Adjustable computer circuit board fixing and encapsulating tool
Technical Field
The utility model belongs to the technical field of circuit boards, and particularly discloses an adjustable computer circuit board fixing and encapsulating tool.
Background
With the continuous development of computers towards high precision and high density, the reliability and heat conducting performance of products need to be improved, so that the design and manufacture of the encapsulating tool become more and more important. The main purpose of embedment is in order to protect product internal circuit and components and parts, can improve dampproofing, dustproof, anticorrosion, impact resistance, the heat conductivility etc. of product simultaneously, so in the design process of embedment frock, need consider factors such as size, shape, embedment material, technological parameter of product, ensure that heat-conducting glue evenly distributed is on the printed plate, avoid appearing gas pocket or impurity problem, carry out the customization design to the frock according to the requirement of product and ensure the practicality and the reliability of frock, the material of frock generally has high hardness, low ductility material. And meanwhile, the tool is finely processed and polished to ensure that the dimensional accuracy and the surface quality meet the requirements.
At present, most of product encapsulation is directly encapsulated in a formal structural member body, once the product is difficult to repair or repair after encapsulation, if the product fails after encapsulation, the structural member needs to be destructively dismantled at first, and the product is possibly irreversibly damaged in the process of destroying and dismantling the structural member, so that a printed board is directly scrapped more seriously, after the structural member is destroyed, one surface of a heat conducting adhesive is tightly attached to the structural member, the other surface of the heat conducting adhesive is tightly attached to a component, and two end forces act simultaneously in the separation process, so that the component is possibly stripped from the printed board.
Disclosure of utility model
In order to solve the technical problems, the utility model provides an adjustable computer circuit board fixing and encapsulating tool, which comprises a fixing base (2), a circuit board positioning block and a wire pressing plate (9), wherein the fixing base (2) and the circuit board positioning block are connected in a splicing way so as to clamp a circuit board (1), and the wire pressing plate (9) and the circuit board positioning block are connected through a rotating column (11).
Furthermore, the fixed base (2) and the circuit board positioning block are respectively provided with a clamping groove and a bulge which can be spliced and connected.
Further, the line pressing plate (9) is a rectangular sheet, and a line pressing groove is arranged below the line pressing plate.
Further, a locating hole is formed in the circuit board (1) or the fixed base (2), and the circuit board (1) is installed on the fixed base (2) through the locating hole.
Further, the roughness of the surface of the fixed base (2) contacted with the rubber body is less than or equal to 1.6, and the flatness is less than or equal to 0.01.
According to the utility model, the computer circuit board is fixed, so that the colloid and the formal structural member are in a separated state, but the colloid and the structural member can be tightly attached, the product is guaranteed to realize functions, and meanwhile, the reworkability is realized, the problem of encapsulating the circuit board is solved, the production cost is reduced, and the production efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of the operation of the present utility model;
FIG. 2 is a schematic diagram of an explosion of the structure of the present utility model;
FIG. 3 is a schematic diagram of a computer circuit board structure;
fig. 4 is a schematic diagram of a card slot splicing structure of the present utility model.
The device comprises a circuit board 1, a fixed base 2, circuit board positioning blocks 3-8, a line pressing plate 9, a clamping groove 10 and a rotary column 11.
Detailed Description
For a better understanding of the objects, technical solutions and functions of the present utility model, reference will be made to the following description of the utility model in further detail with reference to fig. 1-4, but the utility model may be embodied in many different forms as defined and covered by the claims. The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model.
In an embodiment, as shown in fig. 1 and 2, the utility model comprises a fixed base 2, circuit board positioning blocks 3-8 and a wire pressing plate 9, wherein the wire pressing plate 9 is connected with the circuit board positioning blocks 8 through a rotary column 11, the wire pressing plate 9 is a rectangular small piece, and the fixed base 2 is used as the bottom surface for fixing and encapsulating the whole circuit board and plays roles of fixing, limiting and encapsulating. The fixed base 2 contacts with the colloid the surface roughness is less than or equal to 1.6, the flatness is less than or equal to 0.01. There are a plurality of draw-in grooves 10 between unable adjustment base 2, the circuit board locating piece 3~8, and draw-in groove 10 is located unable adjustment base 2, inserts the protruding draw-in groove 10 on the circuit board locating piece 3~8 during the use, realizes the piece together of circuit board locating piece 3~8 and unable adjustment base 2, dismantles after the colloid solidification of being convenient for, fastens and adjusts through piece together the mode of inserting between unable adjustment base 2 and each circuit board locating piece 3~ 8.
In another embodiment, the clamping groove 10 is located on the circuit board positioning blocks 3-8, and the protrusions are located on the fixed base 2. Or the clamping groove and the bulge can be respectively positioned on the circuit board positioning blocks 3-8 or the fixed base 2, so long as the connection in the splicing and inserting mode can be realized. As shown in fig. 4.
Fig. 3 is a schematic diagram of a computer circuit board structure, in operation, a circuit board 1 is firstly installed on a fixed base 2 through a positioning hole, then circuit board positioning blocks 3-8 are adjusted, protrusions on the circuit board positioning blocks 3-8 are inserted into clamping grooves to clamp the circuit board, the circuit board positioning blocks 3-8 are installed on the fixed base 2 through the protrusions and the clamping grooves on the fixed base 2, and finally wire harnesses on the circuit board are placed in the wire pressing grooves under the wire pressing plates 9. After the circuit board is fixed, the colloid can be filled. And after the colloid is solidified, the circuit board positioning block is taken down, and finally the encapsulated circuit board is taken out, so that the whole encapsulation process is completed.
The above embodiments are merely preferred embodiments of the present utility model, and all changes and modifications that come within the meaning and range of equivalency of the structures, features and principles of the utility model are therefore intended to be embraced therein.