CN221880855U - Auxiliary support device for heat dissipation - Google Patents

Abstract

The utility model belongs to the technical field of heat dissipation brackets, and particularly relates to an auxiliary supporting device for heat dissipation, which comprises a supporting shell for supporting electronic equipment and a base hinged to one side surface of the supporting shell, wherein a supporting rod for adjusting the angle of the supporting shell is arranged between the base and the supporting shell, a placing groove is formed in one side surface of the supporting shell, which is close to the electronic equipment, a supporting panel is arranged above the placing groove, a plurality of first heat dissipation fins are arranged in the placing groove at intervals, one end of each first heat dissipation fin is jointly fixed with a first heat conduction block, a semiconductor refrigerating sheet is attached to one side surface of each first heat conduction block, which is far away from each heat dissipation fin, and the semiconductor refrigerating sheet is fixedly arranged in the supporting shell.

Description

Auxiliary support device for heat dissipation

Technical Field

The utility model belongs to the technical field of auxiliary heat dissipation, and in particular relates to an auxiliary supporting device for heat dissipation.

Background Art

During the use of current electronic devices, their CPU or graphics card parts will generate heat. The more complex the task being processed, the more heat generated by the corresponding CPU or graphics card parts will increase exponentially. In addition, most CPUs and graphics cards are installed in relatively sealed places with poor air flow. If the heat cannot be dissipated in time, the accumulated heat will not only seriously affect the performance of the device, causing the running speed to slow down, but also cause the surrounding temperature to rise rapidly, causing the surrounding electronic components to burn out or desolder, affecting the normal service life of the electronic equipment. In order to ensure the heat dissipation performance of electronic equipment, installing auxiliary heat dissipation brackets has become the mainstream method now.

For example, application number CN218767996U discloses a heat dissipation bracket, which rotates the limit block 90 degrees around the round rod, and then rotates the handle according to the size of the notebook to rotate the screw rod, thereby adjusting the position of the threaded block, and then placing the laptop on the placement plate, and then rotating the handle again, through fine-tuning, the corrugated rubber block slowly contacts the laptop and limits it laterally. In this way, when facing laptops of different sizes, the laptop is stabilized by the mutual cooperation of the lateral and longitudinal limits, and the fan arranged inside the placement plate is aimed at the bottom of the laptop to blow air, so as to actively dissipate the bottom of the laptop.

Although the above technical solution can improve the heat dissipation effect of existing electronic devices, it only uses an external fan for auxiliary heat dissipation, and the range of improvement in heat dissipation efficiency is limited. When the operating power of the electronic device is large, or the external ambient temperature is relatively high, even if the speed of the external fan is adjusted to the highest, it can only increase the heat exchange speed between the outside air and the electronic device, and the heat dissipation effect is limited. In addition, the higher the speed of the external fan, the greater the noise, which affects the user experience.

Utility Model Content

In view of this, the purpose of the present invention is to provide an auxiliary support device for heat dissipation, so as to solve the problem that the existing heat dissipation bracket has limited improvement on the heat dissipation efficiency of electronic equipment.

In order to achieve the above object, the utility model provides the following technical solutions:

An auxiliary support device for heat dissipation, comprising a support shell for supporting an electronic device and a base hinged on a side surface of the support shell, a support rod for adjusting the angle of the support shell is provided between the base and the support shell; a placement groove is provided on a side surface of the support shell close to the electronic device; a support panel is provided above the placement groove; the support panel is fixedly connected to the support shell, and a plurality of through holes arranged at intervals are provided on the surface of the support panel; a plurality of first heat dissipation fins arranged at intervals are provided inside the placement groove; the plurality of first heat dissipation fins are arranged in a vertical direction, and a first heat conductive block is fixed to one end of the plurality of first heat dissipation fins; a semiconductor cooling fin is attached to a side surface of the first heat conductive block away from the first heat dissipation fin, and the semiconductor cooling fin is fixedly arranged inside the support shell; two heat dissipation fans are also slidably provided in the placement groove; the two heat dissipation fans are both horizontally arranged above the first heat dissipation fins.

Furthermore, a second heat-conducting block is attached to a surface of the semiconductor refrigeration plate on one side away from the first heat-conducting block; a plurality of second heat-dissipating fins are fixed to a surface of the second heat-conducting block on one side away from the semiconductor refrigeration plate; the plurality of second heat-dissipating fins are arranged at intervals in the vertical direction; and a turbofan is fixed to the surface of the supporting shell for removing heat from the surface of the second heat-dissipating fins.

Furthermore, a protective shell is fixed to the back of the supporting shell; the semiconductor refrigeration plate, the second heat-conducting block and the second heat-dissipating fins are all within the coverage of the protective shell; a partition is vertically provided on the surface of the protective shell facing the supporting shell, and the partition is provided on the side close to the turbofan and the second heat-dissipating fins; the supporting panel and the partition are both made of sound-proof material, and the surface of the supporting panel facing the heat-dissipating fan is covered with sound-absorbing cotton, and part of the surface of the protective shell facing the turbofan is covered with the sound-absorbing cotton.

Furthermore, an adjustment member is provided between the outer surface of the two cooling fans and the support shell; the adjustment member includes a sleeve vertically fixed on the outer surface of the cooling fan and an adjustment rod passing through one end of the sleeve; the sleeves are horizontally arranged, and the end of the adjustment rod away from the sleeve is extended out of the support shell; the adjustment rod is rotatably connected to the support shell, and the outer surface of the adjustment rod is threadedly connected to the inner wall of the sleeve.

Furthermore, the surface of the support shell is provided with two strip-shaped through holes located below the support panel; a stopper with one end protruding from the surface of the support shell is slidably connected in the two strip-shaped through holes; a threaded rod for adjusting the position of the stopper is provided in the strip-shaped through hole; the threaded rod is arranged along the length direction of the strip-shaped through hole and is rotatably connected to the support shell; the stopper is penetrated by the threaded rod and is threadedly connected to the threaded rod.

Furthermore, a non-slip sticker is provided on the surface of the supporting shell and the supporting panel on one side in contact with the electronic device.

The beneficial effects of the utility model are:

1. The utility model improves the heat dissipation effect of electronic equipment through the cooperation of semiconductor refrigeration sheets and heat dissipation fans, and provides a second heat dissipation fin and a turbo fan at the heating end of the semiconductor refrigeration sheet for heat dissipation, thereby improving the upper limit of the cooling of the semiconductor refrigeration sheet, thereby effectively improving the upper limit of the heat dissipation of the electronic equipment, and by adjusting the position of the block and the heat dissipation fan, it can also be applied to the heat dissipation of electronic equipment of various sizes, thereby improving the scope of application of the utility model.

2. The utility model can effectively reduce the noise generated by the vortex fan when it is working through the cooperation of multiple partitions, sound-absorbing cotton and a protective shell. The supporting panel and the sound-absorbing cotton on its surface can effectively reduce the noise generated by the cooling fan when it is working, and can effectively improve the user experience.

Other advantages, objectives and features of the utility model will be described in the following description and will be apparent to those skilled in the art to some extent, or those skilled in the art can be taught from the practice of the utility model. The objectives and other advantages of the utility model can be realized and obtained through the following description.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to make the purpose, technical solution and beneficial effects of the utility model clearer, the utility model is described with the following drawings:

FIG1 is a top view of the support housing of the utility model;

Figure 2 is a schematic diagram of the support shell structure of the utility model;

Figure 3 is a second schematic diagram of the support housing structure of the utility model;

FIG4 is a schematic diagram of the structure of the heat dissipation fan and the first heat dissipation fin of the utility model;

FIG5 is a schematic diagram of the structure of the turbo fan and the second heat dissipation fins of the utility model;

FIG6 is an enlarged schematic diagram of point A in FIG4 ;

FIG. 7 is a schematic diagram of the protective shell structure.

The following are marked in the accompanying drawings:

1 supporting shell, 2 base, 3 supporting rod, 4 supporting panel, 5 first heat dissipation fin, 6 strip through hole, 7 semiconductor refrigeration plate, 8 heat dissipation fan, 9 second heat conduction block, 10 second heat dissipation fin, 11 turbo fan, 12 protective shell, 13 sleeve, 14 adjusting rod, 15 stopper, 16 threaded rod, 17 partition, 18 sound-absorbing cotton.

DETAILED DESCRIPTION

As shown in Figures 1 to 7,

An auxiliary support device for heat dissipation, comprising a support shell 1 for supporting an electronic device and a base 2 hinged on a side surface of the support shell 1, a support rod 3 for adjusting the angle of the support shell 1 is provided between the base 2 and the support shell 1, the support rod 3 is hinged to the support shell 1, and a plurality of abutment blocks cooperating with the support rod 3 are bonded to the upper surface of the base 2; a placement groove is provided on a side surface of the support shell 1 close to the electronic device; a support panel 4 is provided above the placement groove; the support panel 4 is fixedly connected to the support shell 1 by bolts, and a plurality of through holes arranged at intervals are provided on the surface of the support panel 4; a plurality of first heat dissipation holes arranged at intervals are provided inside the placement groove Heat fins 5; a plurality of the first heat dissipation fins 5 are arranged in a vertical direction, and a first heat conductive block (blocked in the figure and not shown) is welded together at one end of the plurality of first heat dissipation fins 5; a semiconductor cooling sheet 7 is attached to the surface of the first heat conductive block on the side away from the first heat dissipation fins 5, the first heat conductive block is attached to the cooling surface of the semiconductor cooling sheet 7, and thermal conductive silicone grease is filled between the semiconductor cooling sheet 7 and the first heat conductive block, and the semiconductor cooling sheet 7 is fixedly arranged inside the supporting shell 1; two heat dissipation fans 8 are also slidably arranged in the placement groove, and the outer ring surfaces of the two heat dissipation fans 8 are slidably connected to the groove surface; the two heat dissipation fans 8 are horizontally arranged above the first heat dissipation fins 5.

As shown in the figure, the electronic device is placed on the upper surface of the supporting shell 1, and a part of the back of the electronic device will be located on the supporting panel 4. Since the back of the current electronic device will have an air inlet for heat dissipation, even if the position of the air inlet is different, the position of the two cooling fans 8 can be adjusted so that the two cooling fans 8 are aligned with the air inlet of the electronic device; when heat dissipation is required, the semiconductor cooling plate 7 and the two cooling fans 8 are started at the same time, and the end surface of the semiconductor cooling plate 7 that is in contact with the first heat conductive block begins to cool, and transfers heat to the multiple first heat dissipation fins 5 through the first heat conductive block, so that the surface temperature of the first heat dissipation fins 5 is lower than the ambient temperature. When the two While the cooling fan 8 blows air toward the air inlet at the bottom of the electronic device, the other side of the cooling fan 8 absorbs the air around the first cooling fin 5. The air that has undergone heat exchange with the first cooling fin 5 is blown toward the air inlet at the bottom of the electronic device under the drive of the cooling fan 8. Compared with the surrounding uncooled air, the temperature inside the electronic device can be effectively reduced to achieve a rapid cooling effect. In addition, by increasing the power of the semiconductor refrigeration sheet 7 and the cooling fan 8, the cooling effect can be further improved. By moving the two cooling fans 8, they can be effectively aligned with the air inlet on the back of the electronic device, reducing the loss of the cooling fan 8 blowing into the air inlet of the electronic device, thereby improving the heat dissipation effect.

In this embodiment, a second heat-conducting block 9 is adhered to a surface of a side of the semiconductor refrigeration plate 7 away from the first heat-conducting block, and thermal grease is filled between the second heat-conducting block 9 and the surface of the semiconductor refrigeration plate 7; a plurality of second heat-dissipating fins 10 are welded to a surface of the second heat-conducting block 9 away from the semiconductor refrigeration plate 7; each second heat-dissipating fin 10 is placed horizontally, and a plurality of second heat-dissipating fins 10 are arranged at intervals in the vertical direction; two turbo fans 11 are fixed to a surface of a side of the support shell 1 away from the support panel 4 by bolts; the two turbo fans 11 are symmetrically arranged with respect to the support shell 1, and are used to take away the heat from the surface of the second heat-dissipating fin 10; a protective shell 12 is fixed to the surface of the support shell 1 by bolts, and a plurality of air inlets and air outlets are provided on the surface of the protective shell 12.

As shown in Figure 5, due to the working principle of the semiconductor refrigeration plate 7, the greater the power of its cooling surface, the greater the heat accumulated on the other side. Through the cooperation of the second heat conductive block 9 and the plurality of second heat sinking fins 10, the contact area between the heating end surface of the semiconductor refrigeration plate 7 and the air can be increased, and the heat on the surface of the second heat sinking fins 10 can be quickly taken away by the two turbo fans 11, thereby ensuring the normal operation of the semiconductor refrigeration plate 7, and the upper limit of the refrigeration of the semiconductor refrigeration plate 7, thereby improving the upper limit of the heat dissipation of the electronic equipment; the two turbo fans 11 are arranged in the middle position of the supporting shell 1, and the air outlet direction thereof is toward the two sides of the supporting shell 1, which can quickly take away the heat on the surface of the second heat sinking fins 10; the setting of the protective shell 12 can effectively protect the turbo fans 11 and the second heat sinking fins 10 for long-term stable operation, thereby improving the use stability of the heat dissipation auxiliary device.

In this embodiment, the back side of the support shell 1 is fixedly connected to the protective shell 12 by bolts; the semiconductor refrigeration plate 7, the second heat conductive block 9 and the second heat dissipating fins 10 are all within the coverage of the protective shell 12; a plurality of partitions 17 are vertically provided on the side surface of the protective shell 12 facing the support shell 1, and the plurality of partitions 17 are arranged around the side close to the turbofan 11 and the second heat dissipating fins 10; the support panel 4 and the partition 17 are made of sound insulation material (polyurethane board, plastic board and other materials with good sound insulation effect can be used), and the side surface of the support panel 4 facing the heat dissipating fan 8 is covered with sound-absorbing cotton 18 (not shown in the figure), and a part of the side surface of the protective shell 12 facing the turbofan 11 is also covered with the sound-absorbing cotton 18.

As shown in FIG7 , the arrangement of the multiple partitions 17 can guide the airflow blown out by the turbofan 11, so that the airflow blown out by the turbofan 11 can quickly take away the heat on the surface of the second heat sink fin 10 and flow out from the air outlet on the surface of the protective shell 12 (as can be seen from the figure, the two side surfaces of the protective shell are provided with air outlets). In addition, the multiple partitions 17 can also effectively isolate the noise generated by the high-speed flow of the airflow to a certain extent. The sound-absorbing cotton 18 on the surface of the protective shell 12 can also reduce the noise generated by the turbofan 11 when it is working to a certain extent. Through the mutual cooperation of the multiple partitions 17, the protective shell 12 and the sound-insulating cotton 18, the noise generated by the turbofan 11 and the airflow can be reduced, thereby improving the user experience. The cooperation between the support panel 4 and the sound-insulating cotton 18 on the back thereof can also reduce the noise of the heat dissipation fan 8 and the airflow blown out thereof, thereby further reducing the total noise and improving the user experience.

Among them, the cooling fan 8 can adopt a silent fan, such as Delta Electronics' AFB0812LB 12V 0.14A 8CM8015 ultra-silent fan, and the turbo fan 11 can adopt Pengda Blueprint Technology's silent MG55150V1-Q080-G99 vortex fan, to further reduce the noise generated when the heat dissipation support device is working.

In this embodiment, an adjusting member is provided between the outer surface of the two cooling fans 8 and the supporting shell 1; the adjusting member includes a sleeve 13 vertically bonded to the outer surface of the cooling fan 8 and an adjusting rod 14 penetrating one end of the sleeve 13; the sleeves 13 are horizontally arranged, and the end of the adjusting rod 14 away from the sleeve 13 is extended out of the supporting shell 1 and welded with a rotating handle; the adjusting rod 14 is rotatably connected to the supporting shell 1, and the outer surface of the adjusting rod 14 is threadedly connected to the inner wall of the sleeve 13; the two cooling fans 8 are horizontally slidably arranged in the placement groove.

As shown in the figure, the setting of the adjustment part can more conveniently adjust the position of the two cooling fans 8. By only turning the corresponding rotating handle of each cooling fan 8, the cooling fan 8 can be reciprocated in the horizontal direction and quickly aligned with the air inlet at the bottom of the electronic device. The operation is convenient and quick.

In this embodiment, the surface of the support shell 1 is provided with two strip-shaped through holes 6 located below the support panel 4; a stopper 15 with one end protruding from the surface of the support shell 1 is slidably connected in both of the strip-shaped through holes 6; a threaded rod 16 for adjusting the position of the stopper 15 is provided in the strip-shaped through hole 6; the threaded rod 16 is arranged along the length direction of the strip-shaped through hole 6 and is rotatably connected to the support shell 1, and a rotating handle is also bonded to one end of the threaded rod 16; the stopper 15 is penetrated by the threaded rod 16 and is threadedly connected thereto.

As shown in the figure, when the electronic device is placed on the supporting shell 1, the surfaces of the two blocks 15 abut against the surface of one side of the electronic device, which can effectively prevent the electronic device from sliding on the surface of the supporting shell 1 in a tilted state, thereby fixing the electronic device; and, when the sizes of the electronic devices are different, in order to always align the air inlet on the back of the electronic device with the cooling fan 8, the threaded rod 16 is driven to rotate by rotating the handle, so that the block 15 reciprocates in the length direction of the strip through hole 6, thereby adjusting the distance between the air inlet on the back of the electronic device and the cooling fan 8, so that the air inlet on the back of electronic devices of different sizes can be aligned with the cooling fan 8, the operation is simple and convenient, and the scope of application of the utility model is effectively improved.

In this embodiment, the surfaces of the supporting shell 1 and the supporting panel 4 that are in contact with the electronic device are both affixed with anti-skid stickers, which can effectively prevent the electronic device from sliding and ensure that the air inlet on the back of the electronic device is aligned with the cooling fan 8.

Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made in form and details without departing from the scope defined by the claims of the utility model.

Claims (6)

1. An auxiliary supporting device for heat dissipation comprises a supporting shell (1) for bearing electronic equipment and a base (2) hinged to one side surface of the supporting shell (1), wherein a supporting rod (3) for adjusting the angle of the supporting shell (1) is arranged between the base (2) and the supporting shell (1); the method is characterized in that: a placing groove is formed in the surface of one side, close to the electronic equipment, of the supporting shell (1); a support panel (4) is arranged above the placing groove; the support panel (4) is fixedly connected with the support shell (1), and a plurality of through holes which are arranged at intervals are formed in the surface of the support panel (4); a plurality of first radiating fins (5) which are arranged at intervals are arranged in the placing groove; the plurality of first radiating fins (5) are arranged along the vertical direction, and one ends of the plurality of first radiating fins (5) are jointly fixed with a first heat conduction block; a semiconductor refrigerating sheet (7) is attached to the surface of one side of the first heat conduction block, which is far away from the first radiating fins (5), and the semiconductor refrigerating sheet (7) is fixedly arranged in the support shell (1); two heat dissipation fans (8) are also arranged in the placing groove in a sliding manner; the two radiating fans (8) are horizontally arranged above the first radiating fins (5).

2. An auxiliary support device for heat dissipation according to claim 1, characterized in that: a second heat conducting block (9) is attached to the surface of one side, far away from the first heat conducting block, of the semiconductor refrigerating sheet (7); a plurality of second radiating fins (10) are fixed on the surface of one side of the second heat conduction block (9) far away from the semiconductor refrigerating sheet (7); the second radiating fins (10) are arranged at intervals along the vertical direction; the surface of the support shell (1) is fixedly provided with a turbofan (11) for taking away the heat on the surface of the second radiating fins (10).

3. An auxiliary support device for heat dissipation according to claim 2, characterized in that: a protective shell (12) is fixed on the back of the support shell (1); the semiconductor refrigerating sheet (7), the second heat conduction block (9) and the second heat dissipation fins (10) are all in the coverage range of the protection shell (12); a baffle plate (17) is vertically arranged on the surface of one side, facing the support shell (1), of the protective shell (12), and the baffle plate (17) is arranged on one side, close to the turbofan (11) and the second radiating fins (10); the support panel (4) and the partition plate (17) are made of sound insulation materials, sound absorption cotton (18) is covered on one side surface of the support panel (4) facing the cooling fan (8), and sound absorption cotton (18) is covered on one side part surface of the protection shell (12) facing the turbine fan (11).

4. An auxiliary support device for heat dissipation according to claim 3, wherein: an adjusting piece is arranged between the outer surfaces of the two radiating fans (8) and the supporting shell (1); the adjusting piece comprises a sleeve (13) vertically fixed on the outer surface of the cooling fan (8), and an adjusting rod (14) penetrating one end of the sleeve (13); the sleeves (13) are horizontally arranged, and one ends of the adjusting rods (14) far away from the sleeves (13) penetrate through the support shell (1); the adjusting rod (14) is rotationally connected with the supporting shell (1), and the outer surface of the adjusting rod (14) is in threaded connection with the inner wall of the sleeve (13).

5. An auxiliary support device for heat dissipation according to claim 4, wherein: two strip-shaped through holes (6) positioned below the support panel (4) are formed in the surface of the support shell (1); a stop block (15) with one end protruding out of the surface of the support shell (1) is slidably connected in each of the two strip-shaped through holes (6); a threaded rod (16) for adjusting the position of the stop block (15) is arranged in the strip-shaped through hole (6); the threaded rod (16) is arranged along the length direction of the strip-shaped through hole (6) and is rotationally connected with the support shell (1); the stop block (15) is arranged on the threaded rod (16) in a penetrating way and is in threaded connection with the threaded rod.

6. An auxiliary support device for heat dissipation according to claim 5, wherein: and the anti-slip patches are arranged on the surfaces of one side, which is contacted with the electronic equipment, of the support shell (1) and the support panel (4).