CN221748700U - A power management module - Google Patents

Abstract

The present application discloses a power management module, which includes a shell, a circuit board and a cover body. The shell includes a wall portion, the wall portion encloses a receiving cavity opened in a first direction, the wall portion forms a first edge at the opening, the circuit board is at least partially overlapped on the first edge, the circuit board is provided with a grounding area, the cover body is provided on the side of the circuit board away from the shell, the cover body includes a main body portion and a second edge surrounding the outer periphery of the main body portion, the main body portion is arched relative to the second edge toward the side away from the receiving cavity, the second edge is connected to the first edge and the circuit board is enclosed in the receiving cavity, and the cover body is at least partially crimped to the grounding area of the circuit board. The power management module in the embodiment of the present application can realize electrostatic protection of the power management module, reduce the risk of external static electricity breaking down the circuit board, and improve the reliability of the power management module.

Description

A power management module

Technical Field

The present application relates to the technical field of power management, and in particular to a power management module.

Background Art

In recent years, the development of new energy vehicles has been growing stronger and stronger, gradually tending to be intelligent, integrated and information-based. On this basis, more and more automotive electronic products have been developed to improve the performance of new energy vehicles. Among them, the power management module mainly provides power and power management in various systems of new energy vehicles. When the vehicle has an abnormality, it reads the sensor input and responds in time, thereby controlling the power of various equipment in the vehicle.

During the use of the power management module, static electricity will be generated inside. If the generated static electricity is not released in time, it will accumulate in the power management module. When the static electricity accumulates to a certain amount, it will discharge instantly and generate a large current. This is the ESD (Electro Static Discharge) phenomenon. Therefore, when the power management module detects and protects the current of the whole vehicle, it is necessary to consider its grounding to avoid failure caused by static electricity breakdown.

Utility Model Content

The embodiment of the present application provides a power management module, which can implement electrostatic protection for the power management module, reduce the risk of external static electricity breaking down the circuit board, and improve the reliability of the power management module.

On the one hand, an embodiment of the present application provides a power management module, including: a shell, including a wall portion, the wall portion encloses a accommodating cavity opening in a first direction, and the wall portion forms a first edge at the opening; a circuit board, at least partially overlapped on the first edge, and the circuit board is provided with a grounding area; a cover body, covering the side of the circuit board away from the shell, the cover body including a main body and a second edge surrounding the outer periphery of the main body, the main body is arched relative to the second edge toward the side away from the accommodating cavity, the second edge is connected to the first edge and encloses the circuit board in the accommodating cavity; wherein the cover body is at least partially crimped to the grounding area of the circuit board.

According to any of the aforementioned embodiments of the present application, the orthographic projection of the grounding area of the circuit board on the shell along the first direction is located within the accommodating cavity; a conductive portion is provided on the side surface of the main body of the cover body facing the accommodating cavity, and the orthographic projection of the conductive portion on the circuit board along the first direction overlaps with the grounding area of the circuit board.

According to any of the aforementioned embodiments of the present application, the orthographic projection of the grounding area of the circuit board on the shell along the first direction is located at the first edge, and the second edge of the cover body is at least partially crimped to the grounding area of the circuit board; the first edge has a first area and a second area surrounding the outer periphery of the first area, the circuit board is overlapped on the first area, and the second edge of the cover body is connected to the second area.

According to any of the aforementioned embodiments of the present application, a first positioning portion is provided on the wall portion, a first positioning hole is provided on the circuit board corresponding to the first positioning portion, and the circuit board is connected to the first positioning portion through the first positioning hole; and/or a second positioning portion is provided on the second area of the first edge, a second positioning hole is provided on the second edge of the cover body corresponding to the second positioning portion, and the cover body is connected to the first edge through the second positioning hole.

According to any of the aforementioned embodiments of the present application, in the second region, one of the first edge and the second edge is provided with a sealing groove, and the other is provided with a sealing protrusion corresponding to the sealing groove; the power management module also includes a sealing portion, which is embedded in the sealing groove and abuts against the sealing protrusion.

According to any of the aforementioned embodiments of the present application, it also includes a breathable membrane, and a breathable hole is opened on the wall portion, and the breathable membrane is arranged in the breathable hole to block the breathable hole.

According to any of the aforementioned embodiments of the present application, it also includes at least one connector, which is arranged as an integrated structure with the housing, one end of the connector extends out of the accommodating cavity to form a connector port, and the other end extends into the accommodating cavity and is electrically connected to the circuit board.

According to any of the aforementioned embodiments of the present application, a PIN needle is provided in the connector, the width of the PIN needle is greater than or equal to 17 mm, and the thickness of the PIN needle is greater than or equal to 1.6 mm.

According to any of the foregoing embodiments of the present application, the circuit board includes a plurality of electronic components located in a receiving cavity, and the plurality of electronic components include a heat source device; a heat conducting portion is provided on a surface of the main body facing the receiving cavity, and the main body is in contact with the heat source device through the heat conducting portion.

According to any of the aforementioned embodiments of the present application, the main body at least partially protrudes toward the accommodating cavity to form a protruding portion, and the heat conducting portion is sandwiched between the protruding portion and the heat source device.

The power management module provided in the embodiment of the present application includes a shell, a circuit board and a cover body, wherein the circuit board is overlapped on the first edge of the shell, and the circuit board is enclosed in the accommodating cavity by connecting the second edge of the cover body with the first edge of the shell. Among them, since the circuit board is provided with a grounding area, after the second edge of the cover body is connected with the first edge of the shell, the cover body is at least partially pressed against the grounding area of the circuit board, that is, the circuit board can be pressed by the cover body while the cover body can be grounded, thereby forming electrostatic protection for the power management module, reducing the risk of external static electricity breaking down the circuit board, and improving the reliability of the power management module.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

FIG1 is a schematic diagram of the structure of a power management module according to an embodiment of the present application;

FIG2 is an exploded view of a power management module according to an embodiment of the present application;

FIG3 is a schematic structural diagram of a housing according to an embodiment of the present application;

FIG4 is a schematic structural diagram of a cover body according to an embodiment of the present application;

FIG. 5 is a front view of a shell according to an embodiment of the present application.

Reference numerals:

100-power management module;

1-housing; 11-side wall; 12-bottom wall; 121-first positioning part; 122-first connecting column; 1221-first connecting hole; 123-breathable membrane; 13-first edge; 131-second positioning part; 132-third connecting hole; 133-sealing groove; 2-circuit board; 21-first positioning hole; 22-second connecting hole; 3-cover; 31-main body; 311-protruding part; 32-second edge; 321-second positioning hole; 322-fourth connecting hole; 323-sealing protrusion; 4-first connecting member; 5-second connecting member; 6-connector; 61-PIN needle;

A1-first area; A2-second area; Z-first direction.

DETAILED DESCRIPTION

The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

When the power management module detects and protects the current of the whole vehicle, it is necessary to consider its grounding to avoid failure caused by static electricity breakdown. In order to solve the problems of the prior art, the embodiment of the present application provides a power management module, which can be added to the vehicle during the design of the whole vehicle to realize the solution of providing integrated power supply and power management for the whole vehicle.

In order to better understand the present application, the power management module provided in the embodiment of the present application is described in detail below with reference to the accompanying drawings.

Please refer to Figures 1 and 2. An embodiment of the present application provides a power management module 100, including a shell 1, a circuit board 2 and a cover body 3. The shell 1 includes a wall portion, which encloses a receiving cavity opened in a first direction Z. The wall portion forms a first edge 13 at the opening. The circuit board 2 is at least partially overlapped on the first edge 13. The circuit board 2 is provided with a grounding area. The cover body 3 is covered on a side of the circuit board 2 away from the shell 1. The cover body 3 includes a main body 31 and a second edge 32 surrounded by the outer periphery of the main body 31. The main body 31 is arched relative to the second edge 32 toward a side away from the receiving cavity. The second edge 32 is connected to the first edge 13 and seals the circuit board 2 in the receiving cavity. The cover body 3 is at least partially crimped to the grounding area of the circuit board 2.

In the power management module 100 in the embodiment of the present application, after the circuit board 2 is overlapped on the first edge 13 of the shell 1, the circuit board 2 can be enclosed in the accommodating cavity by connecting the second edge 32 of the cover 3 with the first edge 13 of the shell 1. Among them, since the circuit board 2 is provided with a grounding area, after the second edge 32 of the cover 3 is connected with the first edge 13 of the shell 1, the cover 3 is at least partially pressed against the grounding area of the circuit board 2, that is, the circuit board 2 can be pressed by the cover 3 while the cover 3 can be grounded, thereby forming electrostatic protection for the power management module 100, reducing the risk of external static electricity breaking down the circuit board 2, and improving the reliability of the power management module 100.

It is understandable that the grounding area can be an exposed copper area. Since some grounding circuits are provided in the exposed copper area of the circuit board 2, the power management module 100 can be grounded by crimping the cover 3 onto the exposed copper area of the circuit board 2, thereby playing a role in electrostatic protection.

According to the setting position of the grounding area on the circuit board 2, the cover 3 is pressed against the grounding area of the circuit board 2 in at least the following two cases:

In the first case, the orthographic projection of the grounding area of the circuit board 2 on the housing 1 along the first direction Z is located within the accommodating cavity.

In this case, in order to press the cover 3 onto the grounding area of the circuit board 2, a conductive portion may be provided on the surface of the main body 31 of the cover 3 facing the accommodating cavity, and the orthographic projection of the conductive portion on the circuit board 2 along the first direction Z overlaps with the grounding area of the circuit board 2, and the cover 3 is pressed onto the grounding area of the circuit board 2 through the conductive portion and is in conduction with the grounding area. Alternatively, the main body 31 of the cover 3 may also be at least partially protruded toward the accommodating cavity, and the protruding portion 311 is pressed onto the grounding area of the circuit board 2 and is in conduction with the grounding area.

Therefore, when the orthographic projection of the grounding area of the circuit board 2 on the shell 1 along the first direction Z is located in the accommodating cavity, the circuit board 2 can be crimped onto the grounding area of the circuit board 2 by setting a conductive part, or by its own structural protrusion setting to crimp onto the grounding area of the circuit board 2, that is, the cover body 3 and the grounding area of the circuit board 2 can be conductively connected.

In the second case, the orthographic projection of the grounding area of the circuit board 2 along the first direction Z on the housing 1 is located at the first edge 13 .

In this case, the second edge 32 of the cover body 3 can be at least partially crimped to the grounding area of the circuit board 2, that is, when the grounding area of the circuit board 2 is located at the first edge 13 of the shell 1, the setting structure of the cover body 3 can be simplified. In addition to being used to be connected to the first edge 13 of the shell 1, the second edge 32 of the cover body 3 can also be crimped to the grounding area of the circuit board 2 at the same time, thereby realizing electrostatic protection of the power management module 100 and preventing external static electricity from breaking through the circuit board 2.

For ease of description, the following description is made by taking the example that the second edge 32 of the cover 3 is pressed against the grounding area of the circuit board 2 .

Please refer to Figures 2 to 4. Since the cover 3 and the circuit board 2 are both connected to the first edge 13 of the housing 1, in order to achieve a reasonable layout of the cover 3 and the circuit board 2, in some optional embodiments, the first edge 13 has a first area A1 and a second area A2 surrounding the periphery of the first area A1, the circuit board 2 is overlapped on the first area A1, and the second edge 32 of the cover 3 is connected to the second area A2. By connecting the second edge 32 of the cover 3 to the second area A2, the circuit board 2 can be more reliably enclosed in the accommodating cavity through the cover 3, and it is also more convenient to press the second edge 32 of the cover 3 onto the circuit board 2.

It can be understood that the first edge 13 of the shell 1 can be formed by extending at least part of the edge of the wall at the opening in a direction closer to and/or away from the accommodating cavity, thereby increasing the area of the first area A1 and the second area A2 of the edge and improving the reliability of the connection between the shell 1 and the circuit board 2 and the cover body 3.

Optionally, a first area A1 of the first edge 13 of the shell 1 corresponding to the circuit board 2 may be provided with an annular groove, the circuit board 2 is overlapped on the annular groove, and the size of the annular groove along the first direction Z is equal to the size of the circuit board 2 along the first direction Z.

Therefore, after the circuit board 2 is overlapped in the annular groove, the second area A2 of the first edge 13 of the shell 1 and the side surface of the circuit board 2 facing the cover body 3 are located on the same plane, so that the second edge 32 of the cover body 3 can be set as a planar structure, which makes it easier to crimp the second edge 32 of the cover body 3 onto the circuit board 2, thereby reducing the possibility of misalignment of the grounding area of the cover body 3 and the circuit board 2 due to the deviation of the circuit board 2, thereby improving the reliability of the power management module 100.

Please refer to Figures 2 to 4. In order to further reduce the reliability of the correspondence between the cover body 3 and the grounding area of the circuit board 2, in some optional embodiments, the wall portion is provided with a first positioning portion 121, and the circuit board 2 is provided with a first positioning hole 21 corresponding to the first positioning portion 121, and the circuit board 2 is connected to the first positioning portion 121 through the first positioning hole 21.

By providing the first positioning portion 121 on the wall of the housing 1 , when the circuit board 2 is overlapped on the first edge 13 of the housing 1 , the circuit board 2 can be positioned by the first positioning portion 121 and the first positioning hole 21 to ensure the reliability of the circuit board 2 .

Among them, the first positioning portion 121 can be arranged on the bottom wall 12 of the housing 1, and the first positioning portion 121 extends from the bottom wall 12 along the first direction Z to the opening, so that it is easier to position the circuit board 2 and the first positioning portion 121, reducing the difficulty of positioning. Optionally, the number of the first positioning portions 121 is more than two, and they can be arranged at intervals along the circumference of the housing 1. For example, when the housing 1 is set as a rectangular housing 1, two first positioning portions 121 can be set, and the two first positioning portions 121 can be respectively arranged at the diagonally opposite corners of the housing 1. The circuit board 2 is positioned and installed on the housing 1 through the two first positioning portions 121 on the housing 1, thereby ensuring the reliability of alignment and connection.

It can be understood that as a specific form of the first positioning portion 121, a plurality of first connecting columns 122 may also be provided on the bottom wall 12 of the shell 1, and the first connecting columns 122 extend from the bottom wall 12 along the first direction Z to the opening, and a first connecting hole 1221 is provided on the first connecting column 122. The circuit board 2 may be provided with a second connecting hole 22 corresponding to the first connecting hole 1221, and the power management module 100 may also be provided with a first connecting member 4, and the first connecting member 4 is sequentially penetrated through the second connecting hole 22 and the first connecting hole 1221 to realize the connection between the circuit board 2 and the shell 1.

That is, the first connecting column 122 can be reused as the first positioning portion 121 , and by providing the first connecting hole 1221 on the first connecting column 122 , the connection between the housing 1 and the circuit board 2 can be achieved while achieving the positioning function.

Among them, by simultaneously providing the first positioning portion 121 and the first connecting column 122 on the shell 1, the circuit board 2 can be preliminarily positioned at the connection position between the circuit board 2 and the shell 1 through the first positioning portion 121 and the first positioning hole 21, and then the circuit board 2 can be fastened to the shell 1 through the first connecting member 4, thereby realizing a reliable connection between the circuit board 2 and the shell 1.

Optionally, the number of first connecting columns 122 is also more than two, and at least one first connecting column 122 is arranged in the central area of the bottom wall 12 of the shell 1 to ensure that the circuit board 2 can be flatly arranged in the shell 1. For example, when the shell 1 is set as a rectangular shell, five first connecting columns 122 can be set, and four first connecting columns 122 are respectively arranged at the four corners of the bottom wall 12 of the rectangular shell 1, and one first connecting column 122 is arranged in the central area of the bottom wall 12, thereby ensuring the reliability of the connection between the shell 1 and the circuit board 2.

Similar to the connection between the circuit board 2 and the shell 1, in some optional embodiments, a second positioning portion 131 is provided in the second area A2 of the first edge 13, and a second positioning hole 321 is provided on the second edge 32 of the cover body 3 corresponding to the second positioning portion 131, and the cover body 3 is connected to the first edge 13 through the second positioning hole 321.

By providing the second positioning portion 131 on the first edge 13 of the shell 1 , when the cover 3 is overlapped on the first edge 13 of the shell 1 , the cover 3 can be positioned by the second positioning portion 131 and the second positioning hole 321 to ensure the reliability of the setting of the cover 3 .

Optionally, the number of the second positioning portions 131 is more than two, and they can be arranged at circumferential intervals along the first edge 13 of the shell 1. For example, when the shell 1 is set as a rectangular shell, two second positioning portions 131 can also be set, and the two second positioning portions 131 can be respectively arranged on the two side edges of the shell 1. The cover body 3 is positioned and installed on the shell 1 through the two second positioning portions 131 on the shell 1, thereby ensuring the reliability of alignment and connection.

It can be understood that a plurality of third connection holes 132 may be provided on the first edge 13 of the shell 1, the cover body 3 may be provided with a fourth connection hole 322 corresponding to the third connection hole 132, and the power management module 100 may also be provided with a second connecting member 5, and the second connecting member 5 is sequentially passed through the fourth connection hole 322 and the third connection hole 132 to realize the connection between the cover body 3 and the shell 1.

Specifically, by providing a second positioning portion 131 and a third connecting hole 132 on the shell 1, the cover body 3 can be preliminarily positioned at the connection position between the cover body 3 and the shell 1 through the second positioning portion 131 and the second positioning hole 321, and then the cover body 3 can be fastened to the shell 1 through the second connecting member 5, thereby achieving a reliable connection between the cover body 3 and the shell 1.

Please refer to Figures 1 to 4. After the cover body 3 is connected to the shell 1, the power management module 100 is formed. However, considering that there may be liquid around the power management module 100, in some optional embodiments, in the second area A2, one of the first edge 13 and the second edge 32 is provided with a sealing groove 133, and the other is provided with a sealing protrusion 323 corresponding to the sealing groove 133. The power management module 100 also includes a sealing portion, which is embedded in the sealing groove 133 and abuts against the sealing protrusion 323.

By providing a sealing groove 133 on one of the shell 1 and the cover 3, and providing a sealing protrusion 323 on the other corresponding to the sealing groove 133, and by providing a sealing portion in the gap between the two, the power management module 100 can have a protection level of IP67 and IP6K9K after the wiring harness is connected, thereby improving the sealing of the power management module 100 after the cover 3 is connected to the shell 1, avoiding liquid infiltration around the power management module 100, and improving the protection of the power management module 100.

Optionally, the sealing portion may be configured as a sealant.

In some optional embodiments, the power management module 100 further includes a breathable membrane, a breathable hole is opened on the wall, and the breathable membrane is arranged in the breathable hole and blocks the breathable hole. By arranging the breathable membrane on the wall, the sealing of the power management module 100 can be ensured, and the pressure difference inside and outside can be balanced.

Optionally, the breathable membrane can be welded into the breathable hole by ultrasonic welding process, and the material of the breathable membrane can be set to PTFE or the like, that is, it can be breathable and liquid-impermeable.

Please refer to Figures 1 to 5. Considering that the power management module 100 needs to exchange information with various systems, in some optional embodiments, the power management module 100 also includes a connector 6, and the connector 6 and the shell 1 are configured as an integrated structure. One end of the connector 6 extends out of the accommodating cavity and forms a socket, and the other end extends into the accommodating cavity and is electrically connected to the circuit board 2.

By configuring the connector 6 and the housing 1 as an integral structure, an integrated design of the connector 6 and the housing 1 can be achieved. Compared with the use of a finished connector solution, more space for arranging the connector 6 can be effectively saved, so that the power management module 100 can integrate more connectors 6 in a smaller layout space to achieve information interaction between the power management module 100 and various systems.

Optionally, the connector 6 can be integrally injection molded on the shell 1. When the number of connectors 6 is more than two, the connectors 6 can be respectively arranged on multiple wall portions, for example, can be arranged on multiple side walls 11 of the shell 1. The specific setting position can be adjusted according to the specific structure of the power management module 100, and the present application does not make any specific limitations on this.

Since the power management module 100 needs to electrically interact with various systems and detect the power consumption of the entire vehicle, it is required to carry a relatively large current input. Therefore, in some optional embodiments, a PIN pin 61 is provided in the connector, and the width of the PIN pin 61 is greater than or equal to 17 mm, and the thickness of the PIN pin 61 is greater than or equal to 1.6 mm.

For example, the width of the PIN needle 61 can be set to 17.7 mm, and the thickness of the PIN needle 61 can be set to 1.63 mm, which can carry a large current of more than 120 A and can be used for current detection and protection of various loads. Therefore, the integrated high-current connector 6 can carry a current of more than 120 A for current detection and protection of various loads.

Please refer to Figures 1 to 5. Since the heat generated by the power management module 100 will increase while supporting a larger current, in some optional embodiments, the circuit board 2 includes a plurality of electronic components located in the accommodating cavity, the plurality of electronic components include a heat source device, and a heat conducting portion is provided on a surface of the main body 31 on one side facing the accommodating cavity, and the main body 31 is in contact with the heat source device through the heat conducting portion.

Since multiple electronic components include heat source devices, a heat conducting portion can be provided on the side of the main body 31 of the cover body 3 facing the accommodating cavity. When the cover body 3 is connected to the shell 1, the main body 31 of the cover body 3 can be in contact with the heat source device through the heat conducting portion, so that the heat of the heat source can be transferred to the cover body 3 through the heat conducting portion, and the cover body 3 then transfers the heat to the surrounding air through the thermal radiation effect.

Therefore, the power management module 100 of the embodiment of the present application, through the cooperation between the cover body 3, the circuit board 2 and the shell 1, can make the power management module 100 have good sealing and electrostatic protection while also having good heat dissipation. Moreover, the above-mentioned heat dissipation method does not require an external heat dissipation device, and the heat dissipation requirements of the circuit board 2 can be achieved by passive heat dissipation alone, and the structure is simpler and more reliable.

Optionally, the heat conductive part can be set as a thermal conductive adhesive, and the thermal conductive adhesive can be directly bonded to the side surface of the main body 31 of the cover body 3 facing the accommodating cavity, so that when the cover body 3 is connected to the shell 1, the thermal conductive adhesive on the cover body 3 is in contact with the heat source device of the circuit board 2.

In some optional embodiments, the main body 31 at least partially protrudes toward the accommodating cavity to form a protruding portion 311 , and the heat conducting portion is sandwiched between the protruding portion 311 and the heat source device.

Among them, the main body 31 can form a protrusion 311 by stamping or the like. By making the main body 31 at least partially protrude toward the accommodating cavity, on the one hand, the volume of the heat-conducting part can be reduced and the cost can be reduced. On the other hand, the contact area between the cover body 3 and the surrounding air can be increased. Therefore, after the circuit board 2 transfers the heat to the cover body 3, the cover body 3 can quickly radiate the heat to the surrounding air, further improving the heat dissipation effect.

Optionally, the protrusion 311 may be provided in only a partial area of the main body 31, and the orthographic projection of the protrusion 311 along the first direction Z on the circuit board 2 corresponds to the area where the heat source device is located, thereby avoiding the protrusion 311 occupying the space of other electronic components and ensuring the setting of the circuit board 2.

The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

Claims (10)

1. A power management module, comprising:

A housing including a wall portion enclosing a receiving chamber formed to be opened in a first direction, the wall portion being formed with a first rim at the opening;

The circuit board is at least partially overlapped on the first edge and is provided with a grounding area;

The cover body is covered on one side of the circuit board, which is far away from the shell, and comprises a main body part and a second edge which is arranged around the periphery of the main body part, wherein the main body part is arched towards one side, which is far away from the accommodating cavity, relative to the second edge, and the second edge is connected with the first edge and seals the circuit board in the accommodating cavity;

The cover body is at least partially pressed and connected to the grounding area of the circuit board.

2. The power management module of claim 1, wherein an orthographic projection of a ground area of the circuit board onto the housing along the first direction is located within the receiving cavity;

A conductive part is arranged on the surface of one side, facing the accommodating cavity, of the main body part of the cover body, and orthographic projection of the conductive part on the circuit board along the first direction is overlapped with a grounding area of the circuit board.

3. The power management module of claim 1, wherein a orthographic projection of the ground region of the circuit board onto the housing along the first direction is at the first edge, and wherein the second edge of the cover is at least partially crimped to the ground region of the circuit board;

the first edge is provided with a first area and a second area surrounding the periphery of the first area, the circuit board is lapped on the first area, and the second edge of the cover body is connected with the second area.

4. A power management module according to claim 3, wherein the wall portion is provided with a first positioning portion, the circuit board is provided with a first positioning hole corresponding to the first positioning portion, and the circuit board is connected with the first positioning portion through the first positioning hole;

and/or, a second positioning part is arranged in a second area of the first edge, a second positioning hole is arranged on the second edge of the cover body corresponding to the second positioning part, and the cover body is connected with the first edge through the second positioning hole.

5. A power management module according to claim 3, wherein in the second region, one of the first edge and the second edge is provided with a seal groove, and the other is provided with a seal projection corresponding to the seal groove;

The power management module further comprises a sealing part, and the sealing part is embedded in the sealing groove and is abutted against the sealing protrusion.

6. The power management module of any one of claims 1-5, further comprising a vent membrane, wherein the wall is provided with a vent, and wherein the vent membrane is disposed within the vent and seals the vent.

7. The power management module of any one of claims 1-5, further comprising at least one connector disposed in a unitary structure with the housing, the connector having one end extending out of the receiving cavity and forming a connector socket and the other end extending into the receiving cavity and electrically connected to the circuit board.

8. The power management module of claim 7, wherein a PIN is disposed within the socket, the PIN having a width greater than or equal to 17mm and a thickness greater than or equal to 1.6mm.

9. The power management module of any one of claims 1-5 wherein the circuit board includes a plurality of electronic components located within the receiving cavity, a plurality of the electronic components including heat generating source devices;

And a heat conducting part is arranged on the surface of one side of the main body part, which faces the accommodating cavity, and the main body part is contacted with the heating source device through the heat conducting part.

10. The power management module of claim 9 wherein the body portion is at least partially disposed in a convex configuration toward the receiving cavity and forms a convex portion, the thermally conductive portion being sandwiched between the convex portion and the heat generating source device.