CN222015400U - Integrated circuit board with heat dissipation mechanism - Google Patents
Integrated circuit board with heat dissipation mechanism Download PDFInfo
- Publication number
- CN222015400U CN222015400U CN202420652927.2U CN202420652927U CN222015400U CN 222015400 U CN222015400 U CN 222015400U CN 202420652927 U CN202420652927 U CN 202420652927U CN 222015400 U CN222015400 U CN 222015400U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- dissipation mechanism
- integrated circuit
- circuit board
- air outlet
- Prior art date
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 72
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 8
- 230000001681 protective effect Effects 0.000 claims abstract description 5
- 230000000694 effects Effects 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 description 20
- 230000001105 regulatory effect Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型公开了一种具有散热机构的集成电路板，包括散热机构，所述散热机构设在集成电路板的上方，所述散热机构的内部的中间位置设有凹槽，所述凹槽的内部设有快速散热风扇，所述凹槽的底端设有防护盖，所述散热机构的边缘位置设有铝制散热翅片。该实用新型中在风口导向框架的内部设有风向调节片，将风口导向框架设在散热机构的上方，不仅可以提高散热的效果，还可以对内部热量输送的方向进行调节，根据散热方向的需求，将每片风向调节片进行向左或向右进行翻转，从而对风口的方向进行调节定位，使热量输送的方位与装置壳体的散热口的方位相同，避免热量重新回流至集成电路板上，从而提高内部的散热效果。
The utility model discloses an integrated circuit board with a heat dissipation mechanism, including a heat dissipation mechanism, wherein the heat dissipation mechanism is arranged above the integrated circuit board, a groove is arranged in the middle position inside the heat dissipation mechanism, a fast heat dissipation fan is arranged inside the groove, a protective cover is arranged at the bottom end of the groove, and aluminum heat dissipation fins are arranged at the edge of the heat dissipation mechanism. In the utility model, a wind direction adjustment sheet is arranged inside the air outlet guide frame, and the air outlet guide frame is arranged above the heat dissipation mechanism, which can not only improve the heat dissipation effect, but also adjust the direction of internal heat transfer. According to the requirements of the heat dissipation direction, each wind direction adjustment sheet is flipped to the left or right, so as to adjust and position the direction of the air outlet, so that the direction of heat transfer is the same as the direction of the heat dissipation port of the device shell, so as to avoid the heat from flowing back to the integrated circuit board, thereby improving the internal heat dissipation effect.
Description
Technical Field
The utility model relates to the related field of integrated circuit boards, in particular to an integrated circuit board with a heat dissipation mechanism.
Background
The integrated circuit board is a carrier for carrying integrated circuits, the integrated circuit board is manufactured by adopting a semiconductor manufacturing process, a plurality of components such as transistors, resistors, capacitors and the like are manufactured on a small monocrystalline silicon wafer, the components are combined into a complete electronic circuit according to a multi-layer wiring or tunnel wiring method, the integrated circuit board can be divided into two main types of analog integrated circuit boards and digital according to different functions and structures, the analog is used for generating, amplifying and processing various analog signals, and the digital is used for generating, amplifying and processing various digital signals.
In the prior art, certain defects still exist in the use of the integrated circuit board, and the heat dissipation mode of the integrated circuit board is generally that an aluminum heat dissipation plate is arranged on a component with larger heat dissipation, and the heat dissipation mode is simple, but only conducts heat for a certain component, and the conducted heat can be gathered in the installation space of the whole integrated circuit board, so that the temperature of other components is increased, the conducted heat cannot be dissipated in time, and the internal heat dissipation effect is poor.
Disclosure of utility model
The utility model aims to provide an integrated circuit board with a heat dissipation mechanism, which solves the problems that the heat dissipation mode of the common integrated circuit board proposed in the background art is to install an aluminum heat dissipation plate on a component with larger heat dissipation, the heat dissipation mode is simple, but only one component can conduct heat, the exported heat can be gathered in the installation space of the whole integrated circuit board, the temperature of other components is increased, the exported heat cannot be timely dissipated, and the internal heat dissipation effect is poor.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an integrated circuit board with cooling mechanism, includes cooling mechanism, cooling mechanism establishes in the top of integrated circuit board, cooling mechanism's inside intermediate position is equipped with the recess, the inside of recess is equipped with quick radiator fan, the bottom of recess is equipped with the protective cover, cooling mechanism's border position is equipped with aluminium system radiating fin, cooling mechanism's four angle's of bottom position all is equipped with screw thread barrel casing, screw thread barrel casing's inside is equipped with mounting bolt, cooling mechanism's top is equipped with wind gap guiding frame, wind gap guiding frame's inside is equipped with wind direction regulating plate, the intermediate position of wind gap guiding frame's bottom surface is equipped with the thermovent.
In a further embodiment, the cross section of the heat dissipation mechanism is set to be a square structure, two sides of the middle position inside the air port guiding frame are provided with upper screw holes, fixing screws are arranged inside the upper screw holes, and the air port guiding frame and the heat dissipation mechanism are fixedly connected with the lower screw holes through the fixing screws.
In a further embodiment, a disassembly opening is formed in the position, aligned with the mounting bolt, of the bottom surface of the tuyere guiding frame, and the disassembly opening is in a circular structure.
In a further embodiment, the wind direction adjusting plate is connected with the tuyere guiding frame through an assembling clamping column, and the assembling clamping column is connected with the tuyere guiding frame through rotation.
In a further embodiment, the heat dissipation port is provided with a circular structure, and the size of the heat dissipation port is the same as the size of the groove.
In a further embodiment, the tuyere guiding frame is rectangular in structure.
Compared with the prior art, the utility model has the beneficial effects that:
According to the utility model, the wind direction regulating sheets are arranged in the wind gap guiding frame, the wind gap guiding frame is arranged above the heat dissipation mechanism, so that the heat dissipation effect can be improved, the direction of internal heat transportation can be regulated, each wind direction regulating sheet can be turned left or right according to the requirement of the heat dissipation direction, the direction of the wind gap is regulated and positioned, the heat transportation direction is the same as the direction of the heat dissipation opening of the device shell, the heat is prevented from flowing back to the integrated circuit board again, the internal heat dissipation effect is improved, the quick heat dissipation fan is arranged in the wind gap guiding frame, the internal heat can be quickly transmitted to the outside through the quick heat dissipation fan, and the device has good heat dissipation performance.
Drawings
FIG. 1 is a schematic diagram of an integrated circuit board with a heat dissipation mechanism according to the present utility model;
FIG. 2 is a side view of an integrated circuit board with a heat dissipation mechanism according to the present utility model;
FIG. 3 is a top view of the fast cooling fan of the present utility model;
FIG. 4 is a schematic cross-sectional view of the tuyere guiding frame of the present utility model;
FIG. 5 is a top view of the tuyere guiding frame of the present utility model;
fig. 6 is a schematic view showing a bottom structure of the tuyere guiding frame of the present utility model.
In the figure: 1. an integrated circuit board; 2. an air port guide frame; 3. a heat dissipation mechanism; 4. a wind direction adjusting sheet; 5. a threaded cylinder sleeve; 6. installing a bolt; 7. aluminum radiating fins; 8. a lower screw hole; 9. a groove; 10. a fast cooling fan; 11. a protective cover; 12. assembling a clamping column; 13. a set screw; 14. a disassembly and assembly opening; 15. an upper screw hole; 16. and a heat radiation port.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-6, an embodiment of the present utility model is provided: the utility model provides an integrated circuit board with cooling mechanism, including cooling mechanism 3, cooling mechanism 3 establishes in the top of integrated circuit board 1, the intermediate position of the inside of cooling mechanism 3 is equipped with recess 9, the inside of recess 9 is equipped with quick radiator fan 10, the bottom of recess 9 is equipped with protective cover 11, cooling mechanism 3's edge position is equipped with aluminium system radiating fin 7, the position at four angles of cooling mechanism 3's bottom all is equipped with screw thread barrel casing 5, screw thread barrel casing 5's inside is equipped with mounting bolt 6, cooling mechanism 3's top is equipped with wind gap guiding frame 2, wind gap guiding frame 2's inside is equipped with wind direction regulating plate 4, the intermediate position of the bottom surface of wind gap guiding frame 2 is equipped with thermovent 16.
The air inlet guide frame is used for hiding the rapid cooling fan 10 through the groove 9, the rapid cooling fan 10 is used for improving the internal cooling speed, the heat conductivity is increased through the aluminum cooling fins 7, the installation bolts 6 are used for installing the installation bolts 6 through the threaded cylinder sleeves 5, the heat dissipation mechanism 3 and the integrated circuit board 1 are fixedly installed through the installation bolts 6, the air inlet guide frame 2 is used for assembling a plurality of air inlet adjusting plates 4, the air inlet adjusting plates 4 are used for changing the direction of an air inlet, and the heat is convenient to outwards dissipate through the heat dissipation openings 16.
Further, the cross section of the heat dissipation mechanism 3 is set to be a square structure, two sides of the middle position inside the air port guide frame 2 are provided with upper screw holes 15, the inside of the upper screw holes 15 is provided with fixing screws 13, and the air port guide frame 2 and the heat dissipation mechanism 3 are fixedly connected with the lower screw holes 8 through the fixing screws 13.
The tuyere guiding frame 2 is convenient to be mounted or dismounted with the heat dissipation mechanism 3 by the fixing screws 13.
Further, a detachable opening 14 is provided at a position where the bottom surface of the tuyere guiding frame 2 is aligned with the mounting bolt 6, and the detachable opening 14 is formed in a circular structure.
The mounting bolts 6 are convenient to mount or dismount through the dismounting openings 14.
Further, the wind direction adjusting piece 4 is connected with the tuyere guiding frame 2 through the assembling clamping column 12, and the assembling clamping column 12 is connected with the tuyere guiding frame 2 through rotation.
The wind direction adjusting piece 4 and the wind gap guiding frame 2 are installed through the assembly clamping column 12, and the wind direction adjusting piece 4 can be turned and adjusted conveniently through the rotary connection.
Further, the heat dissipation port 16 is formed in a circular structure, and the size of the heat dissipation port 16 is the same as that of the groove 9.
Further, the tuyere guiding frame 2 has a rectangular structure.
Working principle: when the wind-direction adjusting device is used, the heat dissipation mechanism 3 is placed above components required by the upper side of the integrated circuit board 1, the wind-direction adjusting device is fixed through the mounting bolts 6, the wind-port guiding frame 2 is installed above the heat dissipation mechanism 3, the upper screw holes 15 are aligned with the lower screw holes 8, the wind-direction adjusting plate 4 is fixed through the fixing screws 13, the wind direction adjusting plate 4 is turned to a required angle according to the heat dissipation direction, the internal wind power is increased through the rapid heat dissipation fan 10, and the heat dissipation of the components is rapidly output.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420652927.2U CN222015400U (en) | 2024-04-01 | 2024-04-01 | Integrated circuit board with heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420652927.2U CN222015400U (en) | 2024-04-01 | 2024-04-01 | Integrated circuit board with heat dissipation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222015400U true CN222015400U (en) | 2024-11-15 |
Family
ID=93416874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420652927.2U Active CN222015400U (en) | 2024-04-01 | 2024-04-01 | Integrated circuit board with heat dissipation mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222015400U (en) |
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2024
- 2024-04-01 CN CN202420652927.2U patent/CN222015400U/en active Active
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