CN222192870U

CN222192870U - Cooling module

Info

Publication number: CN222192870U
Application number: CN202323650372.2U
Authority: CN
Inventors: 江加伟
Original assignee: Suzhou Yuanqiao Precision Electronics Co ltd
Current assignee: Suzhou Yuanqiao Precision Electronics Co ltd
Priority date: 2023-12-30
Filing date: 2023-12-30
Publication date: 2024-12-17
Anticipated expiration: 2033-12-30

Abstract

The utility model discloses a heat radiation module, which comprises a fan and a heat radiation assembly, wherein the fan is provided with an air outlet, the heat radiation assembly is provided with a fin group arranged at the air outlet, the fin group comprises a plurality of heat radiation fins which are sequentially arranged along a preset direction at intervals, a heat radiation channel communicated with the air outlet is formed between every two adjacent heat radiation fins, and at least part of the heat radiation fins in the fin group are obliquely arranged, so that the volume of the heat radiation channel is increased, and a plurality of airflow diffusion directions are formed in the whole fin group. The heat radiation module has novel and reasonable structure, large heat radiation area and large heat radiation channel volume, improves the heat radiation efficiency, can disperse heat, optimizes the use environment of electronic products, and ensures the working performance and the service life of the electronic products.

Description

Heat radiation module

Technical Field

The present utility model relates to heat dissipation modules, and particularly to a heat dissipation module for electronic devices.

Background

As is well known, a common problem faced by electronic products is that they must generate heat whenever they are in operation. Moreover, if the heat is not removed in time, the temperature of the electronic product itself is increased, and the performance of the electronic product is reduced or damaged. Therefore, a heat dissipation module is usually added to the electronic product.

The conventional heat dissipation module generally includes a fan, a heat absorbing plate attached to a heat generating electronic component (which belongs to a component on an electronic product), and a heat dissipation fin set connected to the heat absorbing plate through a heat conducting pipe, where the heat dissipation fin set includes two parallel mounting plates and a plurality of fins a200a vertically connected between the two mounting plates, and a heat dissipation channel a201a is formed between every two adjacent fins a200a, as shown in fig. 7. When the heat conducting tube works, the heat on the heating electronic element is conducted to the radiating fin group, and the heat is emitted to the surrounding air through the fan.

However, with the development of high speed, high frequency and integration of electronic products, the existing heat dissipation fin set cannot well and efficiently remove heat generated by the heating electronic element, so that the development requirement of the electronic products cannot be well met.

In view of this, the present utility model has been made.

Disclosure of Invention

In order to overcome the defects, the utility model provides the heat radiation module which has novel and reasonable structure, large heat radiation area and large heat radiation channel volume, improves the heat radiation efficiency, can disperse heat, optimizes the use environment of electronic products, and ensures the working performance and the service life of the electronic products.

The utility model adopts the technical scheme that the heat radiation module is used for radiating heat on electronic products and comprises the following components:

a fan provided with an air outlet;

the heat dissipation assembly is provided with a fin group arranged at the air outlet, the fin group comprises a plurality of heat dissipation fins which are sequentially arranged at intervals along a preset direction, a heat dissipation channel which is communicated with the air outlet is formed between every two adjacent heat dissipation fins, and at least part of the heat dissipation fins in the fin group are obliquely arranged, so that the volume of the heat dissipation channel is increased, and meanwhile, a plurality of airflow diffusion directions are formed in the fin group as a whole.

As a further improvement of the utility model, the fin group is also provided with two support plates which are arranged at intervals in parallel, a plurality of radiating fins are fixedly arranged between the two support plates, and one of the support plates is also fixedly connected with the air outlet.

As a further improvement of the utility model, the radiating fins are vertically or vertically obliquely arranged between the two supporting plates based on the horizontal placement state of the supporting plates.

As a further improvement of the utility model, a plurality of the heat radiation fins in the fin group are all obliquely arranged along the same direction.

As a further improvement of the present utility model, the plurality of heat dissipation fins are divided into three fin units, which are respectively defined as a first fin unit, a second fin unit and a third fin unit;

The first fin unit and the second fin unit are composed of a plurality of radiating fins obliquely arranged along the same direction, and the oblique direction of the radiating fins in the first fin unit is opposite to the oblique direction of the radiating fins in the second fin unit;

the third fin unit is arranged between the first fin unit and the second fin unit, and the third fin unit is composed of a plurality of radiating fins which are vertically arranged.

As a further improvement of the present utility model, a plurality of the heat radiation fins are integrally connected with two of the support plates.

As a further improvement of the present utility model, one of the support plates connected to the air outlet does not completely cover the plurality of heat dissipation fins.

As a further improvement of the utility model, the fan is a centrifugal fan.

As a further improvement of the present utility model, the heat dissipation assembly is further provided with a heat conduction pipe, and the heat conduction pipe is connected with the fin group and is simultaneously arranged on the fan housing.

Compared with the fins A in the prior art, the ① has the advantages that the radiating area of the radiating fins can be increased, the volume of the radiating channel is increased, the flowing air quantity is increased, and therefore the radiating efficiency of the radiating module is improved. In addition, compared with the straight forward airflow diffusion mode (heat diffusion mode) shown by the heat dissipation channel A in the prior art, the airflow (heat) flowing out of the heat dissipation channel can have a plurality of diffusion directions, so that the heat can be dispersed into the air more, the use environment of the electronic product is optimized, and the working performance and the service life of the electronic product are further ensured. ② The heat radiation module has novel, simple and reasonable structure, easy manufacture, lower manufacture cost and easy production and implementation.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation module according to the present utility model at a first view angle;

FIG. 2 is a schematic diagram of a heat dissipation module according to the present utility model at a second view angle;

Fig. 3 is a schematic perspective view of a fin set according to the present utility model;

fig. 4 is a schematic top view of a fin set according to the present utility model;

Fig. 5 is a schematic side view of a fin set according to the present utility model;

FIG. 6 is an enlarged schematic view of the portion A shown in FIG. 5;

Fig. 7 is a schematic diagram showing a comparison between a conventional heat dissipation fin layout and a heat dissipation fin layout according to the present utility model.

The following description is made with reference to the accompanying drawings:

1. The heat-dissipating device comprises a fan, 10, an air outlet, 2, a heat-dissipating component, 20, a fin group, 200, heat-dissipating fins, 201, a heat-dissipating channel, 202, a supporting plate, 21, a heat-conducting pipe, 200a, a fin A, 201a and a heat-dissipating channel A.

Detailed Description

The preferred embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.

Examples:

The embodiment provides a heat dissipation module which is used for dissipating heat on an electronic product (such as a notebook computer).

Referring to fig. 1 to 6, the heat dissipation module provided in this embodiment mainly includes a fan 1 and a heat dissipation assembly 2, wherein the fan 1 is provided with an air outlet 10, the heat dissipation assembly 2 is provided with a fin group 20 disposed at the air outlet 10, the fin group 20 includes a plurality of heat dissipation fins 200 sequentially and alternately arranged along a predetermined direction, and a heat dissipation channel 201 (also referred to as an "air volume channel") penetrating through the air outlet 10 is formed between every two adjacent heat dissipation fins 200, and particularly, at least some of the heat dissipation fins 200 in the fin group 20 are disposed obliquely, so as to increase the heat dissipation area of the heat dissipation fins 200, and at the same time, increase the volume of the heat dissipation channel 201 (even if the air volume flowing through increases), and further form a plurality of air flow (heat) diffusion directions on the fin group 20 as a whole.

As can be appreciated, referring to fig. 3 and fig. 7, compared with the fin a200a in the prior art, which is vertically disposed, the heat dissipation area of the heat dissipation fin 200 itself can be increased by designing the heat dissipation fin 200 to be inclined, so that the volume of the heat dissipation channel 201 is increased, the air volume flowing through the heat dissipation channel is increased, and the heat dissipation efficiency of the heat dissipation module is improved. In addition, compared with the straight forward airflow diffusion mode (heat diffusion mode) shown by the heat dissipation channel A201a in the prior art, the airflow (heat) flowing out of the heat dissipation channel 201 can have a plurality of diffusion directions, so that the heat can be dispersed into the air more dispersedly, the service environment of the electronic product is optimized, and the working performance and the service life of the electronic product are further ensured.

The structure of the fin group 20 in the heat dissipation module according to the present utility model is described in detail below.

First, the heat radiation fins 200 are described as being inclined.

Referring to fig. 1 to fig. 6, in the present embodiment, the fin set 20 is further provided with two spaced and parallel support plates 202, the plurality of heat dissipation fins 200 are sequentially and alternately arranged along a predetermined direction and fixedly disposed between the two support plates 202, and one of the support plates 202 is further fixedly connected to the air outlet 10.

In addition, if the support plates 202 are horizontally placed, the heat sink fins 200 may be vertically or vertically inclined between the two support plates 202.

When the heat dissipation fins 200 are disposed vertically and obliquely, the inclination direction and inclination angle thereof can be determined according to the design requirement of the product, and the utility model is not limited thereto. The following provides just a few embodiments for illustration.

For example, ① may be shown in fig. 5, in which the plurality of heat dissipation fins 200 in the fin group 20 are all inclined along the same direction, and the inclination angle of the heat dissipation fins 200 may be preferably 10 ° to 80 °, and more preferably 30 ° to 45 °.

From the above analysis, the layout manner of the heat dissipation fins 200 provided by the method ① can improve the heat dissipation efficiency of the heat dissipation module, and meanwhile, can disperse heat, optimize the use environment of the electronic product, and ensure the working performance and service life of the electronic product.

The method ② is to divide the plurality of heat dissipation fins 200 into three fin units, which are respectively defined as a first fin unit, a second fin unit and a third fin unit, wherein the first fin unit and the second fin unit are respectively composed of a plurality of heat dissipation fins 200 obliquely arranged along the same direction, the oblique direction of the heat dissipation fins 200 positioned in the first fin unit is opposite to the oblique direction of the heat dissipation fins 200 positioned in the second fin unit, the third fin unit is arranged between the first fin unit and the second fin unit, and the third fin unit is composed of a plurality of heat dissipation fins 200 vertically arranged.

It can be understood that the plurality of heat dissipation fins 200 in the first fin unit are inclined to the left and the inclination angles are the same, and the plurality of heat dissipation fins 200 in the second fin unit are inclined to the right and the inclination angles are the same. Further preferably, the heat radiation fins 200 in the first fin unit and the heat radiation fins 200 in the second fin unit may be designed to be arranged in mirror symmetry. Taking the heat dissipation fins 200 in the second fin unit as an example, the inclination angle can be preferably controlled to be 70-80 °.

As described above, the layout of the heat dissipation fins 200 provided in this manner ② may also improve the heat dissipation efficiency of the heat dissipation module, and meanwhile, may also disperse heat, optimize the use environment of the electronic product, and ensure the working performance and service life of the electronic product.

Next, the manner of forming the fin set 20 and other features are described.

In this embodiment, a plurality of the heat dissipation fins 200 are integrally connected to two support plates 202. That is, the fin group 20 is integrally formed, which is convenient for processing and assembling.

In addition, in the present embodiment, a supporting plate 202 connected to the air outlet 10 does not completely cover the plurality of heat dissipation fins 200, so that the effective volume of the heat dissipation channel 201 can be increased, and the diffusion direction of the air flow (heat) can be further expanded, so as to achieve a better heat dissipation effect.

Further, in the present embodiment, the fan 1 is a centrifugal fan. The heat dissipation assembly 2 is further provided with a heat conduction pipe 21, the heat conduction pipe 21 is connected with the fin group 20, and the heat conduction pipe 21 is further disposed on the fan 1 housing, and can be specifically referred to fig. 1 and fig. 2.

When the heat dissipation module is in operation, the heat conduction tube 21 can conduct heat on the heat-generating electronic component of the electronic product to the fin group 20, and the heat is dissipated to the surrounding air through the fan 1.

In conclusion, the heat radiation module has novel and reasonable structure, large heat radiation area and large heat radiation channel volume, improves the heat radiation efficiency, can disperse heat, optimizes the use environment of electronic products, and ensures the working performance and the service life of the electronic products.

In the above description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The foregoing description is only of a preferred embodiment of the utility model, which can be practiced in many other ways than as described herein, so that the utility model is not limited to the specific implementations disclosed above. While the foregoing disclosure has been described with reference to certain embodiments, it will be understood by those skilled in the art that various changes and modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. Any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present utility model without departing from the technical solution of the present utility model still falls within the scope of the technical solution of the present utility model.

Claims

1. A heat dissipation module, used for heat dissipation of electronic products; characterized in that it comprises:

A fan (1) provided with an air outlet (10);

A heat dissipation component (2), comprising a fin group (20) arranged at the air outlet (10); the fin group (20) comprises a plurality of heat dissipation fins (200) arranged in sequence and at intervals along a predetermined direction, and a heat dissipation channel (201) communicating with the air outlet (10) is formed between each two adjacent heat dissipation fins (200);

In addition, at least part of the heat dissipation fins (200) in the fin group (20) are arranged at an angle, so that the volume of the heat dissipation channel (201) is increased, and at the same time, the fin group (20) as a whole is formed with multiple airflow diffusion directions.

2. The heat dissipation module according to claim 1 is characterized in that: the fin group (20) is also provided with two support plates (202) spaced apart and arranged in parallel, a plurality of the heat dissipation fins (200) are fixedly arranged between the two support plates (202), and one of the support plates (202) is also fixedly connected to the air outlet (10).

3. The heat dissipation module according to claim 2 is characterized in that: based on the horizontal placement state of the support plate (202), the heat dissipation fins (200) are vertically perpendicular or vertically inclined and arranged between the two support plates (202).

4. The heat dissipation module according to claim 3, characterized in that: the plurality of heat dissipation fins (200) in the fin group (20) are all arranged to be inclined in the same direction.

5. The heat dissipation module according to claim 3, characterized in that: the plurality of heat dissipation fins (200) are divided into three fin units, which are respectively defined as: a first fin unit, a second fin unit and a third fin unit;

Wherein, the first fin unit and the second fin unit are both composed of a plurality of heat dissipation fins (200) arranged obliquely in the same direction, and the inclination direction of the heat dissipation fins (200) located in the first fin unit is opposite to the inclination direction of the heat dissipation fins (200) located in the second fin unit;

The third fin unit is arranged between the first fin unit and the second fin unit, and the third fin unit is composed of a plurality of the heat dissipation fins (200) arranged vertically.

6. The heat dissipation module according to claim 2, characterized in that: a plurality of the heat dissipation fins (200) are integrally connected to the two support plates (202).

7. The heat dissipation module according to claim 2, characterized in that: the support plate (202) connected to the air outlet (10) does not completely cover the plurality of heat dissipation fins (200).

8. The heat dissipation module according to claim 1, characterized in that the fan (1) is a centrifugal fan.

9. The heat dissipation module according to claim 1, characterized in that: the heat dissipation component (2) is also provided with a heat pipe (21), the heat pipe (21) is connected to the fin group (20) and is also arranged on the casing of the fan (1).