CN222160053U - Acrylic adhesive tape with low thermal resistance - Google Patents

Abstract

The utility model relates to the technical field of adhesive tapes, in particular to an acrylic adhesive tape with low thermal resistance. The adhesive tape mainly aims at the problems that the acrylic adhesive tape is high in thermal resistance and is not beneficial to heat dissipation at a bonding position and possibly causes overheat damage of equipment, and the adhesive tape comprises a main body, wherein the main body comprises a back adhesive layer, release paper is arranged on one side of the back adhesive layer, and a heat dissipation mechanism for heat dissipation is arranged on one side of the back adhesive layer away from the release paper. The utility model has good adhesiveness and weather resistance, can effectively transfer heat, improves heat dissipation efficiency, and prevents equipment from being overheated and damaged.

Description

Acrylic adhesive tape with low thermal resistance

Technical Field

The utility model relates to the technical field of adhesive tapes, in particular to an acrylic adhesive tape with low thermal resistance.

Background

The acrylic adhesive tape has the effects of water resistance, shock absorption, heat resistance, sound insulation and the like, has the characteristics of strong adhesive force and good weather resistance, is easy to die cut, and has good adhesion to difficult-to-adhere surfaces such as plastic, metal, wood, paper, organosilicon and the like. However, when the adhesive is used on some electronic products, the thermal resistance is high, so that the heat dissipation at the bonding position is not facilitated, and the equipment can be overheated and damaged. In view of the above, the present utility model provides an acrylic adhesive tape with low thermal resistance.

Disclosure of utility model

The utility model aims to provide an acrylic adhesive tape with low thermal resistance, aiming at the problems that the acrylic adhesive tape has high thermal resistance, is not beneficial to heat dissipation at a bonding position and is likely to cause overheat damage of equipment in the background technology.

The technical scheme of the utility model is that the acrylic adhesive tape with low thermal resistance comprises a main body, a wrapping layer and a protective layer, wherein the main body comprises a back adhesive layer, release paper is arranged on one side of the back adhesive layer, the wrapping layer is arranged on one side of the back adhesive layer, which is far away from the release paper, and the protective layer is connected to one side of the wrapping layer, which is far away from the back adhesive layer;

The heat dissipation mechanism is used for radiating, the heat dissipation mechanism sets up in the gum layer and keeps away from type paper one side, the heat dissipation mechanism includes the multiunit mounting groove of seting up in the gum layer, install the contact layer in the mounting groove, the contact layer is including setting up the heat absorption piece in the mounting groove, the heat conduction board with heat absorption piece fixed connection is still installed to one side that the heat absorption piece kept away from type paper, the heat conduction board is located the gum layer and keeps away from type paper one side, the heat dissipation mechanism still includes heat-absorbing layer, transition layer, heat dissipation layer, the heat-absorbing layer sets up in the contact layer and keeps away from type paper one side, the transition layer sets up in the heat-absorbing layer and keeps away from contact layer one side, heat-absorbing layer, transition layer, heat dissipation layer are all installed between gum layer and inoxidizing coating, the heat dissipation mechanism is still including setting up multiunit heat dissipation micropore on the inoxidizing coating, heat dissipation micropore equidistance distributes.

Optionally, one side of the contact layer is embedded in the heat sink layer.

Optionally, the heat dissipation mechanism further includes a first bonding layer, a second bonding layer, and a third bonding layer, the first bonding layer is disposed between the heat absorption layer and the transition layer, the second bonding layer is disposed between the transition layer and the heat dissipation layer, and the third bonding layer is disposed between the third bonding layer and the protection layer.

Optionally, the contact layer and the heat absorption layer are both made of pure copper material, the transition layer is made of silicon nitride material, and the heat dissipation layer is made of graphene material.

Optionally, the wrapping layer and the protective layer are both made of acrylic materials.

Compared with the prior art, the utility model has the following beneficial technical effects:

According to the utility model, the main body can be stuck through the arrangement of the back adhesive layer, and meanwhile, the main body has good adhesiveness and weather resistance, and meanwhile, through the arrangement of the release paper, the good adhesiveness of the back adhesive layer is ensured before the back adhesive layer is stuck;

Furthermore, through the arrangement of the heat absorption layer, the transition layer and the heat dissipation layer, the thermal resistance of the heat absorption layer, the transition layer and the heat dissipation layer is sequentially reduced, so that the heat at the pasting position is conveniently discharged, the conduction and the heat dissipation are facilitated, the performance and the reliability of the equipment are improved, and the equipment is protected from being damaged by overheating;

In conclusion, the utility model has good adhesiveness and weather resistance, can effectively transfer heat, improves heat dissipation efficiency, and prevents equipment from being overheated and damaged.

Drawings

FIG. 1 is a schematic structural view of an acrylic tape with low thermal resistance;

fig. 2 is a schematic exploded view of the main body.

Reference numerals:

1. The adhesive comprises a main body, an adhesive backing layer, 12 release paper, 13 a wrapping layer, 14 and a protective layer;

2. A heat dissipation mechanism; 21, mounting grooves, 22, contact layers, 221, heat absorption blocks, 222, heat conduction plates, 23, heat absorption layers, 231, a first bonding layer, 24, a transition layer, 241, a second bonding layer, 25, a heat dissipation layer, 251, a third bonding layer and 26, heat dissipation micropores.

Detailed Description

The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown.

The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model.

All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Examples

As shown in fig. 1, the acrylic adhesive tape with low thermal resistance provided by the utility model comprises a main body 1, wherein the main body 1 comprises a back adhesive layer 11, and the back adhesive layer 11 enables the whole main body 1 to be attachable and has good adhesion. The release paper 12 is arranged on one side of the back adhesive layer 11, and the release paper 12 is used for preventing foreign matters from adhering to the upper surface of the back adhesive layer 11 before the back adhesive layer is adhered to the back adhesive layer, so that the adhesion of the back adhesive layer is affected. The main body 1 further comprises a wrapping layer 13 arranged on one side, far away from the release paper 12, of the back adhesive layer 11, a protective layer 14 is further connected to one side, far away from the back adhesive layer 11, of the wrapping layer 13, and the wrapping layer 13 and the protective layer 14 are used for fixing the inside and playing a certain role in protection. The wrapping layer 13 and the protective layer 14 are made of acrylic materials, so that the appearance is good in weather resistance, and the anti-aging protective layer is not easy to age, decompose and deform.

Further, referring to fig. 2, the adhesive tape further includes a heat dissipation mechanism 2 for dissipating heat, where the heat dissipation mechanism 2 is disposed on a side of the backing adhesive layer 11 away from the release paper 12. The heat dissipation mechanism 2 comprises a plurality of groups of mounting grooves 21 formed in the back adhesive layer 11, wherein the mounting grooves 21 are formed in equal intervals and are uniformly distributed. The contact layer 22 is mounted in the mounting groove 21, and the contact layer 22 is used for conducting heat in contact with an object. The contact layer 22 includes a heat absorbing block 221 provided in the mounting groove 21, and the heat absorbing block 221 is attached to the object as much as possible, so that heat of the object is conducted to the heat absorbing block 221. The heat conducting plate 222 fixedly connected with the heat absorbing block 221 is further arranged on one side, away from the release paper 12, of the heat absorbing block 221, the heat conducting plate 222 is located on one side, away from the release paper 12, of the back adhesive layer 11, and the heat conducting plate 222 is used for enlarging the contact area and facilitating heat transfer. The heat dissipation mechanism 2 further comprises a heat absorption layer 23, a transition layer 24 and a heat dissipation layer 25, wherein the heat absorption layer 23 is arranged on one side, far away from the release paper 12, of the contact layer 22, and the contact layer 22 and the heat absorption layer 23 are made of pure copper materials, so that the heat absorption mechanism has small thermal resistance and is convenient for heat transfer to the contact layer 22 and the heat absorption layer 23 after contact with an object. One side of the contact layer 22 is embedded in the heat sink layer 23 to facilitate better heat transfer while being less prone to separation. The transition layer 24 is disposed on a side of the heat absorption layer 23 away from the contact layer 22, the transition layer 24 is made of silicon nitride material, and has a thermal resistance smaller than that of the contact layer 22 and the heat absorption layer 23, so that heat is conveniently conducted to the transition layer 24 through the contact layer 22 and the heat absorption layer 23. The heat dissipation layer 25 is arranged on one side, far away from the heat absorption layer 23, of the transition layer 24, the heat dissipation layer 25 is made of graphene materials, the heat resistance is extremely small, and heat is conveniently conducted to the heat dissipation layer 25 to dissipate heat. The heat absorbing layer 23, the transition layer 24 and the heat dissipating layer 25 are all installed between the back adhesive layer 11 and the protective layer 14, so that they are tightly adhered. The heat dissipation mechanism 2 further includes a first adhesive layer 231, a second adhesive layer 241, and a third adhesive layer 251, where the first adhesive layer 231 is disposed between the heat absorption layer 23 and the transition layer 24, and is used for fixing the heat absorption layer 23 and the transition layer 24, preventing separation, and facilitating heat transfer. The second adhesive layer 241 is disposed between the transition layer 24 and the heat dissipation layer 25, and is used for fixing the transition layer 24 and the heat dissipation layer 25, preventing separation, and facilitating heat transfer. The third adhesive layer 251 is disposed between the third adhesive layer 251 and the protective layer 14, and is used for fixing the heat absorbing layer 23 and the transition layer 24 to prevent separation. The heat dissipation mechanism 2 further comprises a plurality of groups of heat dissipation micropores 26 formed on the protective layer 14, the heat dissipation micropores 26 are distributed at equal intervals, and the heat dissipation micropores 26 are formed so that heat on the heat dissipation layer 25 can be dissipated through the heat dissipation micropores 26, and the purpose of heat dissipation is achieved.

In this embodiment, when in use, the release paper 12 is uncovered, and then the wrapping layer 13 and the protective layer 14 are adhered to an object through the back adhesive layer 11 and pressed tightly. At this time, the object is closely attached to the contact layer 22, and since the contact layer 22 and the heat sink layer 23 are made of pure copper, the heat of the object is conducted to the heat sink layer 23 through the contact layer 22. And the transition layer 24 is made of a silicon nitride material, the heat dissipation layer 25 is made of a graphene material, and the thermal resistance is sequentially reduced from copper to silicon nitride to graphene, so that heat can be rapidly conducted to the heat dissipation layer 25 and can be dissipated through the heat dissipation micropores 26 formed in the protective layer 14, the purpose of heat dissipation is achieved, the heat dissipation of the bonding position is guaranteed, the performance and the reliability of equipment are improved, and the equipment is protected from being damaged by overheating.

The above-described embodiment is only one alternative embodiment of the present utility model, and many alternative modifications and combinations of the above-described embodiment may be made by those skilled in the art based on the technical solutions of the present utility model and the related teachings of the above-described embodiment.

Claims (5)

1. An acrylic adhesive tape having low thermal resistance, comprising:

The novel adhesive tape comprises a main body (1), wherein the main body (1) comprises a back adhesive layer (11), release paper (12) is arranged on one side of the back adhesive layer (11), the main body (1) further comprises a wrapping layer (13) arranged on one side, far away from the release paper (12), of the back adhesive layer (11), and a protective layer (14) is further connected to one side, far away from the back adhesive layer (11), of the wrapping layer (13);

the heat dissipation mechanism (2) for heat dissipation is arranged on one side of the back adhesive layer (11) away from the release paper (12), the heat dissipation mechanism (2) comprises a plurality of groups of mounting grooves (21) formed in the back adhesive layer (11), a contact layer (22) is arranged in the mounting grooves (21), the contact layer (22) comprises a heat absorption block (221) arranged in the mounting grooves (21), a heat conduction plate (222) fixedly connected with the heat absorption block (221) is further arranged on one side of the heat absorption block (221) away from the release paper (12), the heat conduction plate (222) is arranged on one side of the back adhesive layer (11) away from the release paper (12), the heat dissipation mechanism (2) further comprises a heat absorption layer (23), a transition layer (24) and a heat dissipation layer (25), the heat absorption layer (23) is arranged on one side of the contact layer (22) away from the release paper (12), the transition layer (24) is arranged on one side of the heat absorption layer (23) away from the contact layer (22), the heat dissipation layer (25) is arranged on one side of the transition layer (23) away from the heat absorption layer (24) and the heat absorption layer (14), the heat dissipation mechanism (2) further comprises a plurality of groups of heat dissipation micropores (26) which are formed in the protective layer (14), and the heat dissipation micropores (26) are distributed at equal intervals.

2. An acrylic adhesive tape with low thermal resistance according to claim 1, characterized in that one side of the contact layer (22) is embedded in a heat absorbing layer (23).

3. The acrylic adhesive tape with low thermal resistance according to claim 1, wherein the heat dissipation mechanism (2) further comprises a first adhesive layer (231), a second adhesive layer (241), and a third adhesive layer (251), the first adhesive layer (231) is disposed between the heat absorption layer (23) and the transition layer (24), the second adhesive layer (241) is disposed between the transition layer (24) and the heat dissipation layer (25), and the third adhesive layer (251) is disposed between the third adhesive layer (251) and the protective layer (14).

4. An acrylic adhesive tape with low thermal resistance according to claim 1, wherein the contact layer (22) and the heat absorbing layer (23) are both made of pure copper material, the transition layer (24) is made of silicon nitride material, and the heat dissipating layer (25) is made of graphene material.

5. An acrylic tape with low thermal resistance according to claim 1, characterized in that the wrapping layer (13) and the protective layer (14) are both made of acrylic material.