CN222190671U - Silicon wafer separation device - Google Patents

Abstract

The utility model provides a silicon wafer separation device, characterized in that it includes: a wafer stage, which is used to carry a silicon wafer group, wherein the silicon wafer group includes multiple silicon wafers stacked vertically; a lifting component, which can drive the wafer stage to lift; a limit component, which is used to limit the horizontal movement of the silicon wafer; an adsorption component, which includes a vibrator and a suction cup, wherein the suction cup can be lifted and lowered above the wafer stage, the suction cup can adsorb the silicon wafer, and the vibrator can drive the suction cup to vibrate. The present application can separate silicon wafers that are adhered to each other, thereby achieving the effect of taking a single silicon wafer.

Description

Silicon chip separation device

Technical Field

The utility model relates to the field of semiconductor production technology, in particular to a silicon wafer separating device.

Background

Silicon wafers are a thin, flat, round silicon matrix material commonly used in the fabrication of integrated circuits and other semiconductor devices, one of the most common substrate materials in the semiconductor industry.

In the related art, a plurality of silicon wafers before testing are often placed in a stacked form for ease of handling. However, due to the influence of the previous process of the silicon wafers, the flatness of the silicon wafers is higher, so that the frequency of adhesion phenomenon between the stacked silicon wafers is higher, and when the silicon wafers stacked on the top are taken, a plurality of silicon wafers are taken together at one time easily due to the adhesion phenomenon, and the normal production of equipment is influenced.

Disclosure of utility model

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides the silicon wafer separating device which has the effect of separating the silicon wafers which are adhered to each other and taking a single silicon wafer.

The utility model provides a silicon wafer separating device which is characterized by comprising a slide holder, a lifting assembly, a limiting assembly and an adsorption assembly, wherein the slide holder is used for bearing a silicon wafer group, the silicon wafer group comprises a plurality of vertically stacked silicon wafers, the lifting assembly can drive the slide holder to lift, the limiting assembly is used for limiting horizontal movement of the silicon wafers, the adsorption assembly comprises a vibrating piece and a sucker, the sucker is arranged above the slide holder in a lifting mode, the sucker can adsorb the silicon wafers, and the vibrating piece can drive the sucker to vibrate.

According to the silicon wafer separating device, when the sucking disc needs to adsorb the silicon wafers, the lifting assembly drives the carrying platform to lift, and the limiting assembly limits the horizontal movement of the silicon wafers, so that the sucking disc descends to adsorb the silicon wafers, the sucking disc easily takes a plurality of silicon wafers at one time due to the fact that adhesion phenomenon is easy to occur between the silicon wafers, at the moment, vibration force is generated through the vibrating piece to drive the sucking disc to vibrate, and therefore the adhesion force between the two silicon wafers is influenced by the vibration force to be reduced, redundant silicon wafers in the adsorbed silicon wafers fall back into the silicon wafer group, the problem that the plurality of silicon wafers are easily taken at one time due to the adhesion phenomenon is solved.

According to some embodiments of the utility model, the silicon wafer separating device comprises a fixing plate which is vertically arranged, the lifting assembly is arranged on the fixing plate, the lifting assembly comprises a sliding rail, a sliding plate, a driving motor and a screw rod, the sliding rail is vertically arranged on one side of the fixing plate, the sliding plate is in sliding fit with the sliding rail, the driving motor is arranged at the bottom of the sliding rail, the screw rod is vertically arranged, the bottom of the screw rod is fixedly connected to the output end of the driving motor, a screw hole is formed in the sliding plate, the screw rod is in threaded fit with the screw hole, and one side of the slide holder is fixedly connected to the sliding plate.

According to some embodiments of the utility model, a supporting frame is arranged on the fixing plate, a supporting plate is arranged on one side of the sliding plate, the supporting plate is positioned below the carrying platform, the limiting component is borne on the supporting plate and comprises an elastic piece and a plurality of limiting rods, the elastic piece is borne on the supporting plate, the limiting rods are distributed at intervals along the circumferential direction of the silicon wafer, the limiting rods are vertically arranged, a plurality of waist-shaped holes are formed in the carrying platform and are respectively in one-to-one correspondence with the limiting rods, the waist-shaped holes are formed in the radial direction of the silicon wafer, the bottom ends of the limiting rods are supported by the elastic piece, the top ends of the limiting rods penetrate through the waist-shaped holes and vertically extend upwards, and the elastic piece can drive the limiting rods to be close to or far away from the silicon wafer group along the length direction of the waist-shaped holes.

According to some embodiments of the utility model, the elastic member comprises a clamping jaw cylinder and a plurality of transmission rods, the clamping jaw cylinder is arranged on the supporting plate, the transmission rods are respectively in one-to-one correspondence with the limiting rods, one end of each transmission rod is connected with the clamping jaw cylinder, the other end of each transmission rod is connected with the limiting rod, and the clamping jaw cylinder can drive the plurality of transmission rods to expand or contract.

According to some embodiments of the utility model, the suction assembly comprises a lifting member for lifting the suction cup.

According to some embodiments of the utility model, the lifting member comprises a cylinder and a switching seat, the cylinder is fixedly connected to the fixed plate through a connecting frame, one side of the switching seat is connected to the cylinder, the cylinder can drive the switching seat to lift, the sucker is movably arranged at the bottom of the switching seat, and the vibrating member is arranged between the switching seat and the sucker.

According to some embodiments of the utility model, the vibrating element comprises a guiding rod, a limiting plate, a vibrating motor and an elastic element, wherein the limiting plate is movably arranged above the adapter seat, a through hole is formed in the top of the adapter seat in a penetrating manner, the bottom end of the guiding rod is fixedly connected with the sucker, the other end of the guiding rod penetrates through the through hole and is fixedly connected with the limiting plate, the elastic element is positioned between the adapter seat and the sucker, the elastic element provides elasticity for the limiting plate to be tightly pressed on the adapter seat, a containing groove is formed in the top of the sucker, and the vibrating motor is embedded in the containing groove.

According to some embodiments of the utility model, the elastic member comprises a spring, the spring is sleeved outside the guide rod, one end of the spring is abutted against the adapter, and the other end of the spring is abutted against the sucker.

According to some embodiments of the utility model, the suction cup is provided with a capacitive sensor.

According to some embodiments of the utility model, a plurality of blowing pieces are arranged on the supporting plate, the blowing pieces are distributed along the circumferential direction of the silicon wafers, and the blowing pieces are used for blowing air between two adjacent silicon wafers.

Drawings

FIG. 1 is a schematic overall structure of an embodiment of the present application;

FIG. 2 is a schematic view of a lifting assembly according to an embodiment of the present application;

FIG. 3 is a schematic view of a limiting assembly according to an embodiment of the present application;

FIG. 4 is a schematic diagram of an adsorption module according to an embodiment of the present application.

The reference numerals comprise 100 parts of fixing plates, 200 parts of carrying platforms, 300 parts of silicon wafer groups, 310 parts of silicon wafers, 410 parts of driving motors, 420 parts of sliding rails, 430 parts of sliding plates, 440 parts of screw rods, 500 parts of supporting plates, 611 parts of clamping jaw cylinders, 612 parts of transmission rods, 620 parts of limiting rods, 630 parts of waist-shaped holes, 700 parts of adsorption components, 710 parts of sucking discs, 721 parts of air cylinders, 722 parts of switching seats, 731 parts of guide rods, 732 parts of limiting plates, 733 parts of vibrating motors, 7341 parts of springs, 735 parts of punching holes, 736 parts of containing grooves. 740. 810, an air tap, 820 and a support.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, the description of the first and second is only for the purpose of distinguishing technical features, and should not be construed as indicating or implying relative importance or implying the number of technical features indicated or the precedence of the technical features indicated.

In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.

The application is described in further detail below in connection with fig. 1-4.

Referring to fig. 1 and 2, a silicon wafer separating device provided by an embodiment of the present utility model includes a fixing plate 100 and a carrier 200, where the carrier 200 is carried on the fixing plate 100, the carrier 200 is used to carry a silicon wafer group 300, and the silicon wafer group 300 includes a plurality of stacked silicon wafers 310.

It will be appreciated that in some embodiments of the present utility model, referring to fig. 1 and 2, a lifting assembly for lifting the stage 200 is provided on the fixing plate 100. Specifically, the lifting assembly comprises a driving motor 410, a sliding rail 420, a sliding plate 430 and a screw rod 440, wherein the sliding rail 420 is vertically arranged on one side of the fixed plate 100, the sliding plate 430 is in sliding fit with the sliding rail 420, the driving motor 410 is arranged at the bottom of the sliding rail 420, the screw rod 440 is vertically arranged, and the bottom of the screw rod 440 is fixedly connected with the output end of the driving motor 410. Screw holes are formed in the sliding plate 430, the screw rod 440 is in threaded fit with the screw holes, one side of the slide holder 200 is fixedly connected to the sliding plate 430, the screw rod 440 is driven to rotate through the driving motor 410, and the sliding plate 430 is driven to slide relative to the sliding rail 420 through threaded fit of the screw rod 440 and the screw holes, so that the slide holder 200 is driven to lift, and the silicon wafer group 300 is driven to lift.

It will be appreciated that in some embodiments of the present utility model, referring to fig. 2 and 3, a support plate 500 is provided on one side of the slide plate 430, the support plate 500 is located below the stage 200, and a limit assembly is provided on the support plate 500 for limiting the horizontal movement of the silicon wafer 310.

It can be appreciated that, in some embodiments of the present utility model, referring to fig. 2 and 3, the limiting assembly includes an elastic member and a plurality of limiting rods 620, the elastic member is carried on the supporting plate 500, the plurality of limiting rods 620 are distributed along the circumferential direction of the silicon wafer 310 at intervals, the limiting rods 620 are vertically disposed, the stage 200 is provided with a plurality of waist-shaped holes 630, the plurality of waist-shaped holes 630 are respectively in one-to-one correspondence with the plurality of limiting rods 620, the waist-shaped holes 630 are radially provided with the silicon wafer 310, the bottom ends of the limiting rods 620 are supported by the elastic member, the top ends of the limiting rods 620 pass through the waist-shaped holes 630 and vertically extend upwards, and the elastic member can simultaneously drive the plurality of limiting rods 620 to approach or separate from the silicon wafer group 300 along the length direction of the waist-shaped holes 630, so that when the silicon wafer group 300 is placed on the stage 200, the plurality of limiting rods 620 are driven to approach the silicon wafer group 300 along the length direction of the waist-shaped holes 630 by the elastic member, so as to limit the horizontal movement of the silicon wafer 310. In some embodiments, three stop bars 620 are provided, and the three stop bars 620 are arranged in a triangular configuration with respect to the silicon wafer 310 to limit the horizontal movement of the silicon wafer 310.

It can be appreciated that, in some embodiments of the present utility model, referring to fig. 2 and 3, the elastic member includes a clamping jaw cylinder 611 and a plurality of transmission rods 612, the clamping jaw cylinder 611 is disposed on the supporting plate 500, the plurality of transmission rods 612 are respectively in one-to-one correspondence with the plurality of limiting rods 620, one end of each transmission rod 612 is connected to the clamping jaw cylinder 611, and the other end is connected to the limiting rod 620, when the plurality of limiting rods 620 need to move, the clamping jaw cylinder 611 can drive the plurality of transmission rods 612 to expand or contract, so that the limiting rods 620 are far away from or near the silicon wafer group 300 along the length direction of the waist-shaped hole 630.

It will be appreciated that in some embodiments of the present utility model, referring to fig. 2 and 4, the silicon wafer separating apparatus further includes an adsorption assembly 700, where the adsorption assembly 700 is configured to adsorb the silicon wafers 310 on top of the silicon wafer group 300, so as to take the silicon wafers 310, and enable detachment of the bonded silicon wafers 310 in the taken silicon wafers 310. Specifically, the adsorption assembly 700 includes a suction cup 710, a lifting member, and a vibration member, wherein the suction cup 710 can adsorb the silicon wafer 310, and the vibration member can generate a vibration force to drive the suction cup 710 to vibrate. The lifting member is used for driving the suction cup 710 to lift, and the suction cup 710 is located above the slide table 200.

It can be understood that in some embodiments of the present utility model, referring to fig. 2 and 4, the lifting member includes an air cylinder 721 and an adapter 722, the air cylinder 721 is fixedly connected to the fixing plate 100 through a connecting frame, one side of the adapter 722 is connected to the air cylinder 721, the air cylinder 721 can drive the adapter 722 to lift, the suction cup 710 is movably disposed at the bottom of the adapter 722, and the vibrating member is disposed between the adapter 722 and the suction cup 710, so that when the suction cup 710 needs to adsorb the silicon wafer 310, the suction cup 710 is driven to descend above the silicon wafer set 300 by the air cylinder 721 to adsorb the silicon wafer 310, and the suction cup 710 is easy to take the silicon wafers 310 together at one time due to the easy occurrence of the adhesion phenomenon between the silicon wafers 310, and at this time, the vibrating member can generate a vibrating force to drive the suction cup 710 to vibrate, so that the adhesion force between the two silicon wafers 310 is affected by the vibrating force to reduce the redundant silicon wafers 310 in the adsorbed silicon wafer 310 to drop back into the silicon wafer set 300, thereby realizing the taking of the silicon wafer 310.

It can be understood that, in some embodiments of the present utility model, referring to fig. 2 and 4, the vibrating member includes a guiding rod 731, a limiting plate 732, a vibrating motor 733 and an elastic member, the limiting plate 732 is movably disposed above the adapter 722, a through hole 735 is formed through the top of the adapter 722, the bottom end of the guiding rod 731 is fixedly connected to the suction cup 710, and the other end of the guiding rod 731 passes through the through hole 735 and is fixedly connected to the limiting plate 732, so that the suction cup 710 is hung on the adapter 722 under the limitation of the limiting plate 732. The elastic member is located between the adapter 722 and the suction cup 710, and the elastic member provides an elastic force for the limiting plate 732 to compress against the adapter 722, so that when the suction cup 710 receives a vibration force, a part of the vibration force can be counteracted by the elastic member, and the suction cup 710 is more stable. The top of the sucker 710 is provided with a containing groove, the vibrating motor 733 is embedded in the containing groove, when a plurality of silicon wafers 310 are required to be separated, vibrating force is generated through the vibrating motor 733 to drive the sucker 710 to vibrate, so that the adhesion force between the two silicon wafers 310 is affected by the vibrating force to be reduced, redundant silicon wafers 310 in the adsorbed silicon wafers 310 fall back into the silicon wafer group 300, and the single silicon wafers 310 are taken.

It can be appreciated that, in some embodiments of the present utility model, referring to fig. 2 and 4, the elastic member includes a spring 7341, the spring 7341 is sleeved outside the guide rod 731, one end of the spring 7341 is abutted against the adapter 722, and the other end is abutted against the suction cup 710, when the spring 7341 is disposed between the adapter 722 and the suction cup 710, the spring 7341 is in a compressed state, so that the spring 7341 always applies pressure to the suction cup 710, so that part of the vibration force can be counteracted by the spring 7341 when the suction cup 710 is subjected to the vibration force, and the suction cup 710 is more stable.

It can be appreciated that in some embodiments of the present utility model, referring to fig. 2 and 4, the chuck 710 is provided with a capacitance sensor, and the controller controls the driving of the cylinder 721 by the capacitance change of the capacitance sensor to transmit the sensing signal to the controller, so as to control the distance between the chuck 710 and the wafer group 300, and further reduce the damage to the wafer 310 caused by the pressing of the wafer group 300 when the chuck 710 descends.

It will be appreciated that in some embodiments of the present utility model, referring to fig. 2, a plurality of air blowing members are provided on the support plate 500, the plurality of air blowing members being distributed along the circumferential direction of the silicon wafers 310, and the air blowing members being used to blow air between two adjacent silicon wafers 310. Specifically, the air blowing member includes an air tap, a plurality of supports are vertically arranged on the supporting plate 500, the plurality of supports are distributed along the circumferential direction of the silicon wafer 310, the plurality of air taps are respectively in one-to-one correspondence with the plurality of supports, and the air tap is used for injecting air between two adjacent silicon wafers 310 so as to further assist the vibration motor 733 to increase the gap between the two silicon wafers 310, thereby improving the separation rate of the two silicon wafers 310 and further improving the success rate and the efficiency of the sucking disc 710 for sucking the single silicon wafer 310.

The application has the implementation principle that when the sucker 710 needs to adsorb the silicon wafer 310, the driving motor 410 drives the screw rod 440 to rotate, and the screw rod 440 is matched with the screw thread of the screw hole to drive the sliding plate 430 to slide relative to the sliding rail 420, so that the slide holder 200 is driven to rise to drive the silicon wafer group 300 to rise. At this time, the suction cup 710 is driven by the air cylinder 721 to descend above the silicon wafer group 300 to adsorb the silicon wafers 310, and since the adhesion phenomenon easily occurs between the silicon wafers 310, the suction cup 710 easily and jointly takes the silicon wafers 310 at one time, and at this time, vibration force can be generated by the vibration motor 733 to drive the suction cup 710 to vibrate, so that the adhesion force between the two silicon wafers 310 is affected by the vibration force to be reduced, and the redundant silicon wafers 310 in the adsorbed silicon wafers 310 fall back into the silicon wafer group 300, so that the problem that the silicon wafers 310 are easily and jointly taken at one time due to the adhesion phenomenon is solved.

The above embodiments are not intended to limit the scope of the application, so that the equivalent changes of the structure, shape and principle of the application are covered by the scope of the application.

Claims (10)

1. A silicon wafer separating apparatus, comprising:

A carrier (200) for carrying a silicon wafer group (300), the silicon wafer group (300) comprising a plurality of vertically stacked silicon wafers (310);

The lifting assembly can drive the slide holder (200) to lift;

A limit assembly for limiting horizontal movement of the silicon wafer (310);

The adsorption component (700) comprises a vibrating piece and a sucker (710), wherein the sucker (710) is arranged above the slide holder (200) in a lifting mode, the sucker (710) can adsorb the silicon wafer (310), and the vibrating piece can drive the sucker (710) to vibrate.

2. The silicon wafer separating device according to claim 1, wherein the silicon wafer separating device comprises a fixing plate (100) which is vertically arranged, the lifting assembly is arranged on the fixing plate (100), the lifting assembly comprises a sliding rail (420), a sliding plate (430), a driving motor (410) and a screw rod (440), the sliding rail (420) is vertically arranged on one side of the fixing plate (100), the sliding plate (430) is in sliding fit with the sliding rail (420), the driving motor (410) is arranged at the bottom of the sliding rail (420), the screw rod (440) is vertically arranged, the bottom of the screw rod (440) is fixedly connected to the output end of the driving motor (410), a screw hole is formed in the sliding plate (430), the screw rod (440) is in threaded fit with the screw hole, and one side of the slide holder (200) is fixedly connected to the sliding plate (430).

3. The silicon wafer separating device according to claim 2, wherein a supporting plate (500) is arranged on one side of the sliding plate (430), the supporting plate (500) is located below the carrying platform (200), the limiting component is carried on the supporting plate (500), the limiting component comprises an elastic piece and a plurality of limiting rods (620), the elastic piece is carried on the supporting plate (500), the limiting rods (620) are distributed at intervals along the circumferential direction of the silicon wafer (310), the limiting rods (620) are vertically arranged, the carrying platform (200) is provided with a plurality of waist-shaped holes (630), the waist-shaped holes (630) are respectively in one-to-one correspondence with the limiting rods (620), the waist-shaped holes (630) are formed along the radial direction of the silicon wafer (310), the bottom ends of the limiting rods (620) are supported through the elastic piece, the top ends of the limiting rods (620) penetrate through the waist-shaped holes (630) and vertically extend upwards, and the elastic piece can drive the waist-shaped rods (620) to be simultaneously far away from the silicon wafer (300) along the length direction of the waist-shaped holes (630).

4. The silicon wafer separating device as set forth in claim 3, wherein the elastic member comprises a clamping jaw cylinder (611) and a plurality of transmission rods (612), the clamping jaw cylinder (611) is disposed on the supporting plate (500), the plurality of transmission rods (612) are respectively in one-to-one correspondence with the plurality of limit rods (620), one end of each transmission rod (612) is connected with the clamping jaw cylinder (611), the other end is connected with the limit rod (620), and the clamping jaw cylinder (611) can drive the plurality of transmission rods (612) to expand or contract.

5. The silicon wafer separating apparatus as set forth in claim 2 wherein the suction assembly (700) comprises a lifting member for lifting the suction cup (710).

6. The silicon wafer separating device of claim 5, wherein the lifting member comprises an air cylinder (721) and an adapter seat (722), the air cylinder (721) is fixedly connected to the fixed plate (100) through a connecting frame, one side of the adapter seat (722) is connected to the air cylinder (721), the air cylinder (721) can drive the adapter seat (722) to lift, the sucker (710) is movably arranged at the bottom of the adapter seat (722), and the vibrating member is arranged between the adapter seat (722) and the sucker (710).

7. The silicon wafer separating device of claim 6, wherein the vibrating member comprises a guide rod (731), a limiting plate (732), a vibrating motor (733) and an elastic member, the limiting plate (732) is movably arranged above the adapter seat (722), a through hole (735) is formed in the top of the adapter seat (722) in a penetrating mode, the bottom end of the guide rod (731) is fixedly connected to the sucker (710), the other end of the guide rod passes through the through hole (735) and is fixedly connected with the limiting plate (732), the elastic member is located between the adapter seat (722) and the sucker (710), the limiting plate (732) is tightly pressed on the adapter seat (722) to provide elasticity, a containing groove is formed in the top of the sucker (710), and the vibrating motor (733) is embedded in the containing groove.

8. The silicon wafer separating device as set forth in claim 7, wherein the elastic member comprises a spring (7341), the spring (7341) is sleeved outside the guide rod (731), one end of the spring (7341) is abutted against the adaptor (722), and the other end is abutted against the suction cup (710).

9. The silicon wafer separating device according to claim 1, wherein the suction cup (710) is provided with a capacitance sensor.

10. The silicon wafer separating device as set forth in claim 3, wherein a plurality of air blowing members are provided on the supporting plate (500), the plurality of air blowing members are distributed along the circumferential direction of the silicon wafer (310), and the air blowing members are used for blowing air between two adjacent silicon wafers (310).