CN221861629U - A device for preparing glass micropores - Google Patents
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- CN221861629U CN221861629U CN202420263788.4U CN202420263788U CN221861629U CN 221861629 U CN221861629 U CN 221861629U CN 202420263788 U CN202420263788 U CN 202420263788U CN 221861629 U CN221861629 U CN 221861629U
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- 239000011521 glass Substances 0.000 title claims abstract description 44
- 239000007788 liquid Substances 0.000 claims abstract description 46
- 238000002360 preparation method Methods 0.000 claims abstract description 10
- 239000011148 porous material Substances 0.000 claims abstract description 7
- 230000010355 oscillation Effects 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 11
- 239000002253 acid Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 230000035515 penetration Effects 0.000 abstract description 2
- 239000012670 alkaline solution Substances 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 description 8
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 2
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000006089 photosensitive glass Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Abstract
本实用新型公开了一种玻璃微孔的制备装置,包括液体容器、激光扫描系统和超声波发生装置;液体容器盛装有腐蚀液;激光扫描系统用于对浸没在所述液体容器中的玻璃进行激光照射;超声波发生装置用于对液体容器中的腐蚀液进行超声振荡。本实用新型对浸没在酸或碱溶液中的玻璃进行激光照射,由于微爆裂和光致压力动力学等效果,改善腐蚀液流动性和渗透深度,较传统可以加工出更小的孔径直径,并具有更好的微孔形貌。
The utility model discloses a glass micropore preparation device, comprising a liquid container, a laser scanning system and an ultrasonic generator; the liquid container contains a corrosive liquid; the laser scanning system is used to perform laser irradiation on the glass immersed in the liquid container; the ultrasonic generator is used to perform ultrasonic oscillation on the corrosive liquid in the liquid container. The utility model performs laser irradiation on the glass immersed in an acid or alkaline solution, and due to the effects of micro-bursting and photo-induced pressure dynamics, the fluidity and penetration depth of the corrosive liquid are improved, and a smaller pore diameter can be processed than the traditional method, and the micropore morphology is better.
Description
技术领域Technical Field
本实用新型涉及玻璃微孔制造技术领域,尤其涉及一种玻璃微孔的制备装置。The utility model relates to the technical field of glass micropore manufacturing, in particular to a glass micropore preparation device.
背景技术Background Art
随着先进电路封装集成技术的出现,可以提供系统级电路架构方法,在芯片电路系统内部存在多个平面器件层的堆叠,经由硅通孔,在垂直方向实现互连,大幅缩小了芯片尺寸,且提高了芯片的晶体管密度,改善了层间电气互连性能,提升了芯片运行速度,降低了芯片的功耗。玻璃通孔是一种可以替代硅通孔的解决方案。其成本更低、具有优良的高频电学特征并且超薄玻璃衬底更容易被获得。但是高质量的玻璃微孔制备仍然面临技术难点。With the emergence of advanced circuit packaging and integration technology, a system-level circuit architecture method can be provided. There are multiple planar device layers stacked inside the chip circuit system, and interconnection is achieved in the vertical direction through silicon vias, which greatly reduces the chip size, increases the transistor density of the chip, improves the electrical interconnection performance between layers, increases the chip operation speed, and reduces the power consumption of the chip. Glass vias are a solution that can replace silicon vias. It has lower cost, excellent high-frequency electrical characteristics, and ultra-thin glass substrates are easier to obtain. However, the preparation of high-quality glass micropores still faces technical difficulties.
玻璃通孔通常的制备方法包括喷砂法、光敏玻璃法、聚焦放电法、激光烧蚀法等。这些方法仍然面临成本高、工艺复杂、加工精度低、存在微裂纹等问题。专利CN112864026公开了一种激光结合HF湿刻蚀加工TGV通孔的工艺。采用激光先打小孔,再由HF扩孔的办法加工玻璃微孔。但是仍然面临加工速度慢、成本高等问题。Common preparation methods for glass through holes include sandblasting, photosensitive glass method, focused discharge method, laser ablation method, etc. These methods still face problems such as high cost, complex process, low processing accuracy, and micro cracks. Patent CN112864026 discloses a process for processing TGV through holes by laser combined with HF wet etching. Laser is used to make small holes first, and then HF is used to expand the holes to process glass micropores. However, it still faces problems such as slow processing speed and high cost.
实用新型内容Utility Model Content
本实用新型的目的是提供一种玻璃微孔的制备装置,以解决现有技术中所存在的一个或多个技术问题,至少提供一种有益的选择或创造条件。The purpose of the utility model is to provide a glass micropore preparation device to solve one or more technical problems existing in the prior art and at least provide a beneficial choice or create conditions.
本实用新型为实现上述实用新型目的采用如下技术方案:The utility model adopts the following technical solutions to achieve the above utility model objectives:
本实用新型提供了一种玻璃微孔的制备装置,包括液体容器、激光扫描系统和超声波发生装置;The utility model provides a glass micropore preparation device, comprising a liquid container, a laser scanning system and an ultrasonic generating device;
所述液体容器盛装有腐蚀液;The liquid container contains corrosive liquid;
所述激光扫描系统用于对浸没在所述液体容器中的玻璃进行激光照射;The laser scanning system is used to perform laser irradiation on the glass immersed in the liquid container;
所述超声波发生装置用于对所述液体容器中的腐蚀液进行超声振荡。The ultrasonic generating device is used to perform ultrasonic oscillation on the corrosive liquid in the liquid container.
进一步地,所述激光扫描系统包括激光器和光路扫描系统;Further, the laser scanning system includes a laser and an optical path scanning system;
所述激光器用于发出脉冲激光光束,并通过所述光路扫描系统在所述液体容器中的玻璃表面扫描激光束,以形成微孔阵列。The laser is used to emit a pulsed laser beam, and the laser beam is scanned on the glass surface in the liquid container by the optical path scanning system to form a microhole array.
进一步地,所述激光器选用红外皮秒激光器或红外飞秒激光器。Furthermore, the laser is an infrared picosecond laser or an infrared femtosecond laser.
进一步地,所述激光器输出的脉冲激光光束的波长的取值范围为1020-1080nm。Furthermore, the wavelength of the pulsed laser beam output by the laser ranges from 1020 to 1080 nm.
进一步地,所述光路扫描系统包括沿激光光路依次排列的反射镜、振镜和场镜;Furthermore, the optical path scanning system comprises a reflector, a galvanometer and a field mirror arranged in sequence along the laser optical path;
所述反射镜、振镜和场镜位于所述液体容器的上方。The reflecting mirror, the galvanometer mirror and the field mirror are located above the liquid container.
进一步地,所述液体容器设置有用于固定玻璃的支架,当玻璃被固定在所述支架上时,液面至少高于所述玻璃上表面50μm。Furthermore, the liquid container is provided with a support for fixing the glass, and when the glass is fixed on the support, the liquid level is at least 50 μm higher than the upper surface of the glass.
进一步地,所述制备装置还包括机器视觉系统;Furthermore, the preparation device also includes a machine vision system;
所述机器视觉系统位于所述激光扫描系统的上方,用于对加工样品和光束进行定位。The machine vision system is located above the laser scanning system and is used for positioning the processing sample and the light beam.
进一步地,所述液体容器内的腐蚀液选用HF或KOH溶液。Furthermore, the corrosive liquid in the liquid container is selected from HF or KOH solution.
本实用新型的有益效果如下:The beneficial effects of the utility model are as follows:
本实用新型对浸没在酸或碱溶液中的玻璃进行激光照射,由于微爆裂和光致压力动力学等效果,改善腐蚀液流动性和渗透深度,较传统可以加工出更小的孔径直径,并具有更好的微孔形貌。The utility model performs laser irradiation on glass immersed in acid or alkali solution, and due to the effects of micro-burst and light-induced pressure dynamics, improves the fluidity and penetration depth of the etching liquid, and can process smaller pore diameters and better micropore morphology than the traditional method.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为根据本实用新型实施例提供的一种玻璃微孔的制备装置的结构示意图。FIG1 is a schematic structural diagram of a device for preparing glass micropores according to an embodiment of the utility model.
图中:10、液体容器;20、激光扫描系统;21、激光器;22、振镜;23、场镜;24、反射镜;30、超声波发生装置;40、支架;50、机器视觉系统;60、玻璃。In the figure: 10, liquid container; 20, laser scanning system; 21, laser; 22, galvanometer; 23, field lens; 24, reflector; 30, ultrasonic generator; 40, bracket; 50, machine vision system; 60, glass.
具体实施方式DETAILED DESCRIPTION
下面,结合附图以及具体实施方式,对本实用新型做进一步描述,需要说明的是,在不相冲突的前提下,以下描述的各实施例之间或各技术特征之间可以任意组合形成新的实施例。The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.
如图1所示的一种玻璃微孔的制备装置,包括液体容器10、激光扫描系统20和超声波发生装置30;液体容器10盛装有腐蚀液;激光扫描系统20用于对浸没在液体容器10中的玻璃60进行激光照射;超声波发生装置30用于对液体容器10中的腐蚀液进行超声振荡。As shown in FIG1 , a device for preparing glass micropores includes a liquid container 10, a laser scanning system 20 and an ultrasonic generating device 30; the liquid container 10 contains a corrosive liquid; the laser scanning system 20 is used to perform laser irradiation on a glass 60 immersed in the liquid container 10; and the ultrasonic generating device 30 is used to perform ultrasonic oscillation on the corrosive liquid in the liquid container 10.
在上述结构基础上,所述激光扫描系统20包括激光器21和光路扫描系统;激光器21用于发出脉冲激光光束,并通过光路扫描系统在液体容器中的玻璃60表面扫描激光束,以形成微孔阵列。Based on the above structure, the laser scanning system 20 includes a laser 21 and an optical path scanning system; the laser 21 is used to emit a pulsed laser beam, and scan the laser beam on the surface of the glass 60 in the liquid container through the optical path scanning system to form a microhole array.
在上述结构基础上,超声波发生装置30控制在50kHz,激光器21选用红外皮秒激光器或红外飞秒激光器,参数为10ps,100kHz,输出的脉冲激光光束的波长的取值范围为1020-1080nm。Based on the above structure, the ultrasonic generator 30 is controlled at 50kHz, the laser 21 uses an infrared picosecond laser or an infrared femtosecond laser with parameters of 10ps, 100kHz, and the wavelength of the output pulse laser beam ranges from 1020 to 1080nm.
在上述结构基础上,光路扫描系统包括沿激光光路依次排列的反射镜22、振镜23和场镜24;反射镜22、振镜23和场镜24位于液体容器的上方,反射镜22与水平方向呈45°夹角,能够将激光器21输出的激光束垂直投射到振镜23上。Based on the above structure, the optical path scanning system includes a reflector 22, a galvanometer 23 and a field lens 24 arranged in sequence along the laser optical path; the reflector 22, the galvanometer 23 and the field lens 24 are located above the liquid container, and the reflector 22 is at an angle of 45° to the horizontal direction, so that the laser beam output by the laser 21 can be vertically projected onto the galvanometer 23.
在上述结构基础上,液体容器设置有用于固定玻璃60的支架40,当玻璃60被固定在支架40上时,液面至少高于玻璃60上表面50μm。Based on the above structure, the liquid container is provided with a bracket 40 for fixing the glass 60 . When the glass 60 is fixed on the bracket 40 , the liquid level is at least 50 μm higher than the upper surface of the glass 60 .
在上述结构基础上,制备装置还包括机器视觉系统50;机器视觉系统50位于激光扫描系统20的上方,用于对加工样品和光束进行定位,在这里,机器视觉系统50选用定位相机等辅助加工系统以用于配合振镜22准确调整激光聚焦点的位置,精确度高。Based on the above structure, the preparation device also includes a machine vision system 50; the machine vision system 50 is located above the laser scanning system 20 and is used to position the processing sample and the light beam. Here, the machine vision system 50 uses auxiliary processing systems such as positioning cameras to cooperate with the galvanometer 22 to accurately adjust the position of the laser focus point with high precision.
在上述结构基础上,液体容器10内的腐蚀液选用10%的HF或KOH溶液。Based on the above structure, the etching liquid in the liquid container 10 is selected from 10% HF or KOH solution.
本实用新型的玻璃微孔的制备方法,包括:The preparation method of glass micropores of the utility model comprises:
S10,将玻璃60完全浸没在液体容器10的腐蚀液中,关闭超声发生装置30,每个孔径接受100uJ激光能量;S10, completely immerse the glass 60 in the etching liquid in the liquid container 10, turn off the ultrasonic generator 30, and each aperture receives 100uJ of laser energy;
S20,通过激光扫描系统20将激光光束聚焦到玻璃上,进行加工;S20, focusing the laser beam onto the glass through the laser scanning system 20 for processing;
S30,当激光扫描完成后,关闭激光扫描系统20后,开启超声波发生装置30,超声作用20分钟;S30, after the laser scanning is completed, the laser scanning system 20 is turned off, and the ultrasonic generating device 30 is turned on to allow the ultrasonic wave to act for 20 minutes;
S40,重复执行开启和关闭超声波发生装置30和激光扫描系统20,直至每个孔径接受的能量总和大于300uJ,由此,在玻璃60上实现了直径10微米的玻璃通孔,孔壁平滑无微裂纹,分布密度达50万孔每平方厘米。S40, repeatedly turning on and off the ultrasonic generator 30 and the laser scanning system 20 until the total energy received by each aperture is greater than 300uJ, thereby realizing a through-glass hole with a diameter of 10 microns on the glass 60, with a smooth hole wall without microcracks and a distribution density of 500,000 holes per square centimeter.
以上所述仅是本实用新型的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本实用新型技术原理的前提下,还可以做出若干改进和变形,这些改进和变形也应视为本实用新型的保护范围。The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.
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