CN222530398U - Wafer etching frame and etching device - Google Patents
Wafer etching frame and etching device Download PDFInfo
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- CN222530398U CN222530398U CN202420365256.1U CN202420365256U CN222530398U CN 222530398 U CN222530398 U CN 222530398U CN 202420365256 U CN202420365256 U CN 202420365256U CN 222530398 U CN222530398 U CN 222530398U
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- 238000005530 etching Methods 0.000 title claims abstract description 50
- 230000000087 stabilizing effect Effects 0.000 claims description 8
- 230000007423 decrease Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 76
- 230000007797 corrosion Effects 0.000 description 15
- 238000005260 corrosion Methods 0.000 description 15
- 230000004075 alteration Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
本申请公开了一种晶圆腐蚀框及腐蚀装置，涉及晶圆腐蚀技术领域，用于解决现有技术中腐蚀后的晶圆存在较为严重的色差的技术问题。该腐蚀框包括框体、多个第一框齿和多个第二框齿，多个第一框齿设置于框体的第一内壁上；多个第二框齿设置于框体的第二内壁上，多个第一框齿与多个第二框齿一一对应，相邻两个第一框齿间形成第一放置间隙，相邻两个第二框齿间形成第二放置间隙，从沿框体顶部到框体底部的方向，第一放置间隙和第二放置间隙的宽度均逐渐减小，第一放置间隙和第二放置间隙靠近框体底部一侧的宽度均小于晶圆的厚度。本申请可以极大地减少晶圆与腐蚀框的接触面积，从而可以极大地改善晶圆腐蚀后的色差问题。
The present application discloses a wafer etching frame and an etching device, which relates to the field of wafer etching technology and is used to solve the technical problem that the wafer after etching in the prior art has a relatively serious color difference. The etching frame includes a frame, a plurality of first frame teeth and a plurality of second frame teeth, wherein the plurality of first frame teeth are arranged on the first inner wall of the frame; the plurality of second frame teeth are arranged on the second inner wall of the frame, the plurality of first frame teeth correspond to the plurality of second frame teeth one by one, a first placement gap is formed between two adjacent first frame teeth, and a second placement gap is formed between two adjacent second frame teeth, and from the top of the frame to the bottom of the frame, the widths of the first placement gap and the second placement gap are gradually reduced, and the widths of the first placement gap and the second placement gap near the bottom of the frame are both less than the thickness of the wafer. The present application can greatly reduce the contact area between the wafer and the etching frame, thereby greatly improving the color difference problem after the wafer is etched.
Description
Technical Field
The application relates to the technical field of wafer corrosion, in particular to a wafer corrosion frame and a corrosion device.
Background
In the process of processing a semiconductor wafer, in order to remove damage on the surface of the thinned wafer, the back surface of the wafer needs to be corroded, and in order to better corrode the back surface of the wafer, a corresponding wafer corrosion frame needs to be used.
Referring to fig. 1, a wafer etching frame in the related art includes a frame body 1 and limiting teeth 2 located on inner walls of two opposite sides of the frame body 1, a placing gap 3 is formed between two adjacent limiting teeth 2, and after at least part of a wafer 4 is placed in the placing gap 3, the wafer 4 can be etched.
However, the opposite sides of the spacing teeth 2 of the wafer etching frame in the related art are parallel to each other, and the widths of the placement gaps 3 are equal from the bottom to the top of the etching frame. Therefore, after the wafer 4 is placed in the placing gap 3, the wafer 4 can swing in the placing gap 3, so that the contact area between the wafer 4 and the corrosion frame is relatively large, the contact part of the wafer 4 and the corrosion frame is not easy to corrode, serious chromatic aberration exists on the corroded wafer, and the quality of the wafer is finally affected.
Disclosure of utility model
The application mainly aims to provide a wafer corrosion frame and a corrosion device, and aims to solve the technical problem that a corroded wafer has serious chromatic aberration in the prior art.
In order to solve the technical problems, the application provides a wafer etching frame, which comprises:
the frame body comprises a first inner wall and a second inner wall which are oppositely arranged;
The first frame teeth are arranged on the first inner wall of the frame body;
The first frame teeth are arranged on the second inner wall of the frame body, the first frame teeth correspond to the second frame teeth one by one, a first placing gap is formed between every two adjacent first frame teeth, and a second placing gap is formed between every two adjacent second frame teeth;
The first placing gap and the second placing gap are used for placing wafers, the widths of the first placing gap and the second placing gap are gradually reduced from the top of the frame to the bottom of the frame, and the widths of the first placing gap and the second placing gap, which are close to one side of the bottom of the frame, are smaller than the thickness of the wafers.
In some possible embodiments, the first frame tooth forms a side of the first placement gap and the second frame tooth forms a side of the second placement gap.
In some possible embodiments, the first frame tooth forms a side of the first placement gap at an angle of 45 ° -75 °, and the second frame tooth forms a side of the second placement gap at an angle of 45 ° -75 °.
In some possible embodiments, the first frame tooth is disposed obliquely to both sides forming the first placement gap, and the second frame tooth is disposed obliquely to both sides forming the second placement gap.
In some possible embodiments, the inclination angles of the two sides of the first frame tooth forming the first placement gap are equal, and the inclination angles of the two sides of the second frame tooth forming the second placement gap are equal.
In some possible embodiments, the first frame tooth forms the first placement gap at an angle of inclination of 55 ° to 85 ° on both sides, and the second frame tooth forms the second placement gap at an angle of inclination of 55 ° to 85 °.
In some possible embodiments, the distance between the first frame tooth and the second frame tooth disposed opposite to each other gradually decreases from the top of the frame body to the bottom of the frame body.
In some possible embodiments, a handle is further mounted on the top surface of the frame, and the cross-section of the handle is arc-shaped.
In some possible embodiments, the bottom of the frame body is further provided with a stabilizing leg, the stabilizing leg comprises an integrally formed inclined section and a horizontal section, the inclined section and the bottom of the frame body are integrally formed, and the horizontal section is located in a horizontal direction.
In some possible embodiments, the application also provides a wafer etching device, which comprises the wafer etching frame.
Compared with the related art, the application has at least the following beneficial effects:
according to the wafer corrosion frame and the corrosion device, the widths of the first placing gap and the second placing gap are gradually reduced from the direction along the top of the frame body to the bottom of the frame body, and the widths of the first placing gap and the second placing gap, which are close to one side of the bottom of the frame body, are smaller than the thickness of a wafer, so that the contact area of the wafer and the corrosion frame can be greatly reduced, the problem of chromatic aberration after the wafer is corroded can be greatly solved, and the quality of the wafer can be further improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic top view of a wafer etching frame according to an embodiment of the present application;
FIG. 2 is a schematic top view of a wafer etching frame according to an embodiment of the present application;
FIG. 3 is one of the schematic cross-sectional views at A-A in FIG. 2 provided in accordance with an embodiment of the present application;
FIG. 4 is one of the schematic cross-sectional views at B-B in FIG. 2 provided by an embodiment of the present application;
FIG. 5 is a second schematic cross-sectional view of the portion A-A of FIG. 2, according to an embodiment of the present application;
FIG. 6 is a second schematic cross-sectional view at B-B in FIG. 2, provided in accordance with an embodiment of the present application;
Fig. 7 is a schematic cross-sectional view at C-C in fig. 2 provided in accordance with an embodiment of the present application.
The device comprises a frame body, a first inner wall, a second inner wall, a limiting tooth, a placing gap, a wafer, a first frame tooth, a first placing gap, a second frame tooth, a handle, a stabilizing foot, a tilting section, a horizontal section and a horizontal section, wherein the reference numerals comprise 1, the frame body, 11, the first inner wall, 12, the second inner wall, 2, the limiting tooth, 3, the placing gap, 4, the wafer, 5, the first frame tooth, 6, the first placing gap, 7, the second frame tooth, 8, the second placing gap, 9, the handle, 10, the stabilizing foot, 101, the tilting section and 102.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present application, it should be noted that the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and are not to be construed as indicating or implying relative importance.
Referring to fig. 2-4, the present application provides a wafer etching frame, which includes a frame body 1, a plurality of first frame teeth 5, and a plurality of second frame teeth 7.
The frame 1 includes a first inner wall 11 and a second inner wall 12 that are oppositely disposed, the frame 1 includes an accommodating space, and a top view of the frame 1 may be square, wherein two inner walls that are oppositely disposed of the frame 1 are the first inner wall 11 and the second inner wall 12 respectively.
The first frame teeth 5 are arranged on the first inner wall 11 of the frame body 1, the second frame teeth 7 are arranged on the second inner wall 12 of the frame body 1, the first frame teeth 5 are uniformly arranged on the first inner wall 11, the second frame teeth 7 are uniformly arranged on the second inner wall 12, the first frame teeth 5 and the second frame teeth 7 are in one-to-one correspondence, a first placing gap 6 is formed between two adjacent first frame teeth 5, a second placing gap 8 is formed between two adjacent second frame teeth 7, the first placing gap 6 and the second placing gap 8 are used for placing the wafer 4, the widths of the first placing gap 6 and the second placing gap 8 are gradually reduced from the direction from the top of the frame body 1 to the bottom of the frame body 1, and the widths of the first placing gap 6 and the second placing gap 8 on the side close to the bottom of the frame body 1 are smaller than the thickness of the wafer 4. The first frame tooth 5 and the second frame tooth 7 can be integrally formed with the frame body 1.
The number of the first frame teeth 5 and the second frame teeth 7 can be set according to actual needs, the more the number of the first frame teeth 5 is, the more the number of the first placing gaps 6 is formed, the more the number of the second frame teeth 7 is, the more the number of the second placing gaps 8 is, the more the number of the first placing gaps 6 and the second placing gaps 8 is, and the more the number of the wafers 4 corroded at one time is.
The width of the first placing gap 6 and the width of the second placing gap 8 which are oppositely arranged at the same height of the frame body 1 are equal, and the widths of the first placing gap 6 and the second placing gap 8 are gradually reduced from the direction from the top of the frame body 1 to the bottom of the frame body 1, and the widths of the first placing gap 6 and the second placing gap 8, which are close to one side of the bottom of the frame body 1, are smaller than the thickness of the wafer 4, so that when the same wafer 4 is placed in the first placing gap 6 and the second placing gap 8 which are oppositely arranged, under the action of the gravity of the wafer 4, the edge of part of the wafer 4 can be clamped in the first placing gap 6 and the second placing gap 8, so that the wafer 4 can be stably placed in the first placing gap 6 and the second placing gap 8, and the wafer 4 is not easy to swing and contact with the etching frame in the process of etching the wafer 4. And only part of the edge of the wafer 4 is contacted with the etching frame, other surfaces of the wafer 4 are not easy to contact with the etching frame, for example, the wafer 4 is not easy to contact with the bottoms of the first placing gap 6 and the second placing gap 8, and the wafer 4 is in a suspended state. Thus, the contact area between the wafer 4 and the etching frame can be greatly reduced, and the wafer 4 can be more uniformly etched, so that the color difference of the etching of the wafer 4 can be reduced.
Based on the above design, in this embodiment, the widths of the first placing gap 6 and the second placing gap 8 are gradually reduced from the direction from the top of the frame 1 to the bottom of the frame 1, and the widths of the first placing gap 6 and the second placing gap 8 on the side close to the bottom of the frame 1 are smaller than the thickness of the wafer 4, so that the contact area between the wafer 4 and the etching frame can be greatly reduced, the color difference problem after the wafer 4 is etched can be greatly improved, and the quality of the wafer 4 can be improved.
In some embodiments, referring again to fig. 3 and 4, the first frame tooth 5 forms a side inclined arrangement of the first placement gap 6 and the second frame tooth 7 forms a side inclined arrangement of the second placement gap 8.
The cross-sectional shape of the first frame tooth 5 is a right trapezoid, and by setting one side surface of the first frame tooth 5 forming the first placement gap 6 to be inclined, the width of the first placement gap 6 can be gradually reduced from the direction along the top of the frame body 1 to the bottom of the frame body 1.
The cross-sectional shape of the second frame teeth 7 is a right trapezoid, and by setting one side surface of the second frame teeth 7 forming the second placement gap 8 to be inclined, the width of the second placement gap 8 can be gradually reduced from the direction along the top of the frame body 1 to the bottom of the frame body 1.
In some embodiments, referring again to fig. 3, the inclination angle β1 of the side of the first frame tooth 5 forming the first placement gap 6 is 45 ° -75 °, for example, the inclination angle β1 may be 45 °, 50 °, 55 °, 60 °, 70 °, 75 °, or the like. By reasonably setting the inclination angle beta 1, the width of the first placing gap 6 can be more properly matched with the thickness of the wafer 4, so that the contact area between the wafer 4 and the corrosion frame can be further reduced.
Referring again to fig. 4, the inclination angle β2 of the side surface of the second frame tooth 7 forming the second placement gap 8 is 45 ° -75 °, for example, the inclination angle β2 may be 45 °, 50 °, 55 °, 60 °, 70 °, 75 °, or the like. By reasonably setting the inclination angle beta 2, the width of the second placing gap 8 can be more properly matched with the thickness of the wafer 4, so that the contact area between the wafer 4 and the corrosion frame can be further reduced.
In some embodiments, referring to fig. 5 and 6, the first frame tooth 5 is disposed obliquely to both sides forming the first placement gap 6, and the second frame tooth 7 is disposed obliquely to both sides forming the second placement gap 8.
The cross-sectional shape of the first frame tooth 5 is isosceles trapezoid, and by setting the two sides of the first frame tooth 5 forming the first placement gap 6 to be inclined, the width of the first placement gap 6 can be gradually reduced from the direction from the top of the frame 1 to the bottom of the frame 1, the inclination angles of the two sides of the first frame tooth 5 forming the first placement gap 6 are equal, and the inclination angles of the two sides of the second frame tooth 7 forming the second placement gap 8 are equal.
The cross-sectional shape of the second frame teeth 7 is isosceles trapezoid, and by setting both side surfaces of the second frame teeth 7 forming the second placement gap 8 to be inclined, the width of the second placement gap 8 can be gradually reduced from the direction along the top of the frame body 1 to the bottom of the frame body 1.
In some embodiments, referring again to fig. 5, the inclination angles β3 of the two sides of the first frame tooth 5 forming the first placement gap 6 are each 55 ° -85 °, for example, the inclination angles β3 may be 55 °, 60 °, 65 °, 70 °, 75 °, 80 °, 85 °, or the like. By reasonably setting the inclination angle beta 3, the width of the first placing gap 6 can be more properly matched with the thickness of the wafer 4, so that the contact area between the wafer 4 and the corrosion frame can be further reduced.
Referring again to fig. 6, the inclination angles β4 of the two sides of the second frame teeth 7 forming the second placement gap 8 are each 55 ° -85 °, for example, the inclination angles β4 may be 55 °, 60 °, 65 °, 70 °, 75 °, 80 °, 85 °, or the like. By reasonably setting the inclination angle beta 4, the width of the second placing gap 8 can be more properly matched with the thickness of the wafer 4, so that the contact area between the wafer 4 and the corrosion frame can be further reduced.
In some embodiments, referring to fig. 7, the distance D between the first frame tooth 5 and the second frame tooth 7, which are disposed opposite to each other, gradually decreases from the top of the frame 1 to the bottom of the frame 1.
Since the distance D between the first frame tooth 5 and the second frame tooth 7 which are oppositely arranged is gradually reduced from the direction along the top of the frame body 1 to the bottom of the frame body 1, the distance between the first placing gap 6 and the second placing gap 8 which are oppositely arranged is gradually reduced from the direction along the top of the frame body 1 to the bottom of the frame body 1, when the wafer 4 is placed between the first placing gap 6 and the second placing gap 8 which are arranged, the edge of the wafer 4 can be more stably clamped at the lower parts of the first placing gap 6 and the second placing gap 8 under the action of the gravity of the wafer 4, so that the contact area between the wafer 4 and the etching frame can be further reduced.
In some embodiments, referring again to fig. 2 and 7, a handle 9 is further mounted on the top surface of the frame 1, and the handle 9 has an arc-shaped cross-section. The etching frame can be moved more conveniently by the handle 9, so that the efficiency of the wafer 4 in the plane view can be improved.
In some embodiments, referring again to fig. 7, the bottom of the frame 1 is further provided with a stabilizing leg 10, where the stabilizing leg 10 includes an integrally formed inclined section 101 and a horizontal section 102, and the inclined section 101 is integrally formed with the bottom of the frame 1, and the horizontal section 102 is located in a horizontal direction.
When the frame body 1 is placed on the etching table, the contact area between the etching frame and the etching table can be increased by the horizontal section 102, so that the etching frame can be more stable, and finally the etching quality of the wafer 4 can be improved.
In some embodiments, the application also provides a wafer etching device, which comprises the wafer etching frame. Since the wafer etching device comprises the wafer etching frame in the application, the wafer etching device has all the beneficial effects of the wafer etching frame in the application, and the description is omitted herein.
The above description is merely illustrative of various embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the scope of the present application, and the application is intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A wafer etch frame, the etch frame comprising:
The device comprises a frame body (1), wherein the frame body (1) comprises a first inner wall (11) and a second inner wall (12) which are oppositely arranged;
A plurality of first frame teeth (5), wherein the plurality of first frame teeth (5) are arranged on a first inner wall (11) of the frame body (1);
A plurality of second frame teeth (7), wherein the plurality of second frame teeth (7) are arranged on a second inner wall (12) of the frame body (1), the plurality of first frame teeth (5) are in one-to-one correspondence with the plurality of second frame teeth (7), a first placing gap (6) is formed between two adjacent first frame teeth (5), and a second placing gap (8) is formed between two adjacent second frame teeth (7);
The first placing gap (6) and the second placing gap (8) are used for placing the wafer (4), the width of the first placing gap (6) and the width of the second placing gap (8) are gradually reduced from the top of the frame (1) to the bottom of the frame (1), and the width of the first placing gap (6) and the width of the second placing gap (8) close to one side of the bottom of the frame (1) are smaller than the thickness of the wafer (4).
2. Wafer etching frame according to claim 1, characterized in that the first frame tooth (5) forms a side-inclined arrangement of the first placement gap (6) and the second frame tooth (7) forms a side-inclined arrangement of the second placement gap (8).
3. Wafer etching frame according to claim 2, characterized in that the first frame tooth (5) forms the side of the first placement gap (6) at an angle of inclination of 45 ° -75 °, and the second frame tooth (7) forms the side of the second placement gap (8) at an angle of inclination of 45 ° -75 °.
4. Wafer etching frame according to claim 1, characterized in that the first frame tooth (5) forms both sides of the first placement gap (6) and the second frame tooth (7) forms both sides of the second placement gap (8).
5. Wafer etching frame according to claim 4, characterized in that the inclination angles of the two sides of the first frame tooth (5) forming the first placement gap (6) are equal and the inclination angles of the two sides of the second frame tooth (7) forming the second placement gap (8) are equal.
6. Wafer etching frame according to claim 5, characterized in that the angle of inclination of the two sides of the first frame tooth (5) forming the first placement gap (6) is 55 ° -85 °, and the angle of inclination of the two sides of the second frame tooth (7) forming the second placement gap (8) is 55 ° -85 °.
7. Wafer etching frame according to any of claims 2-6, characterized in that the distance between the oppositely arranged first frame teeth (5) and the second frame teeth (7) decreases gradually from the top of the frame (1) to the bottom of the frame (1).
8. Wafer etching frame according to any of claims 2-6, characterized in that the top surface of the frame body (1) is also provided with a handle (9), the cross-sectional shape of the handle (9) being arc-shaped.
9. Wafer etching frame according to any of claims 2-6, characterized in that the bottom of the frame body (1) is further provided with a stabilizing foot (10), the stabilizing foot (10) comprises an integrally formed inclined section (101) and a horizontal section (102), the inclined section (101) and the bottom of the frame body (1) are integrally formed, and the horizontal section (102) is located in the horizontal direction.
10. A wafer etching apparatus, characterized in that the etching apparatus comprises a wafer etching frame according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420365256.1U CN222530398U (en) | 2024-02-27 | 2024-02-27 | Wafer etching frame and etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420365256.1U CN222530398U (en) | 2024-02-27 | 2024-02-27 | Wafer etching frame and etching device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222530398U true CN222530398U (en) | 2025-02-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420365256.1U Active CN222530398U (en) | 2024-02-27 | 2024-02-27 | Wafer etching frame and etching device |
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| Country | Link |
|---|---|
| CN (1) | CN222530398U (en) |
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- 2024-02-27 CN CN202420365256.1U patent/CN222530398U/en active Active
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