealing connection with the bottom plate 1, the insulating outer frame 2 comprises a first end face 21 and a second end face 22 which are oppositely arranged, and the second end face 22 is used for being connected with a soaking plate.
The light window 6 is connected with the first end face 21 of the insulating outer frame 2, the light window 6, the insulating outer frame 2 and the bottom plate 1 jointly define a sealed accommodating space, the accommodating space accommodates the light emitting element 3, and the light emitting element 3 is used for emitting light rays, and the light rays are used for being emitted from a perspective area of the light window 6.
The first lead 4 and the second lead 5 are both fixed to a connection side 23 of the insulating housing 2 outside the accommodating space, and the connection side 23 is not the second end 22.
The inside of insulating frame 2 has laid first circuit and second circuit, the one end of first lead wire 4 is passed through first circuit with the anodal of luminescent element 3 is connected, and the other end is used for being connected with the anodal on the base plate circuit, the one end of second lead wire 5 is passed through the second circuit with the negative pole of luminescent element 3 is connected, and the other end is used for being connected with the negative pole on the base plate circuit.
The first lead 4 and the second lead 5 of the application are both fixed on the connecting side surface 23, the connecting side surface 23 is not the second end surface 22 and is positioned outside the accommodating space, the first lead 4 is connected with the positive electrode of the light-emitting element 3 through a first circuit arranged inside the insulating outer frame 2, the second lead 5 is connected with the negative electrode of the light-emitting element 3 through a second circuit arranged inside the insulating outer frame 2, the first lead 4 and the second lead 5 can be respectively connected with the positive electrode and the negative electrode of an external circuit, namely, the connection between the light-emitting element 3 in the accommodating space and the circuit outside the accommodating space is realized, and the circuit communication of the light-emitting element 3 can be realized.
Compared with the prior art that the lead wire is connected with the soaking plate, the first lead wire and the second lead wire can be directly connected with the circuit on the substrate through the circuit on the soaking plate, so that the circuit can be prevented from being arranged on the soaking plate, and the cost for arranging the circuit in the insulating outer frame is lower than the cost for arranging the driving circuit on the soaking plate, so that the manufacturing cost of the light-emitting module can be reduced.
Specifically, the light emitting element 3 may be a laser chip, and when the light emitting element 3 is energized, the light emitting element 3 may emit light.
The light emitting element 3 is fixed to the base plate 1 by welding, or by bonding to the base plate 1.
Furthermore, the application can comprise a plurality of light-emitting elements, the plurality of light-emitting elements are connected together according to the requirement and have a common positive electrode and a common negative electrode, and the common positive electrode and the common negative electrode are connected with corresponding leads, so that a power supply circuit of the light-emitting elements can be formed.
It should be noted that, the bottom plate 1 may be a metal bottom plate, and the metal bottom plate may rapidly transfer heat generated by the light emitting element to the vapor chamber, so as to improve heat dissipation efficiency of the light emitting element, and obviously, the higher the thermal conductivity of the metal bottom plate, the higher the heat dissipation efficiency of the light emitting element. The vapor chamber is a heat dissipation plate and is used for dissipating heat of the bottom plate so that the light-emitting element meets the heat dissipation requirement.
Preferably, the bottom plate may be a copper bottom plate, and the vapor chamber may be made of oxygen-free copper or red copper.
Specifically, the insulating frame 2 surrounds the bottom plate 1 and is in sealing connection with the bottom plate 1, the optical window 6 is connected with the first end surface 21 of the insulating frame 2, and the optical window 6, the insulating frame 2 and the bottom plate 1 jointly define a sealed accommodating space, so that the air tightness requirement of the laser package can be met.
The insulating frame 2 may be made of an insulating material, and may be made of ceramic or glass.
Further, the transparent area of the optical window 6 is made of transparent material, and the optical window 6 can be made of metal or glass.
When the light window 6 is glass, the light window 6 is sealed and welded with the first end surface 21 so that the accommodating space meets the requirement of air tightness.
When the light window 6 is made of metal, the light window 6 and the first end face 21 are sintered in a sealing manner, a through hole is formed in a perspective area of the light window 6, the through hole is communicated with the accommodating space, and the perspective glass is connected with the through hole in a sealing manner, so that the accommodating space meets the requirement of air tightness. In the practical application process, different antireflection films can be plated on the perspective glass according to laser beams with different wavelengths generated by the light-emitting element so as to ensure the transmittance requirement.
Further, the connecting side 23 is provided with a first hole and a third hole which are communicated with the inside, and the side wall of the insulating outer frame 2 in the accommodating space is provided with a second hole and a fourth hole which are communicated with the inside.
One end of the first circuit is connected with one end of the first lead 4 through the first hole, the other end of the first circuit is connected with the positive electrode of the light-emitting element 3 through the second hole, and the other end of the first lead 4 is used for being connected with the positive electrode on the substrate circuit.
One end of the second circuit is connected with one end of the second lead 5 through the third hole, the other end of the second circuit is connected with the negative electrode of the light emitting element 3 through the fourth hole, and the other end of the second lead 5 is used for being connected with the negative electrode on the substrate circuit.
The application can realize the communication between the lead and the light-emitting element by arranging the circuit inside the insulating outer frame, is simple and easy to realize, can directly connect the lead with the circuit of the substrate, can avoid arranging the circuit on the vapor chamber, and can reduce the manufacturing cost of the product using the light-emitting module. For example, the manufacturing cost of the laser can be reduced by manufacturing the laser with the light emitting module.
An exemplary embodiment of the present invention provides a light emitting device, wherein a first lead is connected to a first hole in a sealing manner, a second lead is connected to a third hole in a sealing manner, a positive electrode of the light emitting device is connected to a first circuit through a first wire, the first wire is connected to a second hole in a sealing manner, a negative electrode of the light emitting device is connected to a second circuit through a second wire, and the second wire is connected to a fourth hole in a sealing manner, so that a sealing requirement of a receiving space can be satisfied. The welding of the first lead wire, the second lead wire and the insulating outer frame meets the requirements of circuit connection and drawing force.
Furthermore, the position relation between the bottom plate and the insulating outer frame can be various, and the positions of the bottom plate and the insulating outer frame can be designed according to different structural requirements.
Referring to fig. 2-4, for an exemplary embodiment, the end of the base plate 1 facing away from the light-emitting element 3 extends beyond the second end surface 22.
Referring to fig. 5-6, the surface of the bottom plate 1 facing away from the light emitting element 3 and the second end surface 22 are located on the same plane, so that the bottom plate 1 and the insulating outer frame 2 can be fixed on the vapor chamber together, the insulating outer frame 2 is welded around the bottom plate 1, the strength of the insulating outer frame 2 can be increased, the insulating outer frame 2 and the bottom plate 1 can be prevented from being cracked in the sintering process, and the air tightness requirement of the accommodating space can be met.
Further, the first lead and the second lead extend out of the insulating outer frame. The first lead and the second lead can be directly connected with a circuit on the substrate without an additional connecting wire.
Further, referring to fig. 1-2, the first lead 4 and the second lead 5 are both fixed to the first end surface 21 located outside the accommodating space.
Further, referring to fig. 3-6, the connecting side has a third end surface 231 opposite to the second end surface 22, a distance between the third end surface 231 and the second end surface 22 is smaller than a distance between the first end surface 21 and the second end surface 22, and a maximum distance between the third end surface 231 and an inner wall of the accommodating space is larger than a maximum distance between the first end surface 21 and the inner wall of the accommodating space.
The first lead 4 and the second lead 5 are fixed to the third end surface 231.
Further, the first lead 4 and the second lead 5 may have bending portions, and the number of the bending portions is determined according to actual requirements, which is not limited herein.
According to the application, the first lead 4 and the second lead 5 are both fixed on the third end face 231, so that soldering tin short circuit in the welding process of the optical window and the insulating outer frame can be avoided, and the first lead 4 and the second lead 5 can be bent to match with various structural designs.
Further, the light emitting module further comprises a reflecting element 7;
The reflecting element 7 is fixed on the base plate 1 and is positioned in the accommodating space for changing the direction of the light emitted by the light emitting element 3.
It should be noted that, the reflective element 7 is fixed on the base plate 1, and may be fixed with the base plate 1 by welding, so that the relative positions and angles of the light emitting element 3 and the reflective element 7 need to be ensured to meet the requirements during the welding process. Can also be fixed with the base plate 1 by means of bonding, and the relative positions and angles of the light-emitting element 3 and the reflecting element 7 also need to be ensured to meet the requirements during the bonding process.
Preferably, the reflecting element 7 may convert the light emitted by the light emitting element 3 and parallel to the first end surface 21 into light perpendicular to the first end surface 21.
Preferably, the light reflected by the reflecting element 7 is perpendicular to the first end surface 21.
Further, the reflecting element 7 is disposed opposite to the plurality of light emitting elements 3, and is used for changing the direction of the light emitted by the plurality of light emitting elements 3. The application has less material quantity and can reduce the number of the surface mounting times of the reflecting element, thereby reducing the cost of the light-emitting module.
Further, the light emitting module further comprises a lens 8, wherein the lens 8 is fixed on the light window 6 through a fixing piece 9, and the light reflected by the reflecting element 7 passes through the lens 8.
The lens 8 is used for collimating the light reflected by the reflecting element 7, i.e. the light reflected by the reflecting element 7 can be made parallel by adjusting the lens 8.
After the relative positions of the lens 8 and the light window 6 are adjusted according to the requirements, the lens 8 can be adhered to the light window 6 or welded to the light window 6, so that the lens 8 can collimate the light reflected by the reflecting element 7 in the using process.
An exemplary insulating frame is the ceramic frame, and the one end of first lead wire is connected with the positive pole of luminescent element through the inside first circuit of laying of ceramic frame, and the one end of second lead wire is connected with the negative pole of luminescent element through the inside second circuit of laying of ceramic frame, and satisfies accommodation space's gas tightness requirement, and first lead wire and second lead wire are all fixed on the connection side of non-second terminal surface, can be with first lead wire and second lead wire and external circuit intercommunication, energize for luminescent element, make luminescent element work.
The traditional power supply mode of the light-emitting element is generally to weld the vapor chamber by ceramic, the surface layer of the vapor chamber is wired, the exterior power supply is realized by making a bonding pad or a seat on the vapor chamber, and the process of arranging the driving circuit of the light-emitting element on the vapor chamber is complex and has higher cost. The application directly welds the lead on the ceramic outer frame, does not need to lay a circuit on the vapor chamber, and can directly weld the lead with the bonding pad on the external substrate in the application scene, thereby saving materials such as conductors, leading the driving circuit of the luminous element to be simpler and having lower cost.
Referring to fig. 7, a single light emitting module 100 is fixed on a vapor chamber 101, a first lead and a second lead are respectively connected with a circuit on a substrate 102 to form a single-module laser 200, referring to fig. 8, two light emitting modules 100 are fixed on the vapor chamber 101, and the first lead and the second lead of each light emitting module 100 are respectively connected with the circuit on the substrate 102 to form a dual-module laser 300.
The embodiment of the application provides a carrier system, which comprises a main body and the light-emitting module.
The main body is provided with a mounting position for mounting at least one light emitting module.
The carrier system may be a laser radar, a laser projector, a laser engraving machine, or the like, and is not particularly limited herein.
It should be noted that the above-mentioned embodiments are merely for illustrating the technical solution of the present application and not for limiting the same, and although the present application has been described in detail with reference to the above-mentioned embodiments, it will be understood by those skilled in the art that the technical solution described in the above-mentioned embodiments may be modified or some technical features may be equivalently replaced, and these modifications or replacements do not drive the essence of the corresponding technical solution to deviate from the spirit and scope of the technical solution of the embodiments of the present application.
Claims (10)
1. A lighting module, the lighting module comprising:
the light source comprises a bottom plate, an insulating outer frame, a light emitting element, a first lead wire, a second lead wire and a light window;
The light-emitting element is fixed on the bottom plate, the insulating outer frame surrounds the bottom plate and is connected with the bottom plate in a sealing way, the insulating outer frame comprises a first end face and a second end face which are oppositely arranged, and the second end face is used for being connected with the soaking plate;
the light window is connected with the first end face of the insulating outer frame, the light window, the insulating outer frame and the bottom plate jointly define a sealed accommodating space, the accommodating space accommodates the light-emitting element, the light-emitting element is used for emitting light, and the light is used for emitting from a perspective area of the light window;
The first lead and the second lead are both fixed on a connecting side surface of the insulating outer frame, which is positioned outside the accommodating space, and the connecting side surface is not the second end surface;
The inside of insulating frame has laid first circuit and second circuit, the one end of first lead wire is passed through first circuit with the anodal of light emitting component is connected, and the other end is used for being connected with the anodal on the base plate circuit, the one end of second lead wire is passed through the second circuit with the negative pole of light emitting component is connected, and the other end is used for being connected with the negative pole on the base plate circuit.
2. The lighting module of claim 1, wherein the light emitting device comprises,
The connecting side surface is provided with a first hole and a third hole which are communicated with the inside, and the side wall of the insulating outer frame, which is positioned in the accommodating space, is provided with a second hole and a fourth hole which are communicated with the inside;
One end of the first circuit is connected with one end of the first lead through the first hole, the other end of the first circuit is connected with the positive electrode of the light-emitting element through the second hole, and the other end of the first lead is used for being connected with the positive electrode on the substrate circuit;
One end of the second circuit is connected with one end of the second lead through the third hole, the other end of the second circuit is connected with the negative electrode of the light-emitting element through the fourth hole, and the other end of the second lead is used for being connected with the negative electrode on the substrate circuit.
3. The lighting module of claim 1, wherein the light emitting device comprises,
The first lead and the second lead extend out of the insulating outer frame.
4. The light emitting module as set forth in claim 3, wherein,
The first lead and the second lead are both fixed to the first end face located outside the accommodating space.
5. The light emitting module as set forth in claim 3, wherein,
The connecting side surface is provided with a third end surface which is opposite to the second end surface, the distance between the third end surface and the second end surface is smaller than the distance between the first end surface and the second end surface, and the maximum distance between the third end surface and the inner wall of the accommodating space is larger than the maximum distance between the first end surface and the inner wall of the accommodating space;
The first lead and the second lead are fixed on the third end face.
6. The lighting module of claim 1, wherein the base plate is a copper base plate and the insulating housing is a ceramic housing.
7. The light emitting module according to claim 1, the light emitting module is characterized by further comprising:
a reflective element;
The reflecting element is fixed on the bottom plate and positioned in the accommodating space and is used for changing the direction of light rays emitted by the light-emitting element.
8. The lighting module of claim 7, wherein the light emitting device comprises,
The reflecting element is arranged opposite to the light-emitting elements and is used for changing the directions of light rays emitted by the light-emitting elements.
9. The light emitting module according to claim 7, the light emitting module is characterized by further comprising:
And the lens is fixed on the light window through a fixing piece and is used for enabling the light rays reflected by the reflecting element to pass through the lens.
10. A carrier system, the carrier system comprising:
A body and a light emitting module as claimed in any one of claims 1-9;
The main body is provided with a mounting position for mounting at least one light emitting module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421619162.9U CN222720855U (en) | 2024-07-09 | 2024-07-09 | Light emitting module and carrier system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421619162.9U CN222720855U (en) | 2024-07-09 | 2024-07-09 | Light emitting module and carrier system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222720855U true CN222720855U (en) | 2025-04-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421619162.9U Active CN222720855U (en) | 2024-07-09 | 2024-07-09 | Light emitting module and carrier system |
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| Country | Link |
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| CN (1) | CN222720855U (en) |
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- 2024-07-09 CN CN202421619162.9U patent/CN222720855U/en active Active
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