CN222599686U - Process verification test tool for composite sensor chip - Google Patents
Process verification test tool for composite sensor chip Download PDFInfo
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- CN222599686U CN222599686U CN202420600220.7U CN202420600220U CN222599686U CN 222599686 U CN222599686 U CN 222599686U CN 202420600220 U CN202420600220 U CN 202420600220U CN 222599686 U CN222599686 U CN 222599686U
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Abstract
The utility model discloses a process verification test fixture for a composite sensor chip, which comprises a cover body and a base body, wherein the cover body is in sealing connection with the base body, a sealing cavity is formed between the cover body and the inside of the base body, the cover body comprises an air passage joint, one end of an air passage joint is sealed and embedded into one end of a front cover, the base body comprises a base body and a small base body, the small base body is adhered to the chip to be tested through a stress-free adhesive tape, the inner side of the other end of the front cover is in sealing connection with the outer side of one end of the base body, the outer sides of the small base bodies are in sealing connection with the base body, two small base bodies are provided with two PCB boards, a spring needle seat is arranged between the end parts of the two small base bodies, which are connected with one side close to the air passage joint, a spring needle is arranged on the spring needle seat, a bonding pad of the PCB board is connected with one end of the spring needle, and the other end of the spring needle is connected with an output line. The utility model fixes the chip and the small matrix together by means of the stress-free adhesive tape, and can avoid the influence of stress generated by bonding on the output of the chip, thereby obtaining the real performance of the chip.
Description
Technical Field
The utility model belongs to the technical field of chip testing, and particularly relates to a process verification testing tool for a composite sensor chip.
Background
With the continuous increase of the precision requirements of products, the requirements on the design and the process of the products are also continuously increased, how to optimize the design of the products, how to optimize the process of the products and how to verify whether the process improvement is correct, which are all problems to be solved. Because sensor accuracy is a parameter affected by a process and there is a linear relationship between the different processes. In addition, the influence of the repeatability errors of equipment and environment is reduced as much as possible, and the comparison analysis of different conditions in one experiment is performed as much as possible.
The problems in the existing sensor chip test are that 1. The performance of the sensor chip is checked, and the detection precision cannot be ensured to meet the standard. 2. The accuracy range of the sensor chip is too large to be used as a subsequent measurement reference. 3. Different adhesives have different effects on the accuracy and temperature characteristics of the sensor chip. 4. Different bonding substrates have different effects on the accuracy and temperature characteristics of the sensor chip. And the stress of the bond may adversely affect the test results.
Therefore, there is a need for a stress-free chip testing device that ensures testing accuracy and testing consistency under conditions of controllable parameters and consistent environmental conditions.
Disclosure of utility model
The utility model aims to solve the problem that stress generated by bonding in the conventional sensor chip test affects a test result, and provides a process verification test tool for a composite sensor chip.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a technology verification test fixture of compound sensor chip, including lid and base member, sealing connection between lid and the base member, sealing chamber has between lid and the inside of base member, the lid includes the gas circuit joint, the one end of the sealed embedding protecgulum of gas circuit interface, the base member includes base member main part and little base member, the other end inboard of protecgulum bonds the chip that awaits measuring through the unstressed sticky tape, the outside and the base member main part sealing connection of little base member of the other end inboard and base member main part of protecgulum, little base member sets up two, install the PCB board between the tip that two little base members are close to the gas circuit interface, sealing installation spring needle seat between the base member that two little base members are close one side to be connected, install the spring needle on the spring needle seat, the pad of PCB board meets with the one end of spring needle, the output line is connected to the other end of spring needle.
Further, the small matrix is adhered to the chip to be tested through the stress-free adhesive tape.
Further, pins of the chip to be tested are connected with bonding pads of the PCB, and the PCB is connected with the small base body through pan head screws.
Further, a wire through hole is formed in the base body and used for leading out an output wire from the tool.
Further, a sealing gasket is arranged at the joint of the air passage interface and the front cover.
Further, a front cover O-ring is installed between the inner side of the other end of the front cover and the outer side of one end of the base body.
Further, a small base O-ring is installed between the inside of the base body and the small base.
Further, a needle seat O-shaped ring is arranged between the base body and the spring needle seat.
Further, pouring sealant is arranged between the spring needle seat and the spring needle.
Further, threads are formed on the outer side of the air passage interface, the outer side of one end of the base body and the inner side of the front cover.
Compared with the prior art, the utility model has the following beneficial technical effects:
The utility model fixes the chip and the small matrix together by means of the stress-free adhesive tape, and can avoid the influence of stress generated by bonding on the output of the chip, thereby obtaining the real performance of the chip. The utility model has reasonable scheme, simple structure and easy realization, and can fully exert the effect of improving the test precision and the test efficiency of the chip.
The utility model can realize rapid removal of the adhesive by means of the stress-free adhesive tape to fix the chip and the small matrix, has no residue on the matrix main body, is convenient for repeated use and reduces the cost.
The utility model adopts small matrixes with different materials, and can test the influence of the materials with different thermal expansion coefficients on the stress of the chip. Thereby reducing the thermal stress of the chip and improving the precision.
The utility model adopts spring pin connection, can realize quick replacement of the PCB, prevents the tool from being scrapped due to the reasons of pad damage, pad filling and the like, and reduces the tool cost.
The utility model can realize the operations of pressurizing, depressurizing and the like of the chip through the sealing cavity formed by the front cover and the matrix main body, thereby obtaining a complete function curve of pressure and chip output.
The utility model adopts the quick gas path connector, which is convenient for quick replacement of the gas source and replacement of the test environment.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model.
Fig. 1 is a schematic cross-sectional structure diagram of a process verification test tool for a composite sensor chip according to the present utility model.
Fig. 2 is a schematic diagram of a front view of a process verification test tool for a composite sensor chip according to the present utility model
Fig. 3 is a schematic diagram of a right-side view structure of a process verification test tool for a composite sensor chip according to the present utility model.
1 Is an air passage joint, 2 is a sealing gasket, 3 is a front cover, 4 is a substrate main body, 5 is a wire passing hole, 6 is an output wire, 7 is a pan head screw, 8 is a PCB (printed circuit board), 9 is a small substrate, 10 is a spring needle, 11 is a spring needle seat, 12 is pouring sealant, 13 is a needle seat O-shaped ring, 14 is a small substrate O-shaped ring, and 15 is a front cover O-shaped ring.
Detailed Description
In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the utility model described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Example 1
Referring to fig. 1, fig. 2 and fig. 3, a process verification test fixture for a composite sensor chip comprises a cover body and a substrate, wherein the cover body is in sealing connection with the substrate, a sealing cavity is formed between the cover body and the inside of the substrate, the cover body comprises a gas circuit connector 1, one end of the gas circuit connector 1 is sealed and embedded into one end of a front cover 3, the substrate comprises a substrate main body 4 and a small substrate 9, the small substrate 9 is bonded with the chip to be tested through a stress-free adhesive tape, the inner side of the other end of the front cover 3 is in sealing connection with the outer side of one end of the substrate main body 4, the outer sides of the small substrates 9 are in sealing connection with the substrate main body 4, two small substrates 9 are provided with two, a Printed Circuit Board (PCB) 8 is installed between the ends of the two small substrates 9, which are connected with one sides close to each other, a spring needle 11 is installed on the spring needle 11, a bonding pad of the PCB 8 is connected with one end of the spring needle 10, and the other end of the spring needle 10 is connected with an output line 6.
Preferably, the small substrate 9 is bonded to the chip to be tested by a stress-free adhesive tape.
Preferably, pins of the chip to be tested are connected with bonding pads of the PCB 8, and the PCB 8 is connected with the small base 9 through pan head screws 7.
Preferably, the base body 4 is provided with a wire through hole 5 for leading out the output wire 6 from the tooling.
Preferably, the sealing gasket 2 is arranged at the joint of the air passage interface 1 and the front cover 3.
Preferably, a front cover O-ring 15 is mounted between the inside of the other end of the front cover 3 and the outside of one end of the base body 4.
Preferably, a small base O-ring 14 is mounted between the interior of the base body 4 and the small base 9.
Preferably, a needle seat O-ring 13 is arranged between the base body 4 and the spring needle seat 11.
Preferably, a pouring sealant 12 is arranged between the spring needle seat 11 and the spring needle 10.
Preferably, threads are formed on the outer side of the air passage interface 1, the outer side of one end of the base body 4 and the inner side of the front cover 3.
Example two
A process verification test method of a compound sensor chip utilizes a process verification test fixture of the compound sensor chip, comprising the following steps:
the chip to be tested is adhered to the small matrix 9 by an adhesive, and then the small matrix 9 is placed in the matrix main body 4, and the small matrix and the matrix main body are sealed by an O-shaped ring.
The spring needle 10 is fixed on the spring needle seat 11. The spring needle seat 11 and the matrix body 4 are sealed by pouring sealant 12.
Pins of the chip to be tested and bonding pads of the PCB 8 are fixed together through Jin Sibang, the PCB 8 is connected with the spring pins 10,
The front cover 3 is screwed with the base body 4 and sealed with a front cover O-ring 15. The air passage joint 1 is screwed with the front cover 3 and is sealed with an O-ring of the gasket 2. Thereby realizing the quick connection and switching of the air paths.
The air channel interface 1 is connected with a pressurizing air channel to test the chip, and the chip is pressurized and depressurized through a sealing cavity formed by the front cover 3 and the matrix main body 4 to obtain a complete function curve of pressure and output of the chip to be tested
And supplying power to the chip to be tested through an output line 6 at the rear end of the spring needle 10 and reading and outputting a test result.
Example III
As shown in fig. 1, 2 and 3, the present embodiment provides a process verification test tool for a composite sensor chip, which is capable of ensuring test accuracy and test consistency and achieving the purposes of cost reduction and synergy by performing the process verification test tool for the composite sensor chip under the conditions of controllable parameters and consistent environmental conditions.
The process verification test fixture for the composite sensor chip comprises a cover body part and a base part;
The cover body part comprises an air passage joint 1, a sealing gasket 2 and a front cover 3. Through gas circuit joint 1, the frock can carry out quick connect with the gas circuit, uses sealed pad 2 to seal between gas circuit joint 1 and the protecgulum 3 to guarantee the frock gas tightness, make air supply pressure equal to the chip and feel atmospheric pressure.
The base body part comprises a base body 4, a wire through hole 5, an output wire 6, a pan head screw 7, a PCB 8, a small base body 9, a spring needle 10, a spring needle seat 11, pouring sealant 12, a needle seat O-shaped ring 13, a small base body O-shaped ring 14 and a front cover O-shaped ring 15. The chip to be tested is adhered to the small matrix 9 through the stress-free adhesive tape, so that the minimum stress of the chip after adhesion can be ensured, and real measurement data can be obtained. The small matrix 9 and the matrix 4 are sealed by a small matrix O-shaped ring 14 so as to ensure that the air source pressure is equal to the sensing air pressure of the chip to be tested. The upper pins of the chip to be tested are connected with the bonding pads of the PCB 8 through gold wire bonding, so that power is supplied to the chip to be tested and output is read. The pogo pin 10 is fixed on the pogo pin holder 11, and is fixed with the base body 4 by a potting adhesive 12. The spring pin 10 contacts with a bonding pad on the PCB 8, outputs and leads out the chip to be tested to the output line 6, and then directly supplies power and reads data through the output line 6.
The cover body part and the base body part are sealed by the front cover O-shaped ring 15, thereby isolating the inner air and the outer air and ensuring the pressure to be stable.
The small matrix 9 is made of various materials, and different small matrix 9 materials can be selected according to different chips, adhesives and environmental conditions, so that the use states under various working conditions can be simulated, and the influence of different base materials on the output of the chips can be compared.
It should be finally understood that the foregoing embodiments are merely illustrative of the technical solutions of the present utility model and not limiting the scope of protection thereof, and although the present utility model has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that various changes, modifications or equivalents may be made to the specific embodiments of the utility model, and these changes, modifications or equivalents are within the scope of protection of the claims appended hereto.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420600220.7U CN222599686U (en) | 2024-03-26 | 2024-03-26 | Process verification test tool for composite sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420600220.7U CN222599686U (en) | 2024-03-26 | 2024-03-26 | Process verification test tool for composite sensor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222599686U true CN222599686U (en) | 2025-03-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420600220.7U Active CN222599686U (en) | 2024-03-26 | 2024-03-26 | Process verification test tool for composite sensor chip |
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| CN (1) | CN222599686U (en) |
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- 2024-03-26 CN CN202420600220.7U patent/CN222599686U/en active Active
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