CN221827019U - Gold fingers for high voltage testing of integrated circuit products - Google Patents

Abstract

The utility model discloses a golden finger for high-voltage testing of an integrated circuit product, and belongs to the technical field of high-voltage testing of integrated circuits. The golden finger for high-voltage testing of the integrated circuit product comprises a single-piece golden finger copper sheet, wherein the single-piece golden finger copper sheet comprises a testing end, a first positioning section, a second positioning section and a tail inserting end which are integrally connected, and the width of the testing end is larger than the total width of all PIN PINs of the integrated circuit product; the first insulation positioning assembly is arranged on the first positioning section; the second insulating positioning assembly is arranged on the second positioning section. According to the utility model, all PIN PINs of the integrated circuit product are connected to the same voltage, and the test end of the single-chip gold finger copper sheet is larger than the total width of all PIN PINs of the integrated circuit product, so that the contact area between the gold finger and the PIN PINs of the integrated circuit product is increased, and the ignition phenomenon is avoided.

Description

Gold fingers for high voltage testing of integrated circuit products

Technical Field

The utility model relates to the technical field of integrated circuit high-voltage testing, in particular to a gold finger used for high-voltage testing of integrated circuit products.

Background Art

High voltage testing of integrated circuit products is generally used to perform high voltage testing on the integrated circuits of products before they leave the factory to ensure that the quality of the products leaving the factory meets the standards and to ensure the use effect for users.

During the high-voltage test, a robot is used to clamp the integrated circuit product and bring it close to the test equipment, so that the PIN pins on the integrated circuit product are in contact with the gold fingers on the test equipment and a high-voltage test is performed.

However, the existing test equipment is equipped with multiple gold fingers, each of which has a small width. When the PIN width of the integrated circuit product is larger than the contact area of the gold finger, sparking problems are likely to occur, reducing the safety of the test.

Therefore, it is urgent to provide a gold finger for high voltage testing of integrated circuit products to solve the above problems.

Utility Model Content

The utility model aims to provide a gold finger for high voltage testing of integrated circuit products, which can increase the contact area between the gold finger and the PIN foot of the integrated circuit product to avoid sparking.

In order to achieve the above purpose, the following technical solutions are provided:

Gold fingers used for high voltage testing of integrated circuit products, including:

A single-piece gold finger copper sheet comprises a test end, a first positioning section, a second positioning section and a tail plug end which are integrally connected, wherein the width of the test end is greater than the total width of all PIN pins of the integrated circuit product;

A first insulating positioning component is arranged on the first positioning section of the single-piece gold finger copper sheet;

The second insulating positioning component is arranged on the second positioning section of the single-piece gold finger copper sheet.

As an optional solution for the gold finger used for high-voltage testing of integrated circuit products, the test end is arranged at an angle with the first positioning section, and the first positioning section, the second positioning section and the tail plug end are all located in the same plane.

As an optional solution for the gold finger used for high voltage testing of integrated circuit products, the first insulating positioning assembly includes a first limiting member and a second limiting member, and the first positioning section is clamped between the first limiting member and the second limiting member.

As an optional solution for gold fingers used for high-voltage testing of integrated circuit products, the upper end surface of the second limit member is concavely provided with a first accommodating groove, the first positioning section is embedded in the first accommodating groove, and the first limit member is covered on the upper end surface of the second limit member and bonded.

As an optional solution for gold fingers used for high-voltage testing of integrated circuit products, the second insulating positioning assembly includes a third limiting member and a fourth limiting member, and the second positioning section is clamped between the third limiting member and the fourth limiting member.

As an optional solution for gold fingers used for high-voltage testing of integrated circuit products, the upper end surface of the fourth limiter is concavely provided with a second accommodating groove, the second positioning section is embedded in the second accommodating groove, and the third limiter is covered on the upper end surface of the fourth limiter and bonded.

As an optional solution for the gold finger used for high-voltage testing of integrated circuit products, the upper end surface of the third limiting member is concavely provided with a limiting groove, and the test equipment mounting part can be snap-fitted with the limiting groove.

As an optional solution for the gold finger used for high voltage testing of integrated circuit products, at least two first connection holes are provided at the bottom of the limiting groove.

As an optional solution for the gold finger used for high voltage testing of integrated circuit products, the third limiting member and the fourth limiting member are both provided with at least two second connection holes therethrough.

As an optional solution for the gold finger used for high voltage testing of integrated circuit products, the first insulating positioning component and the second insulating positioning component are both made of plastic.

Compared with the prior art, the utility model has the following beneficial effects:

The gold finger for high-voltage testing of integrated circuit products provided by the utility model installs a first insulating positioning component on the first positioning section of a monolithic gold finger copper sheet, and installs a second insulating positioning component on the second positioning section of the monolithic gold finger copper sheet. When performing high-voltage testing, all PIN pins of the integrated circuit product are connected to the same voltage, and the width of the test end of the monolithic gold finger copper sheet is made larger than the total width of all PIN pins of the integrated circuit product, thereby increasing the contact area between the gold finger and the PIN pin of the integrated circuit product and avoiding sparking. In addition, the use of a monolithic gold finger copper sheet eliminates the need for further processing and bifurcation of the gold finger copper sheet, reduces the processing steps, and is conducive to the mass production of gold fingers for high-voltage testing of integrated circuit products.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

FIG1 is a schematic diagram of the assembly of a gold finger for high voltage testing of integrated circuit products in an embodiment of the utility model;

FIG2 is a side view schematic diagram of a gold finger used for high voltage testing of integrated circuit products in an embodiment of the present utility model;

FIG3 is a front view of a gold finger for high voltage testing of integrated circuit products in an embodiment of the present utility model.

Reference numerals:

1. Single-piece gold finger copper sheet; 2. First insulation positioning component; 3. Second insulation positioning component;

11. Test end; 12. First positioning section; 13. Second positioning section; 14. Tail plug end;

21. first limiting member; 22. second limiting member; 221. first accommodating groove;

31. third limiting member; 32. fourth limiting member; 321. second accommodating groove; 33. limiting groove; 34. first connecting hole; 35. second connecting hole.

DETAILED DESCRIPTION

In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Generally, the components of the embodiment of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

In the description of the present utility model, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

In order to increase the contact area between the gold finger and the PIN pin of the integrated circuit product and avoid sparking, this embodiment provides a gold finger for high-voltage testing of integrated circuit products. The specific contents of this embodiment are described in detail below in conjunction with Figures 1 to 3.

In this embodiment, the gold finger for high voltage testing of integrated circuit products includes a monolithic gold finger copper sheet 1, a first insulating positioning component 2 and a second insulating positioning component 3. The monolithic gold finger copper sheet 1 includes an integrally connected test terminal 11, a first positioning section 12, a second positioning section 13 and a tail plug terminal 14. The width of the test terminal 11 is greater than the total width of all PIN pins of the integrated circuit product. The first insulating positioning component 2 is arranged on the first positioning section 12 of the monolithic gold finger copper sheet 1. The second insulating positioning component 3 is arranged on the second positioning section 13 of the monolithic gold finger copper sheet 1.

In short, the gold finger for high-voltage testing of integrated circuit products provided by the utility model installs the first insulating positioning component 2 on the first positioning section 12 of the monolithic gold finger copper sheet 1, and installs the second insulating positioning component 3 on the second positioning section 13 of the monolithic gold finger copper sheet 1. When performing high-voltage testing, all PIN pins of the integrated circuit product are connected to the same voltage, and the width of the test end 11 of the monolithic gold finger copper sheet 1 is greater than the total width of all PIN pins of the integrated circuit product, thereby increasing the contact area between the gold finger and the PIN pin of the integrated circuit product and avoiding sparking. In addition, by using the monolithic gold finger copper sheet 1, there is no need to further process the gold finger copper sheet, thus reducing the processing steps, which is conducive to the mass production of gold fingers for high-voltage testing of integrated circuit products.

Specifically, as shown in Figure 1 and Figure 2, the test end 11 is set at an angle to the first positioning section 12, the first positioning section 12, the second positioning section 13 and the tail plug end 14 are all located in the same plane, and the test end 11 is matched with the PIN pin of the product by bending the test end 11.

Furthermore, the first insulating positioning assembly 2 includes a first limiting member 21 and a second limiting member 22, and the first positioning section 12 is clamped between the first limiting member 21 and the second limiting member 22. By adding the first limiting member 21 and the second limiting member 22, the first positioning section 12 of the single-piece gold finger copper sheet 1 can be clamped firmly.

Exemplarily, the upper end surface of the second stopper 22 is concavely provided with a first accommodating groove 221, the first positioning section 12 is embedded in the first accommodating groove 221, and the first stopper 21 is covered and bonded to the upper end surface of the second stopper 22. In other embodiments, a third accommodating groove may be concavely provided on the lower end surface of the first stopper 21, the second positioning section 13 is embedded in the third accommodating groove, and the second stopper 22 is bonded to the lower end surface of the first stopper 21.

Optionally, an insulating protective layer is provided on a portion of the monolithic gold finger copper sheet 1 between the first insulating positioning component 2 and the second insulating positioning component 3 to improve the safety of the gold finger.

Furthermore, the second insulating positioning assembly 3 includes a third limiting member 31 and a fourth limiting member 32, and the second positioning section 13 is clamped between the third limiting member 31 and the fourth limiting member 32. By adding the third limiting member 31 and the fourth limiting member 32, the second positioning section 13 of the single-piece gold finger copper sheet 1 can be clamped firmly.

Specifically, the upper end surface of the fourth limiting member 32 is concavely provided with a second accommodating groove 321, the second positioning section 13 is embedded in the second accommodating groove 321, and the third limiting member 31 is covered and bonded to the upper end surface of the fourth limiting member 32. In other embodiments, the lower end surface of the third limiting member 31 may also be concavely provided with a fourth accommodating groove, the second positioning section 13 is embedded in the fourth accommodating groove, and the fourth limiting member 32 is bonded to the lower end surface of the third limiting member 31.

Furthermore, a limiting groove 33 is concavely provided on the upper end surface of the third limiting member 31. By adding the limiting groove 33, it is convenient to clip the gold finger onto the first mounting portion of the test device. Furthermore, at least two first connecting holes 34 are provided at the bottom of the limiting groove 33, and the first fastener passes through the first mounting portion of the test device and is threadedly connected to the first connecting hole 34. By providing at least two first connecting holes 34 in this embodiment, the second insulating positioning component 3 is prevented from being rotationally misaligned with the first mounting portion, and the threaded connection method is adopted to ensure the connection stability between the second insulating positioning component 3 and the first mounting portion of the test device.

Furthermore, at least two second connection holes 35 are formed through the third limiter 31 and the fourth limiter 32. By providing at least two second connection holes 35 in this embodiment, the second insulating positioning assembly 3 is prevented from being misaligned with the second mounting portion of the test device due to rotation, and the connection stability between the second insulating positioning assembly 3 and the second mounting portion of the test device is ensured by threaded connection.

Furthermore, the first insulating positioning component 2 and the second insulating positioning component 3 are both made of plastic material, and the plastic material is used to insulate and protect the gold fingers.

In summary, the material of the voltage-resistant gold finger in this embodiment is copper, and the width of the gold finger is more compatible with the product test terminal 11. The integrated structure makes the test contact more reliable and can effectively reduce the arcing phenomenon during the voltage test. Among them, the width of the contact position of the test terminal 11 of the gold finger is 4.81mm, while the overall width of the product pin is 4.32mm, making the test contact more compatible.

The test conditions of the integrated circuit product mentioned in this embodiment are: AC withstand voltage 5.8KV, test time 3s, leakage control 0.1mA. When using ordinary gold finger test, the product current terminal and the test terminal 11 frequently arc and spark, and the withstand voltage yield is less than 20% (caused by arcing, the product itself has no abnormal characteristics). After replacing it with the gold finger in this embodiment, the withstand voltage test is carried out under the same conditions, and the withstand voltage yield is increased to more than 95%, which effectively improves the low yield problem caused by arcing.

Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described here, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (10)

1. A gold finger for high voltage testing of integrated circuit products, characterized by comprising: A single-piece gold finger copper sheet (1) comprises a test end (11), a first positioning section (12), a second positioning section (13) and a tail plug end (14) which are integrally connected, wherein the width of the test end (11) is greater than the total width of all PIN pins of an integrated circuit product; A first insulating positioning component (2) is arranged on the first positioning section (12) of the single-piece gold finger copper sheet (1); A second insulating positioning component (3) is arranged on the second positioning section (13) of the single-piece gold finger copper sheet (1). 2. The gold finger for high-voltage testing of integrated circuit products according to claim 1 is characterized in that the test end (11) and the first positioning section (12) are arranged at an angle, and the first positioning section (12), the second positioning section (13) and the tail plug end (14) are all located in the same plane. 3. The gold finger for high-voltage testing of integrated circuit products according to claim 1 is characterized in that the first insulating positioning component (2) includes a first limiting member (21) and a second limiting member (22), and the first positioning section (12) is clamped between the first limiting member (21) and the second limiting member (22). 4. The gold finger for high-voltage testing of integrated circuit products according to claim 3 is characterized in that the upper end surface of the second limiting member (22) is concavely provided with a first accommodating groove (221), the first positioning section (12) is embedded in the first accommodating groove (221), and the first limiting member (21) is covered on the upper end surface of the second limiting member (22) and bonded. 5. The gold finger for high-voltage testing of integrated circuit products according to claim 1, characterized in that the second insulating positioning component (3) comprises a third limiting member (31) and a fourth limiting member (32), and the second positioning section (13) is clamped between the third limiting member (31) and the fourth limiting member (32). 6. The gold finger for high-voltage testing of integrated circuit products according to claim 5 is characterized in that the upper end surface of the fourth limiting member (32) is concavely provided with a second accommodating groove (321), the second positioning section (13) is embedded in the second accommodating groove (321), and the third limiting member (31) is covered on the upper end surface of the fourth limiting member (32) and bonded. 7. The gold finger for high voltage testing of integrated circuit products according to claim 5, characterized in that a limiting groove (33) is concavely provided on the upper end surface of the third limiting member (31). 8. The gold finger for high-voltage testing of integrated circuit products according to claim 7, characterized in that at least two first connection holes (34) are provided at the bottom of the limiting groove (33). 9. The gold finger for high-voltage testing of integrated circuit products according to claim 7, characterized in that the third limiting member (31) and the fourth limiting member (32) are both provided with at least two second connection holes (35) therethrough. 10. The gold finger for high-voltage testing of integrated circuit products according to any one of claims 1 to 9, characterized in that the first insulating positioning component (2) and the second insulating positioning component (3) are both made of plastic.