CN222073467U - A metal base plate - Google Patents

Abstract

The present application relates to the field of circuit board production, and discloses a metal-based laminate, which includes a metal substrate, a resin composition dielectric layer, and a circuit layer stacked in sequence. The metal substrate is used for the heat dissipation structure of the metal-based laminate, the thermal conductivity of the resin composition dielectric layer is 0.3 to 30 W/(m·℃), and the circuit layer is used to fix the IGBT chip. A plurality of array-arranged heat-conducting fins or heat-conducting columns are provided on the side of the metal substrate away from the circuit layer, and the heat-conducting fins or heat-conducting columns are used to dissipate heat from the metal substrate. The present application improves the heat dissipation effect of the IGBT module through the high thermal conductivity of the metal substrate.

Description

Metal base laminated board

Technical Field

The application relates to the technical field of circuit board production, in particular to a metal base laminated board.

Background

The IGBT (Insulated Gate Bipolar Transistor) module is a power semiconductor device having characteristics of both MOSFET (metal oxide semiconductor field effect transistor) and bipolar transistor. IGBT modules have high voltage capability and low power drive characteristics, and are commonly used in power electronics and motor control. The IGBT module generally comprises an IGBT chip and a driving circuit, can be applied to high-power application of the IGBT module, and particularly can be applied to the fields of frequency converters, controllers of electric automobiles, high-voltage direct-current transmission and the like, and particularly can be widely applied to new-energy electric cars.

In the traditional IGBT module packaged by the ceramic substrate, because the thermal expansion coefficients of the ceramic and the metal are greatly different, the IGBT module has relatively low temperature circulation capacity, after a plurality of temperature circulation, the ceramic in the middle is easy to crack and the welding layer between the ceramic and the metal bottom plate is easy to crack and degrade, so that the ceramic substrate is layered. In addition, the circuit board packaged by the ceramic substrate has insufficient heat conduction capability, and the heat conduction path from the chip to the heat dissipation bottom plate of the IGBT module using the ceramic substrate is long at present, so that the heat resistance is large during heat dissipation. Meanwhile, the IGBT module packaging technology based on the ceramic substrate is complex, the porosity of the welding layer is relatively difficult to control, and therefore the thermal resistance of the welding layer is difficult to control.

Disclosure of utility model

The application aims to provide a metal base laminated plate, which solves the technical problem that the heat dissipation effect of an IGBT module of a ceramic substrate is poor, and achieves the technical effect that the heat dissipation effect of the IGBT module is improved through the metal substrate.

The metal base laminated board provided by the embodiment of the application comprises a metal substrate, a resin composition medium layer and a circuit layer which are sequentially overlapped, wherein the metal substrate is used for a heat dissipation structure of the metal base laminated board, the heat conductivity of the resin composition medium layer is 0.3-30W/(m DEG C), and the circuit layer is used for fixing an IGBT chip.

In one possible implementation manner, a plurality of heat conducting fins or heat conducting columns arranged in an array are arranged on one side of the metal substrate far away from the circuit layer, and the heat conducting fins or the heat conducting columns are used for radiating heat of the metal substrate.

In another possible implementation, the heat conducting fins or the heat conducting posts are provided on the metal substrate by integral molding.

In another possible implementation manner, the edge of the metal substrate is provided with a fixing portion protruding transversely from the edge of the circuit layer, and the fixing portion is provided with a plurality of fixing holes in annular arrangement.

In another possible implementation manner, a sealing groove is arranged on one side, away from the circuit layer, of the metal substrate, and the sealing groove is arranged in an annular area surrounded by the plurality of fixing holes.

In another possible implementation, the sealing device further comprises a sealing ring, and the sealing ring (116) can be embedded in the sealing groove.

In another possible implementation manner, the heat dissipation device further comprises a heat dissipation shell, an opening part forming an opening is formed in the heat dissipation shell, a heat dissipation cavity is formed in the heat dissipation shell from the opening part to the inside, the edge of the opening part is connected to the fixing part, the heat dissipation cavity can enclose the heat conduction fins or the heat conduction column inside, a liquid inlet pipe and a liquid outlet pipe are respectively arranged on one side wall of the heat dissipation shell, which is opposite to the side wall, and the liquid inlet pipe and the liquid outlet pipe are respectively communicated with the heat dissipation cavity.

In a further possible embodiment, the opening is provided with a connecting flange in the circumferential direction, which is connected to the fastening hole by means of bolts.

In another possible implementation manner, the number of the circuit layers is plural, and the plural circuit layers are disposed independently from each other.

In another possible implementation, the ends of the heat conducting fins or heat conducting posts abut the bottom of the heat dissipating housing.

In another possible implementation, the heat dissipation case is made of metal.

Compared with the prior art, the embodiment of the application has the beneficial effects that:

The embodiment of the application provides a metal base laminated board, which comprises a metal substrate, a resin composition medium layer and a circuit layer which are sequentially overlapped, wherein the metal substrate is used for a heat dissipation structure of the metal base laminated board, the heat conductivity of the resin composition medium layer is 0.3-30W/(m DEG C), and the circuit layer is used for fixing an IGBT chip. According to the embodiment of the application, the metal substrate is used in the IGBT module, so that compared with the problem that the heat conduction path from the chip to the heat dissipation base plate or the heat radiator of the IGBT module packaged by the ceramic substrate is longer, the heat dissipation effect of the IGBT module is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an IGBT module according to the prior art;

fig. 2 is a schematic structural diagram of another IGBT module according to the prior art;

FIG. 3 is a schematic diagram of a metal-based laminate according to an embodiment of the present application;

FIG. 4 is a schematic view of another metal-based laminate in accordance with an embodiment of the present application;

FIG. 5 is a schematic bottom view of a metal-based laminate according to an embodiment of the present application;

FIG. 6 is a schematic bottom view of another metal-based laminate according to an embodiment of the present application;

FIG. 7 is a schematic view of another metal-based laminate in accordance with an embodiment of the present application;

FIG. 8 is a schematic bottom view of another metal-based laminate in accordance with an embodiment of the present application;

FIG. 9 is a schematic diagram of a front view of another metal-based laminate in accordance with an embodiment of the present application;

FIG. 10 is a schematic view of a partial structure at A of a metal-based laminate of FIG. 9;

In the figure, 1, a metal base laminated plate; 11. a metal substrate; 111. a heat conducting fin; 112. a heat conducting column; 113. a fixing part; 114. a fixing hole; 115. sealing grooves; 116. a seal ring; 12. a resin composition dielectric layer; 13. a circuit layer; 131. an IGBT chip; 14. a heat dissipation housing; 141. an opening portion; 142. a heat dissipation cavity; 143. a liquid inlet pipe; 144. a liquid outlet pipe; 21. a substrate; 211. a chip; 22. a bottom plate; 221. a bottom plate solder layer; 23. a heat sink; 231. and (5) heat-conducting silicone grease.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.

It will be understood that when an element or structure is referred to as being "mounted" or "disposed" on another element or structure, it can be directly on the other element or structure or be indirectly on the other element or structure. When an element or structure is referred to as being "connected to" another element or structure, it can be directly connected to the other element or structure or be indirectly connected to the other element or structure.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the apparatus or one component or structure referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Fig. 1 is a schematic structural diagram of an existing IGBT module, as shown in fig. 1, where the existing IGBT module includes a substrate 21, a base plate 22 and a radiator 23, a chip 211 is fixedly connected to the substrate 21, the chip 211 may be an IGBT chip, the substrate 21 is connected to the base plate 22 through a base plate solder layer 221, the base plate 22 is a shell structure of the IGBT module, the base plate 22 may be further connected to the radiator 23 through a heat conducting silicone grease 231, and the radiator 23 may radiate heat conducted by the substrate 21 and the chip 211.

Fig. 2 is a schematic structural diagram of another conventional IGBT module, as shown in fig. 2, the conventional IGBT module includes a substrate 21 and a heat sink 23, a chip 211 is fixedly connected to the substrate 21, the chip 211 may be an IGBT chip, the substrate 21 is connected to the heat sink 23 through a heat-conducting silicone grease 231, and the heat sink 23 can dissipate heat conducted by the substrate 21 and the chip 211.

As shown in fig. 1 and 2, the conventional substrate 21 may include a conductive layer and an insulating plate, which may be made of glass cloth, epoxy, polyimide, ceramic substrate, or the like, but the substrate 21 made of the conventional insulating plate has a poor heat dissipation effect. For example, the heat conduction capability of the substrate 21 packaged by the ceramic substrate is insufficient, so that the heat conduction path of the IGBT module using the substrate 21 from the chip to the bottom plate 22 and the heat sink 23 is long, resulting in a large thermal resistance of the IGBT module at the time of heat dissipation.

Based on the above reasons, the embodiment of the application provides a metal base laminated board, which comprises a metal substrate, a resin composition medium layer and a circuit layer which are sequentially stacked, wherein the metal substrate is used for a heat dissipation structure of the metal base laminated board, the heat conductivity of the resin composition medium layer is 0.3-30W/(m DEG C), and the circuit layer is used for fixing an IGBT chip. According to the embodiment of the application, the metal substrate is used in the IGBT module, so that compared with the problem that the heat conduction path from the chip to the heat dissipation base plate or the heat radiator of the IGBT module packaged by the ceramic substrate is longer, the heat dissipation effect of the IGBT module is improved.

In some scenes, the metal base laminated plate can be applied to the IGBT module, and the heat dissipation effect of the IGBT module can be improved.

The metal-based laminate provided in the embodiment of the application is specifically described below with reference to specific examples.

Fig. 3 is a schematic structural diagram of a metal-based laminate according to an embodiment of the present application, and as shown in fig. 3, the metal-based laminate 1 according to an embodiment of the present application includes a metal substrate 11, a resin composition dielectric layer 12, and a circuit layer 13 stacked in order, where the metal substrate 11 is used for a heat dissipation structure of the metal-based laminate 1, and the thermal conductivity of the resin composition dielectric layer 12 is 0.3-30W/(m·) deg.c, and the circuit layer 13 is used for fixing an IGBT chip 131.

As shown in fig. 3, a metal substrate 11, a resin composition dielectric layer 12, and a circuit layer 13, which are stacked in this order in structure, constitute a metal base laminate 1, and the metal base laminate 1 is used to fix an IGBT chip 131.

When the heat dissipation structure is used, the metal substrate 11 is used for the heat dissipation structure of the metal base laminated plate 1, the thermal conductivity of the resin composition dielectric layer 12 is 0.3-30W/(m·) DEG C, the circuit layer 13 is used for fixing the IGBT chip 131, heat emitted by the IGBT chip 131 is emitted to the metal substrate 11 through the resin composition dielectric layer 12, and the heat can be directly emitted through the metal substrate 11, so that the heat dissipation effect of the metal base laminated plate 1 for the IGBT chip 131 is realized.

Illustratively, the thickness of the metal substrate 11 may be 2mm to 3.2mm, such that the metal substrate 11 is capable of supporting the bottom plate 22 of an existing IGBT module.

The realization mode has the beneficial effects that the metal substrate is used for replacing the ceramic substrate to fix the IGBT chip, so that the heat dissipation effect of the IGBT module can be improved, the metal substrate is not required to be fixed by the bottom plate in the traditional IGBT module, the problem that the heat conduction path from the chip to the heat dissipation bottom plate or the radiator of the IGBT module packaged by the ceramic substrate is long is solved, and the heat dissipation effect of the IGBT module is improved.

In some implementations, fig. 4 is a schematic structural diagram of another metal-based laminate in an embodiment of the present application, fig. 5 is a schematic bottom structural diagram of one metal-based laminate in an embodiment of the present application, fig. 6 is a schematic bottom structural diagram of another metal-based laminate in an embodiment of the present application, and as shown in fig. 4 to 6, a side of the metal substrate 11 away from the circuit layer 13 is provided with a plurality of heat conducting fins 111 or heat conducting columns 112 arranged in an array, where the heat conducting fins 111 or the heat conducting columns 112 are used for dissipating heat from the metal substrate 11.

As shown in fig. 4 to 6, the heat conduction fins 111 or the heat conduction pillars 112 can further improve the heat dissipation efficiency of the metal substrate 11 in terms of structure.

The realization mode has the beneficial effects that the heat dissipation effect on the metal substrate is improved by radiating the heat of the metal substrate through the heat conduction fins or the heat conduction columns.

In some implementations, the heat conductive fins 111 or the heat conductive posts 112 are disposed on the metal substrate 11 by integral molding.

Structurally, the heat transfer efficiency between the metal substrate 11 and the heat conduction fins 111 or the heat conduction columns 112 can be improved by integrally forming the heat conduction fins 111 or the heat conduction columns 112 on the metal substrate 11.

Illustratively, the heat conductive fins 111 or the heat conductive posts 112 may be integrally molded on the metal base plate 11 by casting.

The realization mode has the beneficial effects that the heat dissipation effect on the metal substrate can be improved by integrally forming the heat conduction fins or the heat conduction columns and the metal substrate.

In some implementations, fig. 7 is a schematic structural diagram of another metal base laminate according to an embodiment of the present application, as shown in fig. 7, a fixing portion 113 protruding laterally from an edge of the circuit layer 13 is disposed on an edge of the metal substrate 11, and a plurality of fixing holes 114 are disposed on the fixing portion 113 in a ring shape.

As shown in fig. 7, a plurality of fixing holes 114 are provided so as to protrude laterally from the edge of the circuit layer 13, and the metal substrate 11 can be fixed to the edge of the metal substrate 11 by fixing portions 113.

Illustratively, the plurality of fixing holes 114 are arranged in a ring shape on the fixing portion 113, and the metal substrate 11 can be firmly fixed by the plurality of fixing holes 114 in the circumferential direction of the fixing portion 113.

The beneficial effect that foretell realization mode brought lies in, carries out firm fixed to the metal base plate through a plurality of fixed orifices, can regard the metal base plate as the fixed plate of IGBT module, is convenient for realize the direct fixation to the IGBT module through fixed to the metal base plate, has simplified the structure of IGBT module.

In some implementations, fig. 8 is a schematic bottom view of another metal-based laminate according to an embodiment of the present application, as shown in fig. 7 and fig. 8, a seal groove 115 is disposed on a side of the metal substrate 11 away from the circuit layer 13, where the seal groove 115 is disposed in an annular area surrounded by a plurality of fixing holes 114.

As shown in fig. 7 and 8, the seal groove 115 is configured to seal the metal substrate 11, so that the tightness of fixing the metal substrate 11 can be ensured when the side of the metal substrate 11 away from the circuit layer 13 is subjected to liquid cooling heat dissipation.

For example, when the metal substrate 11 is firmly fixed through the plurality of fixing holes 114, a sealing ring is installed in a sealing groove 115 arranged in an annular area surrounded by the plurality of fixing holes 114, so that the metal substrate 11 and an external fixing structure can be sealed.

The implementation mode has the beneficial effects that the sealing performance of fixing the metal substrate can be improved by installing the sealing ring in the sealing groove.

In some implementations, fig. 9 is a schematic front view of a structure of another metal base laminate according to an embodiment of the present application, and fig. 10 is a schematic partial structure at a of the metal base laminate in fig. 9, as shown in fig. 9 and fig. 10, where the embodiment of the present application further includes a sealing ring 116, and the sealing ring 116 can be embedded in the sealing groove 115.

As shown in fig. 9 and 10, the seal ring 116 is configured to be fitted in the seal groove 115, thereby sealing the metal substrate 11 and the external fixing structure.

The implementation mode has the beneficial effects that the sealing effect on the metal substrate is further improved through the sealing ring.

In some implementations, as shown in fig. 9 and 10, the embodiment of the present application further includes a heat dissipation housing 14, an opening 141 forming an opening is provided on the heat dissipation housing 14, a heat dissipation cavity 142 is provided on the heat dissipation housing 14 from the opening 141 inwards, an edge of the opening 141 is connected to the fixing portion 113, the heat dissipation cavity 142 can enclose the heat conduction fins 111 or the heat conduction columns 112, a liquid inlet pipe 143 and a liquid outlet pipe 144 are respectively provided on opposite side walls of the heat dissipation housing 14, and the liquid inlet pipe 143 and the liquid outlet pipe 144 are respectively communicated with the heat dissipation cavity 142.

As shown in fig. 9 and 10, in the structure, the heat dissipation case 14 is configured to accommodate a heat dissipation fluid to dissipate heat from the metal substrate 11, and the heat dissipation case 14 is provided with an opening 141 forming an opening, and the opening 141 is configured to be directly connected to the metal substrate 11.

Structurally, a heat dissipation cavity 142 is provided on the heat dissipation housing 14 from the opening 141 inwards, the heat dissipation cavity 142 is used for accommodating heat dissipation fluid, the edge of the opening 141 is connected to the fixing portion 113, the heat dissipation cavity 142 can enclose the heat conduction fins 111 or the heat conduction columns 112, so that the heat dissipation fluid can absorb heat of the heat conduction fins 111 or the heat conduction columns 112, and the heat dissipation effect on the heat conduction fins 111 or the heat conduction columns 112 and the metal substrate 11 is improved.

Structurally, a liquid inlet pipe 143 and a liquid outlet pipe 144 are respectively arranged on opposite side walls of the heat dissipation shell 14, the liquid inlet pipe 143 and the liquid outlet pipe 144 are respectively communicated with the heat dissipation cavity 142, and the liquid inlet pipe 143 and the liquid outlet pipe 144 can introduce and draw out heat dissipation fluid into the heat dissipation cavity 142 so as to realize rapid heat dissipation of the metal substrate 11.

The realization mode has the beneficial effects that the heat dissipation fluid can be introduced into and led out of the heat dissipation cavity through the liquid inlet pipe and the liquid outlet pipe, and the rapid heat dissipation of the metal substrate can be realized.

In some implementations, a connection flange 141a is provided in the circumferential direction of the opening portion 141, and the connection flange 141a is connected to the fixing hole 114 by bolts.

As shown in fig. 9 and 10, the connection flange 141a can be structurally connected to the opening 141 by bolts.

The realization mode has the beneficial effects that the opening part and the metal substrate are convenient to be stably connected through the connecting flange.

In some implementations, the number of circuit layers 13 is plural, and the plural circuit layers 13 are disposed independently of each other.

As shown in fig. 9, the plurality of circuit layers 13 are provided independently of each other in structure, and thus a plurality of IGBT chips can be fixed independently of each other.

The implementation mode has the beneficial effects that the IGBT chips are fixed through mutual independence, so that the stability and the reliability of the fixation of the IGBT chips are improved, and the mutual influence among the IGBT chips is avoided.

In some implementations, the ends of the thermally conductive fins 111 or thermally conductive posts 112 abut the bottom of the heat dissipating housing 14.

As shown in fig. 9, in the structure, the heat dissipation case 14 can support the heat conduction fins 111 or the heat conduction columns 112 by abutting the ends of the heat conduction fins 111 or the heat conduction columns 112 with the bottom of the heat dissipation case 14, and further, the heat dissipation case 14 can support the metal substrate 11 through the heat conduction fins 111 or the heat conduction columns 112, so that the metal substrate 11 can be supported when the resin composition dielectric layer 12 and the circuit layer 13 are laminated on the metal substrate 11, and the metal substrate 11 can be prevented from being bent.

The realization mode has the beneficial effects that when the resin composition medium layer and the circuit layer can be pressed on the metal substrate, the metal substrate is supported through the heat conducting fins or the heat conducting columns, the metal substrate is prevented from being bent, and the convenience for packaging the IGBT module is improved.

The beneficial effect that foretell realization brought also lies in, when encapsulating IGBT module, can support heat conduction fin or heat conduction post through the heat dissipation casing, and then support metal substrate, can avoid heat conduction fin or heat conduction post to take place to crooked, has improved the effect to the encapsulation of IGBT module.

In some implementations, the heat dissipation housing 14 is a metallic material.

The realization mode has the beneficial effects that the hardness of the heat dissipation shell made of metal materials is higher, the stability of the heat dissipation shell for supporting the heat conduction fins or the heat conduction columns can be improved, and the encapsulation effect of the IGBT module is ensured.

The beneficial effect that above-mentioned realization mode brought also lies in, and the radiating shell of metal material can dispel the heat to the IGBT module more fast, has improved the radiating effect to the IGBT module.

The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the application.

Claims (9)

1. The metal base laminated board (1) is characterized by comprising a metal substrate (11), a resin composition medium layer (12) and a circuit layer (13) which are sequentially stacked, wherein the metal substrate (11) is used for a heat dissipation structure of the metal base laminated board (1), the heat conductivity of the resin composition medium layer (12) is 0.3-30W/(m DEG C), and the circuit layer (13) is used for fixing an IGBT chip (131);

A plurality of heat conducting fins (111) or heat conducting columns (112) arranged in an array are arranged on one side, far away from the circuit layer (13), of the metal substrate (11), and the heat conducting fins (111) or the heat conducting columns (112) are used for radiating heat of the metal substrate (11).

2. The metal-based laminate of claim 1, wherein the heat conducting fins (111) or the heat conducting posts (112) are provided on the metal substrate (11) by integral molding.

3. The metal-based laminate according to claim 2, wherein the edge of the metal substrate (11) is provided with a fixing portion (113) protruding laterally beyond the edge of the circuit layer (13), and the fixing portion (113) is provided with a plurality of fixing holes (114) arranged in a ring shape.

4. A metal-based laminate according to claim 3, characterized in that the side of the metal substrate (11) remote from the circuit layer (13) is provided with a sealing groove (115), the sealing groove (115) being provided in an annular area surrounded by a plurality of fixing holes (114).

5. The metal-based laminate of claim 4, further comprising a seal ring (116), wherein the seal ring (116) is capable of being disposed in a seal groove (115).

6. The metal-based laminate of claim 5, further comprising a heat-dissipating housing (14), wherein an opening (141) forming an opening is provided on the heat-dissipating housing (14), a heat-dissipating cavity (142) is provided on the heat-dissipating housing (14) from the opening (141) to the inside, the edge of the opening (141) is connected to the fixing portion (113), the heat-dissipating cavity (142) can enclose the heat-conducting fin (111) or the heat-conducting column (112), a liquid inlet pipe (143) and a liquid outlet pipe (144) are provided on opposite side walls of the heat-dissipating housing (14), respectively, and the liquid inlet pipe (143) and the liquid outlet pipe (144) are respectively communicated with the heat-dissipating cavity (142).

7. The metal base laminate according to claim 6, wherein the opening portion (141) is provided with a connecting flange (141 a) in a circumferential direction, and the connecting flange (141 a) is connected to the fixing hole (114) by a bolt.

8. The metal-based laminate of claim 7, wherein the number of circuit layers (13) is plural, and the plural circuit layers (13) are provided independently of each other.

9. The metal-based laminate of claim 8, wherein the ends of the heat conducting fins (111) or the heat conducting posts (112) abut the bottom of the heat dissipating housing (14).