CN221608250U - Germanium crystal segment etching device - Google Patents

Abstract

The utility model discloses a germanium crystal section corrosion device, which comprises a groove body with an opening at the top, wherein a plurality of mutually parallel partition boards are arranged in an inner cavity of the groove body in a dismounting way, the partition boards extend along the vertical direction, the bottoms of the partition boards are fixedly arranged on the bottom wall of the inner cavity of the groove body, and two adjacent partition boards are in clearance fit to form a positioning groove capable of accommodating a germanium crystal section; the edge part of at least one side of the partition plate is in clearance fit with the side wall of the inner cavity of the tank body to form a diversion channel for liquid circulation, and the positioning grooves are mutually communicated through the diversion channel. The germanium crystal section corrosion device can improve the corrosion treatment efficiency of the germanium crystal section and avoid structural damage of the germanium crystal section in the corrosion treatment process.

Description

Germanium crystal segment etching device

Technical Field

The utility model relates to the technical field of semiconductor crystal corrosion processing supporting equipment, in particular to a germanium crystal segment corrosion device.

Background Art

In the field of semiconductor material processing, etching of semiconductor crystal segments is one of the more conventional process methods, and germanium crystal segments are one of the types of semiconductor crystal segments suitable for etching.

At present, when the industry performs etching treatment on germanium crystal segments, the germanium crystal segments are usually placed in a carrying device such as an etching tank containing etching liquid, so as to perform etching treatment on the germanium crystal segments using the etching liquid.

In the above conventional germanium crystal segment etching process, there are usually two different operation modes.

One of the operation methods is to place multiple germanium crystal segments into the same etching tank in order to implement batch etching treatment of the germanium crystal segments. However, in the actual operation of this method, the germanium crystal segments will roll back and forth in the etching tank, causing rigid contact or even collision between different germanium crystal segments, which will directly lead to edge collapse of the germanium crystal segments and even cause cracks in the main structure of the germanium crystal segments, seriously affecting the product quality and process treatment effect of the germanium crystal segments. If scrap parts are generated, the overall production cost will also increase.

Another operation method is to place only a single germanium crystal segment into the etching tank in a single operation, so that only a single germanium crystal segment is corroded in a single batch of corrosion operations. After the current germanium crystal segment is corroded, it is taken out, and then the next germanium crystal segment to be processed is placed in the etching tank for corrosion treatment. Although this treatment method avoids the damage such as edge collapse and cracks of the germanium crystal segment that may occur during the corrosion treatment operation, it can only complete the corrosion treatment of a single germanium crystal segment in a single operation, and the treatment efficiency is extremely low. In addition, the acidic corrosive liquid required for the corrosion treatment consumes a large amount, has a low utilization rate, and is costly, which has many adverse effects on the corrosion treatment of large quantities of germanium crystal segments.

Therefore, how to improve the efficiency of the etching treatment of the germanium crystal segment and avoid structural damage to the germanium crystal segment during the etching treatment process is an important technical problem that technical personnel in this field currently need to solve.

Utility Model Content

The utility model aims to provide a germanium crystal segment etching device, which can improve the etching treatment efficiency of the germanium crystal segment and avoid structural damage to the germanium crystal segment during the etching treatment process.

In order to solve the above technical problems, the utility model provides a germanium crystal segment etching device, comprising a trough body with an opening at the top, wherein a plurality of mutually parallel partitions are detachably arranged in the inner cavity of the trough body, wherein the partitions extend in the vertical direction, and the bottoms of the partitions are fixedly arranged on the inner cavity bottom wall of the trough body, and the gaps between two adjacent partitions cooperate to form a positioning groove capable of accommodating the germanium crystal segment;

The edge portion of at least one side of the partition plate is matched with the inner cavity side wall gap of the groove body to form a guide channel for liquid circulation, and each of the positioning grooves is connected to each other through the guide channel.

Preferably, the bottom of the tank body has a drain port connecting the inner cavity of the tank body with the external space.

Preferably, a flow-adjustable drain valve is provided on the drain port.

Preferably, both side walls of the partition and the inner cavity side walls of the trough body are protrudingly provided with anti-sticking bosses.

Preferably, the anti-sticking boss is a triangular pyramid boss.

Preferably, one side edge of the partition is pressed against the inner cavity side wall of the trough body, and the other side edge of the partition is gap-matched with the inner cavity side wall of the trough body to form the guide channel.

Preferably, a plurality of positioning slots are provided on the inner cavity side walls and/or the inner cavity bottom wall of the trough body, and each of the partitions is detachably inserted into and pressed into connection with each of the positioning slots.

Preferably, the height of the partition is smaller than the inner cavity depth of the trough body.

Compared with the above background technology, in the germanium crystal segment etching device provided by the utility model, during its operation and working process, the germanium crystal segments to be processed are placed in each positioning groove one by one, and the etching liquid is injected into the groove body through the opening at the top of the groove body, and the etching liquid is passed into each positioning groove through the guide channel, and the synchronous conduction structure formed by the connection and cooperation between the guide channel and each positioning groove is used to make the liquid level in each positioning groove consistent, so as to ensure that the etching progress of the germanium crystal segments in each positioning groove is basically synchronized, so as to ensure that each germanium crystal segment can be fully subjected to the etching treatment. After the etching treatment is completed, the acidic etching liquid in the groove body can be discharged, and then pure water can be passed into the groove body to rinse the germanium crystal segments that have completed the etching treatment in each positioning groove, until each germanium crystal segment is rinsed clean, and then the germanium crystal segment can be taken out from the groove body, so as to implement the subsequent germanium crystal segment processing technology, thereby meeting the corresponding germanium crystal segment product processing requirements. The germanium crystal segment etching device utilizes a plurality of positioning groove structures formed by the spaced arrangement of the partitions, so that the germanium crystal segments can be placed in the positioning grooves one by one, avoiding contact or collision between the germanium crystal segments, thereby preventing the germanium crystal segments from edge collapse, cracks or other structural damage, and ensuring the integrity of the germanium crystal segment structure during the etching process; at the same time, the material guide channel is utilized to ensure the smooth connection of the positioning grooves, so that the germanium crystal segments in the positioning grooves can be synchronously corroded, thereby realizing batch corrosion treatment of multiple germanium crystal segments, greatly improving the corrosion treatment efficiency of the germanium crystal segments, and optimizing the batch corrosion treatment effect of the germanium crystal segments.

In another preferred embodiment of the utility model, the bottom of the tank body has a drain port connecting the inner cavity of the tank body with the external space. When the germanium crystal segment in the tank body is completely corroded, the acidic corrosive liquid in the tank body can be discharged through the drain port, and pure water can be injected into the tank body simultaneously, so that each germanium crystal segment in the tank body is always in a liquid-immersed state, avoiding the germanium crystal segment from contacting the air environment too early and affecting its corrosion treatment effect, thereby ensuring the product quality after the germanium crystal segment is corroded.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

FIG1 is a structural perspective view of a germanium crystal segment etching device provided by a specific embodiment of the utility model;

FIG. 2 is a structural perspective view of the germanium crystal segment etching device provided with an anti-sticking boss in FIG. 1 .

in,

11-tank body;

111- drainage port;

12-partition;

121- positioning groove;

122- diversion channel;

13-anti-sticking boss;

20- Germanium crystal segment.

DETAILED DESCRIPTION

The core of the utility model is to provide a germanium crystal segment etching device, which can improve the etching treatment efficiency of the germanium crystal segment and avoid structural damage to the germanium crystal segment during the etching treatment process.

In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

Please refer to Figure 1 and Figure 2.

In a specific embodiment, the germanium crystal segment etching device provided by the utility model comprises a tank body 11 with an opening at the top, a plurality of mutually parallel partitions 12 are detachably arranged in the inner cavity of the tank body 11, the partitions 12 extend in the vertical direction, and the bottom of the partitions 12 is fixedly arranged on the inner cavity bottom wall of the tank body 11, and the gaps between two adjacent partitions 12 are matched to form a positioning groove 121 capable of accommodating the germanium crystal segment 20;

The edge of at least one side of the partition plate 12 is gap-matched with the inner cavity side wall of the groove body 11 to form a guide channel 122 for liquid circulation, and each positioning groove 121 is connected to each other through the guide channel.

During the operation and working process of the equipment, the germanium crystal segments 20 to be processed are placed in each positioning groove 121 one by one, and the corrosive liquid is injected into the tank body 11 through the opening at the top of the tank body 11. The corrosive liquid passes into each positioning groove 121 through the guide channel 122, and the guide channel 122 is connected with each positioning groove 121 to form a synchronous conduction structure, so that the liquid level in each positioning groove 121 can be kept consistent, ensuring that the corrosion treatment progress of the germanium crystal segments 20 in each positioning groove 121 is basically synchronized, thereby ensuring that each germanium crystal segment 20 can be fully corroded.

After the corrosion treatment is completed, the acidic corrosion liquid in the trough body 11 can be discharged, and then pure water can be introduced into the trough body 11 to rinse the germanium crystal segments 20 that have completed the corrosion treatment in each positioning groove 121. After each germanium crystal segment 20 is rinsed clean, each germanium crystal segment 20 can be taken out of the trough body 11 to facilitate the implementation of subsequent germanium crystal segment 20 processing technology, thereby meeting the corresponding germanium crystal segment 20 product processing requirements.

The germanium crystal segment etching device utilizes a plurality of positioning grooves 121 structure formed by the spaced arrangement of the partitions 12, so that the germanium crystal segments 20 can be placed in the positioning grooves 121 one by one, avoiding contact or collision between the germanium crystal segments 20, thereby preventing the germanium crystal segments 20 from edge collapse, cracks or other structural damage, and ensuring the structural integrity of the germanium crystal segments 20 during the etching process; at the same time, the material guide channel is utilized to ensure smooth communication between the positioning grooves 121, so that the germanium crystal segments 20 in the positioning grooves 121 can be synchronously corroded, and at the same time, the operating temperature in the positioning grooves 121 is ensured to be uniform, thereby realizing batch corrosion treatment of multiple germanium crystal segments 20, greatly improving the corrosion treatment efficiency of the germanium crystal segments 20, and optimizing the batch corrosion treatment effect of the germanium crystal segments 20.

During actual operation, a staff member can hold the operating piece to appropriately move the germanium crystal segment 20 located in the positioning groove 121 to make the germanium crystal segment 20 roll appropriately, so that each part of the outer wall of the germanium crystal segment 20 can be fully corroded, thereby further improving the corrosion treatment efficiency of the germanium crystal segment 20 and optimizing its overall corrosion treatment effect.

Generally, the operating member for moving the germanium crystal segment 20 can be a PP (polypropylene) stick or a stick-shaped operating member made of other corrosion-resistant materials, so that the operator can hold and operate it easily, thereby improving the operating convenience and control accuracy.

Furthermore, the bottom of the tank body 11 has a drain port 111 connecting the inner cavity of the tank body 11 and the external space. When the germanium crystal segment 20 in the tank body 11 is completely corroded, the acidic corrosive liquid in the tank body 11 can be discharged through the drain port 111, and pure water can be injected into the tank body 11 simultaneously, so that each germanium crystal segment 20 in the tank body 11 is always in a liquid-immersed state, avoiding the germanium crystal segment 20 from contacting the air environment too early and affecting the corrosion treatment effect thereof, thereby ensuring the product quality of the germanium crystal segment 20 after the corrosion treatment.

Normally, pure water can be directly injected into the inner cavity of the tank body 11 through the top opening of the tank body 11, or pure water can be introduced into the tank body 11 through a liquid supply pipeline or other liquid supply devices. In actual operation, the rate of introducing pure water into the tank body 11 should be higher than the liquid discharge rate at the drain port 111, so as to ensure that the liquid level in the tank body 11 drops rapidly, thereby ensuring that each germanium crystal segment 20 in the tank body 11 is always below the liquid level, further avoiding the uncleaned germanium crystal segment 20 in the tank body 11 from prematurely contacting with the external air environment and being oxidized, thereby ensuring the corrosion treatment effect and product quality of the germanium crystal segment 20.

When the germanium crystal segment 20 in the tank body 11 is cleaned, the residual etching liquid in the tank body 11 and the water after cleaning can be discharged from the tank body 11 through the drain port 111 .

On this basis, the liquid discharge rate at the discharge port 111 can be achieved by regulating the discharge valve disposed at the discharge port 111. By adjusting the opening of the discharge valve, the liquid flow at the discharge port 111 can be accurately adjusted to match the discharge requirements of the tank body 11 under different working conditions and ensure the corresponding working condition operation effect.

Considering the control accuracy and operation efficiency in actual operation, the drain valve is preferably an electric control valve. If the cost of equipment components is more concerned, other valve devices can also be used as drain valves. The staff can flexibly select and adjust the specific structure of the drain valve according to the actual working conditions. In principle, as long as it can meet the actual application needs of the germanium crystal segment corrosion device, it can be used.

Specifically, anti-sticking bosses 13 are protrudingly provided on both side walls of the partition 12 and the inner cavity side walls of the tank body 11. A plurality of anti-sticking bosses 13 located on the same arrangement surface are arranged in an array, so that the anti-sticking bosses 13 serve as a direct contact structure with the germanium crystal segment 20 in the positioning groove 121. After the germanium crystal segment 20 contacts the anti-sticking bosses 13, it can still contact the etching liquid through the gap between the adjacent anti-sticking bosses 13, thereby preventing the outer surface of the germanium crystal segment 20 from being uncleanly corroded due to the outer surface of the germanium crystal segment 20 being attached to the inner cavity side walls of the tank body 11 and the side walls of the partition 12 during the etching process, thereby further ensuring the etching treatment efficiency and treatment effect of the germanium crystal segment 20, avoiding the occurrence of uneven corrosion, and improving the product quality of the germanium crystal segment 20.

Generally, the anti-sticking boss 13 is a triangular pyramid boss. The triangular pyramid structure can further reduce the contact area between a single anti-sticking boss 13 and the germanium crystal segment 20, thereby further increasing the contact area between the germanium crystal segment 20 and the etching liquid, and preventing the occurrence of dead corners on the germanium crystal segment 20 where etching is not in place, so that the etching treatment of the germanium crystal segment 20 is more uniform and sufficient.

On the other hand, one side edge of the partition 12 is pressed against the inner cavity side wall of the tank body 11, and the other side edge of the partition 12 is gap-matched with the inner cavity side wall of the tank body 11 to form a diversion channel 122. By utilizing the alignment and compression fit between one side edge of the partition 12 and the inner cavity side wall of the tank body 11, combined with the reliable connection between the bottom of the partition 12 and the bottom wall of the inner cavity of the tank body 11, reliable structural support and stable structural positioning can be formed for the partition 12, which can not only improve the assembly structural strength and impact resistance of the partition 12, but also ensure the structural compression and sealing effect between the assembly part of the partition 12 and the corresponding inner cavity matching part of the tank body 11, and optimize the liquid diversion effect inside the tank body 11.

Specifically, a plurality of positioning slots are provided on the inner cavity side walls and/or the inner cavity bottom wall of the trough body 11, and each partition 12 can be detachably aligned with each positioning slot and inserted and pressed tightly. Generally, the partition 12 extends along the height and width direction of the trough body 11, and each partition 12 is arranged in sequence along the length direction of the trough body 11. Correspondingly, the positioning slots on the inner cavity side walls of the trough body 11 extend along the height direction of the trough body 11, while the positioning slots on the inner cavity bottom wall of the trough body 11 extend along the width direction of the trough body 11, thereby achieving precise alignment and reliable assembly between each positioning slot and the partition 12.

In actual operation, the number of partitions 12 arranged in the tank body 11 can be flexibly adjusted according to the number of single-batch germanium crystal segments 20 to be processed, so as to achieve the purpose of adjusting the number of positioning slots 121. The adjustment of the number of partitions 12 can be achieved by relying on the disassembly and assembly adaptation connection structure between the partition 12 and the positioning slot. Of course, using the positioning slot as the alignment connection structure of the partition 12 is only a preferred solution. In actual applications, the disassembly and assembly connection between the partition 12 and the main structure of the tank body 11 can also be achieved through other auxiliary connection structures such as buckles. The staff can flexibly select and adjust the direct adaptation connection form between the partition 12 and the tank body 11 according to the actual working conditions. In principle, as long as it can meet the actual application needs of the germanium crystal segment corrosion device, it can be used.

In addition, the height of the partition 12 is less than the depth of the inner cavity of the tank body 11. In this way, the main structure of the partition 12 can be completely located in the inner cavity of the tank body 11, avoiding the partition 12 protruding from the top of the tank body 11 and causing structural interference with other components, and making the overall component structure of the germanium crystal segment etching device more regular and beautiful.

In addition, during the actual corrosion treatment process, the crystal segment needs to be rolled with a PP stick. After 60 seconds, the crystal segment is clean except for the contact surface with the bottom of the groove. At this time, the temperature of the etching liquid has risen when the crystal segment is rolled. One circle of rolling is enough to clean the contact surface. Continuous rolling is to prevent the individual surface from being in contact with the bottom of the groove for too long, and the heat cannot be dissipated, causing the contact surface to turn black. If rolling is too early, other places have not been corroded well, and rolling will increase the corrosion time. If rolling is too late, the corrosion time is too long, the contact surface is seriously black, and the corrosion time is increased. In addition, the corrosion time of other places is too long, and the loss is too large.

In summary, the germanium crystal segment corrosion device provided in the utility model comprises a trough body with an opening at the top, a plurality of mutually parallel partitions are detachably arranged in the inner cavity of the trough body, the partitions extend in the vertical direction, and the bottom of the partitions is fixedly arranged on the bottom wall of the inner cavity of the trough body, and the gap between two adjacent partitions is matched to form a positioning groove capable of accommodating the germanium crystal segment; the edge portion of at least one side of the partition is matched with the gap of the inner cavity side wall of the trough body to form a guide channel for liquid circulation, and each of the positioning grooves is connected to each other through the guide channel.

During the operation and operation of the germanium crystal segment etching device, the germanium crystal segments to be processed are placed in each positioning groove in a one-to-one correspondence, and the etching liquid is injected into the groove body through the opening at the top of the groove body. The etching liquid is passed into each positioning groove through the guide channel, and the synchronous conduction structure formed by the guide channel and the positioning groove is used to make the liquid level in each positioning groove consistent, so as to ensure that the etching progress of the germanium crystal segments in each positioning groove is basically synchronized, so as to ensure that each germanium crystal segment can be fully subjected to the etching treatment. After the etching treatment is completed, the acidic etching liquid in the groove body can be discharged, and then pure water can be introduced into the groove body to rinse the germanium crystal segments that have completed the etching treatment in each positioning groove, until each germanium crystal segment is rinsed clean, and then the germanium crystal segment can be taken out of the groove body, so as to implement the subsequent germanium crystal segment processing technology, thereby meeting the corresponding germanium crystal segment product processing requirements. The germanium crystal segment etching device utilizes a plurality of positioning groove structures formed by the spaced arrangement of the partitions, so that the germanium crystal segments can be placed in the positioning grooves one by one, avoiding contact or collision between the germanium crystal segments, thereby preventing the germanium crystal segments from edge collapse, cracks or other structural damage, and ensuring the integrity of the germanium crystal segment structure during the etching process; at the same time, the material guide channel is utilized to ensure the smooth connection of the positioning grooves, so that the germanium crystal segments in the positioning grooves can be synchronously corroded, thereby realizing batch corrosion treatment of multiple germanium crystal segments, greatly improving the corrosion treatment efficiency of the germanium crystal segments, and optimizing the batch corrosion treatment effect of the germanium crystal segments.

The above is a detailed introduction to the germanium crystal segment etching device provided by the utility model. This article uses specific examples to illustrate the principle and implementation method of the utility model. The description of the above embodiment is only used to help understand the method and core idea of the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims (8)

1. A germanium crystal segment etching device, characterized in that it comprises a trough body with an opening at the top, wherein a plurality of mutually parallel partitions are detachably arranged in the inner cavity of the trough body, wherein the partitions extend in a vertical direction, and the bottoms of the partitions are fixedly arranged on the inner cavity bottom wall of the trough body, and the gaps between two adjacent partitions are matched to form a positioning groove capable of accommodating the germanium crystal segment; The edge portion of at least one side of the partition plate is matched with the inner cavity side wall gap of the groove body to form a guide channel for liquid circulation, and the positioning grooves are connected to each other through the guide channel. 2. The germanium crystal segment etching device as described in claim 1 is characterized in that the bottom of the trough body has a drainage port connecting the inner cavity of the trough body with the external space. 3. The germanium crystal segment etching device as described in claim 2 is characterized in that a flow-adjustable drain valve is provided on the drain port. 4. The germanium crystal segment etching device according to claim 1 is characterized in that anti-sticking bosses are protrudingly provided on both side walls of the partition and the inner cavity side walls of the trough body. 5 . The germanium crystal segment etching device according to claim 4 , wherein the anti-sticking boss is a triangular pyramid boss. 6. The germanium crystal segment etching device as described in claim 1 is characterized in that one side edge portion of the partition is pressed against the inner cavity side wall of the trough body, and the other side edge portion of the partition is gap-matched with the inner cavity side wall of the trough body to form the guide channel. 7. The germanium crystal segment etching device as described in claim 6 is characterized in that a plurality of positioning slots are provided on the inner cavity side walls and/or the inner cavity bottom wall of the trough body, and each of the partitions can be detachably inserted into and pressed into connection with each of the positioning slots. 8. The germanium crystal segment etching device as described in claim 1 is characterized in that the height of the partition is less than the inner cavity depth of the trough body.