CN221466548U - Silicon wafer transmission device - Google Patents
Silicon wafer transmission device Download PDFInfo
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- CN221466548U CN221466548U CN202323240366.XU CN202323240366U CN221466548U CN 221466548 U CN221466548 U CN 221466548U CN 202323240366 U CN202323240366 U CN 202323240366U CN 221466548 U CN221466548 U CN 221466548U
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Abstract
The application provides a silicon wafer transmission device, which comprises: the surface of the tray is provided with a plurality of concave slice pits, and the slice pits are used for placing silicon wafers; the measuring instrument comprises a probe, the probe is suspended above the tray, and the measuring instrument collects the actual height value of the pit through the probe; the executing part of the mechanical arm is arranged above the tray and is used for taking and placing the silicon wafers in the wafer pits of the tray; the controller is in communication connection with the measuring instrument and the mechanical arm, and the controller outputs a picking and placing height value corresponding to the pit according to the actual height value of the pit acquired by the measuring instrument so as to control the picking and placing height value corresponding to the picking and placing action of the mechanical arm. The method can accurately control the taking and placing height of each silicon wafer in the same furnace, avoid the formation of defects on the surface due to excessive extrusion of the silicon wafers, and improve the quality and production efficiency of the silicon wafers.
Description
Technical Field
The application relates to the technical field of semiconductor manufacturing equipment, in particular to a silicon wafer transmission device.
Background
Multi-wafer oven technology has been widely used in semiconductor, photovoltaic and other related industries, particularly in the production of silicon wafers. The main advantage of this technique is the ability to process multiple wafers simultaneously, thereby increasing production efficiency and reducing cost. However, with the development of technology and market demand, more and more silicon wafers need to be processed in a shorter time, which presents a series of challenges for multi-wafer furnace technology.
In the conventional multi-wafer furnace technology, the transmission of the silicon wafers is mainly finished by means of a mechanical arm. These robotic arms need to be moved precisely to a designated location at each operation, take the wafer out of the pit, and then put it in another location. This presents challenges for accurate operation of the robotic arm, as each pit varies slightly in depth and shape. Errors in the operation of the robotic arm can cause the wafer to be over-pressed or create other defects.
In addition, as the tray for placing the silicon wafer is supported by a single shaft, the stability of the tray can be disturbed in the horizontal direction, so that the height of the mechanical arm is not matched with the real height of the silicon wafer when the silicon wafer is taken and placed. This may cause the silicon wafer to be pressed to generate defects, so that the quality of the silicon wafer is degraded.
Therefore, there is a need for improvements to the existing apparatus to solve the problem of accuracy of silicon wafer transport in the multi-wafer furnace technology, thereby improving the quality and production efficiency of silicon wafers.
Disclosure of Invention
The application aims to solve the technical problem of providing a silicon wafer conveying device which can accurately control the taking and placing height of each silicon wafer in the same furnace, avoid the defect formed on the surface due to excessive extrusion of the silicon wafers and improve the quality and the production efficiency of the silicon wafers.
In order to solve the above problems, the present application provides a silicon wafer transfer device, comprising: the surface of the tray is provided with a plurality of concave slice pits, and the slice pits are used for placing silicon wafers; the measuring instrument comprises a probe, the probe is suspended above the tray, and the measuring instrument collects the actual height value of the pit through the probe; the executing part of the mechanical arm is arranged above the tray and is used for taking and placing the silicon wafers in the wafer pits of the tray; a controller, said controller and said meter and
The mechanical arm is in communication connection, and the controller outputs a picking and placing height value corresponding to the pit according to the actual height value of the pit acquired by the measuring instrument so as to control the picking and placing height value corresponding to the picking and placing action of the mechanical arm.
In some embodiments, the silicon wafer transmission device further comprises a rotating shaft, wherein the rotating shaft is perpendicular to the tray and is connected with the tray through a bearing.
In some embodiments, a plurality of the craters are disposed in a linear arrangement on a surface of the tray.
In some embodiments, a plurality of the wells are disposed on the surface of the tray in a circumferential arrangement.
In some embodiments, the height of the gauge is adjustable in a direction perpendicular to the surface of the tray on which the wells are provided.
In some embodiments, the gauge acquires the actual height value of each of the pit sequentially through the probe.
In some embodiments, the plurality of gauges is provided, and a probe of each gauge is suspended directly above a center position of the corresponding pit to acquire an actual height value of each pit.
In some embodiments, the controller controls the gauge to periodically acquire an actual height value of each pit according to a set time interval.
In some embodiments, the probe is a laser probe.
According to the technical scheme, the probe of the measuring instrument is suspended above the tray, the actual height value of the wafer pit on the tray is acquired, the controller is in communication connection with the measuring instrument and the mechanical arm, so that the actual height value of the wafer pit acquired by the controller through the measuring instrument is output to the pick-and-place height value corresponding to the wafer pit, the pick-and-place height corresponding to the pick-and-place action of the mechanical arm is controlled, the mechanical arm is ensured to pick and place the silicon wafer in the wafer pit of the tray at high accuracy, and the situation that the silicon wafer is excessively extruded to generate defects is avoided.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application as claimed. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments of the present application will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a silicon wafer transmission device according to an embodiment of the present application.
Fig. 2 is a schematic structural view of a tray with a plurality of pits according to an embodiment of the present application.
Fig. 3 is a schematic structural view of a tray with a plurality of pits according to a second embodiment of the present application.
Description of main reference numerals:
11. a silicon wafer transmission device; 111. 211, a tray; 112. 212, pit; 12. a rotating shaft; 121. a bearing; 13. a silicon wafer; 14. a measuring instrument; 141. a probe; 15. a mechanical arm; 16. and a controller.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In order to solve the problems in the prior art, the embodiment of the application provides a silicon wafer transmission device which can accurately control the taking and placing height of each silicon wafer in the same furnace, avoid the formation of defects on the surface due to excessive extrusion of the silicon wafers and improve the quality and the production efficiency of the silicon wafers.
Example 1
The following first describes a silicon wafer transmission device provided by the embodiment of the application.
Referring to fig. 1 to fig. 2, fig. 1 is a schematic structural diagram of a silicon wafer transmission device according to an embodiment of the application. Fig. 2 is a schematic structural view of a tray with a plurality of pits according to an embodiment of the present application.
Referring to fig. 1 to 2, the silicon wafer transferring apparatus 11 includes: the surface of the tray 111 is provided with a plurality of concave pit 112, and the pit 112 is used for placing the silicon chip 13. A gauge 14, the gauge 14 including a probe 141, the probe 141 being suspended above the tray 111, the gauge 14 collecting an actual height value of the pit 112 by the probe 141. The mechanical arm 15 is provided with a plurality of arms,
The actuating part of the mechanical arm 15 is disposed above the tray 111, and is used for taking and placing the silicon wafer 13 in the pit 112 of the tray 111. The controller 16 is in communication connection with the measuring instrument 14 and the mechanical arm 15, and the controller 16 outputs a pick-and-place height value corresponding to the pit 112 according to the actual height value of the pit 112 acquired by the measuring instrument 14, so as to control the pick-and-place height value corresponding to the pick-and-place action of the mechanical arm 15. For example, the actual height value of the pit 112 collected by the measuring instrument 14 is a, and the controller 16 outputs a pick-and-place height value a' corresponding to the pit 112 according to the actual height value a of the pit 112 collected by the measuring instrument 14; if the original pick-and-place height value corresponding to the pick-and-place motion of the mechanical arm 15 is a ', the controller 16 controls the pick-and-place height value corresponding to the pick-and-place motion of the mechanical arm 15 to be kept a'; if the original picking and placing height value corresponding to the picking and placing action of the mechanical arm 15 is B, the controller 16 controls the picking and placing height value corresponding to the picking and placing action of the mechanical arm 15 to be adjusted from B to a' so as to ensure the accuracy of the height of the mechanical arm 15 when picking and placing the silicon wafer 13 in the wafer pit 112 of the tray 111, and avoid the defect caused by excessive extrusion of the silicon wafer 13.
According to the technical scheme, the measuring instrument 14 is additionally arranged, the probe 141 of the measuring instrument 14 is suspended above the tray 111, the actual height value of the silicon wafer 13 in the wafer pit 112 on the tray 111 is acquired, the controller 16 is in communication connection with the measuring instrument 14 and the mechanical arm 15, the actual height value of the wafer pit 112 acquired by the measuring instrument 14 is enabled to output the pick-and-place height value corresponding to the wafer pit 112 by the controller 16, the pick-and-place height corresponding to the pick-and-place action of the mechanical arm 15 is controlled, the height accuracy of the mechanical arm 15 when the silicon wafer 13 in the wafer pit 112 of the tray 111 is ensured, and the defect caused by excessive extrusion of the silicon wafer 13 is avoided.
In this embodiment, the silicon wafer transferring device 11 further includes a rotating shaft 12, where the rotating shaft 12 is perpendicular to the tray 111 and is connected to the tray 111 through a bearing 121. The tray 111 is rotatable around the rotation shaft 12 by means of the bearing 121. Because the tray 111 is provided with the plurality of silicon wafers 13, the tray 111 can be rotated to a proper position to facilitate the mechanical arm 15 to pick and place the silicon wafers 13.
With continued reference to fig. 2, in the present embodiment, a plurality of the pits 112 are disposed on the surface of the tray 111 in a linear arrangement. The plurality of pits 112 are uniformly distributed on the surface of the tray 111, so as to improve the stability of the tray 111 on a horizontal plane.
In the present embodiment, the height of the gauge 14 is adjustable in a direction perpendicular to the surface of the tray 111 where the pit 112 is provided (direction D1 shown). In order to accurately measure the actual height of each of the pit 112, a height adjustment of the gauge 14 is required.
In this embodiment, the measuring device 14 is one, and the actual height value of each pit 112 is sequentially collected by the probe 141. In other embodiments, the number of the measuring instruments 14 may be plural, and the probe 141 of each measuring instrument 14 is suspended directly above the center of the corresponding pit 112, so as to collect the actual height value of each pit 112 respectively; each of the gauges 14 may independently measure the actual height value of the corresponding pit 112.
In this embodiment, the controller 16 controls the gauge 14 to periodically acquire the actual height value of each pit 112 according to a set time interval. The actual height value of each pit 112 in the tray 111 is stable for a period of time, so the actual height value of each pit 112 may be periodically collected according to a set time interval.
In this embodiment, the probe 141 is a laser probe. The laser probe performs non-contact measurement, avoiding the pollution or damage of the silicon chip 13 possibly caused by physical touch. The laser probe can rapidly collect data, so that the overall processing time of the silicon wafer transmission device 11 is reduced, and the production efficiency is improved.
The measuring instrument 14 transmits the collected actual height value of the pit 112 to the controller 16, and the controller 16 matches the pick-and-place height value corresponding to the pit 112 according to the actual height value of the pit 112 and outputs the pick-and-place height value to the mechanical arm 15, so as to control the mechanical arm 15 to execute the pick-and-place action according to the pick-and-place height value corresponding to the pit 112. The controller 16 controls the pick-and-place height value corresponding to the pick-and-place motion of the mechanical arm 15 based on the actual height value of each pit 112, so as to ensure that the mechanical arm 15 can accurately reach the actual height of each silicon wafer 13, so as to facilitate the pick-and-place operation. For the same pit 112, the measuring instrument 14 will collect periodically according to a set time interval, and if the actual height value received by the controller 16 changes in each period, the controller 16 will also correspondingly match the corresponding pick-and-place height value to further adjust the pick-and-place height value corresponding to the pick-and-place action of the mechanical arm 15, so as to ensure that the silicon wafer 13 will not be excessively extruded and damaged during each pick-and-place.
Example two
The following first describes a silicon wafer transmission device provided by the embodiment of the application.
In this embodiment, the structure of the silicon wafer transfer device is the same as that shown in fig. 1. But in the present embodiment
The structure of the tray is shown in fig. 3. Fig. 3 is a schematic structural view of a tray with a plurality of pits according to a second embodiment of the present application.
Referring to fig. 3, in the present embodiment, a plurality of pits 212 are disposed on the surface of the tray 211 in a circumferential arrangement. The plurality of the pits 212 are uniformly distributed on the surface of the tray 211, thereby providing better stability. In addition, the plurality of the wafer pits 212 are arranged in a circumference, so that each silicon wafer can be contacted by the mechanical arm 15 by simply rotating the tray 211, the moving time of the mechanical arm 15 is reduced, and the efficiency of picking and placing the silicon wafers is improved.
According to the technical scheme, the measuring instrument is additionally arranged, the probe of the measuring instrument is suspended above the tray, the actual height value of the wafer pit on the tray is acquired, the controller is in communication connection with the measuring instrument and the mechanical arm, so that the controller outputs the pick-and-place height value corresponding to the wafer pit through the actual height value of the wafer pit acquired by the measuring instrument, the pick-and-place height corresponding to the pick-and-place action of the mechanical arm is controlled, the mechanical arm is ensured to pick-and-place the silicon wafer in the wafer pit of the tray, and the defect caused by excessive extrusion of the silicon wafer is avoided.
It is noted that relational terms such as second and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, the statement "comprises" and "comprises" does not exclude the presence of other elements than those listed in any process, method, article, or apparatus that comprises the element.
In this specification, each embodiment is described in a related manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for the embodiments, since they are substantially similar to the embodiments, the description is relatively simple, and reference is made to the description of the embodiments for relevant points.
The foregoing is merely a preferred embodiment of the present application and is not intended to limit the scope of the present application. It should be noted that modifications and adaptations to the present application may occur to one skilled in the art without departing from the principles of the present application and are intended to be comprehended within the scope of the present application.
Claims (9)
1. A silicon wafer transfer device, comprising:
The surface of the tray is provided with a plurality of concave slice pits, and the slice pits are used for placing silicon wafers;
The measuring instrument comprises a probe, the probe is suspended above the tray, and the measuring instrument collects the actual height value of the pit through the probe;
the executing part of the mechanical arm is arranged above the tray and is used for taking and placing the silicon wafers in the wafer pits of the tray;
The controller is in communication connection with the measuring instrument and the mechanical arm, and the controller outputs a picking and placing height value corresponding to the pit according to the actual height value of the pit acquired by the measuring instrument so as to control the picking and placing height value corresponding to the picking and placing action of the mechanical arm.
2. The silicon wafer transport device of claim 1 further comprising a spindle disposed perpendicular to the tray and connected to the tray by bearings.
3. The silicon wafer transport apparatus according to claim 1, wherein a plurality of the wafer pits are provided in a linear arrangement on the surface of the tray.
4. The silicon wafer transport apparatus according to claim 1, wherein a plurality of the wafer pits are provided on the surface of the tray in a circumferential arrangement.
5. The silicon wafer transfer device according to claim 1, wherein a height of the gauge is adjustable in a direction perpendicular to a surface of the tray on which the wafer pit is provided.
6. The silicon wafer transfer device of claim 1, wherein the gauge sequentially collects an actual height value of each of the pits through the probe.
7. The silicon wafer transfer device of claim 1, wherein the plurality of gauges is provided, and the probe of each gauge is suspended directly above the center of the corresponding pit to acquire the actual height value of each pit.
8. The silicon wafer transfer device of claim 1, wherein the controller controls the gauge to periodically collect the actual height value of each pit according to a set time interval.
9. The silicon wafer transfer device of claim 1 wherein the probe is a laser probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323240366.XU CN221466548U (en) | 2023-11-29 | 2023-11-29 | Silicon wafer transmission device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323240366.XU CN221466548U (en) | 2023-11-29 | 2023-11-29 | Silicon wafer transmission device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221466548U true CN221466548U (en) | 2024-08-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323240366.XU Active CN221466548U (en) | 2023-11-29 | 2023-11-29 | Silicon wafer transmission device |
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| Country | Link |
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| CN (1) | CN221466548U (en) |
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2023
- 2023-11-29 CN CN202323240366.XU patent/CN221466548U/en active Active
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