CN221924255U - Drying equipment for silicon wafer tank cleaning machine - Google Patents

Abstract

The utility model provides drying equipment for a silicon wafer groove type cleaning machine, which comprises a drying groove, a bellows assembly, a heating device and a fan, wherein the bellows assembly, the heating device and the fan are arranged on the outer side of the drying groove and are sequentially connected through pipelines, the heating device and the fan are sequentially arranged below the bellows assembly, the bellows assembly comprises a mounting part and a filtering part, the mounting part is fixed on the groove wall of the drying groove, the filtering part is connected with the mounting part through a hose, and air flow generated by the fan sequentially passes through the heating device, the filtering part, the hose and the mounting part to enter the drying groove. The arrangement ensures that the operation of the replacement process of the filter element is simple while the sealing effect is improved, reduces the time required by the replacement of the filter element and improves the working efficiency; in addition, the wall of the drying groove is prevented from being damaged in the disassembly and assembly process.

Description

Drying equipment for silicon wafer tank cleaning machine

Technical Field

The utility model relates to the technical field of silicon wafer manufacturing, in particular to drying equipment for a silicon wafer tank cleaning machine.

Background Art

During the daily use of the tank cleaning equipment, it is necessary to check and replace the drying tank filter element that has reached the maintenance and replacement cycle. The existing drying tank filter bellows is relatively heavy, and the disassembly and installation are unchanged. Generally, two people are required to assist in the handling at the same time, which greatly increases the difficulty of the work. In addition, multiple disassembly and assembly can easily cause the threaded holes of the tank body to slip or the screws to break, and cause the sealing of the connection between the bellows and the drying tank to deteriorate. If not discovered and handled in time, it is easy to cause black spots, black dots, pollution, fragments, etc. on the silicon wafers, making it impossible to effectively control the product yield and fragmentation rate. In addition, it is necessary to stop heating in advance and cool the oven before dismantling and inspection, which is time-consuming and has low work efficiency.

Therefore, it is necessary to design a drying device for a silicon wafer tank cleaning machine to solve the above problems.

Utility Model Content

The utility model aims to provide a drying device for a silicon wafer tank cleaning machine which is convenient for disassembly, assembly and maintenance.

To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a drying device for a silicon wafer tank cleaning machine, which includes a drying tank, a bellows assembly, a heating device and a fan which are arranged on the outside of the drying tank and are connected in sequence through pipes, the heating device and the fan are arranged in sequence below the bellows assembly, the bellows assembly includes a mounting part and a filter part, the mounting part is fixed on the tank wall of the drying tank, the filter part is connected to the mounting part through a hose, and the airflow generated by the fan passes through the heating device, the filter part, the hose and the mounting part in sequence and enters the interior of the drying tank.

As a further improved technical solution of the utility model, the mounting portion is in the shape of a plate and has a plurality of through holes thereon. A first connecting tube is provided on the outer side of each through hole. A second connecting tube corresponding to the first connecting tube is provided on the filter portion. The first connecting tube is connected to the second connecting tube through a hose.

As a further improved technical solution of the utility model, both ends of the hose are fastened to the ends of the first connecting pipe and the second connecting pipe respectively through clamps.

As a further improved technical solution of the utility model, both ends of the hose are connected to the ends of the first connecting pipe and the second connecting pipe respectively through PP flexible joints.

As a further improved technical solution of the utility model, PP welding is added to the connection positions between the PP flexible joint and the first connecting pipe and the second connecting pipe.

As a further improved technical solution of the utility model, the hose is a corrugated tube.

As a further improved technical solution of the utility model, the number of the through holes is 3, and they are arranged in a horizontal row.

As a further improved technical solution of the utility model, the filter part includes a filter body having a accommodating cavity, a filter element arranged in the accommodating cavity and a cover body that encapsulates the filter element in the accommodating cavity, and the second connecting pipe is arranged on the cover body.

As a further improved technical solution of the utility model, a high temperature resistant sealing strip is provided between the mounting portion and the wall of the drying tank.

It can be seen from the above technical scheme that the drying equipment for the silicon wafer tank cleaning machine of the utility model arranges a hose connection between the mounting part and the filter part, thereby improving the sealing effect and simplifying the filter element replacement process; there is no need to fix the bellows assembly as a whole on the drying tank, which on the one hand avoids damage to the tank wall of the drying tank during the disassembly and assembly of the filter part, and on the other hand, there is no need to wait for the drying tank to cool down, and the temperature of the filter part only needs to be lowered to an operable level, thereby reducing the time required for filter element replacement and improving work efficiency.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a drying device for a silicon wafer tank cleaning machine according to an embodiment of the present invention.

FIG. 2 is an exploded view of the filter bellows in FIG. 1 .

DETAILED DESCRIPTION

In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

As shown in FIG1 , the utility model provides a drying device for a silicon wafer tank cleaning machine, which includes a drying tank 40, a bellows assembly 30, a heating device 20 and a fan 10, which are arranged outside the drying tank 40 and are connected in sequence through a pipeline. In this embodiment, the heating device 20 and the fan 10 are arranged in sequence below the bellows assembly 30, and the bellows assembly 30 is placed on the heating device 20. In other embodiments, the bellows assembly can also be placed by setting a bracket, which is not limited here.

The heating device 20 is preferably an air duct type electric heater, which can keep the air flow temperature at a stable level. The fan 10 can be selected according to the actual required air volume, which will not be described in detail here.

Please refer to FIG. 2 , the bellows assembly 30 includes a filter body 31 having a receiving cavity, a filter element 32 disposed in the receiving cavity, a cover 33 for encapsulating the filter element 32 in the receiving cavity 312, a mounting portion 34 and a hose 35. The filter body 31, the filter element 32 and the cover 33 constitute a filter portion of the bellows assembly 30, and the filter portion is connected to the mounting portion 34 via a hose 35.

The mounting portion 34 is fixed to the wall of the drying tank 40. A high temperature resistant sealing strip is provided between the mounting portion 34 and the wall of the drying tank 40 to increase the sealing between the mounting portion 34 and the wall, effectively reducing air leakage caused by loose fitting. The airflow generated by the fan 10 passes through the heating device 20, the filter portion 30, the hose 35 and the mounting portion 34 in sequence and enters the interior of the drying tank 40. The mounting portion 34 is in the shape of a plate and has a plurality of through holes formed thereon. A first connecting pipe 341 is provided on the outer side of each through hole. The number of through holes is 3 and they are arranged in a horizontal row.

The filter unit is provided with a second connecting pipe 331 corresponding to the first connecting pipe 341. Specifically, the second connecting pipe 331 is provided on the cover body 33. The hose 35 is connected between the first connecting pipe 341 and the second connecting pipe 331. The hose 35 is preferably a corrugated tube.

There are many ways to connect the hose 35 to the first connecting pipe 341 and the second connecting pipe 331. One of the connection methods is that the two ends of the hose 35 are fastened to the ends of the first connecting pipe 341 and the second connecting pipe 331 by clamps. Another connection method is that the two ends of the hose 35 are connected to the ends of the first connecting pipe 341 and the second connecting pipe 331 by PP unions. Preferably, PP welding is added to the connection position between the PP union and the first connecting pipe 341 and the second connecting pipe 331. The above connection methods can clamp the hose more efficiently to prevent the hose from falling off during the production process, effectively reduce air leakage, avoid batch rework caused by abnormal falling of the bellows assembly, and abnormal process black spots and black spots caused by air leakage, reduce abnormal rework, and improve production yield. Other connection methods can achieve a soft sealing connection between the first connecting pipe 341 and the second connecting pipe 331, which are not listed here one by one.

In summary, the drying equipment for silicon wafer tank cleaning machine of the utility model has the following advantages:

1. By setting a hose connection between the installation part and the filter part, when replacing the filter element, only the filter part needs to be disassembled, and there is no need to remove the entire bellows assembly from the drying tank. This not only reduces the disassembly time and makes the disassembly more efficient, but also reduces the wear and damage to the groove wall screw threads.

2. The filter part is set independently, and the size of the filter body and the cover can be designed according to the actual size of the filter element, which greatly reduces the overall weight of the bellows assembly and facilitates disassembly and assembly.

3. The filter part is set independently. On the one hand, it prevents hands from being scalded by the high temperature of the drying tank during the replacement of the filter element, reducing the risk of operation; on the other hand, there is no need to wait for the drying tank to cool down, but only the temperature of the filter part needs to be lowered to an operable level, which reduces the time required for filter element replacement and improves work efficiency.

4. The filter unit is set up independently, which improves the sealing effect and simplifies the replacement process of the filter element, reduces air leakage caused during the production process, and improves product yield and production capacity.

Terms such as "upper" and "lower" used herein to indicate spatial relative positions are used for the purpose of convenience to describe the relationship of one feature relative to another feature as shown in the drawings. It is understood that, depending on the placement of the product, the terms of spatial relative positions may be intended to include different orientations other than those shown in the drawings, and should not be construed as limitations on the claims.

In addition, the above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. The understanding of this specification should be based on the technical personnel in the relevant technical field. Although this specification has described the present invention in detail with reference to the above embodiments, ordinary technical personnel in the field should understand that the technical personnel in the relevant technical field can still modify or make equivalent substitutions to the present invention, and all technical solutions and improvements thereof that do not depart from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.

Claims (9)

1. A drying device for a silicon wafer tank cleaning machine, characterized in that it comprises a drying tank, a bellows assembly, a heating device and a fan which are arranged outside the drying tank and are connected in sequence through pipelines, the heating device and the fan are arranged in sequence below the bellows assembly, the bellows assembly comprises a mounting portion and a filtering portion, the mounting portion is fixed on the tank wall of the drying tank, the filtering portion is connected to the mounting portion through a hose, and the airflow generated by the fan passes through the heating device, the filtering portion, the hose and the mounting portion in sequence and enters the interior of the drying tank. 2. The drying equipment for the silicon wafer tank cleaning machine as described in claim 1 is characterized in that: the mounting portion is in the shape of a plate and has a plurality of through holes thereon, a first connecting tube is provided on the outer side of each through hole, a second connecting tube corresponding to the first connecting tube is provided on the filter portion, and the first connecting tube is connected to the second connecting tube through a hose. 3. The drying equipment for the silicon wafer tank cleaning machine as described in claim 2, characterized in that: both ends of the hose are fastened to the ends of the first connecting pipe and the second connecting pipe respectively through clamps. 4. The drying equipment for the silicon wafer tank cleaning machine as described in claim 2 is characterized in that: both ends of the hose are connected to the ends of the first connecting pipe and the second connecting pipe respectively through PP flexible joints. 5. The drying equipment for the silicon wafer tank cleaning machine as described in claim 4 is characterized in that: PP welding is added at the connection position between the PP flexible joint and the first connecting pipe and the second connecting pipe. 6. The drying equipment for a silicon wafer tank cleaning machine as described in claim 3, characterized in that the hose is a corrugated tube. 7. The drying equipment for the silicon wafer tank cleaning machine as described in claim 2 is characterized in that the number of the through holes is 3 and they are arranged in a horizontal row. 8. The drying equipment for the silicon wafer tank cleaning machine as described in claim 2 is characterized in that: the filter part includes a filter body with a accommodating cavity, a filter element arranged in the accommodating cavity and a cover body that encapsulates the filter element in the accommodating cavity, and the second connecting pipe is arranged on the cover body. 9. The drying device for a silicon wafer tank cleaning machine as described in claim 1, characterized in that a high temperature resistant sealing strip is provided between the mounting portion and the tank wall of the drying tank.