CN222033385U - Electrode patch and tumor electric field therapy system - Google Patents

Abstract

The application provides an electrode patch and a tumor electric field treatment system, the electrode patch comprises a flexible circuit board, a high polymer dielectric layer, a temperature sensor and an annular supporting plate. The flexible circuit board comprises a substrate, at least one conducting strip and at least one pair of conducting pads, wherein the conducting strips and the conducting pads are positioned on the same side of the substrate, the conducting strips are covered by a high polymer dielectric layer, and the temperature sensor is connected with the conducting pads in a welding way. The annular supporting plate is fixed on the flexible circuit board and is arranged in a shape surrounding the temperature sensor, and the annular supporting plate is filled with sealant for sealing the temperature sensor. The electrode patch and the tumor electric field treatment system provided by the application have the advantages that the annular supporting plate surrounding the temperature sensor is arranged on the flexible circuit board, so that the temperature sensor is conveniently subjected to glue filling sealing treatment, the cost is low, the process is stable, the manufacture is simple, and the like.

Description

Electrode patch and tumor electric field treatment system

Technical Field

The application relates to an electrode patch for tumor electric field treatment and a tumor electric field treatment system.

Background

Intermediate frequency alternating electric field therapy has proven to be an effective method for tumor therapy, in the whole therapy system, intermediate frequency alternating electric signals are generated by an electric field generator and transmitted to an adapter through a special cable, the adapter is transmitted to an electrode patch, the electrode patch is tightly attached to the skin surface of a patient, an effective therapeutic electric field is formed through coupling, and two vertical electric fields are formed at different moments, so that the mitosis progress of tumor cells is disturbed. In the process of electric field transmission, due to the existence of induction heating phenomenon, the alternating electromagnetic field generates eddy current, so that molecular motion is aggravated, loss is generated in tissues with different conductivities, and the lower the conductivity, the larger the heat productivity of the tissues is, and the loss is transmitted outwards in a heat form. The electrode patch used in the tumor electric field needs to be closely attached to the skin, so that the temperature rise effect of the skin surface with lower conductivity is aggravated, and the temperature at the skin is not suitable to be higher than 41 ℃ for a long time, so that the temperature of the skin surface is necessary to be monitored in real time.

The conventional electrode patch generally employs a thermistor as a temperature sensor and a ceramic sheet as a dielectric sheet, and since the ceramic dielectric sheet has a certain thickness, the temperature sensor is positioned in a center through hole of the dielectric sheet and sealed and fixed by injecting sealant into the through hole. However, as the polymer film material is applied to the electrode patch as a dielectric element, the thickness of the polymer film material is greatly reduced compared with that of a dielectric sheet of conventional ceramic, and the difficulty of the corresponding thermistor mounting process is also greatly increased.

There is a need to provide an improved electrode patch and tumor electric field therapy system.

Disclosure of utility model

The application provides an electrode patch which is thin and has a temperature sensor.

Specifically, the application is realized by the following technical scheme: the electrode patch comprises a flexible circuit board, a high polymer dielectric layer, a temperature sensor and an annular supporting plate, wherein the flexible circuit board comprises a substrate, at least one conducting sheet and at least one pair of conducting pads, wherein the conducting sheets and the at least one pair of conducting pads are arranged on the same side of the substrate, the high polymer dielectric layer covers the conducting sheets, and the temperature sensor is connected with the conducting pads in a welding way; the annular supporting plate is fixed on the flexible circuit board and is arranged in a shape surrounding the temperature sensor, and the annular supporting plate is filled with sealant for sealing the temperature sensor.

According to one embodiment of the utility model, the annular supporting plate and the base plate are tightly adhered in an adhesive mode.

According to one embodiment of the utility model, the annular supporting plate and the base plate are tightly attached in a welding mode.

According to one embodiment of the utility model, the annular support plate has a top end that is not lower than the temperature sensor.

According to one embodiment of the utility model, the annular support plate is an epoxy glass cloth laminate.

According to one embodiment of the present utility model, the flexible circuit board is provided with at least one first soldering lug and at least one pair of second soldering lugs, wherein the first soldering lug is electrically connected with the conductive sheet, and the second soldering lug is electrically connected with the corresponding conductive bonding pad.

According to one embodiment of the utility model, the conductive pads are located in the area surrounded by the corresponding conductive sheets, and the annular support plates are arranged at intervals from the corresponding conductive sheets.

According to one embodiment of the utility model, the conductive pads are located at the periphery of the corresponding conductive sheet, and the annular support plate is spaced from the corresponding conductive sheet.

According to one embodiment of the present utility model, the present utility model further comprises reinforcing plates disposed on opposite sides of the base plate corresponding to the annular support plate.

According to one embodiment of the present utility model, the polymer dielectric layer is formed on the surface of the conductive sheet by vacuum sputtering.

The annular supporting plate surrounding the temperature sensor is arranged on the flexible circuit board of the electrode patch, so that the temperature sensor is conveniently subjected to glue filling and sealing treatment, and the electrode patch has the advantages of low cost, stable process, simplicity in manufacturing and the like.

The application also provides a tumor electric field treatment system which comprises an electric field generator, an adapter electrically connected with the electric field generator and the electrode patch electrically connected with the adapter.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application as claimed.

Drawings

Fig. 1 is a perspective view of an electrode patch according to one embodiment of the present application;

FIG. 2 is a plan view of a flexible circuit board of the electrode patch of FIG. 1;

FIG. 3 is a side view of the electrode patch of FIG. 1;

FIG. 4 is an enlarged view of the inside of the rectangular box in FIG. 3;

fig. 5 is a plan view of a flexible circuit board of an electrode patch according to another embodiment of the present application;

Fig. 6 is a schematic diagram of a tumor electric field therapy system according to an embodiment of the application.

Reference numerals illustrate:

Electrode patches 1,1', electric field generator 2, adapter 3, tumor electric field therapy system 10, flexible circuit board 11, 11', substrates 111, 111', bonding pads 112, first bonding pads 1121, 1121', second bonding pads 1122, 1122', conductive pads 113, 113', conductive pads 114, 114', first conductive pad 1141, second conductive pad 1142, conductive trace 115, first conductive trace 1151, 1151', second conductive trace 1152, 1152', polymer dielectric layer 12, temperature sensor 13, support plate 14, accommodation chamber 141, sealant 15, reinforcing plate 16.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus, systems, devices, and methods that are consistent with aspects of the application.

The tumor electric field treatment system 10 shown in fig. 6 includes an electric field generator 2, a transducer 3 electrically connected to the electric field generator 2, and a plurality of electrode patches 1 electrically connected to the transducer 3.

Referring to fig. 1 to 3, an electrode patch 1 according to an embodiment of the present application is used in an electric field tumor treatment system 10, and can be applied to a body surface of a tumor site of a patient for electric field treatment. The electrode patch 1 comprises a flexible circuit board 11, a polymer dielectric layer 12, a temperature sensor 13, an annular supporting plate 14, sealant 15 and a reinforcing plate 16. The flexible circuit board 11 is positioned at the bottommost layer of the electrode patch 1 as a support layer and has the largest area. The polymer dielectric layer 12 covers the front surface of the flexible circuit board 11, and the temperature sensor 13 is disposed on the same side as the polymer dielectric layer 12 and avoids the coverage area of the polymer dielectric layer 12. The annular supporting plate 14 is sleeved on the periphery of the temperature sensor 13 and fixed on the flexible circuit board 11, and the temperature sensor 13 is encapsulated in the annular supporting plate 14 by the sealant 15. The stiffening plate 16 is mounted on the back of the flexible circuit board 11 at a position corresponding to the temperature sensor 13, and is used for reinforcing rigidity of the flexible circuit board 11 and providing support for welding the temperature sensor 13.

The flexible circuit board 11 includes a substrate 111, a bonding pad 112 disposed on the front surface of the substrate 111, a conductive sheet 113, a conductive pad 114, and a conductive trace 115 layered within the substrate 111. The flexible circuit board 11 has characteristics of light weight, thin thickness, flexibility, high flexibility, and the like. The substrate 111 is made of polyimide or polyester film, and has a shape not limited and a thickness not greater than 300 μm. The solder tab 112, the conductive sheet 113, the conductive pad 114 and the conductive trace 115 are made of conductive copper material, and are arranged on the substrate 111 according to design requirements. The soldering lug 112 is respectively arranged corresponding to the conductive lug 113 and the conductive bonding pad 114, and is electrically connected with the conductive trace 115, wherein the conductive lug 113 is electrically connected with the polymer dielectric layer 12, and the conductive bonding pad 114 is electrically connected with the temperature sensor 13. The soldering lug 112 is soldered to the electric field generator 2 or a wire (not shown) of the adapter 3 electrically connected to the electric field generator 2 to receive an alternating electric signal or direct current from the output of the electric field generator 2. The bonding pads 112 deliver alternating electrical signals to the conductive pads 113 through corresponding conductive traces 115 to form the electrical field required for treatment and direct current to the conductive pads 114 for temperature sensing by the temperature sensor 13.

In the present embodiment, the soldering tab 112 includes a first soldering tab 1121 and two second soldering tabs 1122, the conductive trace 115 corresponding to the soldering tab 112 includes a first conductive trace 1151 and two second conductive traces 1152, wherein the first conductive trace 1151 is electrically connected to the first soldering tab 1121 and the conductive tab 113, respectively, and the second conductive trace 1152 is electrically connected to the second soldering tab 1122 and the corresponding conductive pad 114, respectively. The first conductive trace 1151 and the second conductive trace 1152 are layered on different layers in the substrate 111 of the flexible circuit board, and are electrically connected to the soldering lug 112, the conductive sheet 113 and the conductive pad 114 through conductive channels (not shown) of different layers in the substrate 111 of the flexible circuit board 11. The first bonding pad 1121 receives an alternating electrical signal from the electric field generator 2 and transmits it through the first conductive trace 1151 onto the conductive pad 113. The second tab 1122 receives direct current from the electric field generator 2 and is transmitted to the two conductive pads 114 via the second conductive trace 1152, respectively, and is further transmitted to the temperature sensor 13 electrically connected to the conductive pads 114 via the conductive pads 114.

In this embodiment, the two conductive pads 114 are located in the exposed area surrounded by the conductive sheet 113. As shown in fig. 2, an avoidance area 131 for exposing the conductive pads 114 is formed at the center of the conductive sheet 113, two conductive pads 114 are located in the avoidance area 131 and are not in contact with the conductive sheet 113, and the second conductive trace 1152 avoids the conductive sheet 113 and is electrically connected with the conductive pads 114. The bonding pad 112, the conductive pad 113 or the conductive pad 114 may have the same metal material and thickness, the thickness is not greater than 50 μm, and all protrude from the front surface of the substrate 111, and may be disposed on the substrate 111 by etching or bonding.

It can be understood that the position of the temperature sensor 13 of the electrode patch 1 on the flexible circuit board 11 can be set at will, that is, the relative positions of the conductive sheet 113 and the conductive pad 114 can be flexibly set according to the requirement. Referring to fig. 5, as a simple alternative, the conductive pads 114 'of the flexible circuit board 11' of the electrode patch 1 'in another embodiment are disposed on the periphery of the conductive sheet 113', and the first conductive traces 1151 'electrically connecting the first pads 1121' and the conductive sheet 113 'and the second conductive traces 1152' electrically connecting the second pads 1122 'and the conductive pads 114' are disposed on the same layer in the substrate 111 'of the flexible circuit board 11', so that other structures are unchanged and are not described herein.

Referring to fig. 3-4, the polymeric dielectric layer 12 functions like a conventional ceramic dielectric sheet that is used as a dielectric element for generating capacitive coupling to apply an alternating electric field to a patient. The polymer dielectric layer 12 is disposed on the conductive sheet 113 of the flexible circuit board 11 and electrically connected to the conductive sheet 113 to receive the alternating electrical signal. The polymer dielectric layer 12 is made of a thin film material having an amorphous orientation, high flexibility and high toughness, and has a high dielectric constant and low dielectric loss. In the present embodiment, the polymer dielectric layer 12 is formed on the surface of the conductive sheet 113 by vacuum sputtering. The thickness of the polymer dielectric layer 12 is not more than 300 μm.

The temperature sensor 13 is a thermistor having a negative temperature coefficient, and has a ground terminal (not shown) and a signal terminal (not shown), and is soldered to the two conductive pads 114. The annular supporting plate 14 is in a circular shape, the annular supporting plate 14 is made of hard material with certain rigidity and thickness, preferably epoxy glass cloth laminated board, is processed into a hollow ring shape penetrating up and down and is fixed on the front surface of the flexible circuit board 11 in an adhesive manner, or is welded on the front surface of the flexible circuit board 11 in a manner of arranging a bonding pad below the annular supporting plate. The annular supporting plate 14 is arranged on the periphery of the temperature sensor 13 in a surrounding mode, and forms an accommodating cavity 141 for accommodating the temperature sensor 13 together with the flexible circuit board 11, so that the temperature sensor 13 is conveniently encapsulated with the sealant 15, and the height of the annular supporting plate 14 is not lower than the top surface height of the temperature sensor 13. The annular support plate 14 is spaced apart from the conductive sheet 113 or the polymer dielectric layer 12, preventing the sealant 15 from adhering to the polymer dielectric layer 12 when the bottom of the outer circumference of the annular support plate 14 is glued.

The sealant 15 is formed by curing a curing agent with fluidity and biosafety through high temperature or light with specific wavelength, and has excellent shock resistance and electric corrosion resistance after forming, and is preferably single-component epoxy resin or polyurethane acrylate. The sealant 15 is filled into the accommodating cavity 141 and fully wraps the temperature sensor 13, and the filled sealant 15 can be slightly higher than the top surface of the annular supporting plate 14, but cannot overflow to the surface of the conductive sheet 113 or the polymer dielectric layer 12, and the temperature sensor 13 can be sealed after the sealant is filled and cured.

The stiffener 16 may provide reliable support for the soldering of the temperature sensor 13, the stiffener 16 may be an epoxy glass laminated board or polyimide, with a thickness of 0.1mm to 2mm, which is slightly larger than the projected area of the soldering area of the temperature sensor 13, but in other embodiments, the stiffener 16 may be replaced by increasing the thickness of the substrate 111 of the flexible circuit board 11 by a suitable amount.

The application also provides a manufacturing method of the electrode patch 1, which comprises the following steps:

S1: providing a flexible circuit board 11, wherein the flexible circuit board 11 is provided with at least one conductive sheet 113 and at least one pair of conductive pads 114 which are arranged on the same side;

S2: providing at least one temperature sensor 13, and disposing the temperature sensor 13 on the flexible circuit board 11 in such a manner as to be soldered with a pair of conductive pads 114;

S3: providing an annular supporting plate 14, and fixedly arranging the supporting plate 4 on the flexible circuit board 11 in a mode of being annularly arranged on the periphery of the temperature sensor 13;

S4: filling the inside of the annular supporting plate 14 with the sealant 15 with high fluidity until the sealant 15 completely wraps the temperature sensor 13 positioned in the annular supporting plate 14 and then curing the sealant 15;

S5: a polymer material having a high dielectric constant is provided and attached to the conductive sheet 113 by sputtering to form a polymer dielectric layer 12 covering the conductive sheet 113.

In step S1, the flexible circuit board 11 further has a plurality of bonding pads 112 electrically connected to external wires (not shown) and a plurality of conductive traces 115 correspondingly connected to the bonding pads 112 and the conductive pads 113 or the conductive pads 114, respectively. The conductive pad 114 may be provided in a region surrounded by the conductive sheet 113, or may be provided on the outer periphery of the conductive sheet 113. The flexible circuit board 11 is polyimide, and the thickness of the flexible circuit board 11 is not more than 300 μm.

After step S1, at least one stiffener 16 may also be provided and the stiffener 16 may be adhered to the back surface of the flexible circuit board 11 in a manner corresponding to the pair of conductive pads 114.

In step S3, the annular support plate 14 is an epoxy glass laminated board and is fixed on the flexible circuit board 11 in an adhesive manner or fixed on the flexible circuit board 11 in a welding manner.

In step S4, the sealing compound filling is further performed at the interface between the bottom periphery of the annular support plate 14 and the flexible circuit board 11. Wherein the sealant is a curing adhesive and can be cured at high temperature or by illumination.

In step S5, the polymer dielectric layer 12 is made of a polymer having a dielectric constant of not less than 20 and a dielectric strength of not less than 40V/μm to avoid breakdown under normal applied voltage. The polymer is a polymer with relaxor ferroelectric behavior, and can be a vinylidene fluoride polymer such as P (VDF-TrFE-CTFE), P (VDF-TrFE-CFE) or P (VDF-TrFE-CFE-CTFE), and can be a polyamide composite material such as piperazine-Biuret copolyamide, etc. The thickness of the polymer dielectric layer 12 is not more than 300 μm.

Step S6 may be further included after step S5: an alloy material is provided and deposited on the polymer dielectric layer 12 by vapor deposition to form an alloy layer (not shown). The alloy material can be one or more of zinc-aluminum alloy, zinc-copper alloy, silver or graphite, and the thickness of the alloy layer is not more than 50 mu m. The electrode patch 1 is further provided with a biosafety protection layer (not shown) in contact with a human body, for example, conductive gel, and the polymer dielectric layer 12 and the biosafety protection layer (not shown) cannot be directly bonded, so that an alloy layer (not shown) is covered on the polymer dielectric layer 12, and then the alloy layer (not shown) and the biosafety protection layer (not shown) are bonded through the bonding layer (not shown) to realize the installation of the biosafety protection layer (not shown).

The electrode patches 1 and 1 'form the accommodating cavity 141 surrounding the temperature sensor 13 by arranging the annular supporting plates 14 on the flexible circuit boards 11 and 11', so that the temperature sensor 13 is conveniently sealed by glue filling, the cost is low, the process is stable, and the manufacturing is simple. Likewise, the thickness of the polymer dielectric layer 12 on the flexible circuit boards 11, 11 'is not required, and the temperature measurement requirement of the ultra-thin electrode patches 1,1' can be met.

The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the application.

Claims (11)

1. An electrode patch, characterized by: the flexible circuit board comprises a base plate, at least one conducting sheet and at least one pair of conducting pads, wherein the conducting sheets and the at least one pair of conducting pads are arranged on the same side of the base plate, the conducting sheets are covered by the polymer dielectric layer, and the temperature sensor is in butt welding connection with the conducting pads; the annular supporting plate is fixed on the flexible circuit board and is arranged in a shape surrounding the temperature sensor, and the annular supporting plate is filled with sealant for sealing the temperature sensor.

2. The electrode patch of claim 1, wherein: the annular supporting plate is tightly attached to the base plate in an adhesive mode.

3. The electrode patch of claim 1, wherein: the annular supporting plate is tightly attached to the base plate in a welding mode.

4. The electrode patch of claim 1, wherein: the annular support plate has a top end not lower than the temperature sensor.

5. The electrode patch of claim 1, wherein: the annular supporting plate is an epoxy glass cloth laminated plate.

6. The electrode patch of claim 1, wherein: the flexible circuit board is provided with at least one first soldering lug and at least one pair of second soldering lugs, the first soldering lug is electrically connected with the conductive sheet, and the second soldering lug is electrically connected with the corresponding conductive bonding pad.

7. The electrode patch of claim 1, wherein: the conductive pads are located in the corresponding areas surrounded by the conductive sheets, and the annular support plates and the corresponding conductive sheets are arranged at intervals.

8. The electrode patch of claim 1, wherein: the conductive pads are located at the periphery of the corresponding conductive sheet, and the annular support plates are arranged at intervals with the corresponding conductive sheet.

9. The electrode patch of claim 1, wherein: the annular supporting plate is arranged on the two opposite sides of the base plate.

10. The electrode patch of claim 1, wherein: the high polymer dielectric layer is formed on the surface of the conducting strip in a vacuum sputtering mode.

11. A tumor electric field therapy system, characterized by: an electrode patch according to any one of claims 1-10 comprising an electric field generator, an adapter electrically connected to the electric field generator, and an electrode patch electrically connected to the adapter.