CN221928064U - Chip packaging structure, Clip copper sheet and strip - Google Patents

Abstract

The utility model provides a chip packaging structure, a Clip copper sheet and a strip, wherein the Clip copper sheet has a chip connection part, a lead connection part and an intermediate connection part connecting the chip connection part and the lead connection part, the chip connection part includes a contact surface for connecting to the chip and a side surface connected to the contact surface, the side surface of the chip connection part includes a first section close to the contact surface and a second section connected to the first section and away from the contact surface, and the second section is protruding relative to the first section. In the utility model, the side surface of the chip connection part is set as the first section close to the contact surface and the second section away from the contact surface, and the second section is set to protrude relative to the first section, so that when connecting the chip to the chip connection part of the Clip copper sheet, the protruding second section is used to block the overflowed solder to prevent the solder from climbing onto the surface of the chip connection part, thereby ensuring better connection quality when connecting on the surface of the chip connection part.

Description

Chip packaging structure, Clip copper sheet and strip

Technical Field

The utility model relates to the technical field of semiconductors, and in particular to a chip packaging structure, a Clip copper sheet and a strip.

Background Art

In current semiconductor packaging technology, the electrodes on the chip are often connected to the electrode pins on the lead frame through wires, thereby forming a path between the chip and the lead frame to achieve electrical lead-out of the chip. With the development of technology, copper clips have been used to replace wires, with copper clips as the connecting bridge between the chip and the lead frame.

Lead frames are used to carry chips, connect internal chips with external circuit board electrical signals, and install and fix electronic devices. Clip copper sheet welding, as a commonly used method of connecting chips to frames, replaces the standard wire bonding method between chips and pins to a certain extent, and can obtain unique package resistance values, higher current flow, and better thermal conductivity.

However, when the copper clip and the chip are soldered together, the solder often overflows and climbs onto the back side of the copper clip (the side opposite to the soldering surface), seriously affecting the subsequent soldering quality on the back side of the copper clip.

Utility Model Content

The utility model aims to provide a chip packaging structure, a Clip copper sheet and a strip, so as to improve the welding quality of the back side of the Clip copper sheet.

In order to solve the above technical problems, the utility model provides a Clip copper sheet, which has a chip connection part, a lead connection part and an intermediate connection part connecting the chip connection part and the lead connection part. The chip connection part includes a contact surface for connecting to the chip and a side surface connected to the contact surface. The side surface of the chip connection part includes a first section close to the contact surface and a second section connected to the first section and away from the contact surface. The second section is protruding relative to the first section.

Optionally, the first section is in a straight line shape, the first section is connected to the second section, and an angle between the first section and the contact surface is greater than or equal to 90°.

Optionally, the first section is at a right angle to the contact surface, and the second section is at a right angle.

Optionally, the first section forms a right angle with the contact surface, the second section is a straight line, and the second section forms an obtuse angle with the first section.

Optionally, the angle between the first section and the contact surface is an obtuse angle, and the second section is a right angle.

Optionally, the angle between the first section and the contact surface is an obtuse angle, the second section is a straight line, and the second section and the first section are a continuous straight line or a bent shape.

Optionally, the side surface of the lead connecting portion includes a third section close to the lead frame and a fourth section connected to the third section and away from the lead frame, and the fourth section is connected to the first section and protrudes relative to the third section.

According to another aspect of the present invention, a strip is provided, comprising:

A belt body, on which a mounting hole is provided;

A copper sheet Clip is connected to the mounting hole by connecting ribs, the copper sheet Clip having a chip connection portion, a lead connection portion, and an intermediate connection portion connecting the chip connection portion and the lead connection portion, the chip connection portion comprising a contact surface for connecting to the chip and a side surface connected to the contact surface, the side surface of the chip connection portion comprising a first section close to the contact surface and a second section connected to the first section and away from the contact surface, the second section being arranged to protrude relative to the first section.

Based on another aspect of the utility model, a chip packaging structure is also provided, including a Clip copper sheet,

The Clip copper sheet has a chip connection part, a lead connection part and an intermediate connection part connecting the chip connection part and the lead connection part. The chip connection part includes a contact surface for connecting to the chip and a side surface connected to the contact surface. The side surface of the chip connection part includes a first section close to the contact surface and a second section connected to the first section and away from the contact surface. The second section is protruding relative to the first section.

Optionally, a bonding structure is provided on a surface of the Clip copper sheet facing away from the contact surface.

In summary, the Clip copper sheet provided by the utility model includes a chip connection part, a lead connection part and an intermediate connection part. The chip connection part includes a contact surface for connecting to the chip and a side surface connected to the contact surface. The side surface of the chip connection part is set as a first section close to the contact surface and a second section away from the contact surface, and the second section is set to be protruding relative to the first section. When connecting (for example, welding) the chip and the chip connection part of the Clip copper sheet, the protruding second section is used to block the overflowed adhesive (for example, solder) to prevent the adhesive from climbing onto the surface of the chip connection part (the side away from the contact surface), thereby ensuring better connection quality (welding quality) when connecting on the surface of the chip connection part.

BRIEF DESCRIPTION OF THE DRAWINGS

Those skilled in the art should understand that the drawings provided are used to better understand the present invention and do not constitute any limitation to the present invention.

FIG1 is a schematic diagram of the end surface of a Clip copper sheet provided in Example 1;

FIG2 is a side view schematic diagram of the Clip copper sheet provided in Example 1;

3a to 3d are schematic diagrams of a plurality of Clip copper sheets provided in Example 1;

FIG. 4 is a schematic diagram of a chip packaging structure provided in the third embodiment.

In the attached figure:

10-substrate; 11-chip; 12-solder; 13-bonding structure; 20-Clip copper sheet; 21-chip connection part; 21a-contact surface; 21b-side; 211-first section; 212-second section; 22-middle connection part; 23-lead connection part.

DETAILED DESCRIPTION

In order to make the purpose, advantages and features of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing is different, and sometimes different scales are used.

It should be understood that when an element or layer is referred to as "on...", "connected to" other elements or layers, it can be directly on other elements or layers, connected to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on...", "directly connected to" other elements or layers, there is no intervening element or layer. Although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and/or parts, these elements, components, regions, layers and/or parts should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teaching of the present invention, the first element, component, region, layer or part discussed below can be expressed as a second element, component, region, layer or part. Spatial relationship terms such as "under...", "below", "below", "above...", "above", "above", etc., can be used here for the convenience of description to describe the relationship between an element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, the spatial relationship terms are intended to include different orientations of the devices in use and operation. For example, if the device in the accompanying drawings is turned over, then, the elements or features described as "under...", "below", "below" will be oriented to be "on" other elements or features. The device can be oriented in other ways (rotated 90 degrees or other orientations) and the spatial descriptors used here are interpreted accordingly. The purpose of the terms used here is only to describe specific embodiments and is not a limitation of the utility model. When used here, the singular forms of "one", "one" and "said/the" are also intended to include plural forms, unless the context clearly indicates another way. It should also be understood that the term "including" is used to determine the existence of features, steps, operations, elements and/or parts, but does not exclude the existence or addition of one or more other features, steps, operations, elements, parts and/or groups. When used here, the term "and/or" includes any and all combinations of the relevant listed items.

Embodiment 1

Embodiment 1 provides a Clip copper sheet.

FIG. 1 is a schematic diagram of the end face of the copper sheet Clip provided in the first embodiment; FIG. 2 is a schematic diagram of the side face of the copper sheet Clip provided in the first embodiment.

As shown in Figures 1 and 2, the Clip copper sheet 20 provided in this embodiment includes a chip connecting part 21, a lead connecting part 23 and an intermediate connecting part 22. The chip connecting part 21 includes a contact surface 21a for connecting to the chip and a side surface 21b connected to the contact surface 21a. The side surface 21b of the chip connecting part 21 includes a first section 211 close to the contact surface 21a and a second section 212 connected to the first section 211 and away from the contact surface 21a. The second section 212 is protruding relative to the first section 211.

Among them, the intermediate connection part 22 connects the chip connection part 21 and the lead connection part 23. Usually, the intermediate connection part 22 is raised relative to the contact surface 21a (such as the welding surface) of the chip connection part 21 to prevent it from being short-circuited on the chip surface. According to actual needs, one or at least two chip connection parts 21 can be connected to the intermediate connection part 22. At least two chip connection parts 21 and the intermediate connection part 22 can be arranged in a forked finger shape, and the side 21b of the chip connection part 21 can include all other side surfaces 21b (side walls) except those in contact with the intermediate connection part 22.

The cross-sectional view (cross-sectional view) of the side surface 21b of the chip connection portion 21 may include a first section 211 close to the contact surface 21a and a second section 212 away from the contact surface 21a (as shown in the corresponding dotted box in Figure 1), the first section 211 is connected to the contact surface 21a, the second section 212 is connected to the side of the chip connection portion 21 away from the contact surface 21a, the second section 212 is connected to the first section 211, and the second section 212 is protruding relative to the first section 211. When connecting (for example, welding) the chip and the chip connection portion 21 of the Clip copper sheet 20, the protruding second section 212 is used to block the overflowed adhesive (for example, solder) to prevent it from climbing onto the surface of the chip connection portion 21 (the side away from the contact surface 21a), thereby ensuring the connection quality (welding quality) on the surface of the chip connection portion 21. In addition, in other examples of this embodiment, another intermediate transition section may be provided between the second section 212 of the side surface 21 b and the first section 211 , that is, the first section 211 and the second section 212 are connected by the intermediate transition section.

In the example shown in FIG. 1 , the first section 211 may be in a straight line and at a right angle to the contact surface 21a, and the second section 212 may be in a right angle and protrude relative to the first section 211. The protruding width of the second section 212 may be determined according to the amount of solder used and the thickness of the Clip copper sheet 20 (chip connection portion 21). In this example, the thickness of the Clip copper sheet 20 may be 0.4 mm to 0.6 mm, the protruding width of the second section 212 relative to the first section 211 may be 0.2 mm to 0.3 mm, and the ratio of the thickness of the first section 211 to the second section 212 in the thickness direction may be 0.8:1 to 1:0.8.

In the example shown in FIG. 3a , the first section 211 may be in a straight line shape and have a right angle with the contact surface 21a, and the second section 212 may be in a straight line shape and have an obtuse angle with the first section 211. Compared with the second section 212 protruding in a right angle in FIG. 3a , the second section 212 in this example protrudes gradually in an inclined shape, thereby forming a larger solder accommodation space on the side 21b of the chip contact portion to provide a better blocking effect.

In the example shown in FIG. 3 b , the first section 211 is at an obtuse angle to the contact surface 21 a , and the second section 212 is at a right angle.

In the example shown in FIG. 3 c , the first segment 211 and the contact surface 21 a form an obtuse angle, the second segment 212 forms a straight line, and the second segment 212 and the first segment 211 form a continuous straight line, that is, the second segment 212 can be linearly extended from the first segment 211 .

In the example shown in FIG. 3 d , the angle between the first section 211 and the contact surface 21 a is an obtuse angle, the second section 212 is a straight line, and the second section 212 and the first section 211 are bent, and the bend is convex outward.

It is understandable that, considering that the Clip copper sheet 20 is actually manufactured by punching and bending the entire copper material using a punching die, in this embodiment, the shapes and angles of the first section 211 and the second section 212 of the Clip copper sheet 20 are straight lines and broken lines to facilitate manufacturing. In some other embodiments, under the condition that the manufacturing process allows, the first section 211 and/or the second section 212 may also include curves or rounded corners, wherein the settings of the first section 211 and the second section 212 may be similar to the above example.

In addition, the lead connection portion 23 of the Clip copper sheet 20 can also be set in the same way as the chip connection portion 21, that is, the side 21b of the lead connection portion 23 includes a third section close to the lead frame and a fourth section away from the lead frame, the fourth section is connected to the third section, and the fourth section is connected to the third section and protrudes relative to the third section.

Embodiment 2

Embodiment 2 provides a strip.

The strip provided in this embodiment includes a strip body and a plurality of Clip copper sheets arranged on the strip body. The strip body may include an upper frame and a lower frame that are surrounded by a ring, and a plurality of mounting holes (for example, rectangular) are arranged between the upper frame and the lower frame. However, when multiple rows of mounting holes are arranged between the upper frame and the lower frame, a strip body middle rib may be arranged between two adjacent rows of mounting holes for fixing. The Clip copper sheet is connected to the mounting hole by a plurality of connecting ribs, for example, two connecting ribs are arranged on both sides of the mounting hole to connect with the Clip copper sheet. Among them, the Clip copper sheet may have a chip connection part, a lead connection part, and an intermediate connection part connecting the chip connection part and the lead connection part. The chip connection part includes a contact surface for connecting to the chip and a side surface connected to the contact surface. The side surface of the chip connection part includes a first section close to the contact surface and a second section connected to the first section and away from the contact surface. The second section is arranged to protrude relative to the first section. The specific structure and setting of the Clip copper sheet can refer to the first embodiment, and will not be repeated here.

Embodiment 3

Embodiment 3 provides a chip packaging structure.

FIG. 4 is a schematic diagram of a chip packaging structure provided in the third embodiment.

As shown in FIG4 , the chip packaging structure provided in this embodiment includes a substrate 10, a chip 11, a lead frame (not shown), a Clip copper sheet 20 and a solder 12. Among them, the Clip copper sheet 20 may have a chip connection portion and a lead connection portion, and the chip connection portions of the substrate 10 and the Clip copper sheet 20 are respectively arranged on both sides of the chip 11, the substrate 10 is used to carry the chip 11, the chip connection portion is used to electrically connect to the chip 11 using the solder 12, and the lead connection portion is used to electrically connect to the frame electrode (such as a pin). Among them, the chip connection portion includes a contact surface for connecting to the chip and a side surface connected to the contact surface, and the side surface of the chip connection portion includes a first section close to the contact surface and a second section connected to the first section and away from the contact surface, and the second section is protruding relative to the first section. In particular, in some examples, please continue to refer to FIG4 , a bonding structure 13, such as a bonding wire, may also be provided on the surface of the chip connection portion of the Clip copper sheet 20.

In addition, in some examples, the substrate may also be part of a lead frame, that is, the lead frame includes a frame body and a frame electrode, and the frame electrode is used to replace the substrate to carry the chip, and the frame electrode is used to connect to the lead connection part of the Clip copper sheet.

The structure and arrangement of the Clip copper sheet in the third embodiment may be specifically referred to in the first embodiment, and will not be described in detail here.

In summary, the Clip copper sheet provided by the utility model includes a chip connection part, a lead connection part and an intermediate connection part. The chip connection part includes a contact surface for connecting to the chip and a side surface connected to the contact surface. The side surface of the chip connection part is set as a first section close to the contact surface and a second section away from the contact surface, and the second section is set to be protruding relative to the first section. When connecting (for example, welding) the chip and the chip connection part of the Clip copper sheet, the protruding second section is used to block the overflowed adhesive (for example, solder) to prevent the adhesive from climbing onto the surface of the chip connection part (the side away from the contact surface), thereby ensuring better connection quality (welding quality) when connecting on the surface of the chip connection part.

The above description is only a description of the preferred embodiment of the utility model, and is not any limitation on the scope of the utility model. Any changes and modifications made by ordinary technicians in the field of the utility model based on the above disclosure shall fall within the scope of protection of the claims.

Claims (10)

1. A Clip copper sheet, comprising a chip connection portion, a lead connection portion and an intermediate connection portion connecting the chip connection portion and the lead connection portion, wherein the chip connection portion comprises a contact surface for connecting to a chip and a side surface connected to the contact surface, the side surface of the chip connection portion comprises a first section close to the contact surface and a second section connected to the first section and away from the contact surface, and the second section is arranged to protrude relative to the first section. 2. The Clip copper sheet according to claim 1, characterized in that the first section is in a straight line shape, the first section is connected to the second section, and an angle between the first section and the contact surface is greater than or equal to 90°. 3. The copper clip according to claim 2, characterized in that the first section is at a right angle to the contact surface, and the second section is at a right angle. 4. The copper clip according to claim 2, characterized in that the angle between the first section and the contact surface is a right angle, the second section is a straight line, and the angle between the second section and the first section is an obtuse angle. 5 . The copper clip according to claim 2 , wherein the angle between the first section and the contact surface is an obtuse angle, and the second section is a right angle. 6 . The copper clip according to claim 2 , wherein the angle between the first section and the contact surface is an obtuse angle, the second section is a straight line, and the second section and the first section are a continuous straight line or a bent shape. 7. The Clip copper sheet according to claim 1 is characterized in that the lead connecting portion is used to connect to the lead frame, and the side of the lead connecting portion includes a third section close to the lead frame and a fourth section connected to the third section and away from the lead frame, and the fourth section is connected to the first section and protrudes relative to the third section. 8. A strip, characterized in that it comprises: A belt body, on which a mounting hole is provided; A copper sheet Clip is connected to the mounting hole by connecting ribs, the copper sheet Clip having a chip connection portion, a lead connection portion, and an intermediate connection portion connecting the chip connection portion and the lead connection portion, the chip connection portion comprising a contact surface for connecting to the chip and a side surface connected to the contact surface, the side surface of the chip connection portion comprising a first section close to the contact surface and a second section connected to the first section and away from the contact surface, the second section being arranged to protrude relative to the first section. 9. A chip packaging structure, characterized by comprising a Clip copper sheet, The Clip copper sheet has a chip connection part, a lead connection part and an intermediate connection part connecting the chip connection part and the lead connection part. The chip connection part includes a contact surface for connecting to the chip and a side surface connected to the contact surface. The side surface of the chip connection part includes a first section close to the contact surface and a second section connected to the first section and away from the contact surface. The second section is protruding relative to the first section. 10 . The chip packaging structure according to claim 9 , wherein a bonding structure is provided on a surface of the Clip copper sheet facing away from the contact surface.