CN221777979U

CN221777979U - Sputtering coating equipment

Info

Publication number: CN221777979U
Application number: CN202323575132.0U
Authority: CN
Inventors: 陈卫军; 欧阳增图; 刘凌海
Original assignee: Suzhou Chenhua Semiconductor Technology Co ltd
Current assignee: Suzhou Chenhua Semiconductor Technology Co ltd
Priority date: 2023-12-25
Filing date: 2023-12-25
Publication date: 2024-09-27
Anticipated expiration: 2033-12-25

Abstract

The utility model provides a sputtering coating device, the sputtering coating device includes: a chamber; a support plate, which is arranged in the chamber and close to the top plate of the chamber, a substrate fixing hole is arranged on the support plate, a substrate is arranged in the substrate fixing hole, and the support plate can drive the substrate to rotate; a plurality of magnetron cathodes, which are arranged on the bottom plate of the chamber, and the output end of the magnetron cathode is arranged toward the substrate fixing hole; a plurality of target materials, which are arranged on the plurality of magnetron cathodes; and a plurality of controllable power supplies, one side of the controllable power supply is electrically connected to the magnetron cathode, and the other side is grounded. The sputtering coating device provided by the utility model improves the quality and efficiency of thin film formation.

Description

Sputtering coating equipment

Technical Field

The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to sputtering coating equipment.

Background

Physical vapor deposition (Physical Vapor Deposition, PVD) is a surface treatment technique that forms a thin film on a substrate surface by converting a thin film material into a granular state under vacuum conditions and then rapidly depositing the granular state of the thin film material on the substrate. However, when a single-material target is used for coating a substrate in conventional PVD preparation, the single-material target is difficult to use for preparing a multi-component and multi-phase composite material. And when the single-material target is deposited on the surface of the substrate, the phenomena of polarization effect, non-uniform energy deviation and the like are easy to occur, and the quality and stability of the coating are reduced.

Disclosure of utility model

In view of the above drawbacks of the prior art, an object of the present utility model is to provide a sputter coating apparatus, by which the problems that when a single material target is used to coat a substrate, it is difficult to prepare a multi-component and multi-phase composite material, and when the single material target is deposited on the surface of the substrate, polarization effects, non-uniform energy deviations, etc. are easily generated, and the quality and stability of the coated film are reduced are effectively improved.

To achieve the above and other related objects, the present utility model provides a sputter coating apparatus comprising:

a chamber;

The support plate is arranged in the cavity and close to the top plate of the cavity, a substrate fixing hole is formed in the support plate, a substrate is arranged in the substrate fixing hole, and the support plate can drive the substrate to rotate;

The magnetic control cathodes are arranged on the bottom plate of the chamber, and the output ends of the magnetic control cathodes are arranged towards the substrate fixing holes;

A plurality of targets arranged on the plurality of magnetic control cathodes; and

One side of the controllable power supply is electrically connected with the magnetic control cathode, and the other side of the controllable power supply is grounded.

In one embodiment of the utility model, an air inlet is provided on one side of the chamber, from which process gas enters the chamber.

In an embodiment of the utility model, the film spraying and plating device further comprises a filtering baffle plate, wherein the filtering baffle plate is arranged in the cavity and is positioned on the air inlet hole.

In an embodiment of the utility model, an exhaust hole is arranged at one side of the chamber, and the exhaust hole is arranged at one side opposite to the air inlet hole.

In an embodiment of the present utility model, the sputter coating apparatus further includes a driving device, an output end of the driving device is in transmission connection with one end of the support plate, and the driving device drives the support plate to rotate.

In an embodiment of the present utility model, the plurality of magnetic control cathodes includes a first magnetic control cathode, a second magnetic control cathode, and a third magnetic control cathode, where the first magnetic control cathode, the second magnetic control cathode, and the third magnetic control cathode are arranged on a bottom plate of the chamber side by side.

In an embodiment of the present utility model, one end of the first magnetic control cathode, one end of the second magnetic control cathode and one end of the third magnetic control cathode are provided with the target, and the other end extends to the outside of the chamber.

In an embodiment of the present utility model, the plurality of controllable power sources includes a first controllable power source, a second controllable power source, and a third controllable power source, and the first controllable power source, the second controllable power source, and the third controllable power source are disposed outside the chamber.

In an embodiment of the present utility model, one end of the first controllable power supply is electrically connected to the other end of the first magnetic control cathode, one end of the second controllable power supply is electrically connected to the other end of the second magnetic control cathode, and one end of the third controllable power supply is electrically connected to the other end of the third magnetic control cathode.

In an embodiment of the present utility model, the intensity of the magnetic field generated at one end of the magnetron cathode may be changed by adjusting the controllable power supply.

In summary, according to the sputtering coating equipment provided by the utility model, the preparation of the multi-component film can be realized by arranging a plurality of targets on a plurality of magnetic control cathodes, and alternate coating, hybrid coating or sequential single layered coating can be realized according to coating requirements, so that the equipment is flexible in use, the influence of polarization effect and energy deviation phenomenon is reduced, and the quality and purity of the film are improved. And the difficulty of setting the technological parameters is reduced, the material cost is reduced, and the stability and the deposition efficiency of the coating are improved. And the substrate is driven to rotate through the rotation of the supporting plate, so that the efficiency of substrate coating is improved. And the filtering baffle is arranged at the air inlet hole, so that the purity of argon and oxygen is improved, and the quality of the coating film is improved.

Of course, it is not necessary for any one product to practice the utility model to achieve all of the advantages set forth above at the same time.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a structural view of a sputtering coating apparatus of the present utility model.

Description of element reference numerals

100. A chamber; 110. an air inlet hole; 120. an exhaust hole; 200. a first magnetically controlled cathode; 210. a second magnetically controlled cathode; 220. a third magnetically controlled cathode; 300. a first controllable power supply; 310. a second controllable power supply; 320. a third controllable power supply; 400. a target material; 500. a filtering baffle; 600. a support plate; 700. a substrate; 800. a driving device.

Detailed Description

Other advantages and effects of the present utility model will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present utility model with reference to specific examples. The utility model may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present utility model. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. It is also to be understood that the terminology used in the examples of the utility model is for the purpose of describing particular embodiments only, and is not intended to limit the scope of the utility model. The test methods in the following examples, in which specific conditions are not noted, are generally conducted under conventional conditions or under conditions recommended by the respective manufacturers.

Please refer to fig. 1. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the utility model to the extent that it can be practiced, since modifications, changes in the proportions, or adjustments of the sizes, which are otherwise, used in the practice of the utility model, are included in the spirit and scope of the utility model which is otherwise, without departing from the spirit or scope thereof. Also, the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like recited in the present specification are merely for descriptive purposes and are not intended to limit the scope of the utility model, but are intended to provide relative positional changes or modifications without materially altering the technical context in which the utility model may be practiced.

Where numerical ranges are provided in the examples, it is understood that unless otherwise stated herein, both endpoints of each numerical range and any number between the two endpoints are significant both in the numerical range. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs and to which this utility model belongs, and any method, apparatus, or material of the prior art similar or equivalent to the methods, apparatus, or materials described in the examples of this utility model may be used to practice the utility model.

In one embodiment of the present utility model, a sputter coating apparatus is provided that is applicable to sputter coating a substrate. The coating material includes, but is not limited to, metals, alloys, oxides, nitrides, and the like. The substrate with clean surface is fixed in the substrate fixing holes on the support frame, a plurality of target materials are placed on a plurality of magnetic control cathodes, and process gas is introduced into the chamber through the air inlet holes, so that the target materials sputter target material atoms in the direction of the substrate, and the target material atoms are deposited on the substrate and react with the process gas to form a film layer. The sputtering coating equipment provided by the utility model can form a multi-component film on the surface of the substrate, and improves the quality and purity of the coating.

Referring to fig. 1, in an embodiment of the utility model, a sputter coating apparatus is provided, which includes a chamber 100, a plurality of magnetron cathodes, a plurality of controllable power sources, a plurality of targets 400, and a support plate 600. The support plate 600 is disposed in the chamber 100, and a substrate fixing hole is provided on the support plate 600. The plurality of magnetron cathodes are disposed on the bottom plate of the chamber 100, and output ends of the plurality of magnetron cathodes are disposed toward the substrate fixing hole. The targets 400 are disposed on the magnetic cathodes, and one side of the controllable power supply is electrically connected to the magnetic cathodes, while the other side is grounded.

Referring to fig. 1, in an embodiment of the present utility model, the magnetic field strength generated at one end of the magnetron cathode can be changed by adjusting the controllable power supply. The plurality of magnetron cathodes includes a first magnetron cathode 200, a second magnetron cathode 210, and a third magnetron cathode 220. The first magnetron cathode 200, the second magnetron cathode 210 and the third magnetron cathode 220 are sequentially disposed on the inner wall of the chamber 100, and the output ends of the first magnetron cathode 200, the second magnetron cathode 210 and the third magnetron cathode 220 are disposed towards the substrate fixing hole on the support plate 600, and the other end extends outwards through the chamber 100. The plurality of targets 400 are disposed at one ends of the first, second and third magnetron cathodes 200, 210 and 220. The plurality of controllable power sources include a first controllable power source 300, a second controllable power source 310 and a third controllable power source 320, wherein one end of the first controllable power source 300 is electrically connected to the other end of the first magnetic cathode 200, one end of the second controllable power source 310 is electrically connected to the other end of the second magnetic cathode 210, and one end of the third controllable power source 320 is electrically connected to the other end of the third magnetic cathode 220. The other ends of the first, second and third controllable power sources 300, 310 and 320 are grounded. The magnetron cathode is used for generating a large amount of particles on the surface of the target 400 when the target 400 at one end of the magnetron cathode is bombarded by high-energy particles. The magnetron cathode generates a strong magnetic field to collect a large amount of particles generated on the surface of the target 400 in the beam and move along a straight line to reach the substrate 700 to form a thin film. The controllable power supply provides energy for the magnetic control cathode, so that the magnetic control cathode generates a magnetic field.

Referring to fig. 1, in one embodiment of the present utility model, an inlet port 110 and an outlet port 120 are provided on opposite sides of the chamber 100, and process gas, including oxygen, nitrogen and argon, for example, is introduced into the chamber 100 from the inlet port 110. Wherein oxygen and nitrogen are reactive gases, and oxygen or nitrogen is introduced into the chamber 100 for the purpose of reacting the target particles with oxygen or nitrogen to form an oxide film or a nitride film when the target particles are deposited on the substrate 700. Among them, argon is used as an industrial gas, and the main function is to provide an energy source for ionization and activation reactions. When argon enters the vacuum chamber 100, the argon can be excited into a plasma form by heating or ionization and the like, so that a large amount of high-energy particles are generated, and the high-energy particles strike the target 400, so that physical and chemical changes are generated on the surface of the target 400, and atoms of the target 400 are sputtered. And the argon can also adjust ion energy distribution in the reaction process in the chamber 100, control the reaction air pressure and discharge non-reactive gas, thereby protecting the stability and quality of the reaction environment in the chamber 100 and improving the coating quality of the substrate 700. A vacuum system is connected to the output of the vent 120 such that a vacuum is drawn at the vent 120 creating a vacuum environment within the chamber 100.

Referring to fig. 1, in an embodiment of the present utility model, a sputter coating apparatus further includes a filtering baffle 500. The filtering baffle 500 is disposed within the chamber 100 and is disposed on the air intake aperture 110. The filtering baffle 500 filters the process gas entering the chamber 100 to avoid impurities from affecting the accuracy and stability of the reaction, to improve the accuracy, rapidity and reliability of the reaction, and to improve the quality of the coating film.

Referring to fig. 1, in an embodiment of the present utility model, a support plate 600 is disposed in the chamber 100 and is disposed near the top plate of the chamber 100. A substrate fixing hole is provided on the support plate 600, and the substrate 700 may be disposed in the substrate fixing hole. The sputtering coating equipment provided by the utility model further comprises a driving device 800, wherein the driving device 800 is arranged outside the chamber 100, and one end of the supporting plate 600 is in transmission connection with the driving device 800 through a connecting rod. The driving device 800 drives the support plate 600 to rotate, thereby driving the substrate 700 to rotate, and coating the two opposite surfaces of the substrate 700 can be realized.

Referring to fig. 1, in an embodiment of the present utility model, when the sputtering apparatus provided by the present utility model is used to film a substrate 700, the substrate 700 needs to be fixed on a support plate 600, and one side surface of the substrate 700 faces the direction of the magnetron cathode. The corresponding target 400 is disposed on the magnetron cathode according to the coating requirements of the substrate 700. The magnetron cathode is energized and a process gas is introduced into the chamber 100 to sputter coat one side of the substrate 700. After the film plating on one side of the substrate 700 is completed, the rotation of the output end of the driving device 800 can drive the support plate 600 and the substrate 700 to rotate, thereby realizing the film plating on the other side of the substrate 700.

In summary, according to the sputtering coating equipment provided by the utility model, the preparation of the multi-component film can be realized by arranging a plurality of targets on a plurality of magnetic control cathodes, and alternate coating, hybrid coating or sequential single layered coating can be realized according to coating requirements, so that the equipment is flexible in use, the influence of polarization effect and energy deviation phenomenon is reduced, and the quality and purity of the film are improved. And the difficulty of setting process parameters is reduced, the material cost is reduced, the stability and the deposition efficiency of the coating are improved, and the bonding strength of the film and the substrate is improved. And the substrate is driven to rotate through the rotation of the supporting plate, so that the efficiency of substrate coating is improved. And the filtering baffle is arranged at the air inlet hole, so that the purity of argon and oxygen is improved, and the quality of the coating film is improved. Therefore, the utility model effectively overcomes some practical problems in the prior art, thereby having high utilization value and use significance.

The above embodiments are merely illustrative of the principles of the present utility model and its effectiveness, and are not intended to limit the utility model. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the utility model. Accordingly, it is intended that all equivalent modifications and variations of the utility model be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims

1. A sputter coating apparatus, characterized by comprising:

a chamber;

2. A sputter coating apparatus according to claim 1, characterized in that one side of the chamber is provided with an inlet aperture from which process gas enters the chamber.

3. The sputter coating apparatus of claim 2, further comprising a filter baffle disposed in the chamber and positioned over the inlet aperture.

4. The sputter coating apparatus according to claim 2, wherein one side of the chamber is provided with an exhaust hole, and the exhaust hole is provided at a side opposite to the intake hole.

5. The sputter coating apparatus of claim 1, further comprising a driving device, wherein an output end of the driving device is in transmission connection with one end of the support plate, and the driving device drives the support plate to rotate.

6. The sputter coating apparatus of claim 1, wherein the plurality of magnetron cathodes comprises a first magnetron cathode, a second magnetron cathode, and a third magnetron cathode, the first magnetron cathode, the second magnetron cathode, and the third magnetron cathode being disposed side-by-side on a floor of the chamber.

7. The sputter coating apparatus of claim 6, wherein one end of the first, second and third magnetron cathodes is provided with the target, and the other end extends to the outside of the chamber.

8. The sputter coating apparatus of claim 7, wherein the plurality of controllable power sources includes a first controllable power source, a second controllable power source, and a third controllable power source, the first controllable power source, the second controllable power source, and the third controllable power source being disposed outside of the chamber.

9. The sputter coating apparatus of claim 8, wherein one end of the first controllable power source is electrically connected to the other end of the first magnetron cathode, one end of the second controllable power source is electrically connected to the other end of the second magnetron cathode, and one end of the third controllable power source is electrically connected to the other end of the third magnetron cathode.

10. The sputter coating apparatus of claim 1, wherein the intensity of the magnetic field generated at one end of the magnetron cathode is varied by adjusting the controllable power supply.