CN222233619U - Ejector device, chip separation equipment - Google Patents

Abstract

The utility model discloses a pin device and a chip separation device, which relates to the technical field of semiconductor chip packaging. The pin device includes a pin assembly, an adjustment assembly, and a displacement sensor. The pin assembly includes a pin cap disposed below a placement position, and a pin piece movably connected to the pin cap. The pin cap is used to lift and absorb a blue film. The adjustment assembly includes a voice coil motor driving the pin piece. The voice coil motor drives the pin piece to move relative to the pin cap. The pin cap absorbs the blue film, and the pin is lifted to hold the chip. The pin cap absorbs the blue film downward to separate the chip from the blue film. The displacement sensor is used to detect the displacement of the pin piece driven by the voice coil motor. The displacement sensor is connected to the voice coil motor so that the voice coil motor controls the pin piece to lift the chip to the pickup position. The technical solution provided by the utility model aims to reduce the possibility of the pin being squeezed and damaged when it lifts the chip to the pickup position, and improve the success rate of picking up the chip.

Description

Thimble device and chip separating equipment

Technical Field

The utility model relates to the technical field of semiconductor chip packaging, in particular to a thimble device and chip separation equipment.

Background

With the rapid development of microelectronic technology, the integration level of semiconductor chips is continuously improved, the chip size is increasingly reduced, and the requirements on the chip manufacturing and packaging process are also increasingly strict. Chip stripping is one of the key steps in the chip manufacturing process, and directly affects chip yield and packaging quality. The traditional chip picking mode is that the ejector pin is lifted up to enable the chip to be separated from the blue film, the pick-up piece is pressed down to be in contact with the chip to pick up the chip, the strength of the pick-up head and the ejector pin when the pick-up head and the ejector pin are in contact with the chip is difficult to control, the chip is easy to damage, and the production cost is improved.

Disclosure of utility model

The utility model mainly aims to provide a thimble device, which aims to reduce the possibility of being extruded and damaged when a thimble lifts a chip to a pick-up piece and improve the success rate of picking up the chip.

In order to achieve the above object, the present utility model provides a thimble device applied to a chip separation apparatus, where the chip is mounted on a blue film, the blue film is mounted on a wafer ring, the chip separation apparatus includes a pick-up member having a pick-up position, and a carrying platform, where the pick-up member picks up the chip at the pick-up position, and the carrying platform has a placement position for placing the wafer ring, the thimble device is characterized in that the thimble device includes:

The thimble assembly comprises a thimble cap arranged below the placement position and a thimble piece movably connected with the thimble cap, and the thimble cap is used for jacking and sucking the blue film so as to separate the blue film from the wafer ring;

The adjusting assembly comprises a voice coil motor which is in driving connection with the ejector pin piece, the voice coil motor drives the ejector pin piece to move relative to the ejector pin cap so as to move to the pick-up position to abut against the chip, and the ejector pin cap adsorbs the blue film and is used for separating the chip from the blue film; and

The displacement sensor is used for detecting displacement of the voice coil motor driving the ejector pin to move, and is electrically connected with the voice coil motor, so that the voice coil motor controls the ejector pin to lift the chip to the pick-up position.

In an embodiment, the displacement sensor is configured as a grating ruler, the grating ruler comprises an encoder arranged on the thimble member and a reading head slidably connected with the encoder, the encoder follows the thimble member to move towards the pick-up position, the encoder and the reading head relatively move, and the reading head is used for detecting the displacement of the movement of the thimble member.

In an embodiment, the ejector pin member includes a needle head for lifting up and contacting the chip, and a lifting rod drivingly connected to the voice coil motor, the needle head is disposed on the lifting rod, and the encoder is disposed at an end of the lifting rod away from the needle head.

In an embodiment, the adjusting assembly further includes a first sensing element disposed on the encoder, and a first sensor for detecting the first sensing element, where the first sensing element can move along with the encoder relative to the first sensor, and pass through a detection area of the first sensor, so as to determine a zeroing position of the ejector pin.

In an embodiment, the ejector pin cap has a receiving cavity for receiving the ejector pin member, a through hole is formed in an end of the ejector pin cap facing the pick-up position, the lifting rod and the needle are both disposed in the receiving cavity, and the needle can penetrate through the through hole to lift the chip.

In an embodiment, the needles are provided in plurality, the through holes are provided in plurality, and one through hole is provided corresponding to one needle, so that the needles can pass through the through holes to jack up the chip.

In an embodiment, the adjusting assembly further comprises a rotating bearing rotatably connected with the voice coil motor, and a first motor in transmission connection with the rotating bearing, the first motor drives the rotating bearing to rotate around the axis of the thimble assembly, and the rotating bearing drives the voice coil motor to rotate around the axis, so that the plurality of needles are aligned below the pick-up position.

In an embodiment, the adjusting assembly further includes a second sensing member disposed on the rotating bearing, and a second sensor for detecting the second sensing member, where the second sensing member may rotate along with the rotating bearing and determine a zeroing position of the rotating bearing through a detection area of the rotating sensor.

In an embodiment, the adjusting assembly further comprises a first sliding seat arranged below the rotating bearing, a second motor, a second sliding seat and a third motor, the second motor is in driving connection with the first sliding seat, the third motor is in driving connection with the second sliding seat, the second sensor is arranged on the first sliding seat, the rotating bearing is arranged on the first sliding seat, the second motor drives the rotating bearing to move towards a first direction, the first sliding seat is arranged on the second sliding seat in a sliding manner, the third motor drives the second sliding seat to drive the first sliding seat to move towards a second direction, the second direction is different from the first direction, the adjusting assembly further comprises a stator, a rotor which is arranged on the stator in a sliding manner, and a fourth motor which is in driving connection with the rotor, and the third sliding seat is arranged on the rotor, and the fourth motor drives the rotor to drive the third sliding seat to move on the stator.

The utility model also proposes a chip separation device comprising:

A pick-up member having the pick-up position, the pick-up member being configured to pick up the chip at the pick-up position;

the bearing platform is provided with a placement position for placing the wafer ring;

The thimble device.

According to the technical scheme, the voice coil motor is arranged to drive the connecting ejector pin to drive the ejector pin to lift the chip to the pick-up position, the displacement sensor is arranged to detect the displacement of the ejector pin, when the ejector cap lifts the blue film to the pick-up position, the voice coil motor drives the ejector pin to move relative to the ejector pin cap to prop against the lower surface of the chip, so that the chip is clamped between the ejector pin and the pick-up member, because the voice coil motor outputs driving force of the ejector pin in proportion to input current, the voice coil motor can realize very accurate displacement control of the ejector pin, so that the ejector pin can accurately move to the pick-up position to lift the chip, the possibility of the chip being extruded and damaged is reduced, during the period, the displacement sensor continuously detects the displacement of the ejector pin under the driving of the voice coil motor, when the displacement sensor detects that the ejector pin moves towards the chip, the displacement of the ejector pin is smaller than a preset displacement value, the displacement sensor feeds back signals to the motor, so as to control the voice coil motor to drive the ejector pin to move towards the chip, so that the motor is propped against the chip, the chip is enabled to accurately move to the pick-up position, the displacement of the ejector pin is damaged when the chip is continuously detected, the displacement sensor is continuously pressed towards the chip, the chip is damaged, the displacement sensor is continuously arranged between the chip, and the chip is damaged due to the displacement sensor is continuously, and the displacement sensor is higher than the displacement sensor is arranged to the chip, and the displacement sensor is continuously arranged to the chip, and can be damaged when the displacement sensor is continuously is detected to the chip, and the displacement sensor is higher to the chip, and the displacement sensor is detected to the chip, and the chip is damaged, the production cost is saved.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of an embodiment of a thimble device according to the present utility model;

FIG. 2 is a schematic view of the thimble device of FIG. 1 from another perspective;

FIG. 3 is a schematic top view of the thimble device of FIG. 1;

FIG. 4 is a schematic view of the thimble member of FIG. 1;

FIG. 5 is a schematic view of the thimble cap of FIG. 1;

Fig. 6 is a schematic structural diagram of an embodiment of a chip separation apparatus according to the present utility model.

Reference numerals illustrate:

100. The device comprises a thimble assembly, 110, a thimble cap, 111, a containing cavity, 112, a through hole, 120, a thimble piece, 121, a jacking rod, 122, a needle head, 210, a voice coil motor, 221, a first sensing piece, 222, a first sensor, 231, a second sensing piece, 232, a second sensor, 241, a rotating bearing, 242, a first motor, 251, a first sliding seat, 252, a second motor, 261, a second sliding seat, 262, a third motor, 271, a stator, 272, a rotor, 273, a fourth motor, 300, a grating ruler, 310, an encoder, 320, a reading head, 400, a picking piece, 410, a picking position, 500, a carrying platform, 510, a placing position, 600, a wafer ring, 700, a blue film, 800 and a chip.

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, if directional indications (such as up, down, left, right, front, and rear are referred to in the embodiments of the present utility model), the directional indications are merely used to explain the relative positional relationship, movement conditions, and the like between the components in a specific posture, and if the specific posture is changed, the directional indications are correspondingly changed.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, if "and/or" and/or "are used throughout, the meaning includes three parallel schemes, for example," a and/or B "including a scheme, or B scheme, or a scheme where a and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

With the rapid development of microelectronic technology, the integration level of semiconductor chips is continuously improved, the chip size is increasingly reduced, and the requirements on the chip manufacturing and packaging process are also increasingly strict. Chip stripping is one of the key steps in the chip manufacturing process, and directly affects chip yield and packaging quality. The traditional chip picking mode is that the ejector pin is lifted up to enable the chip to be separated from the blue film, the pick-up piece is pressed down to be in contact with the chip to pick up the chip, the strength of the pick-up head and the ejector pin when the pick-up head and the ejector pin are in contact with the chip is difficult to control, the chip is easy to damage, and the processing quality of the chip is reduced. Therefore, the utility model provides the ejector pin device which aims to reduce the possibility of being extruded and damaged when the ejector pin lifts the chip to the pick-up piece and improve the success rate of picking up the chip.

Referring to fig. 1 to 3, in an embodiment of the present utility model, the ejector device is applied to a chip separating apparatus, a chip 800 is mounted on a blue film 700, the blue film 700 is mounted on a wafer ring 600, the chip separating apparatus includes a pick-up member 400 having a pick-up position 410, a carrying platform 500, the pick-up member 400 picks up the chip 800 at the pick-up position 410, the carrying platform 500 has a placing position 510 for placing the wafer ring 600, the ejector device includes an ejector assembly 100, an adjusting assembly, and a displacement sensor, the ejector assembly 100 includes an ejector cap 110 disposed below the placing position 510, and an ejector member 120 movably connected to the ejector cap 110, the ejector cap 110 is used for lifting the blue film 700 to detach the blue film 700 from the wafer ring 600, the adjusting assembly includes a voice coil motor 210 driving the ejector member 120, the voice coil motor 210 drives the ejector member 120 to move relative to the ejector cap 110 to move to the pick-up position 410 and abut the chip 800, the ejector cap 110 sucks the blue film 700 to detach the chip 800 from the wafer ring 700, the displacement sensor is used for detecting the displacement of the ejector member 120, and the displacement sensor is used for driving the voice coil motor 210 to move, and the ejector motor 210 is connected to the voice coil motor 210 to the ejector cap 110 to lift the voice coil motor 110 to lift the ejector member 120 to the voice coil 120.

In order to facilitate understanding of the scheme, the working principle of the chip 800 separating device is described first, the ejector cap 110 and the ejector pin 120 are driven by the adjusting component to move towards the blue film 700, the ejector cap 110 adsorbs the blue film 700 and lifts the blue film 700 to be separated from the wafer ring 600, the ejector pin 120 abuts against the lower surface of the chip 800, the ejector cap 110 continuously lifts the blue film 700 until the ejector pin 120 and the pick-up 400 clamp the chip 800, then the ejector cap 110 sucks the blue film 700 to move towards the lower side of the pick-up position 410, the chip 800 is separated from the blue film 700, and the pick-up 400 picks up the chip 800 for the next processing. In this process, when the ejector pin 120 lifts the chip 800 until the pick-up piece 400 picks up, the chip 800 may be damaged by extrusion due to the larger displacement of the ejector pin 120 lifting the chip 800, which causes the chip 800 to be damaged by the larger pressure between the pick-up piece 400 and the ejector pin 120, thereby reducing the success rate of picking up the chip 800 and increasing the production cost, or the pick-up piece 400 may be difficult to pick up the chip 800 due to the smaller displacement of the ejector pin 120 lifting the chip 800, thereby reducing the success rate of picking up the chip 800.

Therefore, the voice coil motor 210 is arranged to drive the ejector pin 120 to be connected with the ejector pin 120 so as to drive the ejector pin 120 to lift the chip 800 to the pick-up position 410, the displacement sensor is arranged to detect the displacement amount of the ejector pin 120, when the ejector pin cap 110 lifts the blue film 700 to the pick-up position 410, the voice coil motor 210 drives the ejector pin 120 to move relative to the ejector pin cap 110 so as to prop against the lower surface of the chip 800, the chip 800 is clamped between the ejector pin 120 and the pick-up member 400, because the output of the driving force of the voice coil motor 210 to the ejector pin 120 is proportional to the input current, the voice coil motor 210 can realize very accurate displacement control of the ejector pin 120 so as to enable the ejector pin 120 to accurately move to the pick-up position to jack up the chip, the possibility that the displacement of the ejector pin passes the pick-up position and the chip is damaged by extrusion is reduced, during the period, the displacement sensor continuously detects the displacement amount of the ejector pin 120 under the driving of the ejector pin 210, and when the displacement sensor detects that the displacement amount of the ejector pin 120 moving towards the chip 800 is smaller than a preset displacement value, the voice coil motor 210 drives the voice coil motor 210 to drive the driving force of the ejector pin 120 towards the chip 800 so as to continuously clamp the chip 800 against the chip 800, and the chip 800 by the chip 800, the chip 800 is continuously clamped between the ejector pin 800 and the chip 800 by the control element is controlled by the force by the voice coil motor 210; when the displacement sensor detects that the displacement of the ejector pin 120 moving towards the chip 800 reaches a preset displacement value, the displacement sensor feeds back a signal to the voice coil motor 210 to control the voice coil motor 210 to stop driving the ejector pin 120 to continuously lift the chip 800, so as to reduce the possibility that the voice coil motor 210 continuously drives the ejector pin 120 to lift the chip 800, resulting in the chip 800 being damaged due to larger pressure between the ejector pin 120 and the pick-up 400, the success rate of picking up the chip 800 is improved, the possibility of damaging the chip 800 by extrusion is reduced, and the production cost is saved.

Alternatively, in an embodiment, referring to fig. 2 to 4, the displacement sensor is configured as a grating scale 300, the grating scale 300 includes an encoder 310 provided on the ejector 120, and a reading head 320 slidably connected to the encoder 310, the encoder 310 moves towards the pick-up position 410 along with the ejector 120, the encoder 310 moves relative to the reading head 320, and the reading head 320 is used to detect the displacement of the movement of the ejector 120. In this way, the displacement sensor is configured as the grating ruler 300, the encoder 310 is arranged on the thimble member 120, the reading head 320 is slidably connected to the encoder 310, when the thimble member 120 is driven to move by the voice coil motor 210, the encoder 310 moves along with the thimble member 120, the reading head 320 detects the relative displacement of the reading head 320 on the encoder 310, so as to calculate the displacement of one end of the thimble member 120 far away from the voice coil motor 210 relative to the voice coil motor 210, and according to the detected displacement, the grating ruler 300 feeds back a signal to the voice coil motor 210 and controls the displacement of the voice coil motor 210 to drive the thimble member 120.

Alternatively, in another embodiment, the type of the displacement sensor may be various, and may be a laser displacement sensor, so long as the displacement of the voice coil motor 210 driving the ejector 120 can be detected, and the voice coil motor 210 is controlled to drive the ejector 120 to displace.

Optionally, in an embodiment, referring to fig. 3 to 5, the ejector 120 includes a needle 122 for lifting up the contact chip 800, and a lifting rod 121 drivingly connected to the voice coil motor 210, the needle 122 is disposed on the lifting rod 121, and the encoder 310 is disposed on an end of the lifting rod 121 away from the needle 122. In this way, the encoder 310 is arranged on the lifting rod 121, the lifting rod 121 is in driving connection with the voice coil motor 210, the voice coil motor 210 drives the ejector pin rod to move towards the direction of the chip 800, so that the encoder 310 moves along with the lifting rod 121, the reading head 320 is convenient for detecting the displacement of the encoder 310 relative to the reading head 320, the detection precision of the grating ruler 300 on the displacement of the needle 122 relative to the voice coil motor 210 is improved, and the grating ruler 300 is convenient for controlling the voice coil motor 210 to drive the needle 122 to precisely move to abut against the lower surface of the chip 800.

Alternatively, in another embodiment, the encoder 310 may be disposed in various manners, the encoder 310 may be fixed on the housing of the voice coil motor 210, the reading head 320 is disposed on the lifting rod 121, the reading head 320 moves up and down along with the lifting rod 121, and the displacement of the needle 122 relative to the voice coil motor 210 can be detected, so long as the above functions can be implemented.

Optionally, in an embodiment, the adjusting assembly further includes a first sensing element 221 disposed on the encoder 310, and a first sensor 222 for detecting the first sensing element 221, wherein the first sensing element 221 can move relative to the first sensor 222 along with the encoder 310, and is configured to determine the zeroing position of the ejector pin 120 through the detection area of the first sensor 222. When the ejector pin device is started, the position of the ejector pin member 120 may not be at the initial zero position, so that the ejector pin member 120 has a certain height value when being driven to eject the chip 800, and the voice coil motor 210 drives the ejector pin member 120 to exceed a preset displacement value, so that the chip 800 is extruded and damaged between the pick-up member 400 and the ejector pin member 120, and the pick-up success rate of the chip 800 is reduced. Therefore, the first sensor 222 and the first sensing element 221 are provided, when the voice coil motor 210 drives the ejector pin 120, the lifting rod 121 moves in the up-down direction to drive the first sensing element 221 to pass through the detection area of the first sensor 222, so as to determine the zeroing position of the ejector pin 120, enable the needle 122 to return to the initial position, reduce the possibility that the voice coil motor 210 drives the ejector pin 120 to exceed a preset displacement value, and crush and damage the chip 800.

Alternatively, in another embodiment, the structures of the first sensing element 221 and the first sensor 222 may be omitted, and the voice coil motor 210 drives the ejector pin 120 to descend through the zero scale of the encoder 310, so that the reading head 320 slides to the zero scale of the encoder 310 to determine the zeroing position of the ejector pin 120.

Optionally, in an embodiment, spike cap 110 has a receiving cavity 111 for receiving spike member 120, a through hole 112 is formed at an end of spike cap 110 facing pick-up location 410, a lifting rod 121 and a needle 122 are disposed in receiving cavity 111, and needle 122 can lift chip 800 through hole 112. In this way, the lifting rod 121 and the needle 122 are both disposed in the accommodating cavity 111, the lifting rod 121 and the needle 122 can move relative to the thimble cap 110 in the accommodating cavity 111, the needle 122 is driven by the voice coil motor 210 to pass through the through hole 112 to abut against the lower surface of the chip 800, so as to realize the relative movement of the needle 122 and the thimble cap 110, and complete the separation between the chip 800 and the blue film 700.

Optionally, in one embodiment, the needles 122 are provided in plurality, the through holes 112 are provided in plurality, and a through hole 112 is provided corresponding to one needle 122, so that the needles 122 can pass through the through holes 112 to lift the chip 800. In this way, the plurality of needles 122 are arranged, so that the ejector pin piece 120 can jack up the plurality of chips 800 simultaneously, the separation work of the plurality of chips 800 on the blue film 700 is completed, and the pick-up efficiency of the chips 800 is improved.

Alternatively, in another embodiment, the number of needles 122 may be set in a plurality of cases, and only one needle 122 may be set, so long as the function of jacking up the chip 800 is achieved.

Optionally, in an embodiment, the adjusting assembly further includes a rotating bearing 241 rotatably connected to the voice coil motor 210, and a first motor 242 drivingly connected to the rotating bearing 241, the first motor 242 driving the rotating bearing 241 to rotate about the axis of the ejector pin assembly 100, the rotating bearing 241 driving the voice coil motor 210 to rotate about the axis, so that the plurality of needles 122 are aligned under the pick-up location 410. In this way, the rotary bearing 241 is disposed under the voice coil motor 210, and the first motor 242 drives the rotary bearing 241 to drive the thimble cap 110 and the thimble member 120 to rotate, so that the needle 122 is aligned with the chip 800 under the pick-up member 400, the accuracy of the needle 122 abutting the chip 800 is improved, if the needle 122 is not aligned with the chip 800 at the pick-up position 410, the needle 122 will apply an eccentric force to the chip 800, and the chip 800 is inclined between the pick-up member 400 and the needle 122, and even separated from the pick-up member 400, the success rate of picking up the chip 800 is reduced, or the needle 122 cannot abut the chip 800, the chip 800 and the blue film 700 cannot be separated, and the efficiency and success rate of picking up the chip 800 are reduced.

Alternatively, in another embodiment, the structures of the first motor 242 and the rotating bearing 241 may be omitted to reduce development costs and weight of the thimble device.

Optionally, in an embodiment, the adjusting assembly further includes a second sensing member 231 disposed on the rotating bearing 241, and a second sensor 232 for detecting the second sensing member 231, wherein the second sensing member 231 can rotate along with the rotating bearing 241 and determine the zeroing position of the rotating bearing 241 through the detection area of the rotating sensor. When the ejector pin device is started, the position of the rotating bearing 241 on the horizontal plane may not be at the initial zero position, so that the needle 122 has a certain rotation angle when being driven to jack up the chip 800, and the needle 122 cannot be accurately aligned with the chip 800 when moving towards the chip 800, if the needle 122 is not aligned with the chip 800 at the pick-up position 410, the needle 122 will apply eccentric force to the chip 800, and the chip 800 is inclined between the pick-up piece 400 and the needle 122, and even separated from the pick-up piece 400, thereby reducing the pick-up success rate of the chip 800, or the needle 122 cannot be abutted with the chip 800, so that the chip 800 cannot be separated from the blue film 700, and reducing the pick-up efficiency and success rate of the chip 800. Therefore, the second sensor 232 and the second sensing member 231 are provided, and when the first motor 242 drives the rotating bearing 241 to rotate, the second sensing member 231 is detected via the detection area of the second sensor 232 to determine the zeroing position of the rotating bearing 241, so that the needle 122 can be accurately aligned with the chip 800, and the success rate and the efficiency of picking up the chip 800 are improved.

Optionally, in another embodiment, the structural arrangement of the second sensing element 231 and the second sensor 232 may be omitted, so as to reduce the development cost of the thimble device.

Optionally, in an embodiment, the adjusting assembly further includes a first sliding seat 251 disposed below the rotating bearing 241, a second motor 252 driving the first sliding seat 251, a second sliding seat 261, and a third motor 262 driving the second sliding seat 261, the second sensor 232 is disposed on the first sliding seat 251, the rotating bearing 241 is disposed on the first sliding seat 251, the second motor 252 drives the first sliding seat 251 to drive the rotating bearing 241 to move towards a first direction, the first sliding seat 251 is slidably disposed on the second sliding seat 261, the third motor 262 drives the second sliding seat 261 to drive the first sliding seat 251 to move towards a second direction, the second direction is different from the first direction, the adjusting assembly further includes a stator 271, a mover 272 slidably disposed on the stator 271, and a fourth motor 273 driving the mover 272, the fourth motor 273 drives the third sliding seat to move on the stator 271. In this way, the second motor 252 is set to drive the first slider 251 to move towards the first direction, so as to drive the rotary bearing 241 and the thimble assembly 100 to move towards the first direction, so as to adjust the position of the thimble assembly 100 in the first direction, the third motor 262 is set to drive the second slider 261 to move towards the second direction, so as to drive the rotary bearing 241 and the thimble assembly 100 to move towards the second direction, so as to adjust the thimble assembly 100 in the second direction, the first direction and the second direction are not in the same direction, the fourth motor 273 is set to drive the stator 271 to slide in the up-down direction of the mover 272, so as to drive the thimble assembly 100 and the rotary bearing 241 to move in the up-down direction, so as to adjust the position of the thimble assembly 100 in the up-down direction, and adjust the thimble assembly 100 in the first direction, the second direction and the up-down direction under the drive of the second motor 252, the third motor 262 and the fourth motor 273, so that the thimble cap 110 can accurately push the blue film 700, and the pick up success rate of the chip 800 is improved.

The present utility model further provides a chip separation apparatus, please refer to fig. 6, which includes a pick-up member 400, a carrying platform 500, and the foregoing ejector pin device, wherein the pick-up member 400 has a pick-up position 410, the pick-up member 400 is used for picking up a chip 800 at the pick-up position 410, the carrying platform 500 has a placement position 510 for placing a wafer ring 600, and the specific structure of the ejector pin device refers to the foregoing embodiment.

The foregoing description is only exemplary embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the present utility model.

Claims (10)

1. The utility model provides a thimble device, is applied to chip splitter, the chip is loaded in blue membrane, blue membrane is loaded in the wafer ring, chip splitter is including having picking up piece and the load-carrying platform of picking up the position, picking up the piece pick up the position pick up the platform has the position of placing that is used for placing the wafer ring, its characterized in that, thimble device includes:

The thimble assembly comprises a thimble cap arranged below the placement position and a thimble piece movably connected with the thimble cap, and the thimble cap is used for jacking and sucking the blue film so as to separate the blue film from the wafer ring;

The adjusting assembly comprises a voice coil motor which is in driving connection with the ejector pin piece, the voice coil motor drives the ejector pin piece to move relative to the ejector pin cap so as to move to the pick-up position to abut against the chip, and the ejector pin cap adsorbs the blue film and is used for separating the chip from the blue film; and

The displacement sensor is used for detecting displacement of the voice coil motor driving the ejector pin to move, and is electrically connected with the voice coil motor, so that the voice coil motor controls the ejector pin to lift the chip to the pick-up position.

2. The ejector device of claim 1, wherein the displacement sensor is configured as a grating scale comprising an encoder disposed on the ejector, and a reading head slidably coupled to the encoder, the encoder following movement of the ejector toward the pick-up position, the encoder moving relative to the reading head, the reading head being configured to detect displacement of movement of the ejector.

3. The ejector pin device of claim 2, wherein the ejector pin member comprises a pin head for lifting up and contacting the chip, and a lifting rod drivingly connected to the voice coil motor, the pin head being provided on the lifting rod, and the encoder being provided on an end of the lifting rod remote from the pin head.

4. The ejector pin device of claim 2, wherein the adjustment assembly further comprises a first sensing member disposed on the encoder and a first sensor for detecting the first sensing member, the first sensing member being movable relative to the first sensor along with the encoder and through a detection area of the first sensor for determining a return-to-zero position of the ejector pin.

5. The ejector pin device of claim 3, wherein the ejector pin cap has a receiving cavity for receiving the ejector pin member, a through hole is formed in an end of the ejector pin cap facing the pick-up position, the ejector pin and the needle are both disposed in the receiving cavity, and the needle can eject the chip through the through hole.

6. The ejector pin device of claim 5, wherein a plurality of pins are provided, a plurality of through holes are provided, and one through hole is provided corresponding to one pin, so that the pin can pass through the through hole to jack up the chip.

7. The ejector pin assembly of claim 3 wherein said adjustment assembly further comprises a rotary bearing rotatably coupled to said voice coil motor and a first motor drivingly coupled to said rotary bearing, said first motor driving said rotary bearing to rotate about an axis of said ejector pin assembly, said rotary bearing driving said voice coil motor to rotate about said axis to align said plurality of said pins below said pick-up location.

8. The ejector pin assembly of claim 7 wherein the adjustment assembly further comprises a second sensing member disposed on the pivot bearing and a second sensor for sensing the second sensing member, the second sensing member being rotatable with respect to the pivot bearing and defining a return-to-zero position of the pivot bearing via a sensing region of the second sensor.

9. The ejector pin device of claim 8, wherein the adjusting assembly further comprises a first slide seat arranged below the rotating bearing, a second motor in driving connection with the first slide seat, a second slide seat, and a third motor in driving connection with the second slide seat, the second sensor is arranged on the first slide seat, the rotating bearing is arranged on the first slide seat, the second motor drives the first slide seat to drive the rotating bearing to move towards a first direction, the first slide seat is slidably arranged on the second slide seat, the third motor drives the second slide seat to drive the first slide seat to move towards a second direction, the second direction is different from the first direction, the adjusting assembly further comprises a stator, a rotor in sliding connection with the stator, a third slide seat and a fourth motor in driving connection with the rotor, the third slide seat is arranged on the rotor, and the fourth motor drives the rotor to drive the third slide seat to move on the stator.

10. A chip separating apparatus, characterized by comprising:

A pick-up member having the pick-up position, the pick-up member being configured to pick up the chip at the pick-up position;

the bearing platform is provided with a placement position for placing the wafer ring;

the ejector pin device of any one of claims 1 to 9.