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CN222283374U - Camera device and intelligent terminal - Google Patents

Camera device and intelligent terminal Download PDF

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Publication number
CN222283374U
CN222283374U CN202420390880.7U CN202420390880U CN222283374U CN 222283374 U CN222283374 U CN 222283374U CN 202420390880 U CN202420390880 U CN 202420390880U CN 222283374 U CN222283374 U CN 222283374U
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China
Prior art keywords
assembly
coil
magnet
imaging chip
tsa
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Active
Application number
CN202420390880.7U
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Chinese (zh)
Inventor
刘鑫建
崔桥军
郭书存
傅饶
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Kunshan Q Technology Co Ltd
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Kunshan Q Technology Co Ltd
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Priority to CN202420390880.7U priority Critical patent/CN222283374U/en
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Abstract

本申请提供一种摄像设备,包括镜头组件、主壳体、成像芯片组件、光路调节件、磁铁组件及线圈组件;所述镜头组件及所述磁铁组件均装配在所述主壳体上,所述线圈组件可移动地装设在所述磁铁组件中,所述成像芯片组件与所述线圈组件相互固定,且所述成像芯片组件位于所述镜头组件的光轴方向的一侧;所述光路调节件装设在所述主壳体中,用于将所述光学信号传输到所述成像芯片组件进行成像;所述磁铁组件和所述线圈组件用于产生电磁推力驱动所述线圈组件带动所述成像芯片组件移动;所述主壳体还形成有避让部,所述磁铁组件部分地嵌入在所述避让部中。本申请还提供一种包括所述摄像设备的智能终端。

The present application provides a camera device, including a lens assembly, a main housing, an imaging chip assembly, an optical path adjustment member, a magnet assembly and a coil assembly; the lens assembly and the magnet assembly are both mounted on the main housing, the coil assembly is movably mounted in the magnet assembly, the imaging chip assembly and the coil assembly are fixed to each other, and the imaging chip assembly is located on one side of the optical axis direction of the lens assembly; the optical path adjustment member is mounted in the main housing, and is used to transmit the optical signal to the imaging chip assembly for imaging; the magnet assembly and the coil assembly are used to generate electromagnetic thrust to drive the coil assembly to drive the imaging chip assembly to move; the main housing is also formed with an avoidance portion, and the magnet assembly is partially embedded in the avoidance portion. The present application also provides a smart terminal including the camera device.

Description

Camera equipment and intelligent terminal
Technical Field
The application belongs to the technical field of image pickup, and particularly relates to image pickup equipment and an intelligent terminal with the same.
Background
Various commonly used smart terminals, such as smartphones, tablet computers, etc., are generally configured with built-in camera devices so as to implement a photographing function at any time and any place.
In the prior art, a built-in image pickup apparatus of an intelligent terminal is generally the same as a conventional independent image pickup apparatus, and includes a lens assembly, a focusing mechanism, an anti-shake mechanism, and an imaging chip assembly. Due to the size limitation of the intelligent terminal, these components of the built-in image pickup apparatus must be further miniaturized compared to the similar components of the independent image pickup apparatus. Therefore, the built-in image pickup apparatus of the existing smart terminal is generally designed to be similar in structure to the independent image pickup apparatus, but is scaled down in size.
In recent years, as consumers continuously pursue that the smart terminal is lighter, thinner, shorter, and smaller, the demand for further miniaturization of the smart terminal is also more and more severe. The built-in camera device of the intelligent terminal cannot be infinitely scaled down, otherwise its necessary optical and mechanical properties would be affected. Particularly, for a tele photographing apparatus for performing a telescopic photographing or an ultra-macro photographing, a long optical path is required to achieve clear imaging, and in the prior art, in order to form a long optical path, it is required to secure a sufficient overall length of the tele photographing apparatus, so that it is particularly difficult to miniaturize the tele photographing apparatus and to install it in an intelligent terminal.
Accordingly, there is a need to provide an image pickup apparatus and an intelligent terminal having the image pickup apparatus built therein, which are more novel in structure, to solve the above-described drawbacks in the prior art.
Disclosure of Invention
The application aims to provide an imaging device with a more novel structure and an intelligent terminal with the imaging device, so as to solve the problem that the miniaturization of the built-in imaging device, particularly a long-focus imaging device, in the existing intelligent terminal is more and more difficult.
In order to solve the problems, an embodiment of one aspect of the application provides an image pickup apparatus, which comprises a lens assembly, a main housing, an imaging chip assembly, an optical path adjusting member, a magnet assembly and a coil assembly, wherein the lens assembly and the magnet assembly are assembled on the main housing, the coil assembly is movably arranged in the magnet assembly, the imaging chip assembly and the coil assembly are mutually fixed, the imaging chip assembly is positioned at one side of the lens assembly in the optical axis direction, the optical path adjusting member is arranged in the main housing and is used for receiving an optical signal acquired by the lens assembly and transmitting the optical signal to the imaging chip assembly for imaging, the magnet assembly and the coil assembly are used for generating electromagnetic thrust to drive the coil assembly to drive the imaging chip assembly to move, an avoidance part is formed on the main housing, and the magnet assembly is partially embedded in the avoidance part.
In some embodiments, the image capturing apparatus further includes an Automatic Focusing (AF) device in which the lens assembly is mounted, the AF device being mounted on the main housing, the lens assembly including at least one fixed lens unit and at least one movable lens unit, the AF device being for driving the movable lens unit to move for focusing.
In some embodiments, the magnet assembly comprises a magnet support and a magnet fixedly arranged on the magnet support, the coil assembly comprises a coil support which can move relative to the magnet support and a coil fixedly arranged on the coil support, the imaging chip assembly is fixedly arranged in the coil support, and the coil and the magnet are used for generating electromagnetic thrust and driving the imaging chip assembly to move through the coil support.
In some embodiments, the imaging chip assembly is sleeved in the coil support, and the coil support is sleeved in the magnet support.
In some embodiments, the image pickup apparatus further includes a ball rollably mounted between the magnet assembly and the coil assembly.
In some embodiments, the magnet support is provided with a first ball hole, the coil support is provided with a second ball hole corresponding to the first ball hole, and the balls are rollably embedded in the first ball hole and the second ball hole.
In some embodiments, the relief is a notch formed in the main housing, and the magnet support is partially embedded in the relief.
In some embodiments, the image capturing apparatus further includes a TSA (full scale Trace suspension assembly, i.e., a tracking suspension assembly) including a TSA frame, a TSA circuit board, and a cantilever unit including a plurality of cantilevers made of a material having elasticity and conductivity, the TSA circuit board being disposed inside the TSA frame, the plurality of cantilevers being connected between the TSA frame and the TSA circuit board, and the imaging chip assembly and the TSA circuit board being fixed to each other and electrically connected.
In some embodiments, the imaging apparatus further comprises a top cover comprising a top plate and a clamping plate arranged at the edge of the top plate, wherein the coil assembly, the imaging chip assembly and the TSA are all clamped between the magnet assembly and the top plate, and the clamping plate is fixed on the magnet support.
An embodiment of another aspect of the present application further provides an intelligent terminal, where the intelligent terminal includes the image capturing apparatus according to any one of the foregoing embodiments.
Compared with the prior art, the imaging device and the intelligent terminal with the imaging device have more excellent technical effects, such as (1) the lens component and the imaging chip component are not coaxially arranged, but are arranged in parallel, so that the imaging chip component is positioned at one side of the lens component 1 in the optical axis direction, and the optical path adjusting component receives the optical signal acquired by the lens component and adjusts the optical path of the optical signal so as to transmit the optical signal to the imaging chip component for imaging. Therefore, the lens assembly 1 and the imaging chip assembly need not be disposed on the same straight line, i.e., a common optical axis, but may be disposed substantially in the same plane. The overall length of the imaging device in the optical axis direction can be obviously shortened, the assembly difficulty of the imaging device is obviously reduced, and the further miniaturization of the intelligent terminal is facilitated. (2) The lens assembly is divided into the fixed lens unit and the movable lens unit, and only the movable lens unit is driven to move when the AF operation is needed, and the whole lens assembly is not required to be driven to move, so that the load of the AF device is lightened, the energy conservation is facilitated, the service life is prolonged, and the AF operation sensitivity is improved. And the at least two lens units are matched with the light path adjusting piece, the light path is increased through multiple reflections, and the large aperture and long focus micro-distance shooting effect is realized. (3) The imaging chip assembly is sleeved inside the coil support, and the coil support is sleeved inside the magnet support, so that the imaging chip assembly and the optical anti-shake mechanism are integrated together to form a chip sinking structure, the overall thickness of the imaging chip assembly and the optical anti-shake mechanism in the Z-axis direction is greatly reduced, the structure is simplified, and the cost is saved. (4) The TSA circuit board is used as a circuit board of the imaging chip assembly, the circuit board is not required to be additionally arranged for the imaging chip assembly, the integral thickness of the imaging chip assembly and the TSA can be further reduced, the structure is further simplified, and the cost is saved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of an image capturing apparatus according to a preferred embodiment of the present application.
Fig. 2 is an exploded structural schematic view of the image pickup apparatus shown in fig. 1.
Fig. 3 is a schematic structural diagram of a main casing in the image pickup apparatus shown in fig. 1.
Fig. 4 is a schematic structural view of the main casing and the optical path adjusting member in the image pickup apparatus shown in fig. 1 assembled together.
Fig. 5 is a schematic structural view of a magnet holder in the image pickup apparatus shown in fig. 1.
Fig. 6 is a schematic structural diagram of the TSA housing, TSA circuit board, and cantilever unit in the image pickup apparatus shown in fig. 1 assembled together.
Fig. 7 is a schematic sectional view of the imaging apparatus shown in fig. 1 after the magnet assembly, the coil assembly, the ball, the imaging chip assembly, and the TSA are assembled together.
Fig. 8 is a schematic diagram of the optical path adjustment principle of the optical path adjustment member in the image pickup apparatus shown in fig. 1.
Fig. 9 is a schematic diagram of the operation principle of the image pickup apparatus shown in fig. 1.
Detailed Description
Specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art without making any inventive effort, are intended to be within the scope of the present application.
The application mainly aims to provide an imaging device with a more novel structure and an intelligent terminal with the imaging device, so as to solve the problem that the miniaturization of the built-in imaging device, particularly the long-focus imaging device, in the existing intelligent terminal is more and more difficult.
Referring first to fig. 1 and 2, a preferred embodiment of an aspect of the present application provides an image capturing apparatus, which may be used in a smart terminal, such as a smart phone, a tablet computer, etc., as a built-in image capturing apparatus of the smart terminal.
The image pickup apparatus includes a lens assembly 1, an Automatic Focus (AF) device 2, a main housing 3, an optical path adjuster 4, a magnet assembly 5, a coil assembly 6, balls 7, an imaging chip assembly 8, a TSA (full scale Trace Suspension Assembly, a tracking suspension assembly) 9, and a top cover 10.
The lens assembly 1 includes a first lens unit 11 and a second lens unit 12, wherein the first lens unit 11 and the second lens unit 12 each include at least one optical lens, and the optical axis directions of all the optical lenses included in the first lens unit 11 and the second lens unit are all arranged on the same straight line, so that the lens assembly 1 has a single optical axis. The lens units in the lens assembly 1, for example, the first lens unit 11 and the second lens unit 12 may be existing lens units as long as they are shaped and sized to be assembled into a smart terminal. In the present embodiment, it is preferable to provide the first lens unit 11 as a fixed lens unit, install an optical lens having a relatively large size and weight in the first lens unit 11, provide the second lens unit 12 as a movable lens unit, and install an optical lens having a relatively small size and weight in the second lens unit 12. In other embodiments, the lens assembly 1 may include a different number and specification of lens units from those of the present embodiment, as long as at least one movable lens unit is included therein.
The AF device 2 may be, for example, a voice coil motor, and the lens assembly 1 is mounted in the AF device 2. The AF device 2 is used to drive at least one movable lens unit in the lens assembly 1 to move in the optical axis direction thereof for focusing. For example, in the present embodiment, it is preferable that the first lens unit 11 is fixedly installed in the AF device 2, and the second lens unit 12 is movably installed in the AF device 2, and the AF device 2 is provided so as to be able to drive the second lens unit 12 to move in the optical axis direction thereof for focusing. The specific structure of the AF device 2, the assembly method of the AF device and the lens assembly 1, and the working principle of driving the second lens unit 12 to perform focusing can all be referred to the prior art. In the present embodiment, driving the second lens unit 12 to focus may be performed by any one of electromagnetic, memory alloy, piezoelectric effect, or the like, or by a combination of two or more thereof.
Referring to fig. 3, the main housing 3 includes a first transition plate 31, a second transition plate 32, a first end plate 33, a second end plate 34, and two side plates 35. The first transition plate 31 and the second transition plate 32 are connected between the two side plates 35 and are disposed obliquely relative to each other, so that the first transition plate 31, the second transition plate 32, and the two side plates 35 together enclose a receiving space having an outward expansion opening for receiving the optical path adjusting member 4. In addition, the length of the first transition plate 31 is preferably longer than the length of the second transition plate 32. The first end plate 33 is connected to the end of the first transition plate 31 extending out and is inclined with respect to the first transition plate 31, and the second end plate 34 is connected to the end of the second transition plate 32 extending out and is inclined with respect to the second transition plate 32. It will be appreciated that the first transition plate 31 and the second transition plate 32 are both inclined, which helps to form a space for avoidance outside the main casing 3, reducing the overall size of the image pickup apparatus. In this embodiment, the edge of each side plate 35 located at the opening of the accommodating space includes a first edge section 351 and a second edge section 352, the first edge section 351 is flush or substantially flush with the first end plate 33, the second edge section 352 is flush or substantially flush with the second end plate 34, and since the length of the first transition plate 31 is greater than that of the second transition plate 32, a height difference is formed between the first edge section 351 and the second edge section 352, and each side plate 35 forms a notch 353 at the boundary between the first edge section 351 and the second edge section 352 based on the height difference therebetween, and the notch 353 is preferably in a right angle shape and can serve as a avoiding portion for the magnet assembly 5 to be partially embedded during assembly, thereby contributing to further saving the assembly space and reducing the overall size of the image capturing apparatus. In addition, a protruding limit bar 36 is formed inside the second edge section 352 of the two side plates 35 for limiting the optical path adjusting member 4, preventing the optical path adjusting member 4 from shaking in the main housing 3.
Referring to fig. 4, in the present embodiment, the optical path adjusting member 4 is a total reflection prism and is disposed in the accommodating space formed by the main housing 3. The optical path adjuster 4 has two end faces 40, a bottom face 41, a main optical face 42, a first sub optical face 43a, and a second sub optical face 43b, which are identical in shape and size. Wherein the bottom surface 41 is parallel to the main optical surface 42, and the first and second sub-optical surfaces 43a and 43b are oblique to the bottom surface 41 and the main optical surface 42. The two end surfaces 40 are respectively bonded to the inner surfaces of the two side plates 35, and the first and second sub-optical surfaces 43a and 43b are respectively bonded to the inner surfaces of the first and second transition plates 31 and 32. The AF device 2 is then fixed to the first end plate 33 of the main casing 3 and the first edge sections 351 of the two side plates 35, and the optical axis of the lens assembly 1 mounted in the AF device 2 is arranged perpendicular to the main optical surface 42 and aligned with the main optical surface 42 and the first sub-optical surface 43a. In addition, a light shielding film (not shown) or ink may be attached to the bottom surface 41 of the light path adjuster 4 to prevent external stray light from entering the light path adjuster 4 from the bottom surface 41 to cause interference.
The magnet assembly 5 includes a magnet holder 51 and a magnet 52. Referring to fig. 5, in the present embodiment, the magnet holder 51 is a substantially rectangular frame, and the magnet 52 is a bar magnet and is fixed inside the magnet holder 51. Preferably, one of the four frame sides of the magnet holder 51 is provided to be fitted to the frame side 510, and the width and height thereof are provided to be significantly smaller than the other three for better fitting with the optical path adjusting member 4 at the time of assembly, allowing the optical path adjusting member 4 to be partially snapped into the magnet holder 51 based on its smaller size, thereby saving the assembly space. The other three frame sides of the magnet support 51 are provided with recessed magnet grooves 511, and the number of magnets 52 is three, and the magnets are fixedly embedded in the three magnet grooves 511 respectively. The magnet holder 51 has flat plate-shaped bearing portions 512 provided on the inner sides of the four corners thereof, and each bearing portion 512 has a circular hole-shaped first ball hole 513 formed therein.
The coil assembly 6 includes a coil bracket 61 and a coil 62. The coil holder 61 of the present embodiment is a substantially rectangular flat plate-like frame body, and has a shape and a size corresponding to those of the magnet holder 51, and is capable of being fitted in the magnet holder 51 and being moved in a predetermined direction (for example, the X-axis direction and the Y-axis direction shown in fig. 7 and 9) within a predetermined range. The coil bracket 61 is provided at each of four corners thereof with round hole-shaped second ball holes 610, and the four second ball holes 610 are aligned with the four first ball holes 513, respectively. The coils 62 are fixedly mounted on the coil support 61, and the shape, size and number of the coils 62 correspond to those of the magnets 52. Specifically, the coils 62 are racetrack coils, the size of which corresponds to the number of magnets 52, and the number of the coils 62 is three, and the three coils 62 are respectively arranged on three sides of the coils 62 and are respectively aligned with the three magnets 52, and the length direction of each coil 62 and the length direction of the corresponding magnet 52 are parallel to each other. The specific configuration of COIL 62 may take a variety of forms, such as a wound COIL form or a flexible printed COIL (FP-COIL) form.
The balls 7 are preferably insulating balls, and the number of the balls is plural, preferably four in the present embodiment. Each ball 7 is sandwiched between the magnet holder 51 and the coil holder 61, and each ball 7 is simultaneously fitted in one first ball hole 513 and one second ball hole 610 aligned with each other. The size of the balls 7 is slightly smaller than the first and second ball holes 513 and 610 so that the balls 7 can roll in the corresponding first and second ball holes 513 and 610, thereby allowing the coil assembly 6 and the magnet assembly 5 to be moved in parallel with each other. In this embodiment, the four balls 7 are arranged in a single layer, and in other embodiments, a plurality of balls 7 may be arranged in a multi-layer arrangement, and the specific arrangement structure may refer to the prior art.
The imaging chip assembly 8 includes an image sensor chip 81, and a filter 82. The image sensor chip 81 has a shape and a size corresponding to those of the coil holder 61, and can be fixedly mounted inside the frame structure of the coil holder 61. The image sensor chip 81 may be, for example, an existing complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, abbreviated as CMOS) chip, and the optical filter 82 may be various optical filters for image pickup apparatuses, which are currently available, and fixedly attached to the image sensor chip 81.
Referring to fig. 6, the TSA9 includes a TSA frame 91, a TSA circuit board 92, a cantilever unit 93, and a TSA stiffener 94. The TSA frame 91 includes a frame body 911 and a frame extension portion 912, wherein the frame body 911 is a rectangular flat plate frame body having a shape and size corresponding to the magnet holder 51, the coil holder 61 and the support frame 81, and the frame extension portion 912 is in a bar shape and extends from one side of the frame body 911. The TSA circuit board 92 is rectangular flat plate-like and is arranged in the center of the frame structure of the TSA outer frame 91. The cantilever unit 92 includes a plurality of cantilevers (not numbered in the drawing), each including a plurality of suspension wires (not numbered in the drawing) having a meandering shape and disposed parallel to each other, connected between the TSA frame 91 and the TSA circuit board 92. The suspension wires are made of a material having elasticity and electrical conductivity (e.g., a metal material) so that the TSA circuit board 92 can simultaneously establish mechanical and electrical connection with the TSA frame 91 through the cantilever unit 92. When the TSA circuit board 92 is subjected to an external force, the cantilever unit 92 can allow the TSA circuit board 92 to move relative to the TSA frame 91 based on the elasticity of the suspension wire, and when the external force is cancelled, the cantilever unit 92 can drive the TSA circuit board 92 to restore to the initial position by utilizing the elasticity of the suspension wire. The TSA reinforcing plate 94 is rectangular and flat, and is made of rigid material, and is fixed on one side surface of the TSA frame 91 to enhance the overall strength, and the TSA circuit board 92 and the cantilever unit 93 should be spaced apart from the TSA reinforcing plate 94 by a certain gap to reserve an elastic deformation space.
Referring to fig. 7, when assembling the magnet assembly 5, the coil assembly 6, the ball 7, the imaging chip assembly 8 and the TSA9, the magnet assembly 5, the coil assembly 6 and the ball 7 may be assembled together according to the specific structure described above, then the imaging chip assembly 8 is sleeved and fixed inside the frame structure of the coil support 61, the TSA9 is disposed on the side of the coil support 61 facing away from the magnet assembly 5, then the TSA circuit board 92 and the imaging chip assembly 8 are mutually fixed, and an electrical connection is established between the image sensor chip 81 and the TSA circuit board 92, and the TSA circuit board 92 is used as the circuit board of the imaging chip assembly 8. After the above assembly, referring again to fig. 1 and also to fig. 9, the magnet holder 51 may be fixed to the second end plate 34 of the main casing 3 and the second edge sections 352 of the two side plates 35, that is, the magnet holder 51 may be fixed to the main casing 3 in parallel with the AF device 2, and the magnet holder 51 may be partially embedded in the recess 353 of the main casing 3 to form a recess, while aligning the imaging chip assembly 8 with the main optical surface 42 and the second sub-optical surface 43b.
The top cover 10 includes a top plate 101 and a clip plate 102 provided at an edge of the top plate 11. The top plate 101 has a rectangular flat plate shape and its shape and size correspond to those of the outer frame main body 911 of the TSA 9. The clamping plates 102 are elongated flat plates, preferably disposed on at least two opposite edges of the top plate 11 and perpendicular to the top plate 101. It will be appreciated that top plate 101 and clamping plate 102 may be integrally formed. The top cover 10 is covered on the outer side of the TSA9, so that the coil block 6, the ball 7, the imaging chip block 8, and the TSA9 are sandwiched between the magnet block 5 and the top plate 101, and the engagement plate 102 of the top cover 10 is engaged with and fixed to the outer surface of the magnet holder 51.
The image capturing apparatus 100 may establish electrical connection and communication connection with the outside through the outer frame extension 912 of the TSA9, and in addition, the AF device 2 itself may also directly establish electrical connection and communication connection with the outside. The above specific manner of establishing the electrical connection and the communication connection may refer to the prior art, and need not be described herein.
Referring to fig. 8 and 9, when the image capturing apparatus is used, the lens assembly 1 is used to capture an optical signal generated by a photographing object (not shown) directly opposite to the photographing object. The collected optical signal passes through the lens assembly 1 in the direction of the optical axis of the lens assembly 1 or in the direction parallel to the optical axis of the lens assembly 1 (i.e., in the direction perpendicular to the main optical surface 42 of the optical path adjusting member 4), and then perpendicularly enters the main optical surface 42 of the optical path adjusting member 4. According to the working principle of the total reflection prism in the prior art, the optical signal enters the optical path adjusting member 4 from the main optical surface 42, then total reflection is generated on the inner sides of the first sub optical surface 43a, the main optical surface 42 and the second sub optical surface 43b in sequence according to the optical signal transmission direction shown in fig. 8 and 9, and finally the optical signal is reflected to the outgoing direction perpendicular to the main optical surface 42 and aligned with the imaging chip assembly 8, and is emitted perpendicularly from the main optical surface 42, passes through the optical filter 82 and finally reaches the image sensor chip 81. The image sensor chip 81 converts the optical signal into an electronic image signal, which can be transmitted to an external data processing device, such as a data processing device of an intelligent terminal equipped with the image capturing apparatus, through the TSA circuit board 92, the suspension wire, and the TSA outer frame 91 of the TSA9 for subsequent processing. Thus, the photographing function of the image pickup apparatus is realized.
In the above-described photographing process using the image pickup apparatus, if focusing is required, at least one movable lens unit of the AF device 2 driving the lens assembly 1 may be controlled by, for example, a conventional means, such as the above-described second lens unit 12 moving in the optical axis direction thereof (for example, the Z-axis direction shown in fig. 7 and 9), so that the distance required to pass the optical signal from the lens assembly 1 to the imaging chip assembly 8 may be adjusted, thereby achieving focusing. The specific AF driving manner may be fully referred to the prior art, and need not be described herein.
In the above-described photographing process using the image pickup apparatus, if an optical anti-shake operation is required, the coil 62 may be energized by, for example, a conventional technical means. After the coil 62 is energized, electromagnetic induction occurs in the magnetic field of the corresponding magnet 52, so that the coil 62 receives electromagnetic thrust, and the electromagnetic thrust drives the coil block 6 and the imaging chip block 8 fixedly mounted thereon to move in a direction perpendicular to the optical axis of the lens block 1 (for example, the X-axis direction and the Y-axis direction shown in fig. 7 and 9), so that the optical signal emitted from the main optical surface 42 can be adjusted to a specific position on the image sensor chip 81 to compensate for the offset of the lens block 1 or the optical path adjuster 4 relative to the imaging chip block 8 in the X-axis direction and/or the Y-axis direction due to shake, so that the imaging chip block 8 is maintained at a position most suitable for receiving the optical signal, and thus an optical anti-shake operation is realized. During this operation, the balls 7 may provide isolation and support between the coil 62 and the magnet 52, while facilitating movement of the coil 62 relative to the magnet 52 by rolling itself.
In the above-described optical anti-shake operation, by adjusting the direction and magnitude of the voltage applied to the coil 62, the direction and magnitude of the current passing through the coil 62 can be adjusted, and thus the direction and magnitude of the electromagnetic thrust received by the coil 62 can be adjusted, so as to achieve the purpose of precise anti-shake. The specific regulation methods of the relevant voltages and currents can be fully referred to the prior art, and need not be described here in detail. Further, in the above-mentioned optical anti-shake operation, when the imaging chip assembly 8 moves, a compressive force or a tensile force is applied to the suspension wire in the cantilever unit 93 of the TSA9, and at this time, the suspension wire can be elastically deformed based on its elasticity, allowing the lens assembly 6 and the imaging chip assembly 8 to move relative to the TSA frame 91, and when the operation is completed, the suspension wire is restored from the elastically deformed state, so as to drive the lens assembly 6 and the imaging chip assembly 8 to reset.
Based on the above specific structure, compared with the prior art, the imaging device provided in this embodiment may obtain various beneficial technical effects, for example (1) the lens assembly 1 and the imaging chip assembly 8 of the imaging device are not coaxially arranged, but the lens assembly 1 and the imaging chip assembly 8 are arranged in parallel, so that the imaging chip assembly 8 is located at one side of the optical axis direction of the lens assembly 1, and the optical path adjusting member 4 receives the optical signal collected by the lens assembly 1 and adjusts the optical path thereof, so as to transmit the optical signal to the imaging chip assembly 8 for imaging. Therefore, the lens assembly 1 and the imaging chip assembly 8 need not be disposed on the same straight line, i.e., a common optical axis, but may be disposed substantially in the same plane. The overall length of the imaging device in the optical axis direction can be obviously shortened, the assembly difficulty of the imaging device is obviously reduced, and the further miniaturization of the intelligent terminal is facilitated. (2) The imaging apparatus divides the lens assembly 1 into a fixed lens unit and a movable lens unit, and only drives the movable lens unit therein to move when the AF operation is required, without driving the whole lens assembly 1 to move, thereby reducing the load of the AF device 2, being beneficial to saving energy, prolonging the service life and improving the AF operation sensitivity. And the at least two lens units are matched with the light path adjusting piece, the light path is increased through multiple reflections, and the large aperture and long focus micro-distance shooting effect is realized. (3) The imaging chip assembly 8 is sleeved inside the coil bracket 61, and the coil bracket 61 is sleeved inside the magnet bracket 51, so that the imaging chip assembly 8 and the optical anti-shake mechanism are integrated together to form a chip sinking structure, the overall thickness of the imaging chip assembly and the optical anti-shake mechanism in the Z-axis direction is greatly reduced, the structure is simplified, and the cost is saved. (4) The use of the TSA circuit board 92 as a circuit board for the imaging chip assembly 8 eliminates the need for providing the imaging chip assembly 8 with a circuit board, and further reduces the overall thickness of the imaging chip assembly 8 and TSA9, which contributes to further simplifying the structure and saving costs.
It will be appreciated that in other embodiments, the specific driving manner of driving the imaging chip assembly 8 to move to achieve optical anti-shake is not limited to electromagnetic induction driving described in the above embodiments, and driving force may be provided to the imaging chip assembly 8 by a Shape Memory Alloy (SMA) driving manner, a piezoelectric driving manner, or the like. The specific structure and working principle of these driving modes can be referred to the prior art. The optical path adjuster 4 is not limited to the prism described in the above embodiment, and may be any other optical structure such as a mirror assembly or a total reflection optical fiber, as long as the same optical path adjusting function can be achieved.
An embodiment of another aspect of the present application provides a smart terminal, which may be, for example, a smart phone, a tablet computer, a personal computer, a wearable device, or the like, and which includes the image pickup device as described in the foregoing embodiment. It can be appreciated that, due to the inclusion of the image capturing apparatus according to the foregoing embodiment, the intelligent terminal can also obtain the beneficial technical effects of the foregoing aspects as compared with the prior art.
The present application is not limited to the above embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present application are intended to be included in the scope of the present application. Accordingly, the scope of the application should be assessed as that of the appended claims.

Claims (10)

1. The imaging device is characterized by comprising a lens assembly, a main shell, an imaging chip assembly, an optical path adjusting piece, a magnet assembly and a coil assembly, wherein the lens assembly and the magnet assembly are assembled on the main shell, the coil assembly is movably arranged in the magnet assembly, the imaging chip assembly and the coil assembly are mutually fixed, the imaging chip assembly is located on one side of the lens assembly in the optical axis direction, the optical path adjusting piece is arranged in the main shell and is used for receiving optical signals collected by the lens assembly and transmitting the optical signals to the imaging chip assembly for imaging, the magnet assembly and the coil assembly are used for generating electromagnetic thrust to drive the coil assembly to drive the imaging chip assembly to move, and the main shell is further provided with an avoidance part, and the magnet assembly is partially embedded in the avoidance part.
2. The image pickup apparatus according to claim 1, further comprising an autofocus device in which the lens assembly is mounted, the autofocus device being mounted on the main housing, the lens assembly including at least one fixed lens unit and at least one movable lens unit, the autofocus device being configured to drive the movable lens unit to move for focusing.
3. The image pickup apparatus according to claim 1, wherein the magnet assembly includes a magnet holder and a magnet fixedly mounted on the magnet holder, the coil assembly includes a coil holder movable with respect to the magnet holder and a coil fixedly mounted on the coil holder, the imaging chip assembly is fixedly mounted in the coil holder, the coil and the magnet are for generating electromagnetic thrust, and the imaging chip assembly is moved by the coil holder.
4. The image pickup apparatus according to claim 3, wherein the imaging chip assembly is housed in the coil bracket, and the coil bracket is housed in the magnet bracket.
5. The image pickup apparatus according to claim 4, further comprising a ball rollably mounted between the magnet assembly and the coil assembly.
6. The image pickup apparatus according to claim 5, wherein the magnet holder is provided with a first ball hole, the coil holder is provided with a second ball hole corresponding to the first ball hole, and the balls are rollably inserted in the first ball hole and the second ball hole.
7. The image pickup apparatus according to claim 3, wherein the escape portion is a notch formed in the main casing, and the magnet holder is partially embedded in the escape portion.
8. The image capturing apparatus according to claim 1, further comprising a TSA including a TSA frame, a TSA circuit board, and a cantilever unit including a plurality of cantilevers made of a material having elasticity and conductivity, the TSA circuit board being disposed inside the TSA frame, the plurality of cantilevers being connected between the TSA frame and the TSA circuit board, the imaging chip assembly and the TSA circuit board being fixed to each other and electrically connected.
9. The image pickup apparatus according to claim 8, further comprising a top cover including a top plate and a clamping plate provided at an edge of the top plate, wherein the coil assembly, the imaging chip assembly, and the TSA are sandwiched between the magnet assembly and the top plate, and the clamping plate is fixed to the magnet holder.
10. An intelligent terminal comprising the image pickup apparatus according to any one of claims 1 to 9.
CN202420390880.7U 2024-02-29 2024-02-29 Camera device and intelligent terminal Active CN222283374U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202420390880.7U CN222283374U (en) 2024-02-29 2024-02-29 Camera device and intelligent terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202420390880.7U CN222283374U (en) 2024-02-29 2024-02-29 Camera device and intelligent terminal

Publications (1)

Publication Number Publication Date
CN222283374U true CN222283374U (en) 2024-12-31

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202420390880.7U Active CN222283374U (en) 2024-02-29 2024-02-29 Camera device and intelligent terminal

Country Status (1)

Country Link
CN (1) CN222283374U (en)

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