CN222378781U - A heating mechanism for semiconductor heat treatment equipment - Google Patents

Abstract

The utility model belongs to the technical field of semiconductor processing, in particular to a heating mechanism of semiconductor heat treatment equipment, which comprises a furnace body, wherein the front surface of the furnace body is provided with a furnace door, the inner wall of the top of the furnace body is fixedly provided with a mounting ring, when a heating component needs to be disassembled, a threaded rod is rotated anticlockwise, the threaded rod drives the locking block to move in a direction far away from the inner wall of the furnace body, and when the threaded rod is separated from the inner wall of the furnace body, the locking structure is lifted upwards, the locking structure can be disassembled, then the lower mounting ring is held to rotate anticlockwise, the lower mounting ring drives the upper mounting ring to rotate through the vertical rod, the upper mounting ring drives the clamping block to move in the clamping groove again through the clamping ring, when the clamping block moves to the longitudinal groove of the clamping groove, the heating assembly is pulled downwards again, the heating assembly can be taken out, the heating assembly is maintained or replaced, a traditional bolt fixing mode is replaced, the disassembling difficulty is reduced, and the follow-up maintenance of equipment is facilitated.

Description

Heating mechanism of semiconductor heat treatment equipment

Technical Field

The utility model relates to the technical field of semiconductor processing, in particular to a heating mechanism of semiconductor heat treatment equipment.

Background

The heat treatment refers to a metal heat treatment process for obtaining expected tissues and performances by heating, preserving heat and cooling materials in a solid state, wherein the heat treatment process generally comprises three processes of heating, preserving heat and cooling, and sometimes only comprises two processes of heating and cooling, the processes are connected with each other, and the heating is an important process of heat treatment.

But the existing heat treatment equipment, the internal heating structure is fixed with the inner wall of the heating furnace through the cooperation of rivets and buckles, so that the subsequent disassembly and maintenance are inconvenient, and the heating mechanism of the semiconductor heat treatment equipment is provided.

Disclosure of utility model

The utility model aims to solve the defects in the prior art and provides a heating mechanism of semiconductor heat treatment equipment.

In order to achieve the purpose, the heating mechanism of the semiconductor heat treatment equipment comprises a furnace body, wherein the front surface of the furnace body is provided with a furnace door, the inner wall of the top of the furnace body is fixedly provided with a mounting ring, the inner wall of the mounting ring is provided with a plurality of clamping grooves, the bottom of the mounting ring is provided with a heating assembly, the inner wall of the top of the furnace body is provided with a material placing structure, and the inner wall of the furnace body is provided with a plurality of locking structures.

As a further description of the above technical solution:

the heating element comprises a clamping ring fixedly installed with the mounting ring, a plurality of clamping blocks are fixedly arranged on the outer portion of the clamping ring, the clamping blocks are matched with the clamping grooves, an upper mounting ring is fixedly arranged on the bottom of the clamping ring, a plurality of vertical rods are fixedly arranged on the bottom of the upper mounting ring, the bottom of each vertical rod is fixedly provided with the same lower mounting ring, and heating wires are respectively sleeved on the vertical rods.

As a further description of the above technical solution:

The number of the vertical rods is eight, and the eight vertical rods are in annular equidistant arrays.

As a further description of the above technical solution:

The material placing structure comprises three mounting rods fixedly connected with the inner wall of the top of the furnace body, three placing plates are fixedly arranged on the mounting rods, and the distances between the three placing plates are the same.

As a further description of the above technical solution:

The locking structure comprises a threaded rod fixedly connected with the inner wall of the furnace body, a guide plate is fixedly arranged on one side of the threaded rod, and a locking block is movably arranged on one side of the guide plate.

As a further description of the above technical solution:

One side of baffle is equipped with the recess, the recess internal fixation is equipped with the bearing, the fixed bull stick that is equipped with in one side of latch segment, bull stick and bearing inner race fixed connection, the bottom of latch segment is equipped with the arc wall, the size of arc wall is greater than the external diameter of lower collar.

The utility model has the following beneficial effects:

1. Compared with the prior art, this heating mechanism of semiconductor heat treatment equipment, through setting up the rand, the retainer plate, the fixture block, the threaded rod, baffle and latch segment, when heating element needs to dismantle the maintenance, anticlockwise rotation threaded rod earlier, the threaded rod drives the latch segment and moves to the direction of keeping away from the furnace body inner wall, when the threaded rod breaks away from on the inner wall of furnace body, one side that the latch segment arc groove is close to the furnace body inner wall is laminated with lower collar, again with locking structure upwards carry out the dismantlement to locking structure, then hold down the collar anticlockwise rotation, lower collar passes through the montant and drives the collar rotation of upper collar, the rand drives the fixture block again and moves in the draw-in groove, when the fixture block moves to the longitudinal groove of draw-in groove, again with heating element downwardly pulling, can take out it, maintain or change heating element, traditional bolt fastening mode has been replaced, the dismantlement degree of difficulty is reduced, follow-up maintenance to equipment of being convenient for.

2. Compared with the prior art, the heating mechanism of the semiconductor heat treatment equipment can be used for placing semiconductor materials at the top of the placing tray during heating by arranging the mounting rod and the placing tray, a plurality of placing trays can be used for simultaneously processing a plurality of materials, and the three placing trays can be used for heating different semiconductor materials in a classified manner in a staggered manner, so that the follow-up collection is convenient.

Drawings

Fig. 1 is a schematic perspective view of a heating mechanism of a semiconductor heat treatment apparatus according to the present utility model;

FIG. 2 is a schematic diagram showing a front sectional structure of a heating mechanism of a semiconductor heat treatment apparatus according to the present utility model;

fig. 3 is a schematic perspective view of a heating assembly and a placing structure in a heating mechanism of a semiconductor heat treatment apparatus according to the present utility model;

FIG. 4 is a schematic perspective view of a mounting ring and collar in a heating mechanism of a semiconductor thermal processing apparatus according to the present utility model;

Fig. 5 is a schematic perspective view showing a locking structure in a heating mechanism of a semiconductor heat treatment apparatus according to the present utility model.

Legend description:

1. Furnace body, 2, furnace door, 3, mounting ring, 4, heating component, 401, collar, 402, upper mounting ring, 403, vertical rod, 404, lower mounting ring, 405, heating wire, 406, fixture block, 5, material placing structure, 501, mounting rod, 502, placing plate, 6, locking structure, 601, threaded rod, 602, guide plate, 603, locking block, 7, clamping groove.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1 to 5, the heating mechanism of the semiconductor heat treatment equipment provided by the utility model comprises a furnace body 1, wherein a furnace door 2 is arranged on the front surface of the furnace body 1, a mounting ring 3 is fixedly arranged on the inner wall of the top of the furnace body 1, a plurality of clamping grooves 7 are arranged on the inner wall of the mounting ring 3, a heating component 4 is arranged at the bottom of the mounting ring 3, the heating component 4 comprises a clamping ring 401 fixedly arranged with the mounting ring 3, a plurality of clamping blocks 406 are fixedly arranged outside the clamping ring 401, the clamping blocks 406 are matched with the clamping grooves 7, an upper mounting ring 402 is fixedly arranged at the bottom of the clamping ring 401, a plurality of vertical rods 403 are fixedly arranged at the bottom of the upper mounting ring 402, eight vertical rods 403 are in an annular equidistant array, the bottom of the plurality of vertical rods 403 is fixedly provided with a same lower mounting ring 404, and heating wires 405 are sleeved on the plurality of vertical rods 403;

Referring to fig. 3, in order to achieve the purpose of heating multiple materials simultaneously, a material placement structure 5 is arranged on the top inner wall of the furnace body 1, the material placement structure 5 comprises three mounting rods 501 fixedly connected with the top inner wall of the furnace body 1, three placement plates 502 are fixedly arranged on the three mounting rods 501, the distances between the three placement plates 502 are the same, the multiple placement plates 502 can process multiple materials simultaneously, and the three placement plates 502 are staggered and distributed to be capable of heating different semiconductor materials in a classified manner, so that subsequent collection is facilitated;

Referring to fig. 5, in order to realize the locking to lower collar 404, the inner wall of furnace body 1 is equipped with a plurality of locking structures 6, locking structure 6 includes the threaded rod 601 with furnace body 1 inner wall fixed connection, one side of threaded rod 601 is fixed to be equipped with baffle 602, one side activity of baffle 602 is equipped with latch segment 603, one side of baffle 602 is equipped with the recess, the recess internal fixation is equipped with the bearing, one side of latch segment 603 is fixed and is equipped with the bull stick, bull stick and bearing inner race fixed connection, the bottom of latch segment 603 is equipped with the arc wall, the size of arc wall is greater than the external diameter of lower collar 404, transfer latch segment 603 through rotating threaded rod 601 and remove, and make the laminating of arc wall and lower collar 404 of latch segment 603 bottom, can realize the location to lower collar 404, cooperation fixture block 406 and draw-in groove 7 use, can realize the quick installation to heating element 4, also can realize the quick dismantlement to heating element 4 simultaneously, the subsequent maintenance of being convenient for.

The heating furnace comprises the working principle that when a semiconductor material needs to be heated, the furnace door 2 is opened, the semiconductor material is placed on the top of the placing plates 502, the plurality of placing plates 502 can process the plurality of materials simultaneously, the three placing plates 502 are staggered and distributed and can also heat different semiconductor materials in a classified mode, so that subsequent collection is facilitated, if a heating component 4 or part of heating elements need to be maintained or replaced, a threaded rod 601 can be rotated anticlockwise firstly, the threaded rod 601 drives a guide plate 602, the guide plate 602 drives a locking block 603 to move in a direction far away from the inner wall of the furnace body 1, when the locking block 601 is separated from the inner wall of the furnace body 1, one side, close to the inner wall of the furnace body 1, of an arc groove of the locking block 603 is attached to a lower mounting ring 404, the locking structure 6 is lifted upwards, the locking structure 6 can be detached, the locking block 603 is separated from the lower mounting ring 404, then the lower mounting ring 404 is held to rotate anticlockwise, the lower mounting ring 404 drives the upper mounting ring 402 to rotate through a vertical rod 403, the upper mounting ring 402 drives a clamping ring 401, the clamping ring 406 moves in the clamping block 7, and when the clamping block 406 moves to the longitudinal groove of the clamping block 7, and the heating component 4 is pulled downwards to be maintained or replaced.

It should be noted that the foregoing description is only a preferred embodiment of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it should be understood that modifications, equivalents, improvements and modifications to the technical solution described in the foregoing embodiments may occur to those skilled in the art, and all modifications, equivalents, and improvements are intended to be included within the spirit and principle of the present utility model.

Claims (6)

1. The heating mechanism of the semiconductor heat treatment equipment comprises a furnace body (1) and is characterized in that a furnace door (2) is arranged on the front side of the furnace body (1), a mounting ring (3) is fixedly arranged on the inner wall of the top of the furnace body (1), a plurality of clamping grooves (7) are formed in the inner wall of the mounting ring (3), a heating component (4) is arranged at the bottom of the mounting ring (3), a material placement structure (5) is arranged on the inner wall of the top of the furnace body (1), and a plurality of locking structures (6) are arranged on the inner wall of the furnace body (1).

2. The heating mechanism of semiconductor heat treatment equipment according to claim 1, wherein the heating assembly (4) comprises a clamping ring (401) fixedly installed with the mounting ring (3), a plurality of clamping blocks (406) are fixedly arranged outside the clamping ring (401), the clamping blocks (406) are matched with the clamping grooves (7), an upper mounting ring (402) is fixedly arranged at the bottom of the clamping ring (401), a plurality of vertical rods (403) are fixedly arranged at the bottom of the upper mounting ring (402), the same lower mounting ring (404) is fixedly arranged at the bottom of the plurality of vertical rods (403), and heating wires (405) are sleeved on the plurality of vertical rods (403).

3. A heating mechanism of a semiconductor heat treatment apparatus according to claim 2, wherein the number of said vertical bars (403) is eight, and eight of said vertical bars (403) are in an annular equidistant array.

4. The heating mechanism of the semiconductor heat treatment equipment according to claim 1, wherein the material placement structure (5) comprises three mounting rods (501) fixedly connected with the inner wall of the top of the furnace body (1), three placement plates (502) are fixedly arranged on the three mounting rods (501), and the distances between the three placement plates (502) are the same.

5. The heating mechanism of the semiconductor heat treatment equipment according to claim 2, wherein the locking structure (6) comprises a threaded rod (601) fixedly connected with the inner wall of the furnace body (1), a guide plate (602) is fixedly arranged on one side of the threaded rod (601), and a locking block (603) is movably arranged on one side of the guide plate (602).

6. The heating mechanism of a semiconductor heat treatment apparatus according to claim 5, wherein a groove is formed in one side of the guide plate (602), a bearing is fixedly arranged in the groove, a rotating rod is fixedly arranged on one side of the locking block (603), the rotating rod is fixedly connected with an inner ring of the bearing, an arc-shaped groove is formed in the bottom of the locking block (603), and the size of the arc-shaped groove is larger than the outer diameter of the lower mounting ring (404).