Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The features of the application "first", "second" and the like in the description and in the claims may be used for the explicit or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be understood that the terms "length," "width," "thickness," "upper," "lower," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
In the description of the present application, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
An electronic device according to an embodiment of the present application is described below with reference to fig. 1 to 5.
As shown in fig. 1, an electronic device according to some embodiments of the present application includes a frame 1, the frame 1 including an insulating frame 10 and a metal frame 12, the insulating frame 10 being disposed inside the metal frame 12 and connected to the metal frame 12, the metal frame 12 including an antenna 18, a circuit board 2 disposed inside the insulating frame 10, a metal conductive member 3 disposed inside the insulating frame 10, and a first end 30 of the metal conductive member 3 being electrically connected to the metal frame 12, and a second end 32 of the metal conductive member 3 being electrically connected to the circuit board 2, such that the antenna 18 is electrically connected to the circuit board 2 through the metal conductive member 3.
In the embodiment of the application, the electronic equipment comprises the frame body 1, the circuit board 2 and the metal conducting piece 3, the frame body 1 comprises the metal frame 12 and the insulating frame 10, and the insulating frame 10 is arranged on the inner side of the metal frame 12, so that the electronic equipment has a metal appearance and good wear resistance, meanwhile, the manufacture of a complex structure on the insulating frame 10 can be realized, and the waterproof performance of the electronic equipment can be improved. The circuit board 2 is arranged on the inner side of the insulating frame 10, the metal conducting piece 3 is arranged on the insulating frame 10, the first end 30 of the metal conducting piece 3 is electrically connected with the metal frame 12, the second end 32 of the metal conducting piece 3 is electrically connected with the circuit board 2, so that the antenna 18 on the metal frame 12 can be electrically connected with the circuit board 2 through the metal conducting piece 3, and further related functions of the antenna 18 of the electronic device are realized.
Meanwhile, the metal frame 12 includes the antenna 18, for example, a part of the metal frame 12 is configured as the antenna 18, so that the antenna 18 is not shielded by other components, and the performance of the antenna 18 is improved.
Specifically, the first end 30 of the metal feedthrough 3 is electrically connected with a feed point of the antenna 18.
Alternatively, the antenna 18 may be capable of implementing an ESIM (Embedded-SIM) function.
Optionally, the insulating frame 10 is a plastic frame.
Alternatively, the frame 1 is annular.
According to some embodiments of the present application, optionally, the insulating frame 10 is an injection molded part, the metal conducting member 3 is embedded in the insulating frame 10, and the first end 30 and the second end 32 are exposed from the insulating frame 10.
In this embodiment, the insulating frame 10 is an injection molding piece, and the metal conducting piece 3 is embedded in the insulating frame 10, so that the metal conducting piece 3 and the insulating frame 10 can be injection molded through an insert, the processing efficiency is high, the connection strength between the metal conducting piece 3 and the insulating frame 10 is high, and the problem that abnormal sound is caused by shaking of the metal conducting piece 3 in the frame body 1 can be avoided. The first end 30 and the second end 32 are exposed from the insulating frame 10, so that the first end 30 can be electrically connected with the metal frame 12, and the second end 32 can be electrically connected with the circuit board 2, thereby eliminating the need for secondary processing and reducing the manufacturing cost.
As shown in fig. 1, according to some embodiments of the present application, optionally, a spring plate 4 is disposed between the first end 30 and the metal frame 12, and the first end 30 is electrically connected to the metal frame 12 through the spring plate 4.
In this embodiment, the spring plate 4 is disposed between the first end 30 of the metal conduction member 3 and the metal frame 12, so that the metal conduction member 3 is electrically connected to the metal frame 12. The elastic sheet 4 has elasticity, and under the action of the elasticity, the metal conducting piece 3 and the metal frame 12 can be reliably and electrically connected, so that the signal of the antenna 18 is prevented from being influenced due to disconnection of the metal conducting piece and the metal frame.
In addition, when the metal conducting member 3 and the insulating frame 10 are insert molded, the metal conducting member 3 generally does not protrude from the insulating frame 10, so the elastic sheet 4 can connect the first end 30 exposed on the insulating frame 10 to the metal frame 12, and thus, no secondary treatment is required to be performed on the insulating frame 10 to connect the metal conducting member 3 and the metal frame 12.
It will be appreciated that the spring 4 is a metal piece.
According to some embodiments of the present application, the spring plate 4 is optionally welded to the metal frame 12, or the spring plate 4 is welded to the first end 30.
In this embodiment, the spring plate 4 is welded to the metal frame 12 or welded to the first end 30 to improve the reliability of the electrical connection between the metal frame 12 and the metal conductive member 3.
Alternatively, the spring plate 4 is welded to the metal conducting member 3 by spot welding, or the spring plate 4 is welded to the metal frame 12 by spot welding. Optionally, one end of the elastic piece 4 is welded with the first end 30 of the metal conducting piece 3, the other end of the elastic piece 4 is a free end and has an included angle with the first end 30 of the metal conducting piece 3, and after the insulating frame 10 and the metal frame 12 are assembled, the other end of the elastic piece 4 is abutted against the metal frame 12.
Optionally, the direction of welding the elastic sheet 4 is required to design the opening direction of the elastic sheet 4 along the assembly direction of the metal frame 12 and the plastic frame, so as to avoid scraping during assembly.
As shown in fig. 1 and 5, the metal continuity member 3 optionally includes at least one bending structure 34, the at least one bending structure 34 being located between the first end 30 and the second end 32, according to some embodiments of the present application.
In this embodiment, the metal conduction member 3 includes at least one bending structure 34, which increases the overall length of the metal conduction member 3, and further increases the contact area between the metal conduction member 3 and the insulating frame 10, so that the metal conduction member 3 is reliably embedded in the insulating frame 10, and the connection strength between the metal conduction member 3 and the insulating frame 10 is improved. Meanwhile, the metal conducting piece 3 is bent, so that electric connection of contact surfaces in different directions can be realized, and further electric connection of antennas 18 of a plurality of frequency bands and the circuit board 2 is realized. In addition, the length of the metal conduction member 3 is increased, so that the waterproof path at the metal conduction member 3 is increased, and the waterproof effect is further increased.
It will be appreciated that the metal vias 3 are formed by a plurality of bends.
As shown in fig. 3 and 4, according to some embodiments of the present application, optionally, a sidewall of the insulating frame 10 is provided with a through hole 14, and the first end 30 is disposed through the through hole 14 and connected to the metal frame 12.
In this embodiment, the through hole 14 is disposed on the sidewall of the insulating frame 10, and the first end 30 of the metal conducting member 3 is inserted into the through hole 14, so that the first end 30 of the metal conducting member 3 can be directly electrically connected with the metal frame 12, and no other metal component is needed to connect the metal conducting member 3 and the metal frame 12, thereby reducing the manufacturing cost.
As shown in fig. 3, the connection between the first end 30 and the metal frame 12 may optionally be covered with a waterproof member 16 according to some embodiments of the present application, wherein the waterproof member 16 is positioned in the through hole 14 to block the through hole 14.
In this embodiment, the connection between the first end 30 of the metal conducting member 3 and the metal frame 12 is covered with the waterproof member 16, so that the connection between the metal conducting member 3 and the metal frame 12 can be waterproof sealed, sweat or other liquid is prevented from entering the connection between the first end 30 of the metal conducting member 3 and the metal frame 12, and further corrosion of the connection between the metal conducting member 3 and the metal frame 12 is avoided, which results in failure of the connection between the metal conducting member 3 and the metal frame 12. Meanwhile, the waterproof piece 16 is located in the through hole 14, so that the waterproof piece 16 can seal the through hole 14, and further external liquid is prevented from entering the inside of the frame body 1 through the through hole 14.
Alternatively, the flashing 16 comprises a flashing glue or flashing rubber or a flashing silicone or flashing film.
As shown in fig. 1, 2 and 3, according to some embodiments of the present application, optionally, the electronic device further includes a locking member 5, where the locking member 5 sequentially penetrates through the circuit board 2, the second end 32 and the insulating frame 10, and is connected to the insulating frame 10, so that the second end 32 is sandwiched between the insulating frame 10 and the circuit board 2.
In this embodiment, the electronic device further includes a locking member 5, and the second end 32 of the metal conducting member 3 is connected to the circuit board 2 through the locking member 5, so that the second end 32 of the metal conducting member 3 is fixed on the circuit board 2, thereby ensuring the reliability of the connection between the second end 32 of the metal conducting member 3 and the circuit board 2.
Optionally, the locking member 5 comprises a screw.
Optionally, a first mounting hole is formed in the circuit board 2, a second mounting hole is formed in the insulating frame 10, the second mounting hole penetrates through the second end 32 of the metal conducting member 3, and the locking member 5 penetrates through the first mounting hole and the second mounting hole, so that the second end 32 of the metal conducting member 3 is tightly attached to the circuit board 2, and further connection between the metal conducting member 3 and the circuit board 2 is achieved.
Optionally, the second mounting hole is a threaded hole.
As shown in fig. 1 and 3, according to some embodiments of the present application, optionally, the electronic device further includes a screen 6 disposed on a first side of the frame 1, a bottom case 7 disposed on a second side of the frame 1 opposite to the first side, a mounting cavity 70 surrounded by the screen 6, the bottom case 7 and the insulating frame 10, and a circuit board 2 disposed in the mounting cavity 70, wherein the insulating frame 10 is adhesively connected to the screen 6, and the insulating frame 10 is adhesively connected to the bottom case 7.
In this embodiment, the electronic apparatus further includes a screen 6 and a bottom case 7, the screen 6 is disposed on a first side of the frame 1, the bottom case 7 is disposed on a second side of the frame 1, and the screen 6 and the bottom case 7 are respectively located on opposite sides of the frame 1, such that the screen 6, the bottom case 7, and the insulating frame 10 enclose a mounting cavity 70 for mounting the circuit board 2 and other components. The insulating frame 10 is connected with the screen 6 in an adhesive mode, so that the connection between the insulating frame 10 and the screen 6 and the sealing of a gap are achieved, the insulating frame 10 is connected with the bottom shell 7 in an adhesive mode, and the connection between the insulating frame 10 and the bottom shell 7 and the sealing of the gap are achieved.
Optionally, the insulating frame 10 is in sealing connection with the screen 6 through waterproof sealant, and the insulating frame 10 is in sealing connection with the bottom shell 7 through waterproof sealant.
Optionally, the insulating frame 10 and the screen 6 are provided with waterproof sealant along the peripheral circles, and the insulating frame 10 and the bottom shell 7 are provided with waterproof sealant along the peripheral circles.
According to some embodiments of the present application, the insulating frame 10 is optionally adhesively attached to the metal frame 12.
In this embodiment, the insulating frame 10 and the metal frame 12 are bonded and connected, so that the connection process between the metal frame 12 and the insulating frame 10 is simplified, and the manufacturing cost is reduced.
According to some embodiments of the present application, optionally, the metal casing (e.g. metal frame 12) is first processed by a simple numerical control machine (Computerized Numerical Control, CNC) and then glued to the injection molded plastic middle frame (e.g. insulating frame 10) at the sides, so that the metal casing and plastic middle frame are glued together by glue. The plastic middle frame is fixed with the display screen (for example, screen 6) and the bottom shell 7 through glue, and the glue plays a role in water resistance. Therefore, the metal conducting piece 3 does not participate in the complete machine waterproofing, and the scheme is simple and reliable.
The metal shell is assembled with the plastic middle frame and fixed together through glue. However, the glue is not a whole circle and cannot play a role in water resistance. External water or perspiration may enter between the metal shell and the plastic center.
Optionally, the metal conducting piece 3 is formed by machining stainless steel, and is fixed through an insert injection scheme, so that the machining efficiency is relatively high, and the structure is reliable.
Optionally, one side of the metal conducting member 3 is connected with the metal shell, as shown in fig. 1, the elastic sheet 4 is spot-welded on the metal conducting member 3, and the elastic sheet 4 is connected with the metal shell. In this embodiment, the spring plate 4 may also be spot welded to the metal housing. The other side of the metal conducting member 3 is conducted with the printed circuit board 2 (Printed Circuit Board, PCB), so that the feeding point of the antenna 18 can be realized. In this embodiment, the metal vias 3 are directly locked to the PCB by screws.
Optionally, the stainless steel is formed by bending for multiple times, so that the electric connection of contact surfaces in different directions can be effectively realized. Meanwhile, because the insert injection molding binding force is general, the waterproof path needs to be designed as long as possible in order to ensure a better waterproof effect.
Since insert molding requires a relatively large thickness of steel sheet, and the elastic sheet 4 for electrical connection needs to be excellent in elasticity and thin in thickness. Here, the stainless steel surface is spot welded with the spring plate 4 to achieve the two functions.
The direction of the opening of the elastic sheet 4 is required to be designed along the assembly direction of the metal shell, so that scraping during assembly is avoided.
In this embodiment, a metal feed point scheme in which the antenna 18 is directly conducted with the circuit board 2 (e.g., motherboard) can be implemented for a metal center scheme of a metal patch. Thereby enabling ESIM functionality. The antenna 18 with other frequency bands can also be realized by the scheme, so that the debugging difficulty is reduced, and the performance of the whole antenna 18 is improved.
According to some embodiments of the present application, optionally, a through hole 14 is formed on the plastic middle frame, and the metal conducting member 3 can be directly welded and conducted with the metal shell, so that a spring plate 4 can be omitted, reliability is improved, procedures are fewer, and cost is lower.
Optionally, a layer of waterproof glue is added to the welding area, so that the plastic middle frame and the metal shell can be sealed, the welding area can be protected, the waterproof effect of the whole machine can be achieved, and water is prevented from entering the whole machine from the metal shell and the through hole 14.
The other side of the metal conducting member 3 is connected to the motherboard, and in this embodiment, is locked to the PCB by a screw.
In this embodiment, the plastic middle frame is provided with a through hole 14, which is convenient for assembling the metal conducting piece 3 and assembling the waterproof layer. For the metal middle frame scheme of the metal patch, a scheme of a metal feed point that the antenna 18 is directly conducted with the main board can be realized, so that an ESIM function can be realized. Meanwhile, the antenna 18 with other frequency bands can be realized by the scheme, so that the debugging difficulty is reduced, and the performance of the whole antenna 18 is improved. The waterproof performance of the whole machine above 5 atmospheric pressure (atmospheres, ATM) levels can be realized, and the contact reliability of the antenna 18 is ensured.
Optionally, the electronic device includes a wearable device such as a wristwatch, a bracelet, and the like, and may also include other electronic devices having a metal housing, such as headphones, a mobile phone, a tablet computer, and the like.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the application as defined by the appended claims and their equivalents.