CN221768543U - A high-power mini amplifier - Google Patents

Abstract

The present application proposes a high-power mini amplifier, comprising: a shell, the shell is a tubular structure with openings at both ends, and the inner wall of the shell is provided with a slot; a cover plate, the cover plate covers the openings at both ends of the shell; a PCB board, the PCB board is installed in the space surrounded by the shell and the cover plate through the slot; wherein, an amplifier chip is provided on the PCB board, a heat sink is provided on the outer side of the amplifier chip, a connecting column is provided on the heat sink, and one end of the connecting column is connected to the heat sink. The present application opens heat dissipation holes at the bottom and top of the shell, so that the heat generated by the components can be exchanged with the outside world, and the heat sink on the amplifier chip is cleverly fitted with the inner wall of the all-aluminum alloy shell, so that the whole body becomes a radiator, effectively improving the heat dissipation performance, ensuring the safe and stable operation of the chip, reducing the volume, meeting the portability requirements of the amplifier, and at the same time effectively improving the heat dissipation, meeting the heat dissipation requirements of the high-power amplifier.

Description

A high-power mini amplifier

Technical Field

The present application relates to the technical field of audio equipment, and in particular to a high-power mini amplifier.

Background Art

A power amplifier is abbreviated as a power amplifier. It generally refers to one of the most basic devices in an audio system, commonly known as a "loudspeaker". Its task is to amplify the weak electrical signal from the signal source to drive the speaker to make a sound. Traditional power amplifiers are large in size, with ample internal space for easy heat dissipation, so high-power power amplifier chips can be used. However, traditional power amplifiers are not easy to carry, so people have designed some small power amplifiers. However, the existing mini power amplifiers, although meeting the needs of portable use, are limited by the size and are not conducive to heat dissipation, making it impossible to use high-power power amplifier chips inside. Therefore, it is necessary to design a high-power mini power amplifier with a reasonable internal design, which can make the entire body a radiator, effectively improve the heat dissipation performance, meet the heat dissipation needs of high-power amplifiers, and ensure the safe and stable operation of the chip.

Utility Model Content

In order to solve the above problems, the present application proposes a high-power mini amplifier, which dissipates heat by opening holes at the bottom and top of the shell, and cleverly fits the heat sink of the amplifier chip to the all-aluminum alloy shell to improve the heat dissipation efficiency.

This application is implemented through the following technical solutions:

The present application proposes a high-power mini amplifier, comprising:

A shell, the shell is a tubular structure with openings at both ends, and a card slot is provided on the inner wall of the shell;

A cover plate, the cover plate covers the openings at both ends of the shell;

A PCB board, wherein the PCB board is installed in a space surrounded by the housing and the cover plate through a slot;

The PCB board is provided with a power amplifier chip, a heat sink is provided on the outside of the power amplifier chip, a connecting column is provided on the heat sink, one end of the connecting column is connected to the heat sink, and the other end of the connecting column penetrates the PCB board and is connected to the PCB board by screws;

One side of the heat sink is attached to the inner wall of the shell.

Furthermore, a thermally conductive silicone sheet is provided between the heat sink and the power amplifier chip.

Furthermore, the area of the heat sink is larger than the area of the power amplifier chip.

Furthermore, the end surface of the heat sink is flat, and when the PCB board is installed in the housing, the thermally conductive silicone sheet presses the heat sink to be tightly attached to the inner wall of the housing.

Furthermore, the connecting posts are provided on the four corners of the heat sink, the connecting posts are slidably connected to the PCB board, and the screws are screwed into the connecting posts along the axial direction of the connecting posts.

Furthermore, a plurality of heat dissipation holes are provided on both sides of the shell.

Furthermore, the cover plates are connected to each other via connecting rods.

Furthermore, a limit block is provided on the inner side of the cover plate, and the cover plate is clamped to the two ends of the shell through the limit block.

Furthermore, the PCB board is provided with a connector and a knob, and the connector and the knob extend outward through the cover plate.

Furthermore, the shell is made of aluminum alloy.

The beneficial effects of the present application are as follows: by opening heat dissipation holes at the bottom and top of the shell, the heat generated by the components can be exchanged with the outside world, and the heat sink on the power amplifier chip is cleverly fitted with the inner wall of the all-aluminum alloy shell, so that the entire body becomes a radiator, effectively improving the heat dissipation performance, ensuring the safe and stable operation of the chip, reducing the size, meeting the portability requirements of the power amplifier, and at the same time effectively improving the heat dissipation to meet the heat dissipation requirements of high-power amplifiers.

BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 is a schematic diagram of the structure of the utility model;

FIG2 is a schematic diagram of components inside the housing of the present invention;

FIG3 is a schematic diagram of the structure of a heat sink;

The descriptions of the reference numerals in the figures are as follows:

1-housing, 2-cover plate, 3-PCB board, 101-card slot, 102-heat dissipation hole, 201-connecting rod, 301-power amplifier chip, 302-heat sink, 303-connecting column, 304-thermal conductive silicone sheet.

DETAILED DESCRIPTION

The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

In addition, the descriptions of "first", "second", etc. in this application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

As shown in Figures 1 to 3, an embodiment of the utility model provides a high-power mini amplifier, including: a shell 1, the shell 1 is a tubular structure with openings at both ends, and the inner wall of the shell 1 is provided with a card slot 101; a cover plate 2, the cover plate 2 covers the openings at both ends of the shell 1; a PCB board 3, the PCB board 3 is installed in the space surrounded by the shell 1 and the cover plate 2 through the card slot 101; wherein, a power amplifier chip 301 is provided on the PCB board 3, a heat sink 302 is provided on the outer side of the power amplifier chip 301, and a connecting column 303 is provided on the heat sink 302, one end of the connecting column 303 is connected to the heat sink 302, and the other end of the connecting column 303 penetrates the PCB board 3 and is connected to the PCB board 3 through screws; one side of the heat sink 302 is attached to the inner wall of the shell 1.

The power amplifier chip 301 generates heat when working. Traditional large-volume power amplifiers have ample internal space and the heat can be dissipated in time. The present application adopts a compact design. In order to dissipate heat quickly, the heat sink 302 is closely attached to the shell 1. The heat generated by the power amplifier chip 301 is transferred to the shell 1 through the heat sink 302. The shell 1 has a large surface area and is made of aluminum alloy. It has fast thermal conductivity and good heat exchange with the external atmosphere. It can effectively reduce the temperature of the power amplifier chip 301, ensure the safe and stable operation of the chip, reduce the size, meet the portability requirements of the power amplifier, and effectively improve the heat dissipation to meet the heat dissipation requirements of high-power amplifiers.

In a preferred embodiment, a thermally conductive silicone sheet 304 is provided between the heat sink 302 and the power amplifier chip 301. The thermally conductive silicone sheet 304 has a high thermal conductivity and can fill the gap between the heat sink 302 and the power amplifier chip 301, so that the heat generated by the power amplifier chip 301 can be more efficiently transferred to the heat sink 302. At the same time, the thermally conductive silicone sheet 304 is soft in texture and can produce a certain elastic deformation, so as to press the heat sink 302 to fit the inner wall of the shell 1, so as to utilize the shell 1 to improve the heat dissipation efficiency.

In a preferred embodiment, the area of the heat sink 302 is larger than the area of the power amplifier chip 301, which can increase the heat exchange area and improve the heat dissipation efficiency. At the same time, the heat sink 302 is made of copper or aluminum, which has a heat-averaging effect and avoids excessive local temperature of the power amplifier chip 301.

In a preferred embodiment, the end surface of the heat sink 302 is flat to facilitate efficient heat transfer. When the PCB board 3 is installed in the shell 1, the thermal conductive silicone sheet 304 presses the heat sink 302 to fit tightly against the inner wall of the shell 1. The reaction force after the thermal conductive silicone sheet 304 is pressed makes the heat sink 302 fit tightly against the inner wall of the shell 1, ensuring that heat can be effectively transferred to the shell 1.

Preferably, connecting columns 303 are provided on the four corners of the heat sink 302, and the connecting columns 303 are slidably connected to the PCB board 3. Screws are screwed into the connecting columns 303 along the axial direction of the connecting columns 303, so that the heat sink 302 can slide relative to the PCB board 3, so that after assembly, the heat sink 302 can be pressed tightly against the shell 1 by the pressure of the thermal conductive silicone sheet 304.

Specifically, a plurality of heat dissipation holes 102 are provided on both sides of the housing 1 to facilitate the hot air in the housing 1 to dissipate outwards.

Specifically, the cover plates 2 are connected to each other via the connecting rods 201 , so that the cover plates 2 are firmly connected to each other.

In a preferred embodiment, a limit block is provided on the inner side of the cover plate 2, and the cover plate 2 is clamped at both ends of the shell 1 through the limit block to prevent the cover plate 2 from shaking at both ends of the shell 1, thereby ensuring the assembly quality.

In a preferred embodiment, the PCB board 3 is provided with a connector and a knob, and the connector and the knob extend outward through the cover plate 2 to meet the use requirements of the power amplifier.

In a preferred embodiment, the housing 1 is made of aluminum alloy, which has a high thermal conductivity, so that the housing 1 assists the power amplifier chip 301 in dissipating heat.

In a preferred embodiment, a high temperature mark is attached to the housing 1 . When the temperature of the housing 1 rises to 50° C. to 60° C. during operation, the high temperature mark reminds people not to touch the housing 1 .

Of course, the present application may have many other implementations. Based on the present implementation, other implementations obtained by ordinary technicians in this field without any creative work are all within the scope of protection of the present application.

Claims (10)

1. A high power mini power amplifier, comprising:

the device comprises a shell (1), wherein the shell (1) is of a tubular structure with openings at two ends, and a clamping groove (101) is formed in the inner wall of the shell (1);

the cover plate (2) covers openings at two ends of the shell (1);

the PCB (3) is arranged in a space surrounded by the shell (1) and the cover plate (2) through the clamping groove (101);

The power amplification chip (301) is arranged on the PCB (3), a radiating fin (302) is arranged on the outer side of the power amplification chip (301), a connecting column (303) is arranged on the radiating fin (302), one end of the connecting column (303) is connected with the radiating fin (302), and the other end of the connecting column (303) penetrates through the PCB (3) and then is connected with the PCB (3) through a screw;

one side of the radiating fin (302) is attached to the inner wall of the shell (1).

2. The high-power mini power amplifier according to claim 1, wherein a heat conducting silicon sheet (304) is arranged between the heat sink (302) and the power amplifier chip (301).

3. A high power mini power amplifier according to claim 2, characterized in that the area of the heat sink (302) is larger than the area of the power amplifier chip (301).

4. A high-power mini power amplifier according to claim 3, wherein the end face of the heat sink (302) is flat, and the heat conducting silicon sheet (304) presses the heat sink (302) to be tightly attached to the inner wall of the casing (1) when the PCB (3) is mounted in the casing (1).

5. The high-power mini power amplifier according to claim 1, wherein the connecting columns (303) are arranged on four corners of the radiating fin (302), the connecting columns (303) are slidably connected with the PCB (3), and the screws are screwed into the connecting columns (303) along the axial direction of the connecting columns (303).

6. The high-power mini power amplifier according to claim 1, wherein a plurality of heat dissipation holes (102) are formed on two sides of the housing (1).

7. A high power mini power amplifier according to claim 1, characterized in that the cover plates (2) are interconnected by connecting rods (201).

8. The high-power mini power amplifier according to claim 7, wherein a limiting block is arranged on the inner side of the cover plate (2), and the cover plate (2) is clamped at two ends of the shell (1) through the limiting block.

9. A high power mini power amplifier according to claim 1, characterized in that the PCB board (3) is provided with a connector and a knob which protrude outwards through the cover plate (2).

10. The high-power mini power amplifier according to claim 1, wherein the housing (1) is made of aluminum alloy.