CN221860611U - Chip aging test cabinet temperature control device and chip aging test cabinet - Google Patents

Abstract

The utility model discloses a temperature control device for a chip aging test cabinet, which is used for a chip aging test cabinet. The chip aging test cabinet includes an inner cabinet and a multi-layer test board located in the inner cabinet. The temperature control device for the chip aging test cabinet includes: a plurality of air supply components, each of which is arranged up and down corresponding to a layer of test board, and is used to blow air vertically toward the test board; a fan, the fan has an air inlet and an air outlet, and the air inlet is used to connect to the inner cabinet so as to take in air from the inner cabinet when the fan is working; a temperature control component, the temperature control component is arranged between the fan and the plurality of air supply components, and is respectively connected to the air outlet and the plurality of air supply components, and the temperature control component is used to adjust the temperature of the passing gas. The temperature control device for a chip aging test cabinet of the utility model is used for a chip aging test cabinet, which can make the chip aging test cabinet suitable for mass testing of high-power chips, increase the number of high-power chips tested at the same time, improve test efficiency, and increase test capacity to meet market supply needs.

Description

Chip aging test cabinet temperature control device and chip aging test cabinet

Technical Field

The utility model relates to the technical field of semiconductor testing, in particular to a temperature control device for a chip aging test cabinet and a chip aging test cabinet.

Background Art

With the advancement of semiconductor electronic technology, aging testing has become a key process to ensure the quality of chip products. In addition, aging test cabinets are usually used to perform aging tests on chips, and chips can only be shipped after passing quality inspection tests.

At present, the existing aging test cabinets on the market are generally used for aging tests of general-power chips. The temperature control device on the test cabinet is mainly designed for general-power chips to form a temperature environment that meets the general-power chip test in the cabinet during chip testing. However, if relatively high-power chips are tested in large quantities, the high-power chips will have a large thermal impact on the temperature environment in the cabinet during the test, which can easily cause uneven heat in the cabinet and fail to keep the test temperature of each high-power chip the same, affecting the test stability. Therefore, the number of high-power chips tested at the same time is usually reduced, resulting in low test efficiency and insufficient test capacity, which cannot meet market supply needs.

Utility Model Content

The main purpose of the utility model is to provide a temperature control device for a chip aging test cabinet, aiming to solve the technical problems of low chip testing efficiency and insufficient testing capacity in the current aging test cabinet with relatively high test power.

To achieve the above purpose, the utility model proposes a chip aging test cabinet temperature control device, which is used for a chip aging test cabinet. The chip aging test cabinet includes an inner cabinet and a multi-layer test board located in the inner cabinet. The chip aging test cabinet temperature control device includes:

A plurality of air supply components, each of which is arranged above and below a layer of the test board and is used to blow air vertically toward the test board;

A fan, the fan having an air inlet and an air outlet, the air inlet being used to communicate with the inner cabinet so as to take air from the inner cabinet when the fan is working;

A temperature regulating component is arranged between the fan and the plurality of air supply components and is respectively connected to the air outlet and each of the air supply components. The temperature regulating component is used to regulate the temperature of the passing gas.

In some embodiments, the test board is provided with a plurality of test sockets for carrying the chips under test, and the air supply assembly includes:

An air supply frame having an air supply channel;

A plurality of direct-blowing air outlets are arranged on a side of the air supply frame facing the test board and are connected to the air supply channel, and each of the direct-blowing air outlets blows air vertically toward a corresponding test seat.

In some embodiments, the air supply frame includes:

A first air duct and a second air duct are arranged opposite to each other, and at least one of the first air duct and the second air duct is connected to the temperature adjustment component;

A plurality of third air ducts are located between the first air duct and the second air duct and are arranged in sequence at intervals along the length direction of the first air duct and the second air duct. One end of each of the third air ducts is perpendicular to the first air duct and connected to the first air duct, and the other end is perpendicular to the second air duct and connected to the second air duct. Each of the third air ducts is provided with a plurality of installation positions arranged in sequence at intervals along the length direction thereof, and each of the installation positions is provided with one of the direct blowing outlets.

In some embodiments, the air supply frame further includes:

The plurality of fourth air ducts are located between the first air duct and the second air duct and are arranged in sequence along the length direction of the third air duct. Each of the fourth air ducts is connected to the plurality of third air ducts respectively.

In some embodiments, the direct-blowing air outlet head is detachably connected to the air supply frame.

In some embodiments, the diameter of the air outlet of the direct-blowing air outlet gradually decreases along the air outlet direction.

In some embodiments, the temperature adjustment component includes:

A heating module, used to heat the passing gas; and/or,

The refrigeration module is used to cool the passing gas.

In some embodiments, the chip aging test cabinet temperature control device further includes:

A plurality of temperature sensors, at least one of which is disposed on the blowing surface of each of the air supply components, and the temperature sensor is used to detect the outlet air temperature of the air supply component.

The utility model also provides a chip aging test cabinet, which comprises an inner cabinet, a multi-layer test board located in the inner cabinet, and the chip aging test cabinet temperature control device as described above.

In some embodiments, the test board is provided with a plurality of air holes arranged in an array.

The temperature control device of a chip aging test cabinet of the utility model is used for a chip aging test cabinet, wherein the fan, the temperature regulating component and the plurality of air supply components and the inner cabinet of the chip aging test cabinet form a gas circulation system. When the fan is working, the gas in the inner cabinet enters the fan through the air inlet, and is output through the air outlet of the fan and flows to the temperature regulating component. After the temperature is adjusted, the gas flows to the air supply components located in the inner cabinet. Each air supply component blows air vertically toward the corresponding test board to uniformly supply air to the tested chips carried on each test board, and can accurately control the test temperature of the tested chips, greatly improve the thermal uniformity, and make the chip aging test cabinet suitable for mass testing of high-power chips, increase the number of high-power chips tested at the same time, improve the test efficiency, and improve the test capacity to meet the market supply demand.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic structural diagram of a chip aging test cabinet in one embodiment of the present invention;

FIG2 is a schematic structural diagram of an air supply assembly and a test board of a temperature control device of a chip aging test cabinet in one embodiment of the present invention;

FIG3 is a schematic structural diagram of an air supply assembly and a test board of the temperature control device of the chip aging test cabinet in the embodiment of FIG2 from another perspective;

FIG4 is a schematic structural diagram of an air supply assembly of a temperature control device for a chip aging test cabinet according to the embodiment of FIG2 ;

FIG5 is a schematic structural diagram of a direct-blowing air outlet of an air supply assembly of a temperature control device of a chip aging test cabinet in the embodiment of FIG2 ;

FIG6 is a schematic structural diagram of a temperature control assembly of a temperature control device for a chip aging test cabinet in an embodiment of the present invention.

DETAILED DESCRIPTION

The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the scheme in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

It should also be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

The utility model provides a chip aging test cabinet temperature control device 110, which is used for a chip aging test cabinet 100. Referring to FIG. 1 , the chip aging test cabinet 100 includes an inner cabinet 120 and a multi-layer test board 130 located in the inner cabinet 120, wherein the chip aging test cabinet temperature control device 110 includes:

A plurality of air supply components 111, each air supply component 111 is arranged up and down corresponding to a layer of the test board 130, and is used to blow air vertically toward the test board 130;

The fan 112 has an air inlet and an air outlet, and the air inlet is used to communicate with the inner cabinet 120 so as to take air from the inner cabinet 120 when the fan 112 is working;

The temperature regulating component 113 is disposed between the fan 112 and the plurality of air supply components 111 and is respectively connected to the air outlet and each air supply component 111. The temperature regulating component 113 is used to regulate the temperature of the passing gas.

The chip aging test cabinet temperature control device 110 involved in this embodiment is used in the chip aging test cabinet 100 to form a temperature environment suitable for high-power chip testing in the cabinet, thereby realizing mass testing of high-power chips.

The chip aging test cabinet 100 has an inner cabinet 120 and a multi-layer test board 130, and the multi-layer test board 130 is arranged in sequence from top to bottom in the inner cabinet 120. Among them, a placement rack is provided in the inner cabinet 120, and the placement rack has multi-layer placement positions for placing the test board 130. When an aging test is required, multiple test boards 130 are placed on the placement rack in sequence. Furthermore, a handle can be provided on one side of the test board 130 to facilitate the extraction and insertion operation of the test board 130 on the placement rack during the process of taking and placing. Optionally, the chip aging test cabinet also includes an outer cabinet, and the inner cabinet 120 is arranged in the outer cabinet.

When the temperature control device 110 of the chip aging test cabinet is applied to the chip aging test cabinet 100, its fan 112, temperature adjustment component 113 and multiple air supply components 111 form a gas circulation system with the inner cabinet 120 of the chip aging test cabinet. The multiple air supply components 111 are located in the inner cabinet 120, and the fan 112 and the temperature adjustment component 113 are located outside the inner cabinet 120. The inner cabinet 120, the fan 112, the temperature adjustment component 113, and the multiple air supply components 111 are connected in sequence. Specifically, the air inlet of the fan 112 is connected to the inner cabinet 120 through the air inlet pipeline, and the air outlet is connected to the temperature adjustment component 113 through the air outlet pipeline. The temperature adjustment component 113 is then connected to each air supply component 111 through the air guide pipeline. When the fan 112 is working, the gas circulates according to the flow path of the inner cabinet 120 → fan 112 → temperature adjustment component 113 → air supply component 111 → inner cabinet 120. Optionally, a vent hole is provided at the bottom of the inner cabinet 120, and the air intake pipeline is connected to the inner cabinet 120 by connecting the vent hole. Optionally, the air guide pipeline is a manifold, and the manifold has a main pipeline and multiple branch pipelines connected to the main pipeline. The main pipeline of the manifold is connected to the temperature control component 113. The side of the inner cabinet 120 is also provided with multiple through holes. The multiple branch pipelines of the manifold extend into the inner cabinet 120 through the multiple through holes and are correspondingly connected to each air supply component 111. Further, a control valve can be set on each branch pipeline to control the conduction or cutoff, adjust the gas flow, etc., so as to achieve separate control of the air supply of the corresponding air supply component 111.

Multiple air supply components 111 correspond to the multi-layer test board 130, and each air supply component 111 is arranged up and down corresponding to a layer of the test board 130, that is, in the vertical direction, multiple air supply components 111 and the multi-layer test board 130 are alternately arranged. The air supply component 111 is located above the test board 130, and the test board 130 is located below the air supply component 111. The air supply component 111 is used to blow air vertically toward the test board 130 (specifically, the side of the test board 130 carrying the chip under test). The air supply component 111 can have an air outlet surface, and a plurality of air outlets are arranged on the air outlet surface. The plurality of air outlets correspond to a plurality of positions of the test board 130 to achieve uniform blowing at each position of the test board 130. The test board 130 is equipped with a plurality of chips under test and the plurality of chips under test are distributed at a plurality of positions of the test board 130. The air supply component 111 can accurately control the temperature of each chip under test on the test board 130 by blowing air vertically toward the test board 130.

Among them, the function of the temperature control component 113 is to adjust the temperature of the passing gas to accurately control the temperature of the air blown out by the air supply component 111, so as to meet the test temperature of the chip under test on the test board 130. The temperature control component 113 can be used in a variety of ways. For example, when the chip under test requires a high-temperature test environment, the temperature control component 113 can include a heating rod or a heating wire for heating the passing gas. When the chip under test requires a low-temperature test environment, the temperature control component 113 can include a compressor for cooling the passing gas. This is only exemplary and not restrictive. In addition, the temperature adjustment range of the temperature control component 113 is not limited here and can be set according to actual conditions.

When the fan 112 is working, the gas in the inner cabinet 120 enters the fan 112 through the air inlet, and flows to the gas through the air outlet of the fan 112 through the temperature control component 113. After temperature adjustment, the gas flows to each air supply component 111 located in the inner cabinet 120. Each air supply component 111 blows air vertically toward the corresponding test board 130 to evenly supply air to the tested chips carried on each test board 130. It can accurately control the test temperature of the tested chip and greatly improve thermal uniformity. It can make the chip aging test cabinet suitable for mass testing of high-power chips, increase the number of high-power chips tested simultaneously, improve test efficiency, and increase test capacity to meet market supply needs.

In some embodiments, referring to FIG. 2 and FIG. 3 , a plurality of test sockets 131 for carrying the chips under test are provided on the test board 130. Each test socket 131 can carry a corresponding chip under test to perform aging tests on batches of chips under test. Among them, the test socket 131 is provided with a placement slot for placing the chip under test, and a test interface is provided in the placement slot. When the chip under test is placed in the placement slot of the test socket 131, the pins on the chip under test are connected to the test interface, so that when the test system issues a test instruction, the test socket 131 can perform an aging test on the chip under test carried thereon. Optionally, the plurality of test sockets 131 are arranged in an array, that is, the plurality of test sockets 131 form multiple rows and columns on the test board 130.

The air supply assembly 111 includes:

The air supply frame 1111 has an air supply channel;

A plurality of direct-blowing air outlets 1112 are disposed on a side of the air supply frame 1111 facing the test board 130 and are connected to the air supply channel. Each direct-blowing air outlet 1112 blows air vertically toward a corresponding test seat 131 .

Specifically, the air supply channel of the air supply frame 1111 is connected to the temperature adjustment component 113, and the gas enters the air supply channel of the air supply frame 1111 after being temperature-adjusted by the temperature adjustment component 113, and is transported to each direct blowing air outlet 1112 through the air supply channel, and each direct blowing air outlet blows vertically toward the corresponding test seat 131 to accurately control the temperature of each chip under test. Among them, the spacing between the direct blowing air outlet and the test seat 131 can be pre-set according to actual conditions so that the chip under test on the test seat 131 is within the blowing range of the direct blowing air outlet 1112. Optionally, corresponding to multiple test seats 131, multiple direct blowing air outlets 1112 are arranged in an array, that is, multiple direct blowing air outlets 1112 form multiple rows and columns on the air supply frame 1111 to correspond one by one to multiple test seats 131 arranged in an array.

In some embodiments, referring to FIG. 4 , the air supply frame 1111 includes:

A first air duct 1111A and a second air duct 1111B are arranged opposite to each other, and at least one of the first air duct 1111A and the second air duct 1111B is connected to and communicates with the temperature adjustment component 113;

Multiple third air ducts 1111C are located between the first air duct 1111A and the second air duct 1111B and are arranged in sequence at intervals along the length direction of the first air duct 1111A and the second air duct 1111B. One end of each third air duct 1111C is perpendicular to the first air duct 1111A and connected to the first air duct 1111A, and the other end is perpendicular to the second air duct 1111B and connected to the second air duct 1111B. Each third air duct 1111C is provided with multiple installation positions arranged in sequence at intervals along the length direction thereof, and a direct blowing air outlet 1112 is installed at each installation position.

The air supply frame 1111 adopts a tube structure, and has a first air duct 1111A, a second air duct 1111B and a third air duct 1111C. The first air duct 1111A and the second air duct 1111B are arranged opposite to each other, and the third air duct 1111C is provided with a plurality of third air ducts 1111C, and the plurality of third air ducts 1111C are located between the first air duct 1111A and the second air duct 1111B and are arranged in sequence along the length direction of the first air duct 1111A and the second air duct 1111B. The pipes are interconnected to form an air supply channel. Among them, the number of the third air duct 1111C is not limited, and can be set according to actual conditions. Among them, the plurality of mounting positions on the third air duct 1111C are used to install a plurality of direct blowing air outlets 1112 correspondingly, and the number of direct blowing air outlets 1112 installed on each third air duct 1111C is not limited, and can be set correspondingly with reference to the number of test seats 131 on the test board 130. In this embodiment, the first air duct 1111A may be connected to the temperature control component 113, the second air duct 1111B may be connected to the temperature control component 113, or both the first air duct 1111A and the second air duct 1111B may be connected to the temperature control component 113, according to the actual situation. When the fan 112 is working, the gas temperature-controlled by the temperature control component 113 passes through the first air duct 1111A and/or the second air duct 1111B, and can be quickly transported to each third air duct 1111C, and blown out through each direct blowing outlet 1112.

In some embodiments, the air supply frame 1111 further includes:

The plurality of fourth air ducts (not shown) are located between the first air duct 1111A and the second air duct 1111B and are sequentially spaced apart along the length direction of the third air duct 1111C. Each of the fourth air ducts is connected to the plurality of third air ducts 1111C respectively.

The air supply frame 1111 also has a fourth air duct, and a plurality of fourth air ducts are provided. The plurality of fourth air ducts are located between the first air duct 1111A and the second air duct 1111B and are arranged in sequence along the length direction of the third air duct 1111C. That is, the plurality of fourth air ducts are staggered and connected with the plurality of third air ducts 1111C, and are arranged in a tic-tac-toe shape, and each fourth air duct is connected with the plurality of third air ducts 1111C respectively. Among them, the number of fourth air ducts is not limited and can be set according to actual conditions. Through the plurality of fourth air ducts, the gas between the plurality of third air ducts 1111C can circulate with each other, thereby accelerating the flow of gas, so that the gas quickly reaches each direct blowing outlet 1112, and reduces heat loss.

In some embodiments, the direct-blowing air outlet head 1112 is detachably connected to the air supply frame 1111 .

Among them, the detachable connection method between the direct blowing air outlet head 1112 and the air supply frame 1111 includes a threaded connection, a snap connection, etc., which can be set according to actual conditions. For example, the air supply frame 1111 is provided with a mounting hole connected to the air supply channel, the mounting hole is a threaded hole, and the direct blowing air outlet head 1112 is provided with an external thread. The direct blowing air outlet head 1112 is matched with the mounting hole thread through the provided external thread to be detachably installed on the air supply frame 1111. In this way, the direct blowing air outlet head 1112 can be replaced on the air supply frame 1111, so that the direct blowing air outlet head 1112 with different gas flow rates can be replaced in real time according to the test requirements, and the vertical flow rate for each chip to be tested can be accurately adjusted.

In some embodiments, referring to FIG5 , the aperture of the air outlet hole 1112A of the direct blowing air outlet head 1112 gradually decreases along the air outlet direction. When the fan 112 is working, under the action of a certain air supply pressure, since the aperture of the air outlet hole 1112A of the direct blowing air outlet head 1112 gradually decreases along the air outlet direction, the air pressure will gradually increase, thereby increasing the air pressure of the gas blown out of the direct blowing air outlet head 1112, so as to accurately blow directly onto the chip to be tested on the test socket 131, which helps to achieve accurate temperature control.

In some embodiments, referring to FIG. 6 , the temperature adjustment component 113 includes:

The heating module 1131 is used to heat the passing gas; and/or,

The refrigeration module 1132 is used to cool the passing gas.

In this embodiment, the temperature control component 113 may include a heating module 1131 and/or a cooling module 1132. The heating module 1131 may include a heating rod or a heating wire, etc., and the cooling module 1132 may include a compressor, etc.

As shown in FIG6 , when the temperature control component 113 includes a heating module 1131 and a cooling module 1132, a temperature control pipeline may be provided, and the two ends of the temperature control pipeline are respectively connected to the air outlet of the ventilator 112 and the plurality of air supply components 111, the heating module 1131 is located in the heating section of the temperature control pipeline, and the cooling module is located in the cooling section of the temperature control pipeline. When the chip under test requires a high-temperature test environment, the heating module 1131 is controlled to work accordingly to heat the gas passing through the temperature control pipeline; when the chip under test requires a low-temperature test environment, the cooling module 1132 is controlled to work accordingly to cool the gas passing through the temperature control pipeline.

In addition to this embodiment, in other embodiments, a heating pipeline and a cooling pipeline may be provided, the heating module 1131 is provided on the heating pipeline, the cooling module 1132 is provided on the heating pipeline, one end of the heating pipeline and one end of the cooling pipeline are connected to the air outlet of the fan 112 through a three-way valve, and the other end of the heating pipeline and the other end of the cooling pipeline are connected to multiple air supply components 111. When the chip under test requires a high-temperature test environment, the gas circuit is switched by controlling the three-way valve so that the air outlet of the fan 112 is connected to the heating pipeline, and the heating module 1131 is controlled to work to heat the gas passing through the heating pipeline; when the chip under test requires a low-temperature test environment, the gas circuit is switched by controlling the three-way valve so that the air outlet of the fan 112 is connected to the cooling pipeline, and the cooling module 1132 is controlled to work to cool the gas passing through the cooling pipeline.

The utility model also proposes a chip aging test cabinet 100. Referring to FIG. 1 , the chip aging test cabinet 100 includes an inner cabinet 120, a multi-layer test board 130 located in the inner cabinet 120, and a chip aging test cabinet temperature control device 110 as described in the above embodiment. The specific structure of the chip aging test cabinet temperature control device 110 refers to the above embodiment. Since the chip aging test cabinet 100 adopts all the technical solutions of all the above embodiments, it has at least all the technical effects brought by the technical solutions of the above embodiments, which will not be repeated here.

Among them, the chip aging test cabinet 100 is mainly used for aging test of relatively high-power chips. The chip aging test cabinet 100 has an inner cabinet 120 and a multi-layer test board 130, and the multi-layer test board 130 is arranged in the inner cabinet 120 from top to bottom. Among them, a placement rack is provided in the inner cabinet 120, and the placement rack has a multi-layer placement position for placing the test board 130. When the aging test is required, multiple test boards 130 are placed on the placement rack in sequence. Further, a handle can be provided on one side of the test board 130 to facilitate the extraction and insertion operation of the test board 130 on the placement rack during the process of taking and placing. Optionally, the chip aging test cabinet 100 also includes an outer cabinet, and the inner cabinet 120 is arranged in the outer cabinet. Optionally, multiple test seats 131 can be arranged on the test board 130, and each test seat 131 corresponds to a chip under test. Optionally, multiple test seats 131 are arranged in an array, that is, multiple test seats 131 form multiple rows and columns on the test board 130.

In some embodiments, referring to FIG. 3 , the test board 130 is provided with a plurality of air holes 130A arranged in an array. The air blown vertically toward the test board 130 by the air supply component 111 exchanges energy with the chip under test on the test board 130, and then flows downward through the air holes 130A on the test board 130, thereby accelerating the gas flow and gas circulation in the inner cabinet 120, helping to ensure the thermal uniformity in the inner cabinet 120, and improving the stability of the chip test temperature environment. Optionally, the plurality of air holes 130A are arranged in an array, that is, the plurality of air holes 130A form multiple rows and columns on the test board 130. Among them, the plurality of air holes 130A arranged in an array are staggered with the plurality of test sockets 131 arranged in an array, and the four corners of the air holes 130A correspond to four test sockets 131, and the four corners of the test socket 131 also correspond to four air holes 130A.

The above description is only a partial or preferred embodiment of the present invention. Neither the text nor the drawings can limit the scope of protection of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the overall concept of the present invention, or direct/indirect application in other related technical fields are included in the scope of protection of the present invention.

Claims (10)

1. The utility model provides a chip burn-in test cabinet temperature control device for chip burn-in test cabinet, chip burn-in test cabinet includes the interior cabinet body and is located multilayer test board in the interior cabinet body, its characterized in that, chip burn-in test cabinet temperature control device includes:

The air supply assemblies are arranged up and down corresponding to one layer of the test board and are used for vertically blowing air towards the test board;

The fan is provided with an air inlet and an air outlet, and the air inlet is used for communicating the inner cabinet body so as to enter air from the inner cabinet body when the fan works;

The temperature adjusting assembly is arranged between the fan and the plurality of air supply assemblies and is respectively communicated with the air outlet and each air supply assembly, and the temperature adjusting assembly is used for adjusting the temperature of the passing air.

2. The temperature control device of claim 1, wherein the test board is provided with a plurality of test seats for carrying chips to be tested, and the air supply assembly comprises:

An air supply frame provided with an air supply channel;

The plurality of straight air blowing heads are arranged on one side of the air blowing frame, which faces the test board, and are communicated with the air blowing channel, and each straight air blowing head vertically blows air towards one test seat.

3. The die burn-in cabinet temperature control device of claim 2, wherein the air supply frame comprises:

The first air guide pipe and the second air guide pipe are oppositely arranged, and at least one of the first air guide pipe and the second air guide pipe is communicated with the temperature adjusting component;

The air guide device comprises a plurality of first air guide pipes, a plurality of second air guide pipes, a plurality of first air guide pipes, a plurality of second air guide pipes and a plurality of first air guide pipes, wherein the plurality of third air guide pipes are located between the first air guide pipes and the second air guide pipes and are sequentially arranged at intervals along the length directions of the first air guide pipes and the second air guide pipes, one end of each third air guide pipe is perpendicular to the first air guide pipes and communicated with the first air guide pipes, the other end of each third air guide pipe is perpendicular to the second air guide pipes and communicated with the second air guide pipes, and a plurality of mounting positions which are sequentially arranged at intervals along the length directions of the third air guide pipes are arranged at intervals of each mounting position to install one straight-blowing air outlet head.

4. The die burn-in cabinet temperature control device of claim 3 wherein said air supply frame further comprises:

The fourth air guide pipes are positioned between the first air guide pipes and the second air guide pipes and are sequentially arranged at intervals along the length direction of the third air guide pipes, and each fourth air guide pipe is respectively communicated with the plurality of third air guide pipes.

5. The temperature control device of the chip burn-in cabinet of claim 2, wherein the straight air outlet head is detachably connected to the air supply frame.

6. The temperature control device of the chip burn-in testing cabinet according to claim 2, wherein the aperture of the air outlet hole of the straight air outlet head is gradually reduced along the air outlet direction.

7. The die burn-in cabinet temperature control device of claim 1, wherein the temperature adjustment assembly comprises:

The heating module is used for heating the passing gas; and/or the number of the groups of groups,

And the refrigeration module is used for refrigerating the passing gas.

8. The die burn-in cabinet temperature control device of claim 1, further comprising:

The air supply assembly comprises a plurality of temperature sensors, wherein at least one temperature sensor is arranged on the air blowing surface of the air supply assembly, and the temperature sensors are used for detecting the air outlet temperature of the air supply assembly.

9. A die burn-in cabinet comprising an inner cabinet body, a multi-layer test panel positioned in the inner cabinet body, and a die burn-in cabinet temperature control device according to any one of claims 1-8.

10. The die burn-in board of claim 9, wherein a plurality of air holes are formed through the test board in an array arrangement.