CN221805487U - Wafer lifting mechanism for wafer drying device - Google Patents

Abstract

The utility model relates to a crystal dome lifting mechanism for a wafer drying device, which belongs to the field of crystal dome lifting mechanisms and comprises a flower basket, a support frame, a flower basket positioning assembly and a top cutter assembly, wherein the flower basket positioning assembly and the top cutter assembly are arranged on the support frame, the left side positioning block, the right side positioning block, the front side positioning block and the rear side positioning block are respectively provided with a guiding inclined surface which inclines inwards, the top cutter assembly consists of four vertically arranged top plates, and the top of each top plate is provided with V-shaped top cutters which correspond to the number and the positions of positioning grooves and are used for supporting the bottom of a wafer. The four groups of V-shaped top cutters are supported at the bottom of the wafer in the process of lowering the flower basket, so that the wafer is kept in a vertical state, the bottom of the wafer is separated from the bottom of the positioning groove, the back of the wafer is abutted against the inner wall of one end of the positioning groove, only a small part of the back of the wafer is contacted with the inner wall of one end of the positioning groove, the standard requirement on the wafer watermark is met, the bottom and the front of the wafer are ensured to be separated from the flower basket, and the technical problem that the watermark is generated at the contact point of the front and the bottom of the wafer due to the contact point of the flower basket can be effectively solved.

Description

Wafer lifting mechanism for wafer drying device

Technical Field

The utility model relates to the field of a wafer lifting mechanism, in particular to a wafer lifting mechanism for a wafer drying device.

Background

A wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer has a circular shape. Various circuit element structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface is useful with inexhaustible silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon, and the purity of the polysilicon is as high as 99.999999999 percent. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer.

Wafer cleaning is an important step in semiconductor manufacturing to remove dirt, impurities and residues from the wafer surface to ensure successful subsequent processing. The cleaning is generally performed by wet cleaning, i.e., using chemical solutions or distilled water, and cleaning the wafer by ultrasonic waves or spraying.

The wafer drying is a final finishing operation of the wet cleaning process, and it is required to ensure effective control of removing residual moisture on the wafer surface and surface cleanliness, which requires continuous optimization of the drying method and improvement of drying efficiency, which will be a point that needs to be paid attention to in the wafer cleaning apparatus and the drying apparatus. However, with the increasing standards of semiconductor manufacturing, and in particular the tight control of post-drying watermarks, conventional drying equipment has increasingly exposed its limitations.

Conventional wafer drying methods are generally divided into two types, including spin drying and marangoni drying. The spin drying technique is also called wafer spin drying technique, which is to put a wafer into a special clamping mechanism, spin off water through high-speed rotation, and needs spin drying equipment, which has simple structure, low price and high throughput, but needs parts with high flexibility and static electricity generation. By adopting the wafer spin-drying technology, the problems of particle increase and fragments caused by overlarge centrifugal force can exist, and the problems are always pain spots in the industry.

Marangoni drying is a drying technique developed based on the Marangoni effect. A drying tank is needed, and after the wafer enters the drying tank, the wafer overflows in the drying tank. The drying tank is filled with the IPA gas carried by nitrogen gas, and an IPA gas environment is formed on the water surface. The wafer is then slowly released from the water surface, and because the surface tension of the IPA is much less than that of the water, a surface tension gradient is formed on the surface of the sloping water flow, creating Marangoni convection, where the water is "sucked back" into the water surface. Compared with IPA Vapor drying, marangoni drying has little dosage of IPA and can overcome the difficulty of dehydration of deep and narrow ditches, and is suitable for drying wafers with diameters of more than 150mm (6 inches). The marangoni IPA dryer uses a vaporized isopropyl alcohol (IPA) device and an N2 supply device, and is equipped with a flowmeter for detecting the amounts of IPA and N2 used.

In the marangoni drying process, the wafer is attached to the inclined surface of the basket, the wafer is not separated from the basket, and watermarks (WATER MARK) and particles (particle) are generated at the contact position of the wafer and the basket. In order to avoid the contact between the wafer and the basket, the mainstream optimization method is to lift the wafer by a mechanical device, completely separate the slow-pull process from the basket, and replace the wafer after the drying is completed. However, the mechanical lifting and separating mode has the problems of complex structure, dislocation of the engagement of the basket and the wafer in the basket returning process, and occurrence of wafer breakage.

Disclosure of utility model

The utility model aims to solve the defects and provide the wafer lifting mechanism for the wafer drying device, which can lift the wafer in the process of lowering the flower basket, so that the residual watermark at the bottom of the wafer in the drying process can be eliminated, and the technical problem that the contact point is generated at the watermark due to the contact point between the bottom of the wafer and the flower basket in the prior art is effectively solved.

The object of the utility model is achieved by:

The utility model provides a crystal dome plays mechanism for wafer drying device, including basket, support frame and the basket locating component and the top sword subassembly of setting on the support frame, two inner walls are equipped with a plurality of constant head tank that are used for vertically placing the wafer around the basket, basket locating component is equipped with two sets of, be left and right sides locating piece and front and back side locating piece respectively, left and right sides locating piece and front and back side locating piece all are equipped with the direction inclined plane of inwards slope, left and right sides locating piece and front and back side locating piece are around forming the location area, when the basket is placed in the location area from top to bottom, left and right sides locating piece is tight the left and right sides of basket, the front and back side locating piece is tight the front and back side of basket, top sword subassembly is located the location area, top sword subassembly comprises four roof boards of erectting the setting, four roof boards are parallel arrangement each other, the top of roof board is equipped with the V-shaped top sword that corresponds and be used for supporting the wafer bottom, when the basket is placed in the location area, V-shaped top sword will jack up the wafer simultaneously, make the bottom of wafer break away from the bottom of constant head tank, and the inner wall that the back is tight one end of wafer.

Further, the top surface of support frame is equipped with the mounting panel, and the both ends of mounting panel all are equipped with horizontal spout, and side locating piece is the structure of falling U-shaped about, and side locating piece installs respectively in horizontal spout about, and can carry out horizontal sliding adjustment along horizontal spout, and side locating piece is equipped with two pairs altogether, and side locating piece is L-shaped structure about, and side locating piece is fixed in the top surface of mounting panel about, and is located between the side locating piece about.

Further, the support frame is formed by splicing an X-axis support plate and a Y-axis support plate, two X-axis support plates are arranged in total, and the mounting plate is mounted on the top surface of the X-axis support plate.

Further, a horizontal beam is connected between the two left side surface positioning blocks and the right side surface positioning blocks, and four top plates are vertically arranged on the side surfaces of the horizontal beam.

Further, a pointed bulge is formed between two adjacent V-shaped top cutters. The pointed bulge can be used for auxiliary guiding, and the wafer is guided along the side surface of the pointed bulge in the process of lowering the flower basket, so that the wafer accurately falls into the V-shaped top knife.

The beneficial effects of the utility model are as follows: through setting up side locating piece about and preceding side locating piece, and all be provided with the direction inclined plane, side and front and back side are followed about the basket of flowers respectively and are carried out accurate location to the basket of flowers, ensure that the position of constant head tank of basket of flowers corresponds with V-arrangement top sword, be provided with four sets of V-arrangement top sword in addition and be used for supporting and jack-up wafer, four sets of V-arrangement top sword in the basket decline in-process will support in the bottom of wafer, four sets of V-arrangement top sword divide into two sets of fore-and-aft symmetry, constitute two sets of front bottom and the back bottom of supporting the wafer respectively, thereby can jack-up the wafer stably, make the wafer keep vertical state, the bottom of wafer will break away from the bottom of constant head tank, and the back of wafer just has the one end inner wall of minority contact constant head tank, the standard requirement to the wafer watermark, ensure that the bottom and the front of wafer all separate with the basket of flowers, can effectively solve the wafer front and bottom and basket of flowers and the wafer and lead to the technical problem that the contact point produces because of having the contact point, simultaneously, compare the wafer is centrifugal, can avoid the wafer to avoid the accurate positioning problem that the wafer to avoid the dislocation of wafer to take place when the wafer is damaged when setting and the wafer is accurate to the problem of the wafer is lost.

Drawings

Fig. 1 is a schematic perspective view of the flower basket in the non-placed state;

FIG. 2 is an enlarged schematic view of a portion of FIG. 1A;

FIG. 3 is a schematic perspective view showing a basket in a set state in the present embodiment;

FIG. 4 is a schematic perspective view showing a basket in a taken-out state in the present embodiment;

FIG. 5 is a schematic diagram showing a wafer being normally placed in a basket of flowers in this embodiment;

FIG. 6 is a schematic diagram of a state in which a wafer is lifted up in the present embodiment;

Fig. 7 is a schematic perspective view of a V-shaped top knife in the embodiment in a state of lifting up a wafer;

FIG. 8 is an enlarged partial schematic view of B in FIG. 7;

FIG. 9 is a schematic perspective view of a wafer drying apparatus according to the present embodiment;

In the figure, the device comprises a 1-flower basket, a 2-positioning groove, a 3-left side surface positioning block, a 4-front side surface positioning block, a 4-back side surface positioning block, a 5-guiding inclined surface, a 6-top plate, a 7-V-shaped top knife, an 8-X axis supporting plate, a 9-Y axis supporting plate, a 10-mounting plate, an 11-horizontal chute, a 12-horizontal cross beam, a 13-wafer, a 14-drying groove body, a 15-cover plate and a 16-process chamber.

Detailed Description

The utility model is described in further detail below with reference to the drawings and the detailed description.

Referring to fig. 1-9, a wafer lifting mechanism for a wafer drying device in the embodiment includes a basket 1, a support frame, and a basket positioning assembly and a top knife assembly disposed on the support frame, wherein a plurality of positioning slots 2 for longitudinally placing a wafer 13 are disposed on front and rear inner walls of the basket 1. As shown in fig. 2 and 3, the crystal dome lifting mechanism of the present embodiment can simultaneously place two baskets 1, and the whole structure is in a bilateral symmetry structure, so that the basket positioning assembly and the top knife assembly are both two groups of structures with symmetrical structures.

The specific independent basket positioning assembly is provided with two groups, namely a left side positioning block 3, a right side positioning block 3 and a front side positioning block 4, wherein the left side positioning block 3, the right side positioning block 3 and the front side positioning block 4 are respectively provided with a guiding inclined surface 5 which is inclined inwards, the left side positioning block 3, the right side positioning block 3 and the front side positioning block 4 surround a positioning area, when the basket 1 is placed in the positioning area from top to bottom, the left side positioning block 3 is tightly attached to the left side and the right side of the basket 1, and the front side positioning block 4 is tightly attached to the front side and the rear side of the basket 1.

The top knife assembly is located in the positioning area, and consists of four vertically arranged top plates 6, the four top plates 6 are arranged in parallel, as shown in fig. 1 and 2, the top of the top plate 6 is provided with V-shaped top knives 7 which correspond to the number and the positions of the positioning grooves 2 and are used for supporting the bottom of the wafer 13. As shown in fig. 7 and 8, when the basket 1 is placed in the positioning area, the V-shaped top knife 7 will simultaneously lift the wafer 13, so that the bottom of the wafer 13 is separated from the bottom of the positioning groove 2, and the back surface of the wafer 13 abuts against the inner wall of one end of the positioning groove 2.

In this embodiment, the top surface of the support frame is provided with a mounting plate 10, as shown in fig. 1, the support frame is formed by splicing an X-axis support plate 8 and a Y-axis support plate 9, two X-axis support plates 8 are provided in total, the two X-axis support plates 8 are in a front-back symmetrical structure, three Y-axis support plates 9 are provided in total, the three Y-axis support plates are arranged at the bottoms of the two X-axis support plates 8, and the Y-axis support plates 9 and the X-axis support plates 8 are locked and fixed by screws. The mounting panel 10 is installed in the top surface of X axle backup pad 8, and the both ends of mounting panel 10 all are equipped with horizontal spout 11, and side locating piece 3 is the structure of falling U-shaped about, and side locating piece 3 is installed respectively in horizontal spout 11 about, and can follow horizontal spout 11 and carry out horizontal sliding adjustment, and the installation position adjustment is confirmed the back, and rethread screw carries out locking and fixes. The front side positioning block 4 and the rear side positioning block 4 are provided with two pairs, the front side positioning block 4 and the rear side positioning block 4 are of L-shaped structures, the front side positioning block 4 and the rear side positioning block 4 are fixed on the top surface of the mounting plate 10 and are positioned between the two left side positioning blocks 3 and the right side positioning blocks, and the bottoms of the front side positioning block 4 and the rear side positioning block 4 are used for supporting the bottoms of the flower baskets 1.

As shown in fig. 1, a horizontal beam 12 is connected between two left and right side surface positioning blocks 3, four top plates 6 are vertically installed on the side surfaces of the horizontal beam 12, the specific top plates 6 are locked to the side surfaces of the horizontal beam 12 through screws, and two tail ends of the horizontal beam 12 are fixed on the outer side end surfaces of the left and right side surface positioning blocks 3 through pressing blocks. The horizontal position of the top plate 6 can be adjusted by adjusting the horizontal movement positions of the left and right side positioning blocks 3, so that each corresponding V-shaped top knife 7 corresponds to each positioning groove 2. A pointed bulge is formed between two adjacent V-shaped top cutters 7. The arrangement of the pointed bulge can be used for auxiliary guiding, and the wafer 13 is guided along the side surface of the pointed bulge in the descending process of the flower basket 1, so that the wafer 13 can be jacked up by the V-shaped jackknife 7 accurately when the flower basket 1 is slowly placed in a positioning area downwards, the corresponding V-shaped jackknife 7 can be dropped at the bottom of the wafer 13 at home, and the V-shaped jackknife 7 can jack up the wafer 13.

The wafer lifting mechanism of this embodiment is used for a wafer drying device, as shown in fig. 9, the wafer drying device includes a drying tank 14 and a cover plate 15 hinged at one end of the top of the drying tank 14, the cover plate 15 is sealed at the top opening of the drying tank 14, the cover plate 15 can be opened or closed along the top of the drying tank 14, the inside of the drying tank 14 is a process chamber 16, the wafer lifting mechanism of this embodiment is fixedly installed in the process chamber 16, when the cover plate 15 is opened, the basket 1 can be taken out along the top opening of the drying tank 14, the end face of the cover plate 15 facing the process chamber 16 is provided with an IPA nozzle, an ion wind nozzle and a nitrogen nozzle, the bottom of the drying tank 14 is provided with a drain opening which is communicated with the process chamber 16, and the drain opening includes a slow drain opening and a fast drain opening. The working process of the wafer drying device of this embodiment is as follows:

In the first step, the basket is calibrated, ultrapure water is injected into the process chamber 16, the wafer 13 is longitudinally placed in the corresponding positioning groove 2 on the basket 1, as shown in fig. 5, the bottoms of the two ends of the wafer 13 are contacted with the positioning groove 2, and the wafer 13 is supported by the positioning groove 2. The whole flower basket 1 with the wafer 13 is clamped by a manipulator and moved to the upper part of the process chamber 16, as shown in fig. 4, and is slowly put into the process chamber 16 downwards, and in the process of lowering the flower basket 1, the bottom side surface of the flower basket 1 is accurately positioned under the guiding action of the guiding inclined surface 5 of the positioning block of the flower basket 1, so that the flower basket 1 is corrected, as shown in fig. 3;

Secondly, jacking up the wafer, slowly descending the wafer 1 after correction to enable the bottom of the wafer 13 to be in contact with the V-shaped top cutters 7, respectively supporting the V-shaped top cutters 7 of the four top plates 6 at the bottoms of the front end and the rear end of the wafer 13 at the same time to enable the wafer 13 to be in a vertical state, enabling the bottoms of the front end and the rear end of the wafer 13 not to be in contact with the positioning groove 2 of the wafer 1 any more, separating the bottoms of the front end and the rear end of the wafer 13 from the wafer 1, enabling the back surface of the wafer 13 to abut against one end inner wall of the positioning groove 2, enabling the wafer 1 to descend to a lower limit point at the moment, and positioning the wafer 1 to be completed;

Thirdly, overflow of the ultrapure water is carried out, the ultrapure water is continuously injected into the process chamber 16, the wafer 13 is completely soaked in the ultrapure water, the ultrapure water is continuously overflowed, the overflow time of the ultrapure water is 5-10 s, and the overflow process is used for cleaning floating particles on the water surface;

Step four, slow-pull drying, namely opening an IPA nozzle and a nitrogen nozzle to enable the IPA nozzle and the nitrogen nozzle to spray mixed gas of IPA and nitrogen, enabling the mixed gas of IPA and nitrogen to generate a Marangoni phenomenon on the surface of the wafer 13, enabling liquid on the surface of the wafer 13 to fall off from the surface of the wafer 13, opening a slow water outlet at the moment, and continuously reducing the water level during slow-pull drying of the wafer 13 at the moment;

Fifthly, drying the flower basket, namely after the water level drops to the lower part of the wafer 13, namely after slow-pull drying is finished, closing an IPA nozzle and a nitrogen nozzle, closing a slow water outlet, opening a fast water outlet, spraying hot nitrogen from the nitrogen nozzle, and drying water vapor on the surface of the flower basket 1 by the hot nitrogen;

step six, static electricity is removed, after the flower basket 1 is dried, the nitrogen nozzle is closed, the ion wind nozzle is opened, and the ion wind nozzle sprays static ion wind for removing static electricity of the wafer 13;

And seventhly, removing the flower basket, controlling the manipulator to move and clamp the flower basket 1, enabling the flower basket 1 to slowly ascend, enabling the wafer 13 to be separated from the V-shaped top knife 7 upwards in the process, and fall into the positioning groove 2 of the flower basket 1 again, and finally enabling the whole flower basket 1 to be separated from the process chamber 16, and ending the drying process.

The foregoing is a further detailed description of the utility model in connection with specific preferred embodiments, and is not intended to limit the practice of the utility model to such description. It will be apparent to those skilled in the art that several simple deductions or substitutions can be made without departing from the spirit of the utility model, and the scope of the utility model is to be considered as the scope of the utility model.

Claims (5)

1. A wafer lifting mechanism for a wafer drying device, comprising a flower basket, a support frame, and a flower basket positioning assembly and a top knife assembly arranged on the support frame, wherein the front and rear inner walls of the flower basket are provided with a plurality of positioning grooves for longitudinally placing wafers, characterized in that: the flower basket positioning assembly is provided with two groups, namely left and right side positioning blocks and front and rear side positioning blocks, the left and right side positioning blocks and the front and rear side positioning blocks are provided with inwardly inclined guiding inclined surfaces, the left and right side positioning blocks and the front and rear side positioning blocks surround and form a positioning area, when the flower basket is placed in the positioning area from top to bottom, the left and right side positioning blocks are pressed against the left and right sides of the flower basket, the front and rear side positioning blocks are pressed against the front and rear sides of the flower basket, the top knife assembly is located in the positioning area, the top knife assembly is composed of four vertically arranged top plates, the four top plates are arranged parallel to each other, the top of the top plate is provided with a V-shaped top knife corresponding to the number and position of the positioning grooves and used to support the bottom of the wafer, when the flower basket is placed in the positioning area, the V-shaped top knife will simultaneously lift the wafer, so that the bottom of the wafer is separated from the bottom of the positioning groove, and the back of the wafer is close to the inner wall of one end of the positioning groove. 2. According to claim 1, the wafer lifting mechanism for a wafer drying device is characterized in that: a mounting plate is provided on the top surface of the support frame, and horizontal slide grooves are provided at both ends of the mounting plate, and the left and right side positioning blocks are inverted U-shaped structures, and the left and right side positioning blocks are respectively installed in the horizontal slide grooves, and can be adjusted horizontally by sliding along the horizontal slide grooves, and there are two pairs of front and rear side positioning blocks, and the front and rear side positioning blocks are L-shaped structures, and the front and rear side positioning blocks are fixed to the top surface of the mounting plate and are located between the two left and right side positioning blocks. 3. According to claim 2, the wafer lifting mechanism for a wafer drying device is characterized in that: the support frame is composed of an X-axis support plate and a Y-axis support plate, there are two X-axis support plates, and the mounting plate is installed on the top surface of the X-axis support plate. 4. The wafer lifting mechanism for a wafer drying device according to claim 2 is characterized in that a horizontal beam is connected between the two left and right side positioning blocks, and four top plates are vertically installed on the sides of the horizontal beam. 5. The wafer lifting mechanism for a wafer drying device according to any one of claims 1 to 4, characterized in that a pointed protrusion is formed between two adjacent V-shaped lifting knives.