CN222050543U - A 400G DR4 LPO Silicon Photonics Engine - Google Patents
A 400G DR4 LPO Silicon Photonics Engine Download PDFInfo
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- CN222050543U CN222050543U CN202420868679.5U CN202420868679U CN222050543U CN 222050543 U CN222050543 U CN 222050543U CN 202420868679 U CN202420868679 U CN 202420868679U CN 222050543 U CN222050543 U CN 222050543U
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 102
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 102
- 239000010703 silicon Substances 0.000 title claims abstract description 102
- 230000003287 optical effect Effects 0.000 claims abstract description 54
- 239000013307 optical fiber Substances 0.000 claims description 25
- 239000000919 ceramic Substances 0.000 claims description 6
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims description 3
- 239000000835 fiber Substances 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 6
- 238000005452 bending Methods 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- Optical Couplings Of Light Guides (AREA)
Abstract
本实用新型涉及一种400G DR4LPO硅光光引擎，硅光芯片、光纤阵列和棱镜分别固定在阶梯式基座上，硅光芯片顶部具有在同一条线上分布的四个出光光栅以及一个入光光栅，硅光芯片上固定一个覆盖四个出光光栅及入光光栅的阵列硅透镜，四个出光光栅经阵列硅透镜与光纤阵列的四个光口一一耦合，入光光栅经阵列硅透镜与棱镜的45°反射面耦合，棱镜的入光侧耦合光发射器件。有益效果为：只用预留阵列硅透镜的粘接区域，且该尺寸很小，从而可以布局在硅光芯片的边缘，硅光芯片的面积将可以做的很小，成本低；可以采用便宜的45°光纤阵列，光纤阵列固定在阶梯式基座上，光纤弯曲应力不会传导到硅光芯片的光栅区域，从而不会导致性能不良。
The utility model relates to a 400G DR4LPO silicon photonics engine, wherein a silicon photonics chip, a fiber array and a prism are respectively fixed on a stepped base, and the top of the silicon photonics chip has four light-emitting gratings and one light-incoming grating distributed on the same line, and an array silicon lens covering the four light-emitting gratings and the light-incoming grating is fixed on the silicon photonics chip, and the four light-emitting gratings are coupled one by one with the four optical ports of the fiber array through the array silicon lens, and the light-incoming grating is coupled with the 45° reflection surface of the prism through the array silicon lens, and the light-incoming side of the prism is coupled with a light emitting device. The beneficial effects are as follows: only the bonding area of the array silicon lens is reserved, and the size is very small, so that it can be arranged at the edge of the silicon photonics chip, and the area of the silicon photonics chip can be made very small, and the cost is low; a cheap 45° fiber array can be used, and the fiber array is fixed on the stepped base, and the fiber bending stress will not be transmitted to the grating area of the silicon photonics chip, so that poor performance will not be caused.
Description
Technical Field
The utility model relates to the technical field of optical engines, in particular to a 400G DR4 LPO silicon optical engine.
Background
The coupling of the laser chip in the current 400g DR4 silicon optical engine adopts the SIOB scheme, that is, the laser chip is coupled on the silicon optical chip, and uses 90 ° FA (optical fiber array) as output, as shown in fig. 1, 2 and 3, which has the following drawbacks:
1) The light incident grating coupled with the laser chip and the light emergent grating coupled with the 90-degree FA on the silicon optical chip are not on the same line, and because the silicon optical chip is required to reserve an SIOB and FA bonding area, the silicon optical chip has large area and high cost, and in addition, the SIOB and the 90-degree FA are high in cost;
2) SIOB is difficult to dissipate heat;
3) Since the 90 ° FA is bonded to the silicon optical chip, the bending stress of the optical fiber is transmitted to the grating region of the silicon optical chip, and a certain proportion of the bending stress causes poor performance.
Disclosure of utility model
The technical problem to be solved by the utility model is to provide a 400G DR4 LPO silicon optical engine so as to overcome the defects in the prior art.
The technical scheme for solving the technical problems is as follows: a 400g DR4 LPO silicon light engine comprising: the optical fiber array comprises a stepped base, a silicon optical chip, an optical fiber array and a prism, wherein the silicon optical chip, the optical fiber array and the prism are fixed on the stepped base, four light-emitting gratings and one light-entering grating are distributed on the same line at the top of the silicon optical chip, an array silicon lens covering the four light-emitting gratings and the light-entering grating is fixed on the silicon optical chip, the four light-emitting gratings are coupled with four light ports of the optical fiber array one by one through the array silicon lens, the light-entering grating is coupled with a 45-degree reflecting surface of the prism through the array silicon lens, and the light-entering side of the prism is coupled with a light emitting device.
The beneficial effects of the utility model are as follows:
1) Because the four light-emitting gratings and one light-entering grating on the silicon optical chip are distributed on the same line, the silicon optical chip does not need to reserve the bonding area of SIOB and 90-degree FA (optical fiber array), only needs to reserve the bonding area of an array silicon lens, and the size is small, so that the silicon optical chip can be distributed at the edge of the silicon optical chip, the area of the silicon optical chip can be small, and the cost is effectively reduced;
2) Due to the array silicon lens, an inexpensive 45-degree optical fiber array can be adopted, and a 90-degree optical fiber array is not adopted, so that the cost can be effectively reduced;
3) The optical fiber array is fixed on the stepped base, and the bending stress of the optical fibers is not conducted to the grating area of the silicon optical chip, so that poor performance is not caused.
On the basis of the technical scheme, the utility model can be improved as follows.
Further, the array silicon lens is stuck on the silicon optical chip in a passive mode.
Further, the fiber array and the prism are both adhered to the stepped base.
The adoption of the method has the further beneficial effects that: and the repair is convenient, but the original SIOB scheme cannot be repaired.
Further, the lens coupled to the light-emitting grating on the array silicon lens is different from the lens coupled to the light-entering grating in surface shape.
Further, the light emitting device includes: the laser chip is fixed with the ceramic heat sink fixed on the stepped base in an adhesive mode, the silicon lens is fixed on the stepped base, and the optical isolator is adhered to the light inlet side of the prism.
The adoption of the method has the further beneficial effects that: because complex SIOB coupling is not needed, the laser chip only needs to be coupled with a single silicon lens, in addition, the laser chip is fixed with a ceramic heat sink fixed on a stepped base in an adhesive mode, so that the repairing is convenient, the original SIOB scheme cannot be repaired, and the optical isolator is adhered to the light inlet side of the prism, so that the optical isolator can be arranged in a suspended mode, the size of the optical isolator can be small, and the cost is saved.
Furthermore, the stepped base is made of tungsten copper.
The adoption of the method has the further beneficial effects that: the heat dissipation performance of the laser chip can be effectively improved.
Drawings
FIG. 1 is a front view of a 400G D4 silicon light engine of the prior art;
FIG. 2 is a top view of a 400G D4 silicon light engine of the prior art;
FIG. 3 is a top view of a silicon optical chip used in a 400G D4 silicon optical engine of the prior art;
FIG. 4 is a perspective view of a 400G DR4 LPO silicon light engine according to the present utility model;
FIG. 5 is a top view of a 400G DR4 LPO silicon light engine according to the present utility model;
FIG. 6 is a top view of a silicon optical chip used in the 400G DR4 LPO silicon optical engine of the present utility model;
FIG. 7 is a schematic view of the light path of 400G DR4 LPO silicon light engine according to the present utility model;
Fig. 8 is a light-emitting path diagram of 400g DR4 LPO silicon light engine according to the present utility model.
In the drawings, the list of components represented by the various numbers is as follows:
1. The optical fiber laser comprises a stepped base, 2 parts of silicon optical chips, 210 parts of light-emitting gratings, 220 parts of light-entering gratings, 3 parts of optical fiber arrays, 4 parts of prisms, 5 parts of array silicon lenses, 6 parts of laser chips, 7 parts of silicon lenses, 8 parts of optical isolators, 9 parts of ceramic heat sinks.
Detailed Description
The principles and features of the present utility model are described below with reference to the drawings, the examples are illustrated for the purpose of illustrating the utility model and are not to be construed as limiting the scope of the utility model.
Example 1
As shown in fig. 4, 5 and 6, a 400g DR4 LPO silicon optical engine comprises: the stepped base 1, a silicon optical chip 2, an optical fiber array 3 and a prism 4 are fixed on the stepped base 1, and four light-emitting gratings 210 and one light-entering grating 220 are arranged at the top of the silicon optical chip 2, namely, the functions are still consistent with those of the prior art, and the difference is that: in this embodiment, four light-emitting gratings 210 and one light-entering grating 220 are distributed on the same line;
An array silicon lens 5 covering four light-emitting gratings 210 and light-entering gratings 220 is fixed on the silicon optical chip 2, the array silicon lens 5 simultaneously meets the coupling of input and output, and the four light-emitting gratings 210 are coupled with four light ports of the optical fiber array 3 one by one through the array silicon lens 5, namely the optical fiber array 3 is positioned above the array silicon lens 5; the light-entering grating 220 is coupled with the 45-degree reflecting surface of the prism 4 through the array silicon lens 5, namely the prism 4 is positioned above the array silicon lens 5;
The light entering side of the prism 4 is coupled with the light emitting device;
the working principle is as follows:
Light emitted by the light emitting device enters the prism 4, is reflected from the 45-degree reflecting surface of the prism 4 into the array silicon lens 5, and is coupled into the light-entering grating 220 of the silicon optical chip 2 by the array silicon lens 5, as shown in fig. 7;
the silicon optical chip 2 divides light into 4 paths, and emits the light from the four light-emitting gratings 210 respectively, and then the light is coupled into the four light ports of the optical fiber array 3 through the array silicon lens 5, as shown in fig. 8;
the beneficial effects that this technical scheme possessed are:
1) Because the four light-emitting gratings 210 and one light-entering grating 220 on the silicon optical chip 2 are distributed on the same line, the bonding areas of SIOB and 90 DEG FA (fiber array) are not reserved on the silicon optical chip 2, the bonding area of the array silicon lens 5 is reserved only, and the size is small, so that the silicon optical chip can be arranged on the edge of the silicon optical chip 2, the area of the silicon optical chip 2 can be small, and the cost is effectively reduced;
2) Due to the array silicon lens 5, the inexpensive 45-degree optical fiber array 3 can be adopted, and the 90-degree optical fiber array is not adopted, so that the cost can be effectively reduced;
3) The optical fiber array 3 is fixed on the stepped base 1, and the bending stress of the optical fibers is not conducted to the grating area of the silicon optical chip 2, so that poor performance is not caused.
Example 2
As shown in fig. 4 and 5, this embodiment is a further improvement of the embodiment 1, and specifically is as follows:
the array silicon lens 5 is attached to the silicon optical chip 2 in a passive manner.
Example 3
As shown in fig. 4 and 5, this embodiment is a further improvement of the embodiment 1 or 2, and is specifically as follows:
the optical fiber array 3 is fixed on the stepped base 1 in an adhesive mode, and the prism 4 is fixed on the stepped base 1 in an adhesive mode, so that the repairing is convenient, and the original SIOB scheme cannot be repaired.
Example 4
As shown in fig. 4, this embodiment is a further improvement of the embodiment 1, 2 or 3, and is specifically as follows:
The lens coupled to the light-emitting grating 210 on the array silicon lens 5 is different from the lens coupled to the light-entering grating 220 in surface shape.
Example 5
As shown in fig. 4 and 5, this embodiment is a further improvement of any one of embodiments 1 to 4, and specifically includes the following:
the light emitting device includes: the laser chip 6, the silicon lens 7 and the optical isolator 8 are sequentially arranged along the light propagation direction, the laser chip 6 is fixed with the ceramic heat sink 9 fixed on the stepped base 1 in an adhesive mode, the silicon lens 7 is fixed on the stepped base 1, the optical isolator 8 is adhered to the light entering side of the prism 4, and the laser chip 6 is only required to be coupled with a single silicon lens 7 without complex SIOB coupling, in addition, the laser chip 6 is fixed with the ceramic heat sink 9 fixed on the stepped base 1 in an adhesive mode, so that the repair is convenient, the original SIOB scheme can not be repaired, the optical isolator 8 is adhered to the light entering side of the prism 4, the optical isolator 8 can be arranged in a suspended mode, and therefore, the size of the optical isolator can be small, and the cost is saved.
Further: the stepped base 1 is made of tungsten copper, so that the heat dissipation performance of the laser chip 6 can be effectively improved.
While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the utility model.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420868679.5U CN222050543U (en) | 2024-04-24 | 2024-04-24 | A 400G DR4 LPO Silicon Photonics Engine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420868679.5U CN222050543U (en) | 2024-04-24 | 2024-04-24 | A 400G DR4 LPO Silicon Photonics Engine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222050543U true CN222050543U (en) | 2024-11-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420868679.5U Active CN222050543U (en) | 2024-04-24 | 2024-04-24 | A 400G DR4 LPO Silicon Photonics Engine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222050543U (en) |
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- 2024-04-24 CN CN202420868679.5U patent/CN222050543U/en active Active
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