CN222560713U

CN222560713U - Exhaust gas liquid cooling device

Info

Publication number: CN222560713U
Application number: CN202421717893.7U
Authority: CN
Inventors: 姜良斌; 宋德鹏
Original assignee: Shandong Liguan Microelectronics Equipment Co ltd
Current assignee: Shandong Liguan Microelectronics Equipment Co ltd
Priority date: 2024-07-19
Filing date: 2024-07-19
Publication date: 2025-03-04
Anticipated expiration: 2034-07-19

Abstract

The utility model discloses an exhaust gas liquid cooling device, comprising: a cylinder having a first end flange and a second end flange opposite to the first end flange; a first end cap; a second end cap; a first cooling assembly located in the cylinder and mounted on the first end cap, a first piping group of the first cooling assembly passing through a first through hole provided on the first end cap; and a second cooling assembly located in the cylinder and mounted on the second end cap, a second piping group of the second cooling assembly passing through a second through hole provided on the second end cap; the second cooling assembly is separated from the first cooling assembly. The exhaust gas cooling device according to the utility model has relatively good maintainability.

Description

Tail gas liquid cooling device

Technical Field

The utility model relates to a tail gas liquid cooling device.

Background

The tail gas generated by the semiconductor equipment is also called as semiconductor process waste gas, the components of the tail gas are complex, mainly fluorine-containing gas and volatile organic gas, such as CF ₄、NF₃、SF₆、C₂F₆、CHF₃、CH₂F₂ and the like, the tail gas components generated by different types of semiconductor processes are different, different tail gas treatment methods are needed for different tail gases, however, the common temperature of the semiconductor process waste gas is high when the semiconductor process waste gas is led out, and most of the subsequent treatment processes need to cool the semiconductor process waste gas before the semiconductor process waste gas is treated so as to be beneficial to subsequent treatment.

Even though the subsequent treatment process does not require the semiconductor process waste gas to its temperature, its conveying equipment also requires its temperature, in that the semiconductor process waste gas often needs to be pumped to a predetermined tail gas treatment equipment by a pump, the pump working temperature cannot be too high, otherwise the working efficiency and the service life thereof will be affected, especially the oil pumping, and the too high temperature will cause the volatilization of working oil. Meanwhile, for the subsequent treatment, such as an activated carbon adsorption tank, the adsorption temperature is not too high, and it should be known that, for the activated carbon, the desorption temperature is 200 ℃ to 220 ℃, in other words, if the temperature of the semiconductor process exhaust gas is relatively high, the activated carbon is saturated in advance, and even a desorption phenomenon occurs, i.e. the adsorbed semiconductor process exhaust gas is stripped from the activated carbon. In view of this, in general, in order to meet the requirements of conveying the semiconductor process exhaust gas and subsequent process treatment, the semiconductor process exhaust gas generally needs to be subjected to a temperature reduction treatment in advance.

Because of the complex composition of semiconductor process exhaust gases, devices for cooling semiconductor exhaust gases generally require periodic maintenance, and thus, exhaust gas liquid cooling devices for cooling semiconductor exhaust gases are required to meet maintainability requirements in addition to cooling requirements.

A common tail gas liquid cooling device for cooling semiconductor waste gas is configured by arranging a straight cooling pipe or a U-shaped cooling pipe for circulating a cooling medium in a cylindrical shell, and if the straight cooling pipe is adopted, the axial direction of the cooling pipe is parallel to the axial direction of the shell. Meanwhile, the cooling pipe is provided with heat exchange fins so as to improve the heat exchange area of the cooling pipe. When it is necessary to perform maintenance on a heat exchange assembly comprising a cooling tube and heat exchange fins, the housing needs to be removed or the heat exchange assembly needs to be taken out, and under such conditions, the mutual influence of the disassembly and the axial length of the heat exchange assembly on the housing needs to be considered, specifically, if the axial length of the heat exchange assembly on the housing is relatively large, the disassembly of the heat exchange assembly becomes difficult, but if the axial length of the heat exchange assembly is relatively small, the heat exchange capability of the heat exchange assembly tends to be influenced.

Furthermore, in order to improve the heat exchange capacity under the condition that the whole length of the heat exchange assembly is relatively small, a coil pipe or a coil pipe is used for replacing a straight cooling pipe or a U-shaped cooling pipe, but in the axial direction of the shell, the contradiction between the length of the heat exchange assembly and maintainability is still a technical problem to be solved.

Disclosure of utility model

In view of the above, the present utility model aims to provide a tail gas liquid cooling device with relatively high heat exchange efficiency and relatively good maintainability.

In an embodiment of the present utility model, there is provided an exhaust gas liquid cooling apparatus for cooling exhaust gas of a semiconductor process, the exhaust gas liquid cooling apparatus including:

a barrel having a first end flange and a second end flange opposite the first end flange;

The first end sealing head and the first end flange form a first end flange connecting structure, and the first end sealing head is provided with a first port;

the second end sealing head and the second end flange form a second end flange connecting structure, and the second end sealing head is provided with a second port;

A first cooling assembly disposed in the cylinder and mounted on the first end fitting, a first piping group of the first cooling assembly penetrating through a first through hole provided in the first end fitting, and

The second cooling assembly is positioned in the cylinder and is arranged on the second end seal, the second tubing set of the second cooling assembly penetrates out through a second through hole arranged on the second end seal, and the second cooling assembly and the first cooling assembly are mutually separated.

Optionally, the first cooling assembly is secured to the first end fitting by a first tubing set;

the second cooling assembly is fixed on the second end seal through a second piping group.

Optionally, the first cooling assembly and the second cooling assembly are provided with auxiliary brackets supported on the inner wall of the cylinder.

Optionally, the distance between the first cooling component and the second cooling component is 20 mm-150 mm.

Optionally, the first cooling component and the second cooling component are coiled cooling pipes;

Correspondingly, the coil pipe type cooling pipe is provided with a first refrigerant medium port corresponding to the end closure at the side, and the opposite end is provided with a second refrigerant medium port which is connected back to the end closure at the end of the coil pipe type cooling pipe.

Optionally, the coil cooling tube is provided with heat exchange fins or a cooling fin with a central hole is arranged on each turn of coil.

Optionally, the cooling fin is conical, and the side where the conical big end is located is the air inlet side of the tail gas.

Optionally, a third port is further formed in the side surface of the cylinder.

Optionally, the first port and the second port have LF flanges.

Optionally, a first joint surface of the first end closure head and the first end flange, and a second joint surface of the second end closure head and the second end flange are formed with annular positioning grooves;

Correspondingly, the axis of the positioning groove is collinear with the axis of the cylinder;

The positioning groove is positioned with a sealing ring.

It should be noted that, because the semiconductor process waste gas contains more corrosive components and more volatile organic gases and dust, the maintenance period of the cooling assembly is relatively shorter, and the difficulty of assembling and disassembling the cooling assembly on the cylinder has a relatively larger influence on maintainability of the tail gas liquid cooling device. The tail gas liquid cooling device according to the embodiment of the utility model is equivalent to dividing the cooling assembly into two parts, and is in one-to-one correspondence with each of the sealing heads assembled at the two ends of the cylinder. The cooling assembly takes the sealing head as an installation matrix, and during maintenance, the sealing head is removed, and the cooling assembly taking the sealing head as the installation matrix is taken out together for maintenance. The cooling assembly is divided into two parts, and the two parts are separated from each other, so that the cooling assembly with the length halved is used under the condition of determining the length of the cylinder, the assembly and the disassembly difficulty of the cooling assembly on the cylinder are greatly reduced, and the maintainability of the tail gas liquid cooling device is improved. Meanwhile, the cooling assembly is divided into two parts, so that the difficulty in assembly and disassembly is reduced, the obstacle on prolonging the cooling distance is reduced, a longer barrel can be provided, and the tail gas liquid cooling device with better cooling effect is favorably constructed.

Drawings

Fig. 1 is a schematic diagram of a main sectional structure of a tail gas liquid cooling device in an embodiment.

Fig. 2 is an enlarged view of the section I of fig. 1.

Fig. 3 is a schematic left-view structure of an exhaust gas liquid cooling device in an embodiment.

Fig. 4 is a schematic perspective view of a tail gas liquid cooling device according to an embodiment.

FIG. 5 is a schematic diagram of an assembly of a first cooling coil and a first end enclosure according to an embodiment.

In the figure, a first port, a first end enclosure, a third port, a4 LF flange end cover, a first cooling coil pipe, a cooling fin, a heat exchange cavity, a cylinder body, a second cooling coil pipe, a second port, a second end enclosure, a dovetail groove, a 13O-shaped sealing ring, a 14 port flange, a 15 port liquid inlet pipe and a 16 outlet pipe are arranged in the figure.

Detailed Description

It will be appreciated that a tail gas liquid cooling apparatus for cooling semiconductor process exhaust gas generally comprises a cylindrical barrel 8 having defined axial, circumferential and radial directions, wherein the axial directions define the ends of the barrel 8. Meanwhile, the space surrounded by the cylinder 8 is an inner space for circulating the tail gas to be cooled, and is used for accommodating the cooling component, and refrigerant flows in the cooling component, wherein the refrigerant is mostly liquid and comprises fluid which can be subjected to phase change in the heat exchange process, and it is known that the fluid which can be subjected to phase change is usually in a liquid state when being at the side of the cooling component, and the fluid after phase change is usually gas due to phase change caused by heating, but can still be understood as liquid cooling as a whole.

While the embodiments of the present utility model do not involve modifications to the coolant used and optional modifications to the coolant components, and primarily involve modifications to the cooling components, the remainder of the tail gas cooling device is not described in any way, and those skilled in the art will be able to directly follow the general configuration of known tail gas cooling devices.

Correspondingly, the tail gas liquid cooling device according to the embodiment of the utility model comprises a cylinder 8, a sealing head positioned at two ends of the cylinder 8, a cooling component positioned in the cylinder 8 and a pipe inlet and outlet joint of the tail gas to be cooled, wherein the pipe inlet and outlet joint is arranged on the sealing head.

The cylinder 8 may be disposed horizontally or vertically in a use state, and for convenience of description and display, the structure and construction of the tail gas liquid cooling device are shown in a horizontal manner in the structure shown in fig. 1, but it does not indicate that the cylinder 8 must be disposed in a horizontal manner in the position of the tail gas liquid cooling device.

The cylinder 8 is generally cylindrical and has one flange at each end, referred to as a first end flange and a second end flange, collectively referred to as a nozzle flange 14 for ease of description. Obviously, the two nozzle flanges 14 are disposed opposite each other.

The main purpose of adopting the flange connection structure is to facilitate the assembly and disassembly of the corresponding sealing heads.

Further, each of the nozzle flanges 14 corresponds to one sealing head, the nozzle flange 14 matched with the first end flange is called a first end sealing head 2, and the nozzle flange 14 matched with the second end flange is called a second end sealing head 11.

In the structure illustrated in fig. 1, the first end cap 2 and the second end cap 11 are both disc-shaped end caps, while in some embodiments one or both of the first end cap 2 and the second end cap 11 are hemispherical end caps.

In fig. 1, a first port 1 is provided on a first end enclosure 2, a second port 10 is provided on a second end enclosure 11, the first port 1 and the second port 10 are also flange interfaces, and for convenience of description, the first port 1 to the third port 3 are collectively called interfaces. In a preferred embodiment, the first port, the second port and the third port 3 selected in some embodiments are all LF flanges, and are matched with the LF flange end cover 4, so that piping or connection can be rapidly carried out according to the selected interfaces, and the tail gas treatment of different channels is adapted.

The LF flange is a standard flange, and the corresponding LF flange standard was first established by the american society of mechanical engineering, which is a relatively common flange, and those skilled in the art should understand this clearly, and will not be described in detail herein.

The interface and the seal head are coaxially arranged, and under ideal conditions, the interface, the seal head and the cylinder 8 are coaxial, and good coaxiality is kept as much as possible.

In contrast to the prior art, in which only one cooling module is provided, in the exemplary embodiment of the utility model, two cooling modules are provided, so that the length of each cooling module is shortened in the case of a defined length of the cylinder 8, which facilitates the assembly of the cooling modules.

Accordingly, the cooling module fixed to the first head 2 is referred to as a first cooling module, and can be taken out together with the first cooling module when the first head 2 is removed. Similarly, the cooling module fixed to the second end cap 11 is referred to as a second cooling module, and the second cooling module can be taken out together when the second end cap 11 is removed. As can be seen more clearly in the structure illustrated in fig. 5, the first cooling coil 5 is fixed to the first end cap 2 by the liquid inlet pipe 15 and the liquid outlet pipe 16, and when the first end cap 2 is detached from the cylinder 8, the first cooling coil 5 integrally connected to the first end cap 2 can be taken out together.

The conventional single cooling assembly is divided into two parts, so that the length of the single cooling assembly in the axial direction of the cylinder 8 is shortened, and the assembly difficulty of the cooling assembly is greatly reduced. The cost is just one more set of piping.

Accordingly, the first cooling assembly is provided with a first set of piping and the second cooling assembly is provided with a second set of piping. The piping generally includes a liquid inlet pipe 15 and a liquid outlet pipe 16.

In the configuration illustrated in fig. 1, the first cooling coil 5, which is the first cooling assembly, is decoupled from the second cooling coil 9, which is the second cooling assembly, and the inlet tube 15 in each set of tubes can be either tapped from the proximal end of the respective cooling assembly (relative to the head to which it is mounted) or from the distal end of the cooling assembly.

Specifically, if the two cooling modules are considered together and the cooling fluid is delivered from left to right as a whole, the inlet tube 15 of the first cooling coil 5 needs to be located at the proximal end (with respect to the first end cap 2), the cooling fluid is gradually heated until reaching the rightmost end of the first cooling coil 5, and then a drain tube 16 is connected back, at which point the drain tube 16 is connected from the distal end of the first cooling coil 5. Whereas the distal end of the second cooling coil 9 (with respect to the second end head 11) is correspondingly tapped from the inlet pipe 15, then gradually heated from left to right, and finally led out through the outlet pipe 16 tapped from the proximal end of the second cooling coil 9.

Correspondingly, the first end closure 2 is provided with a pair of through holes for the connection of the inlet pipe 15 and the outlet pipe 16 of the matched second cooling coil 9, and the second end closure 11 is also provided with a pair of through holes for the connection of the inlet pipe 15 and the outlet pipe 16 of the matched second cooling coil 5.

The liquid inlet pipe 15 and the liquid outlet pipe 16 are integrated with the penetrated through holes preferably by adopting a welding mode. In some embodiments, the inlet pipe 15 and the outlet pipe 16 are divided into a plurality of parts at the corresponding through holes, wherein one part is a middle part and is fixed at the corresponding through holes in a welding way, and two ends of the middle part can be provided with pipe joints so as to be connected with the part positioned in the cylinder 8 and the cooling pipeline positioned outside the cylinder respectively.

The middle part and the through hole can be connected by screw threads, and the formed screw thread pair is coated with sealant to realize sealing.

In view of the high temperatures that may be associated with the exhaust gas, which may affect the sealing performance of, for example, a rubberized seal structure, in some implementations, a pair of threads formed between, for example, the intermediate portion and the via may be sealed using, for example, a packing seal or other solid sealing medium.

In some embodiments, the first cooling module is secured to the first end closure by a first tubing set and the second cooling module is secured to the second end closure by a second tubing set, where the tubing sets are both the components of the respective cooling module and the components to which it is secured to the respective end closure.

It should be noted that, although the cooling coil is made of metal, the whole weight is not great in the empty pipe state, and the corresponding pipe group can be fixed on the corresponding sealing head.

It should also be appreciated that in the liquid state, the cooling coil plus the injected liquid will typically weigh 1 to 3 times or more than its own weight, under which conditions the cooling coil is preferably provided with auxiliary support, for example, in the portion of the cylinder 8.

It will be appreciated that since the auxiliary support is reacted by gravity, the auxiliary support is located below the respective cooling assembly. As shown in fig. 1, for example, since the first cooling coil 5 is spaced from the inner wall of the cylinder 8 by a certain distance, in other words, when the auxiliary support is provided below the first cooling coil 5, a margin remains above the auxiliary support, so that the penetration of the first cooling coil 5 into the cylinder 8 is not affected.

Further, for the auxiliary support, it may be fixedly provided at the bottom of the cylinder 8, so that the corresponding auxiliary support is not taken together when taking and placing the cooling module.

In some embodiments the auxiliary support may be supported in the barrel 8 in a standing rather than stationary manner, without affecting its support to the cooling assembly in a condition that facilitates the removal of the auxiliary support.

The auxiliary support is configured as an auxiliary support, and in view of, for example, the heat exchange coil being a spiral coil having a predetermined number of turns, the upper surface thereof may be arc-shaped grooves with respect to the auxiliary support to conform to, for example, the contour of the cooling coil.

In addition, regarding the number of auxiliary brackets, one may be used or two may be used, and when one is used, the auxiliary brackets are supported at the inner ends of the respective cooling modules, such as the first cooling coil 5 illustrated in fig. 1, the right end thereof is the inner end, the left end thereof is the outer end, and if only one auxiliary bracket is provided, the auxiliary bracket is supported at the lower right side of the first cooling coil 5.

If two auxiliary brackets are provided, one is provided at the lower side of the inner end of the cooling module and one is provided at the lower side of the middle part of the cooling module.

In order to fully utilize the space, and meanwhile, in order to avoid assembly interference, the distance between the first cooling assembly and the second cooling assembly is 20 mm-150 mm. Because of the expansion with heat and contraction with cold, a certain distance is reserved between the two cooling components, and direct interference of the two cooling components is avoided. Meanwhile, interference between the two components in the middle of the cylinder 8 during assembly is avoided, so that the design distance between the first cooling component and the second cooling component is not less than 20mm at normal temperature.

Meanwhile, in order to fully utilize the space, the space between the first cooling component and the second cooling component is not too large, otherwise, the space in the cylinder 8 is wasted, and the space between the first cooling component and the second cooling component is not larger than 150mm.

In the structure illustrated in fig. 1, the first cooling component and the second cooling component are both coil-type cooling pipes, it should be understood that the first improvement point in the embodiment of the present utility model is to change the configuration of the conventional single cooling component to two cooling components, and the selection of the type of the cooling component is not involved, in other words, in the embodiment of the present utility model, other types of cooling components may also be selected.

For coil-type cooling pipes, a first coolant medium port is provided corresponding to the end head side, and a second coolant medium port is provided at the opposite end, and the second coolant medium port is connected back to the first end head 2 corresponding to the first cooling coil 5 through a liquid outlet pipe 16 by a first cooling coil 5 shown in fig. 1.

It will be appreciated that the coil cooling tube itself has a relatively large heat exchange area and that in some embodiments the coil cooling tube may also be provided with heat exchange fins on its surface. In the structure illustrated in fig. 1, a cooling fin 6 with a central hole is disposed on each turn of coil of the coil-type cooling tube.

The cooling fins 6 can also be used as supporting fins, the cooling fins 6 are welded with the coil cooling pipes, the lower ends of the cooling fins 6 extend downwards to be supported on the lower wall of the cylinder 8, and no independent components for supporting the coil cooling pipes are needed.

In the structure illustrated in fig. 1, the exhaust gas to be cooled is conveyed from left to right, and the cooling fins 6 are configured in a tapered shape under the condition that the cooling fins 6 are configured, and the side where the tapered large end is located is the inlet side of the exhaust gas, so that the exhaust gas to be cooled can be fully contacted with the cooling fins 6, and the effect of the cooling fins 6 can be favorably exerted.

In the structure illustrated in fig. 1 and 4, the side surface of the cylinder 8 is further provided with a third port 3, and the third port 3 is offset on the side where the first port 1 is located and can be used as an air inlet. The advantage of the multi-port design is that the gas inlet and outlet for the tail gas to be cooled can be selected as desired.

As described above, the removability of the seal head is a basis for maintainability of the inner wall of the cylinder 8 and other components built in the cylinder 8, and the seal head and the cylinder 8 are provided with removability based on flange connection. At the same time, the sealing problem should be considered, so that the first joint surface of the first end closure 2 and the first end flange, and the second joint surface of the second end closure 11 and the second end flange are formed with annular positioning grooves, such as dovetail grooves 12 shown in fig. 2. Accordingly, the axis of the positioning groove is collinear with the axis of the cylinder 8, and in turn, the positioning groove is positioned with a sealing ring, such as the O-ring shown in fig. 2.

Claims

1. A tail gas liquid cooling device for cooling semiconductor process exhaust gas, characterized in that the tail gas liquid cooling device comprises:

2. The tail gas cooling device of claim 1, wherein the first cooling assembly is secured to the first end fitting by a first tubing set;

3. The tail gas liquid cooling device according to claim 1 or 2, wherein the first cooling assembly and the second cooling assembly are provided with auxiliary brackets supported on the inner wall of the cylinder.

4. The tail gas liquid cooling device according to claim 1, wherein a distance between the first cooling component and the second cooling component is 20 mm-150 mm.

5. The tail gas cooling device of claim 1, wherein the first cooling assembly and the second cooling assembly are coiled cooling pipes;

6. The tail gas liquid cooling device according to claim 5, wherein the coil cooling pipe is provided with heat exchange fins or a cooling fin with a central hole is arranged on each coil.

7. The tail gas cooling device according to claim 6, wherein the cooling fin is tapered, and a side of the tapered large end is an inlet side of the tail gas.

8. The tail gas cooling device according to claim 1, wherein a third port is further provided on a side surface of the cylinder.

9. The tail gas cooling device of claim 1, wherein the first port and the second port have LF flanges.

10. The tail gas cooling device according to claim 1, wherein a first joint surface of the first end closure and the first end flange, and a second joint surface of the second end closure and the second end flange are formed with annular positioning grooves;

The positioning groove is positioned with a sealing ring.