CN222621540U - A high-efficiency heat dissipation light-emitting diode module - Google Patents
A high-efficiency heat dissipation light-emitting diode module Download PDFInfo
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- CN222621540U CN222621540U CN202421196002.8U CN202421196002U CN222621540U CN 222621540 U CN222621540 U CN 222621540U CN 202421196002 U CN202421196002 U CN 202421196002U CN 222621540 U CN222621540 U CN 222621540U
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Abstract
The utility model provides a high-efficiency heat-dissipation type light-emitting diode module, which belongs to the technical field of LEDs. The first heat radiation structure comprises a liquid cooling cavity, a heat exchange plate and a first shell, wherein cooling liquid is arranged in the liquid cooling cavity, the heat exchange plate is arranged at the top of the liquid cooling cavity and is connected with the liquid cooling cavity, the first shell is arranged on the periphery of the liquid cooling cavity in a surrounding mode, a heat radiation channel is formed between the inner wall of the first shell and the outer wall of the liquid cooling cavity, and the module body is arranged on the heat exchange plate. The second heat dissipation structure is arranged on the first shell and used for driving the gas in the heat dissipation channel to flow. The high-efficiency heat-dissipation type light-emitting diode module can conduct high-efficiency heat dissipation on the module body, so that the module body can keep proper working temperature, the service life of the light-emitting diode module can be prolonged, and the light-emitting diode module can keep high working stability.
Description
Technical Field
The utility model relates to the technical field of LEDs, in particular to a high-efficiency heat-dissipation type light-emitting diode module.
Background
A light emitting Diode (LIGHT EMITTING Diode, LED for short) is a semiconductor device capable of converting electric energy into optical energy. The semiconductor PN junction light source utilizes the carrier injection and recombination principle in the semiconductor PN junction to generate visible light or light with other wavelengths, and the diode has the advantages of high efficiency, energy saving, long service life, environmental protection, quick response and the like. The LED module is a functional unit integrating the components such as the diode chip, the first shell, the printed circuit board, the control circuit, the metal pins and the like into one module. The LED module has wide application in various fields such as illumination, display technology, decoration, entertainment and the like. With the rapid development of electronic technology and the continuous improvement of the performance of electronic devices, the heat generated by the light emitting diode module in the working process is also greatly increased. This build-up of heat not only reduces the performance and lifetime of the diode, but may also have an impact on the stability of the overall mechanism, device. The traditional heat radiation structure often can not effectively conduct out the heat generated by the diode in time and radiate the heat to the external environment, so that the heat is accumulated in the module, and further the problems of performance reduction and even thermal damage are caused.
Therefore, there is a need for an improvement to the existing led modules to overcome the drawbacks of the prior art.
Disclosure of utility model
In order to overcome the problems in the related art, the utility model aims to provide a high-efficiency heat-dissipation type light-emitting diode module, which can conduct high-efficiency heat dissipation on a module body, so that the module body can keep a proper working temperature, the service life of the light-emitting diode module is prolonged, and the light-emitting diode module keeps higher working stability.
The utility model provides a high-efficient heat dissipation formula emitting diode module which characterized in that includes:
A module body;
The heat exchange device comprises a first heat dissipation structure, a second heat dissipation structure and a module body, wherein the first heat dissipation structure comprises a liquid cooling cavity, a heat exchange plate and a first shell, the liquid cooling cavity is internally provided with cooling liquid, the heat exchange plate is arranged at the top of the liquid cooling cavity and is connected with the liquid cooling cavity, the first shell is arranged on the periphery of the liquid cooling cavity in a surrounding mode, and a heat dissipation channel is formed between the inner wall of the first shell and the outer wall of the liquid cooling cavity;
The second heat dissipation structure is arranged on the first shell and is provided with a first air inlet and a first air outlet, the first air inlet is communicated with the heat dissipation channel, and the second heat dissipation structure drives gas in the heat dissipation channel to flow.
In a preferred technical scheme of the utility model, a second air outlet and a plurality of second air inlets are arranged on the first shell, and the first air inlets are communicated with the second air outlets.
In a preferred technical scheme of the utility model, the second heat dissipation structure comprises a second shell and a negative pressure fan, wherein the second shell is arranged on the first shell, and the second shell is provided with the first air inlet and the first air outlet;
the negative pressure fan is arranged in the second shell.
In a preferred technical scheme of the utility model, the cross section of the liquid cooling cavity is circular or polygonal, the outer wall of the liquid cooling cavity is provided with a plurality of radiating fins, and the radiating fins are arranged on the liquid cooling cavity along the circumferential direction of the liquid cooling cavity.
In a preferred technical scheme of the utility model, a plurality of third air inlets are arranged at one side of the first shell, which is away from the heat exchange plate.
In the preferred technical scheme of the utility model, the surface of the heat exchange plate is provided with a clamping groove, the module body is arranged in the clamping groove, and the bottom of the clamping groove is provided with heat-conducting silicone grease.
In a preferred technical scheme of the utility model, the module body comprises a substrate, a light-emitting diode group and a lens, wherein the substrate is arranged on the heat exchange plate, the light-emitting diode group is arranged on the substrate, and the lens is covered on the light-emitting diode group.
In the preferred technical scheme of the utility model, the machine body is also provided with a display screen, and the display screen is electrically connected with the metering device.
The beneficial effects of the utility model are as follows:
The utility model provides a high-efficiency heat-dissipation type light-emitting diode module, which comprises a module body, a first heat-dissipation structure and a second heat-dissipation structure. The first heat radiation structure comprises a liquid cooling cavity, a heat exchange plate and a first shell, wherein cooling liquid is arranged in the liquid cooling cavity, the heat exchange plate is arranged at the top of the liquid cooling cavity and is connected with the liquid cooling cavity, the first shell is arranged on the periphery of the liquid cooling cavity in a surrounding mode, a heat radiation channel is formed between the inner wall of the first shell and the outer wall of the liquid cooling cavity, and the module body is arranged on the heat exchange plate. The second heat dissipation structure is arranged on the first shell and used for driving the gas in the heat dissipation channel to flow. The LED module can efficiently dissipate heat of the module body through cooling liquid in the liquid cooling cavity and the heat exchange plate, and the module can efficiently dissipate heat. The heat exchange plate exchanges heat with the module body and transfers heat to the cooling liquid, so that the cooling liquid effectively absorbs heat generated by the module body, thereby ensuring that the module body keeps proper temperature in the working process and preventing performance degradation or damage caused by overheating. The heat dissipation channel formed between the first shell and the liquid cooling cavity and the gas flowing in the heat dissipation channel through the driving of the second heat dissipation structure dissipate heat of the cooling cavity, so that heat of cooling liquid is rapidly dissipated to the outside, efficient heat dissipation of the module body is guaranteed, faults of the module body due to high temperature are reduced, and the working reliability of the module body is improved.
Drawings
Fig. 1 is a perspective view of a high-efficiency heat dissipation type led module provided in an embodiment of the present utility model;
FIG. 2 is a bottom view of a high efficiency heat dissipating LED module provided in an embodiment of the present utility model;
FIG. 3 is a schematic view of a module body provided on a heat dissipation plate according to an embodiment of the present utility model;
Fig. 4 is a schematic diagram of airflow within a first heat dissipation structure provided in an embodiment of the present utility model.
Reference numerals:
1. The LED module comprises a module body, 11, a substrate, 12, a lens, 13, a light-emitting diode group, 2, a first heat radiation structure, 21, a first shell, 211, a second air inlet, 212, a third air inlet, 213, a second air outlet, 22, a heat exchange plate, 221, a clamping groove, 222, heat conduction silicone grease, 23, a liquid cooling cavity, 3, a second heat radiation structure, 31, a second shell, 311, a first air inlet, 312, a first air outlet, 32 and a negative pressure fan;
Detailed Description
Preferred embodiments of the present utility model will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present utility model are shown in the drawings, it should be understood that the present utility model may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.
It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the utility model. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Examples
As shown in fig. 1-4, the present embodiment provides a high-efficiency heat dissipation type light emitting diode module, which includes:
The module body 1 specifically comprises a substrate 11, a light-emitting diode group 13 and a lens 12, wherein the substrate 11 is arranged on the heat exchange plate 22, the light-emitting diode group 13 is arranged on the substrate 11, and the lens 12 is covered on the light-emitting diode group 13. The substrate 11 is a circuit board, the LED group 13 comprises a plurality of LEDs electrically connected to the circuit board, and the lens 12 is used for protecting the LED group 13
The high-efficiency heat dissipation type light-emitting diode module further comprises a first heat dissipation structure 2 and a second heat dissipation structure 3, wherein the first heat dissipation structure 2 comprises a liquid cooling cavity 23, a heat exchange plate 22 and a first shell 21, cooling liquid is arranged in the liquid cooling cavity 23, the heat exchange plate 22 is arranged at the top of the liquid cooling cavity 23 and is connected with the liquid cooling cavity 23, the first shell 21 is arranged on the periphery of the liquid cooling cavity 23 in a surrounding mode, a heat dissipation channel is formed between the inner wall of the first shell 21 and the outer wall of the liquid cooling cavity 23, and the module body 1 is arranged on the heat exchange plate 22. The liquid cooling cavity 23 stores cooling liquid, and the cooling liquid can exchange heat with the heat exchange plate 22 with high efficiency, so that the heat exchange plate 22 can radiate heat to the module body 1.
The second heat dissipation structure 3 is disposed on the first housing 21, the second heat dissipation structure 3 has a first air inlet 311 and a first air outlet 312, the first air inlet 311 is communicated with the heat dissipation channel, and the second heat dissipation structure 3 drives the gas in the heat dissipation channel to flow. In the working process of the second heat dissipation structure 3, negative pressure is generated, so that air in the heat dissipation channel enters the second heat dissipation structure 3 from the first air inlet 311 and flows out from the first air outlet 312, and the air can exchange heat with the liquid cooling cavity 23 in the heat dissipation channel to cool the cooling liquid in the liquid cooling cavity 23.
The light-emitting diode module comprises a module body 1, a first heat dissipation structure 2 and a second heat dissipation structure 3. The first heat radiation structure 2 comprises a liquid cooling cavity 23, a heat exchange plate 22 and a first shell 21, wherein cooling liquid is arranged in the liquid cooling cavity 23, the heat exchange plate 22 is arranged at the top of the liquid cooling cavity 23 and is connected with the liquid cooling cavity 23, the first shell 21 is arranged on the periphery of the liquid cooling cavity 23 in a surrounding mode, a heat radiation channel is formed between the inner wall of the first shell 21 and the outer wall of the liquid cooling cavity 23, and the module body 1 is arranged on the heat exchange plate 22. The second heat dissipation structure 3 is provided on the first housing 21 for driving the flow of gas in the heat dissipation channel. The LED module can efficiently dissipate heat to the module body 1 through the cooling liquid in the liquid cooling cavity 23 and the heat exchange plate 22, and the module can efficiently dissipate heat. The heat exchange plate 22 exchanges heat with the module body 1 and transfers heat to the cooling liquid, so that the cooling liquid effectively absorbs heat generated by the module body 1, thereby ensuring that the module body 1 maintains proper temperature in the working process and preventing performance degradation or damage caused by overheating. The heat dissipation channel formed between the first shell 21 and the liquid cooling cavity 23 and the gas flowing in the heat dissipation channel is driven through the second heat dissipation structure 3 to dissipate heat of the cooling cavity, so that heat of the cooling liquid is rapidly dissipated to the outside, efficient heat dissipation of the module body 1 is guaranteed, faults of the module body 1 due to high temperature are reduced, and the working reliability of the module body 1 is improved.
Further, a second air outlet 213 and a plurality of second air inlets 211 are disposed on the first housing 21, and the first air inlet 311 is communicated with the second air outlet 213.
Further, the second heat dissipation structure 3 includes a second housing 31 and a negative pressure fan 32, the second housing 31 is disposed on the first housing 21, and the second housing 31 is provided with the first air inlet 311 and the first air outlet 312;
The negative pressure fan 32 is disposed in the second housing 31.
In the working process, the negative pressure fan 32 is started, air in the heat dissipation channel is sucked through the second air outlet 213, so that negative pressure is formed in the heat dissipation channel, and external air enters the heat dissipation channel through the plurality of second air inlets 211, so that the purposes of promoting airflow in the heat dissipation channel and improving heat exchange efficiency of the air and the liquid cooling cavity 23 are achieved. Through the communication between the first air inlet 311 and the second air outlet 213, a circulating air flow path is formed, thereby accelerating the flow of air and the discharge of heat in the heat dissipation channel.
In a more preferred embodiment, the second air inlet 211 may further be provided with a blower to accelerate the flow of air.
Further, the cross section of the liquid cooling cavity 23 is circular or polygonal, a plurality of heat dissipation fins are arranged on the outer wall of the liquid cooling cavity 23, and the plurality of heat dissipation fins are arranged on the liquid cooling cavity 23 along the circumferential direction of the liquid cooling cavity 23.
By adding the heat radiating fins, the heat radiating area of the liquid cooling cavity 23 is greatly increased. The fins can more effectively conduct heat in the liquid cooling cavity 23 to the external environment, so that the heat dissipation performance of the whole module is improved. The heat radiating fins are arranged along the circumferential direction of the liquid cooling cavity 23, so that uniform distribution and rapid conduction of heat are ensured. This design reduces the likelihood of heat build-up and prevents localized overheating of the liquid cooling chamber 23, thereby extending the useful life of the diode module.
Further, a plurality of third air inlets 212 are provided at a side of the first housing 21 facing away from the heat exchange plate 22.
By providing a plurality of third air inlets 212, the way of external cool air entering the heat dissipation channel is increased. This design not only promotes air circulation within the heat dissipation channels, but also allows more cold air to directly contact the heat dissipation fins and heat dissipation channels, thereby more effectively absorbing and carrying away the heat of the cooling fluid within the liquid cooling chamber 23. In practical applications, the third air inlet 212 may be disposed at the bottom of the first housing 21.
Further, a clamping groove 221 is formed in the surface of the heat exchange plate 22, the module body 1 is arranged in the clamping groove 221, and a heat-conducting silicone grease 222 is arranged at the bottom of the clamping groove 221. By providing the heat exchange plate 22 with the clamping groove 221 on the surface and accurately placing the module body 1 in the clamping groove 221, this design not only provides a firm support for the module, but also ensures a tight contact between the module and the heat exchange plate 22. The heat conduction silicone grease 222 at the bottom of the clamping groove 221 further enhances the heat conduction effect, and can fill the tiny gap between the module and the heat exchange plate 22, and increase the effective contact area, thereby effectively reducing the thermal resistance, so that the heat generated by the module can be dissipated out through the heat exchange plate 22 more rapidly.
The foregoing description of embodiments of the utility model has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the improvement of technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (7)
1. The utility model provides a high-efficient heat dissipation formula emitting diode module which characterized in that includes:
A module body;
The heat exchange device comprises a first heat dissipation structure, a second heat dissipation structure and a module body, wherein the first heat dissipation structure comprises a liquid cooling cavity, a heat exchange plate and a first shell, the liquid cooling cavity is internally provided with cooling liquid, the heat exchange plate is arranged at the top of the liquid cooling cavity and is connected with the liquid cooling cavity, the first shell is arranged on the periphery of the liquid cooling cavity in a surrounding mode, and a heat dissipation channel is formed between the inner wall of the first shell and the outer wall of the liquid cooling cavity;
The second heat dissipation structure is arranged on the first shell and is provided with a first air inlet and a first air outlet, the first air inlet is communicated with the heat dissipation channel, and the second heat dissipation structure drives gas in the heat dissipation channel to flow.
2. The high efficiency heat dissipating light emitting diode module of claim 1, wherein:
The first shell is provided with a second air outlet and a plurality of second air inlets, and the first air inlets are communicated with the second air outlets.
3. The high efficiency heat dissipating light emitting diode module of claim 1, wherein:
The second heat dissipation structure comprises a second shell and a negative pressure fan, the second shell is arranged on the first shell, and the first air inlet and the first air outlet are arranged on the second shell;
the negative pressure fan is arranged in the second shell.
4. A high efficiency heat dissipating light emitting diode module as set forth in any one of claims 1-3, wherein:
The cross section of liquid cooling chamber is circular or polygon, the outer wall of liquid cooling chamber is provided with polylith radiating fin, and the polylith radiating fin is followed the circumference in liquid cooling chamber is arranged on the liquid cooling chamber.
5. The high-efficiency heat-dissipating light-emitting diode module of claim 2, wherein:
and one side of the first shell, which is away from the heat exchange plate, is provided with a plurality of third air inlets.
6. The high efficiency heat dissipating light emitting diode module of claim 1, wherein:
The surface of the heat exchange plate is provided with a clamping groove, the module body is arranged in the clamping groove, and the bottom of the clamping groove is provided with heat conduction silicone grease.
7. The high efficiency heat dissipating light emitting diode module of claim 1, wherein:
The module body comprises a substrate, a light-emitting diode group and a lens, wherein the substrate is arranged on the heat exchange plate, the light-emitting diode group is arranged on the substrate, and the lens is covered on the light-emitting diode group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421196002.8U CN222621540U (en) | 2024-05-29 | 2024-05-29 | A high-efficiency heat dissipation light-emitting diode module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421196002.8U CN222621540U (en) | 2024-05-29 | 2024-05-29 | A high-efficiency heat dissipation light-emitting diode module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222621540U true CN222621540U (en) | 2025-03-14 |
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ID=94884259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421196002.8U Active CN222621540U (en) | 2024-05-29 | 2024-05-29 | A high-efficiency heat dissipation light-emitting diode module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222621540U (en) |
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2024
- 2024-05-29 CN CN202421196002.8U patent/CN222621540U/en active Active
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