CN222043329U - Pad assemblies and coating equipment - Google Patents

Abstract

The present application relates to the field of coating technology, and specifically to a pad assembly and coating equipment, in order to solve the problem that the process chamber in the coating equipment is easy to contaminate the heating chamber after being broken. The pad assembly includes at least one pad. Since the pad is arranged between the heating chamber and the process chamber, and is at least located below the process chamber, in the case of the process chamber breaking, the fragments of the process chamber will fall on the pad assembly below it, so that the pad assembly can catch the fragments of the process chamber to prevent it from contaminating the heating chamber. In addition, such an arrangement enables the pad assembly to protect the heating furnace. The fragments of the process chamber will fall on the surface of the pad assembly. When cleaning the fragments of the process chamber in the heating chamber, the fragments of the process chamber can be cleaned out on the surface of the pad assembly, thereby reducing the risk of the fragments scratching the heating furnace and extending the service life of the heating furnace.

Description

Backing plate assembly and coating equipment

Technical Field

The application relates to the technical field of film plating, in particular to a backing plate assembly and film plating equipment.

Background

In the field of photovoltaic coating, a product is generally coated by using coating equipment, and a corresponding film layer is coated on the cavity wall of a process cavity of the coating equipment. Because the coating equipment is generally high-temperature coating, the material of the process cavity is generally quartz rather than metal. Quartz has high hardness and brittleness. An excessively thick film layer can overstress the walls of the process chamber, thereby causing the reaction chamber to fracture.

The outside of the process chamber is a heating chamber. Therefore, after the process cavity is broken, fragments of the process cavity can fall into the heating cavity of the coating equipment and a furnace wire gap of the heating cavity to pollute the heating cavity.

Disclosure of utility model

In view of the above, the embodiment of the application provides a backing plate assembly and coating equipment, which solves the problem that a heating chamber is easy to be polluted after a process cavity is broken in the coating equipment.

In a first aspect, embodiments of the present application provide a backing plate assembly for use in a coating apparatus, the coating apparatus including a heating furnace and a process chamber, the heating furnace including a heating chamber, the process chamber disposed within the heating chamber, the backing plate assembly comprising: at least one backing plate disposed between the heating chamber and the process chamber; wherein the backing plate is at least located below the process chamber.

With reference to the first aspect, in certain implementations of the first aspect, a bottom of the heating chamber includes a heating wire; wherein, the backing plate sets up on the heater strip.

With reference to the first aspect, in certain implementations of the first aspect, the heating chamber is in the shape of a horizontally disposed cylinder; the cross section of the backing plate in the radial direction of the heating chamber is in a first circular arc shape, and the circle center of the first circular arc shape is coincident with the axis of the heating chamber.

With reference to the first aspect, in certain implementations of the first aspect, a first included angle formed by the first end of the first circular arc, the center of the first circular arc, and the second end of the first circular arc, on a side near the pad plate is less than 180 °.

With reference to the first aspect, in certain implementations of the first aspect, the backing plate is symmetrical with respect to a vertical plane in which an axis of the heating chamber lies.

With reference to the first aspect, in certain implementations of the first aspect, the number of the backing plates is a plurality, and the plurality of backing plates are sequentially connected along an axis direction of the heating chamber.

With reference to the first aspect, in some implementations of the first aspect, the number of the backing plates is plural, and the plurality of backing plates are sequentially connected along a circumferential direction of the heating chamber to form a second circular arc-shaped backing plate assembly, a circle center of the second circular arc coincides with an axis of the heating chamber, and a second included angle formed by a first end of the second circular arc, the circle center of the second circular arc, and a second end of the second circular arc, which is close to a side of the backing plate, is greater than or equal to 180 °.

With reference to the first aspect, in certain implementations of the first aspect, the at least one shim plate includes a first shim plate and a second shim plate disposed adjacent to each other; the first backing plate is provided with a bulge at one side contacted with the second backing plate, the second backing plate is provided with a recess at one side contacted with the first backing plate, and the bulge is connected with the recess in a concave-convex manner.

With reference to the first aspect, in certain implementations of the first aspect, the backing plate is made of transparent quartz or infrared radiation ceramic.

In a second aspect, embodiments of the present application provide a plating apparatus including: a heating furnace including a heating chamber; the process cavity is arranged in the heating cavity; the backing plate assembly of any one of the first aspects, disposed between the heating chamber and the process chamber.

The embodiment of the application provides a backing plate assembly, which is applied to coating equipment, wherein the coating equipment comprises a heating furnace and a process cavity, the heating furnace comprises a heating cavity, the process cavity is arranged in the heating cavity, and the backing plate assembly comprises: at least one backing plate disposed between the heating chamber and the process chamber; wherein the backing plate is at least located below the process chamber. Because the backing plate is arranged between the heating chamber and the process chamber and is at least positioned below the process chamber, under the condition that the process chamber is broken, fragments of the process chamber can fall on the backing plate component below the process chamber, so that the backing plate component can catch the fragments of the process chamber and prevent the fragments from polluting the heating chamber. In addition, setting like this for the backing plate subassembly can play the guard action to the heating furnace, and the piece of technology cavity can drop on the surface of backing plate subassembly, when the piece of the interior technology cavity of clearance heating chamber, can clear up the piece of technology cavity at the surface of backing plate subassembly, thereby reduces the risk of piece scratch heating furnace, has prolonged the life of heating furnace.

Drawings

Fig. 1 is a schematic structural diagram of an application scenario suitable for a cushion assembly according to an embodiment of the present application.

Fig. 2 is a schematic view showing a part of a portion at B of the application scenario for the cushion assembly shown in fig. 1 according to an embodiment of the present application.

Fig. 3 is a schematic cross-sectional view along line A-A of the application scenario for the pad assembly shown in fig. 1 according to an embodiment of the present application.

Fig. 4 is a schematic structural view of a pad assembly according to an embodiment of the present application.

FIG. 5 is a cross-sectional view of a shim plate assembly according to one embodiment of the present application.

Fig. 6 is a schematic structural diagram of a pad according to an embodiment of the present application.

Fig. 7 is a schematic cross-sectional view along line A-A of the application scenario for the pad assembly shown in fig. 1 according to another embodiment of the present application.

Fig. 8 is a schematic structural view of a first pad and a second pad according to an embodiment of the present application.

Fig. 9 is a partially enlarged schematic illustration of a portion of the first pad of fig. 8 at C in accordance with an embodiment of the application.

Fig. 10 is a partially enlarged view of a portion D of the second pad shown in fig. 8 according to an embodiment of the present application.

Reference numerals:

1. Coating equipment; 10. a backing plate assembly; 11. a backing plate; 110. a first circular arc-shaped first end; 111. a first circular arc-shaped second end; 112. a first backing plate; 1120. a protrusion; 113. a second backing plate; 1130. a recess; 12. a second circular arc-shaped first end; 13. a second circular arc-shaped second end; 20. a heating furnace; 21. a heating chamber; 22. a heating wire; 30. a process chamber; alpha, a first included angle; beta, a second included angle.

Detailed Description

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

In the coating equipment, the process cavity is arranged in the heating cavity of the heating furnace. In some use scenarios, the process chamber is more brittle and harder. Because the brittleness of the process cavity is high, cracking can occur, and the heating cavity below is easy to be polluted after the process cavity is cracked. In some application scenarios, when the coating equipment is used for coating a piece to be coated (for example, a silicon wafer or a glass substrate), the inner wall of the process cavity is coated with a film layer, and as the process cavity is used for a long time, the thickness of the film layer coated on the inner wall of the process cavity is thicker and thicker, and the too thick film layer causes the stress on the process cavity to be too large, so that the process cavity is broken finally.

In addition, because the hardness of the process cavity fragments is higher, the fragments are also easy to scratch the heating furnace when the process cavity fragments in the heating cavity are cleaned.

In view of the above, the present application provides a backing plate assembly and a plating apparatus. The specific structure of the shim plate assembly and the coating apparatus are described in detail below with reference to the drawings and specific examples.

Fig. 1 is a schematic structural diagram of an application scenario suitable for a cushion assembly according to an embodiment of the present application. Fig. 2 is a schematic view illustrating a part of an application scenario of the pad assembly shown in fig. 1 according to an embodiment of the present application. Fig. 3 is a schematic cross-sectional view along line A-A of the application scenario for the pad assembly shown in fig. 1 according to an embodiment of the present application. Fig. 4 is a schematic structural view of a pad assembly according to an embodiment of the present application. FIG. 5 is a cross-sectional view of a shim plate assembly according to one embodiment of the present application. Fig. 6 is a schematic structural diagram of a pad according to an embodiment of the present application.

As shown in fig. 1 to 6, the pad assembly 10 is applied to the plating apparatus 1. The coating apparatus 1 comprises a heating furnace 20 and a process chamber 30. The heating furnace 20 includes a heating chamber 21, and a process chamber 30 is disposed within the heating chamber 21. The pad assembly 10 includes: at least one pad 11. The backing plate 11 is disposed between the heating chamber 21 and the process chamber 30. The backing plate 11 is located at least below the process chamber 30.

In some applications, the article to be coated (not shown) may be placed in the process chamber 30 of the coating apparatus 1 for coating. In some embodiments, the pallet assembly 10 includes one pallet 11. Illustratively, the pallet assembly 10 may be integrally formed.

Since the pad 11 is disposed between the heating chamber 21 and the process chamber 30 and at least below the process chamber 30, in case of chipping of the process chamber 30, the chips of the process chamber 30 may fall onto the pad assembly 10 therebelow, so that the pad assembly 10 may catch the chips of the process chamber 30 to prevent them from contaminating the heating chamber 21. In addition, the arrangement is such that the backing plate assembly 10 can protect the heating furnace 20, fragments of the process cavity 30 can fall on the surface of the backing plate assembly 10, and when the fragments of the process cavity 30 in the heating cavity are cleaned, the fragments of the process cavity 30 can be cleaned out on the surface of the backing plate assembly 10, so that the risk of scratching the heating furnace 20 by the fragments is reduced, and the service life of the heating furnace 20 is prolonged.

In some embodiments, as shown in fig. 1-3, the bottom of the heating chamber 21 includes a heating wire 22. The backing plate 11 is arranged on the heating wire 22. Since the bottom of the heating chamber 21 includes the heating wire 22, in some application scenarios of the prior art, when the process chamber 30 is broken, fragments of the process chamber 30 may fall on the heating wire 22 and into gaps between the heating wire 22 and the bottom of the heating chamber 21, making it more difficult to clean the fragments of the process chamber 30 in the heating chamber 21. In this embodiment, by arranging the pad 11 on the heating wire 22, fragments of the process chamber 30 can be prevented from falling on the heating wire 22 and in gaps between the heating wire 22 and the bottom of the heating chamber 21, so that the convenience and efficiency of cleaning fragments of the process chamber 30 are improved.

In addition, since the heater wire 22 in the heating furnace 20 may be tilted during the process of manufacturing or recycling, the tilted heater wire 22 may hinder the installation of the process chamber 30. The backing plate 11 provided in this embodiment is disposed on the heating wire 22, and the heating wire 22 in the heating furnace 20 can be flattened by the gravity of the backing plate 11, so that the process chamber 30 can be smoothly installed in the heating chamber 21.

In some embodiments, as shown in fig. 1-6, the heating chamber 21 is cylindrical in shape, placed horizontally. The cross-sectional shape of the backing plate 11 in the radial direction of the heating chamber 21 is a first circular arc shape, and the center of the first circular arc shape coincides with the axis of the heating chamber 21. The arrangement is such that the shape of the backing plate 11 can be adapted to the shape of the heating chamber 21 such that the backing plate 11 can be smoothly fitted into the heating chamber 21. The shape of the heating chamber 21 and the backing plate 11 may be set as desired. In some embodiments, the shape of the backing plate 11 may be configured according to the shape of the heating chamber 21 and/or the profile of the process chamber 30. In some embodiments, the thickness of the backing plate 11 may be set according to the gap between the heating chamber 21 and the process chamber 30. In some embodiments, the thickness of the pad 11 may be 6mm.

In some embodiments, as shown in fig. 1 and 3, the profile of the process chamber 30 includes a horizontally disposed cylinder. The cross-sectional shape of the backing plate 11 in the radial direction of the heating chamber 21, i.e. the center of the first circular arc, the axis of the heating chamber 21 and the axis of the process chamber 30 coincide. This is arranged so that both the backing plate 11 and the process chamber 30 can be smoothly loaded into the heating chamber 21. The shape of the process chamber 30 may be set according to actual needs as long as it can be installed in the heating chamber 21 in which the pad assembly 10 is installed.

In some embodiments, as shown in fig. 3, the cross-sectional shape of the pad assembly 10 in the radial direction of the heating chamber 21, that is, the first included angle α formed by the first circular arc-shaped first end 110, the center of the first circular arc-shaped circle, and the second circular arc-shaped end 111, is less than 180 ° on the side near the pad assembly 10. Since the problem that the backing plate 11 is difficult to be installed into the heating chamber 21 easily occurs when the first included angle α is greater than or equal to 180 °, the processing accuracy of the backing plate 11 is required to be high. In this embodiment, the first included angle α formed by the first circular arc end 110, the center of the first circular arc and the second circular arc end 111 and close to the side of the pad 11 is configured to be smaller than 180 °, so that the pad 11 can be more smoothly installed into the heating chamber 21, the requirement of the processing precision of the pad 11 is reduced, and the manufacturing efficiency of the pad assembly 10 is improved.

In some embodiments, as shown in fig. 3, the backing plate 11 is symmetrical with respect to a vertical plane in which the axis of the heating chamber 21 lies. Since the backing plate 11 is disposed below the process chamber 30 and the backing plate 11 is symmetrical with respect to the vertical plane in which the axis of the heating chamber 21 is located, the backing plate 11 is disposed directly below the process chamber 30 to catch more process chamber 30 fragments.

In some embodiments, as shown in fig. 1 and 4, the number of the pad plates 11 is plural. The plurality of backing plates 11 are connected in sequence along the axis direction of the heating chamber 21. By the arrangement, the cushion plate assembly 10 is formed by connecting a plurality of cushion plates 11 with smaller sizes, the production difficulty of the cushion plate assembly 10 is reduced, the yield of the cushion plate assembly 10 is improved, the production and the manufacture of the cushion plate assembly 10 are facilitated, and the length of the cushion plate assembly 10 can be flexibly adjusted to adapt to heating chambers 21 or process chambers 30 with different sizes.

Fig. 7 is a schematic cross-sectional view along line A-A of the application scenario for the pad assembly shown in fig. 1 according to another embodiment of the present application.

As shown in fig. 7, the number of the pad plates 11 is plural. The plurality of pad plates 11 are sequentially connected in the circumferential direction of the heating chamber 21 to form the second circular arc-shaped pad assembly 10. The center of the second circular arc coincides with the axis of the heating chamber 21. The second included angle beta formed by the first end 12 of the second circular arc, the center of the second circular arc and the second end 13 of the second circular arc, which is close to one side of the backing plate 11, is larger than or equal to 180 degrees. The setting like this for the backing plate subassembly 10 is formed by the connection of the less backing plate 11 of polylith size, has reduced the production degree of difficulty of backing plate subassembly 10, has improved the yield of backing plate subassembly 10, is convenient for the production manufacturing of backing plate subassembly 10, and, because backing plate subassembly 10 is connected gradually along the circumference of heating chamber 21 by a plurality of backing plates 11, the second contained angle beta that makes second convex first end 12, the centre of a circle of second convex and second end 13 of second convex be close to backing plate 11 one side can be configured to be greater than or equal to 180, makes carrier plate subassembly 10 can catch the piece of more process cavity 30.

Fig. 8 is a schematic structural view of a first pad and a second pad according to an embodiment of the present application. Fig. 9 is a partially enlarged schematic illustration of a portion of the first pad of fig. 8 at C in accordance with an embodiment of the application. Fig. 10 is a partially enlarged view of a portion D of the second pad shown in fig. 8 according to an embodiment of the present application.

As shown in fig. 8 to 10, at least one pad 11 includes a first pad 112 and a second pad 113 that are adjacently disposed. The first pad 112 and the second pad 113 are detachably connected. The detachable connection can be in the connection modes of bonding, plugging, screw connection, riveting and the like. The first pad 112 and the second pad 113 may be in planar contact only, and are not fixedly connected.

Illustratively, a male-female connection may be provided between the first pad 112 and the second pad 113. The first pad 112 has a protrusion 1120 at a side contacting the second pad 113. The second pad 113 has a recess 1130 at a side contacting the first pad 112. The protrusion 1120 is in concave-convex connection with the recess 1130. So arranged, the first and second backing plates 112 and 113 can be brought into close contact, and fragments of the process furnace body 30 falling on the backing plate 11 are difficult to fall into the heating chamber 21 below the backing plate 11 from the gap between the first and second backing plates 112 and 113. In some embodiments, the pad assembly 10 includes a plurality of pads 11, and the plurality of pads 11 may be connected by a male-female connection. In some embodiments, the connection between the plurality of pads 11 is a detachable connection, or may be a fixed connection.

In some embodiments, the pad plates 11, or the first pad plate 112 and the second pad plate 113 may be connected by other means. The pads 11 may be connected by a high temperature resistant adhesive, for example. For example, the high temperature resistant adhesive may include an epoxy glue or the like.

In some embodiments, the pad 11 may be made of transparent quartz or infrared radiation ceramics. The surface of the backing plate 11, which is made of quartz or infrared radiation ceramic, is smoother, so that the process chamber 30 can be more smoothly installed in the heating chamber 21. Furthermore, in some application scenarios, the heater wire 22 heats the process chamber 30 by way of heat transfer and light radiation. Because the material of the backing plate 11 is configured as transparent quartz, the light emitted by the heating wire 22 can pass through the backing plate 11, and the heating efficiency of the heating wire 22 on the process chamber 30 is improved. In some embodiments, the material of the pad 11 is configured as an infrared radiating ceramic. This arrangement can increase the heating efficiency of the heater wire 22 to the process chamber 30, since the infrared radiation ceramic has the effect of generating infrared radiation to heat the object. In some applications, the heater wire 22 heats the process chamber 30 by way of heat transfer. The pad 11 may be made of any material capable of transferring heat. Illustratively, the backing plate 11 may be made of metal or silicon carbide.

As shown in fig. 1 to 3, the embodiment of the application further provides a coating device 1. The coating apparatus 1 includes: a furnace 20, a process chamber 30, and a backing plate assembly 10 as described in any of the embodiments above. The heating furnace 20 includes a heating chamber 21. A process chamber 30 is disposed within the heating chamber 21. The backing plate assembly 10 is disposed between the heating chamber and the process chamber 21. The composition and structure of the pad assembly 10 is described in detail above and will not be described in detail herein. The coating apparatus 1 may be used for coating a piece to be coated (not shown in the figures). In some embodiments, the coating apparatus 1 further comprises other structures or devices.

In the coating apparatus 1, since the pad 11 is disposed between the heating chamber 21 and the process chamber 30 and at least below the process chamber 30, in case that the process chamber 30 is broken, fragments of the process chamber 30 may fall on the pad assembly 10 below the same, so that the pad assembly 10 may catch fragments of the process chamber 30, preventing them from contaminating the heating chamber. In addition, the arrangement is such that the backing plate assembly 10 can protect the heating furnace 20, fragments of the process cavity 30 can fall on the surface of the backing plate assembly 10, and when the fragments of the process cavity 30 in the heating cavity are cleaned, the fragments of the process cavity 30 can be cleaned out on the surface of the backing plate assembly 10, so that the risk of scratching the heating furnace 20 by the fragments is reduced, and the service life of the heating furnace 20 is prolonged.

Since the plating apparatus 1 includes the pad assembly 10, the plating apparatus 1 has all technical features and technical effects of the pad assembly 10, which are not described herein.

Reference in the specification to "one embodiment," "an embodiment," etc., means that a particular feature, structure, or characteristic may be included in the embodiments described, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

It should be understood that the terms "on … …", "above … …" and "above … …" in this disclosure should be interpreted in the broadest sense so that "on … …" means not only "directly on something" but also includes "on something" with intermediate features or layers therebetween, and "above … …" or "above … …" includes not only "on something" or "above" but also "above something" or "above" with no intermediate features or layers therebetween (i.e., directly on something).

Further, spatially relative terms, such as "below," "beneath," "above," "over," and the like, may be used herein for ease of description to describe one component or feature's relationship to another component or feature as illustrated. Spatially relative terms are intended to encompass different orientations of the component in use or operation in addition to the orientation depicted in the figures. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is to be construed as including any modifications, equivalents, and alternatives falling within the spirit and principles of the application.

Claims (10)

1. The utility model provides a backing plate subassembly, its characterized in that is applied to coating equipment, coating equipment includes heating furnace and process chamber, the heating furnace includes the heating cavity, the process chamber set up in the heating cavity, the backing plate subassembly includes:

At least one backing plate disposed between the heating chamber and the process chamber;

wherein the backing plate is at least located below the process chamber.

2. The backing plate assembly of claim 1, wherein a bottom of the heating chamber comprises a heating wire;

Wherein, the backing plate set up in on the heater strip.

3. The backing plate assembly of claim 1, wherein the heating chamber is cylindrical in shape with a horizontal placement;

the cross section of the backing plate in the radial direction of the heating chamber is in a first circular arc shape, and the circle center of the first circular arc shape coincides with the axis of the heating chamber.

4. The mat assembly of claim 3, wherein a first included angle formed by the first end of the first circular arc, the center of the first circular arc, and the second end of the first circular arc is less than 180 ° on a side of the mat.

5. The shim plate assembly of claim 4, wherein the shim plate is symmetrical with respect to a vertical plane in which an axis of the heating chamber is located.

6. A pad assembly according to claim 3, wherein the number of pads is plural, and a plurality of pads are sequentially connected in the axial direction of the heating chamber.

7. The mat assembly of claim 3, wherein the plurality of mats are sequentially connected in a circumferential direction of the heating chamber to form a second circular arc-shaped mat assembly, a center of the second circular arc coincides with an axis of the heating chamber, and a second included angle formed by a first end of the second circular arc, the center of the second circular arc, and a second end of the second circular arc, which is close to one side of the mat, is greater than or equal to 180 °.

8. The mat assembly of any one of claims 1 to 7, wherein at least one of said mats comprises a first mat and a second mat disposed adjacent thereto;

The first backing plate is provided with a protrusion on one side contacting with the second backing plate, the second backing plate is provided with a recess on one side contacting with the first backing plate, and the protrusion is connected with the recess in a concave-convex mode.

9. The pad assembly according to any one of claims 1 to 7, wherein the pad is made of transparent quartz or infrared radiation ceramics.

10. A coating apparatus, characterized by comprising:

a heating furnace comprising a heating chamber;

The process cavity is arranged in the heating cavity;

the backing plate assembly of any one of claims 1 to 9, disposed between the heating chamber and the process chamber.