CN222245775U - Positioning type screw bottle die with cooling function - Google Patents
Positioning type screw bottle die with cooling function Download PDFInfo
- Publication number
- CN222245775U CN222245775U CN202420217275.XU CN202420217275U CN222245775U CN 222245775 U CN222245775 U CN 222245775U CN 202420217275 U CN202420217275 U CN 202420217275U CN 222245775 U CN222245775 U CN 222245775U
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- Prior art keywords
- positioning
- module
- cooling
- lower module
- base
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- 238000001816 cooling Methods 0.000 title claims abstract description 50
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 54
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000007493 shaping process Methods 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 abstract description 3
- 239000000498 cooling water Substances 0.000 description 5
- 230000003139 buffering effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000009757 thermoplastic moulding Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010104 thermoplastic forming Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses a positioning type screw bottle mold with a cooling function, which comprises a base, wherein supporting legs are fixedly arranged at the lower end of the base and provide support for the base, the mold also comprises a lower module fixedly arranged on the upper surface of the base, a mold core is arranged on the inner sides of the lower module and the upper module, an electric telescopic rod is arranged at the upper end of the base, a fixing plate is fixedly arranged at the output end of the electric telescopic rod, the upper module is fixedly arranged at the bottom of the fixing plate, the upper module and the lower module are correspondingly distributed up and down, and a positioning assembly is arranged at the bottom of the fixing plate, so that the laminating precision of the lower module and the upper module is improved through the positioning assembly. This locate mode screw bottle mould with cooling function passes through electric telescopic handle output and drives the fixed plate and move down, and when the fixed plate moved down, the locating lever of its bottom was interluded in the locating hole inboard to prevent that last module and lower module from appearing the position deviation in the compound die, promote the precision of compound die.
Description
Technical Field
The utility model relates to the technical field of dies, in particular to a positioning type screw bottle die with a cooling function.
Background
The screw bottle mould is a mould for manufacturing screw bottles, which mainly melts and flows raw materials in a heating and pressurizing mode and fills each part of a mould core so as to achieve the effect of thermoplastic molding.
A die assembly and die having application number CN 201810146714.1. The die assembly comprises a lower die base, a lower die plate, a collecting groove, a transmission assembly and a collecting container, wherein the lower die plate is arranged on the lower die base, the collecting groove is arranged on the lower die plate, and the transmission assembly is connected between the collecting groove and the collecting container.
The device collects the die-cut agent through the collecting vat, can retrain the die-cut agent and flow at will, solves the condition that punch press, ground etc. are polluted by oil, is favorable to the maintenance and the maintenance of workshop environment, reduces the maintenance time in workshop by a wide margin, practices thrift the cost, but the device does not set up location structure, very easily appears the position deviation when last module carries out the compound die with lower module to the compactness is not enough when causing the compound die, influences thermoplastic forming's effect.
Aiming at the problems, innovative design is urgently needed on the basis of the original positioning type screw bottle die structure.
Disclosure of utility model
The utility model aims to provide a positioning type screw bottle mold with a cooling function, which solves the problems that in the prior art, a positioning structure is not arranged in the positioning type screw bottle mold, and the position deviation is very easy to occur when an upper module and a lower module are matched, so that the tightness is insufficient when the upper module and the lower module are matched, and the thermoplastic molding effect is affected.
In order to achieve the purpose, the utility model provides the following technical scheme that the positioning type screw bottle mold with the cooling function comprises a base, wherein the lower end of the base is provided with supporting legs which provide support for the base;
The automatic laminating machine is characterized by further comprising a lower module fixedly arranged on the upper surface of the base, a die core is arranged on the inner sides of the lower module and the upper module, an electric telescopic rod is arranged at the upper end of the base, a fixing plate is fixedly arranged at the output end of the electric telescopic rod, the upper module is fixedly arranged at the bottom of the fixing plate, the upper module and the lower module are correspondingly distributed up and down, a positioning assembly is arranged at the bottom of the fixing plate, and the laminating precision of the lower module and the upper module is improved through the positioning assembly.
Preferably, the upper surface of the base is provided with a water storage tank, the inner side of the water storage tank is provided with a cooling assembly, and the shaping efficiency of the workpiece is improved through the cooling assembly.
Preferably, the positioning assembly comprises a positioning rod and a limiting chassis, wherein the positioning rod is fixedly arranged at the bottom of the fixed plate, two groups of positioning rods are symmetrically arranged on the middle point of the fixed plate in a left-right mode, the positioning rods and the positioning holes are correspondingly distributed up and down, the positioning holes are formed in the inner side of the lower module, and the positioning rod is inserted in the inner side of the positioning holes to position the lower module, so that the die assembly precision of the upper module and the lower module is improved.
Preferably, the outer side of the positioning rod is fixedly provided with a limiting chassis, the limiting chassis is connected with the sliding chassis through a telescopic spring, the sliding chassis is nested at the outer side of the positioning rod, and the structure has a certain buffering effect through the elasticity of the telescopic spring.
Preferably, the cooling assembly comprises a semiconductor refrigerating sheet and a circulating water pump, wherein the semiconductor refrigerating sheet is fixedly arranged on the inner side of the water storage tank, and the semiconductor refrigerating sheet is used for cooling water on the inner side of the water storage tank.
Preferably, the inner side of the water storage tank is fixedly provided with a circulating water pump, the outer side of the circulating water pump is fixedly connected with a circulating water pipe, the circulating water pipe is connected to the outer side of the cooling cavity in a penetrating way, and the structure is connected with the cooling cavity through the circulating water pipe, so that cooling water in the inner side of the water storage tank is circulated into the inner side of the cooling cavity, and a workpiece in the inner side of the die core is cooled.
Preferably, the cooling cavity is arranged on the inner side of the lower module, two groups of cooling cavities are symmetrically arranged on the left and right sides of the middle point of the lower module, and two groups of cooling cavities are symmetrically arranged on the left and right sides of the middle point of the lower module, so that the cooling efficiency of a workpiece can be improved.
Compared with the prior art, the positioning type screw bottle mold with the cooling function has the beneficial effects that:
1. The positioning structure drives the fixed plate to move downwards through the output end of the electric telescopic rod, and when the fixed plate moves downwards, the positioning rod at the bottom of the fixed plate is inserted into the inner side of the positioning hole, so that the position deviation of the upper module and the lower module is prevented when the upper module and the lower module are closed, and the precision of closing the mould is improved;
further, when the positioning rod moves downwards, the sliding chassis at the tail end of the positioning rod is extruded by the inner wall of the positioning hole to compress the telescopic spring to move towards the limiting chassis, so that a certain buffering effect is achieved through the elasticity of the telescopic spring, and damage to the lower module caused by overlarge impact force of downward movement of the fixing plate is avoided;
2. the cooling structure is used for cooling water inside the water storage tank through the semiconductor refrigerating sheet, and the cooled water is discharged from the circulating water pipe through the operation of the circulating water pump and enters the inner side of the cooling cavity, so that the cooling of a workpiece inside the die core is accelerated;
Furthermore, two ends of the circulating water pipe are respectively connected with the inner side of the water storage tank and the output end of the circulating water pump, so that cooling water in the inner side of the circulating water pipe forms a circulating state, and the effect of saving water is achieved;
Further, the cooling cavity is arranged on the left side and the right side of the die core, so that the cooling area of the workpiece on the inner side of the die core is increased, and the cooling molding efficiency is improved.
Drawings
FIG. 1 is a schematic view of the overall three-dimensional structure of the present utility model;
FIG. 2 is a schematic diagram of the overall bottom view structure of the present utility model;
FIG. 3 is an exploded view of the locating lever and locating hole of the present utility model;
FIG. 4 is an enlarged schematic view of the structure of FIG. 2A according to the present utility model;
FIG. 5 is a schematic view of a base of the present utility model;
FIG. 6 is a schematic view of a lower module in a cross-sectional view;
FIG. 7 shows a water storage tank according to the present utility model schematic of the structure in a cut-away view.
The device comprises a base, a supporting leg, a lower module, a die core, a locating hole, an electric telescopic rod, a fixing plate, an upper module, a locating rod, a limiting chassis, a telescopic spring, a sliding chassis, a water storage tank, a semiconductor refrigerating sheet, a circulating water pump, a circulating water pipe, a cooling cavity and a cooling cavity, wherein the lower module is 1, the base, the supporting leg, the lower module, the die core, the locating hole, the electric telescopic rod, the fixing plate, the upper module, the locating rod, the limiting chassis, the telescopic spring, the sliding chassis, the water storage tank, the semiconductor refrigerating sheet, the circulating water pump and the cooling cavity.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The utility model provides the following technical scheme:
The technical scheme as shown in the figures 1-3 is that a positioning type screw bottle mold with a cooling function is disclosed, wherein a base 1 is fixedly provided with supporting legs 2 at the lower end, and the supporting legs 2 provide support for the base 1;
The upper surface of the base 1 is fixedly provided with a lower module 3, the inner sides of the lower module 3 and an upper module 8 are provided with mould cores 4, the upper end of the base 1 is provided with an electric telescopic rod 6, the output end of the electric telescopic rod 6 is fixedly provided with a fixed plate 7, the bottom of the fixed plate 7 is fixedly provided with an upper module 8, the upper module 8 and the lower module 3 are correspondingly distributed up and down, the bottom of the fixed plate 7 is provided with a positioning assembly, and the lamination precision of the lower module 3 and the upper module 8 is improved through the positioning assembly;
The positioning assembly comprises a positioning rod 9 and a limiting chassis 10, the positioning rod 9 is fixedly arranged at the bottom of the fixed plate 7, two groups of positioning rods 9 are symmetrically arranged left and right relative to the midpoint of the fixed plate 7, the positioning rods 9 and the positioning holes 5 are correspondingly distributed up and down, and the positioning holes 5 are formed in the inner side of the lower module 3;
When the structure needs to mould the screw bottle raw materials, firstly pour the raw materials into the inner side of the die core 4, then operate the electric telescopic rod 6, the output end of the electric telescopic rod 6 drives the fixed plate 7 to move downwards, and when the fixed plate 7 moves downwards, the locating rod 9 at the bottom of the fixed plate can be inserted into the inner side of the locating hole 5 to locate, so that the upper module 8 and the lower module 3 are prevented from position deviation in die assembly, and the die assembly precision is improved.
In the second embodiment, different from the first embodiment, a buffering structure is added on the basis of positioning, and as shown in fig. 1-4, a limiting chassis 10 is fixedly arranged on the outer side of a positioning rod 9, the limiting chassis 10 is connected with a sliding chassis 12 through a telescopic spring 11, and the sliding chassis 12 is nested on the outer side of the positioning rod 9;
When the locating rod 9 moves downwards, the sliding chassis 12 at the tail end of the locating rod 9 is extruded by the inner wall of the locating hole 5 to compress the telescopic spring 11 to move towards the limiting chassis 10, so that a certain buffering effect is achieved through the elastic force of the telescopic spring 11, and damage to the lower module 3 caused by overlarge impact force of the downward movement of the fixing plate 7 is avoided.
In the third embodiment, different from the first embodiment, a rapid cooling structure is added on the basis of positioning, and as shown in fig. 1-2 and 5-7, a water storage tank 13 is arranged on the upper surface of a base 1, a cooling component is arranged on the inner side of the water storage tank 13, and the shaping efficiency of a workpiece is improved through the cooling component, the cooling component comprises a semiconductor refrigerating sheet 14 and a circulating water pump 15, the semiconductor refrigerating sheet 14 is fixedly arranged on the inner side of the water storage tank 13, the circulating water pump 15 is fixedly arranged on the inner side of the water storage tank 13, the outer side of the circulating water pump 15 is fixedly connected with a circulating water pipe 16, and the circulating water pipe 16 penetrates through and is connected with the outer side of a cooling cavity 17;
When the workpiece is required to be cooled, the semiconductor refrigerating piece 14 is used for cooling water inside the water storage tank 13 (the two ends of the thermocouple of the semiconductor refrigerating piece 14 are respectively used for sucking out heat and discharging heat), the cooled water is discharged from the circulating water pipe 16 through the operation of the circulating water pump 16 and enters the inner side of the cooling cavity 17, so that the cooling of the workpiece inside the die core 4 is accelerated, the temperature of the cooled water entering the inner side of the cooling cavity 17 is increased and then flows into the inner side of the water storage tank 13 through the circulating water pipe 15 for cooling, and through the structure, the water inside the water storage tank 13 continuously flows into the inner side of the cooling cavity 17 for cooling the workpiece inside the die core 4 after being cooled, so that the thermoplastic molding efficiency is accelerated.
What is not described in detail in this specification is prior art known to those skilled in the art.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420217275.XU CN222245775U (en) | 2024-01-30 | 2024-01-30 | Positioning type screw bottle die with cooling function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420217275.XU CN222245775U (en) | 2024-01-30 | 2024-01-30 | Positioning type screw bottle die with cooling function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222245775U true CN222245775U (en) | 2024-12-27 |
Family
ID=93982668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420217275.XU Active CN222245775U (en) | 2024-01-30 | 2024-01-30 | Positioning type screw bottle die with cooling function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222245775U (en) |
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2024
- 2024-01-30 CN CN202420217275.XU patent/CN222245775U/en active Active
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